摘要:
A circuit-carrying automotive component and a method of manufacturing the same are provided. In a preferred embodiment of the invention, the component includes a substrate made from a polymer that is molten at a predetermined elevated temperature. The component further includes a circuit board which defines an aperture therethrough adapted to receive the molten polymer at the elevated temperature and a fastener formed from the molten polymer through the aperture. The fastener is integral with the substrate and mechanically secures the circuit board to the substrate. The circuit board is made from a material that is resistant to fusing with the molten polymer at the elevated temperature.
摘要:
A semiconductor device including an insulating film substrate having a surface, a high frequency semiconductor chip disposed on the surface, and circuit elements disposed on the surface and connected to the semiconductor chip wherein the insulating film substrate is bent into a U-shape, laminated, and encapsulated with a resin. The package of the device is miniaturized.
摘要:
A warp-free laminate is produced by winding a first set of strands or filaments about a flat mandrel with a second set of strands being wound transverse to the first set. The two sets may be perpendicular to each other. The filaments are maintained under a controlled tension while being impregnated with a resin and during subsequent cure of the resin. In order to permit the formation of a warp-free product, the winding pattern is such that it forms a mirror image about a neutral axis or plane of symmetry. The winding pattern may be chosen to provide interstices in a predetermined pattern determining punching out or high speed drilling of hole openings for subsequent printed circuit applications.
摘要:
A method of producing a board for printed wiring comprising disposing a metal foil in a plate-shape cavity of a mold so that the metal foil is in contact with at least one internal side of the cavity, injecting a molding material comprising an epoxy resin, a hardening agent and a powdery inorganic filler into the cavity and curing the epoxy resin, the molding material containing 50 to 90% by volume of the powdery inorganic filler based on the total of the molding material.
摘要:
A semiconductor device including an insulating film substrate having a surface, a high frequency semiconductor chip disposed on the surface, and circuit elements disposed on the surface and connected to the semiconductor chip wherein the insulating film substrate is bent into a U-shape, laminated, and encapsulated with a resin. The package of the device is miniaturized.
摘要:
Injection-moulded printed circuit boards which have been obtained by injection-moulding thermoplastic materials onto the back of flexible circuits are of a particularly high quality if the conductor tracks have been produced on the flexible carriers employed by direct additive or semiadditive metallisation.
摘要:
A method for the manufacturing of a metal core pc board which provides for manufacturing of two or three dimensional metal core pc boards of any form. The manufacturing of such pc boards can occur by injection molding, injection/compression methods or by a pressing method. High-heat resistant thermoplastics, as well as thermoset plastics are preferably used as pc board materials. A metal with good thermal conductibility is used for the core. The material is selected such that the thermal expansion coefficients of the metal core and the pc board material are optimally equal. The manufacturing contains the following steps: lamination of the metal plate with a plastic foil on one or both sides; placing of such prepared metal core in an injection molding tool; and thermoforming the plastic on the laminated core over the plastic foil.
摘要:
A method of producing an instrument panel of a motor vehicle or similar molding of forming resin which includes a section for fitting an electrical part. The electrical part fitting section is constituted by a coupler engageable with the electrical part and an opening which is contiguous with the interior of the coupler. The opening is surrounded in a liquid-tight configuration by a pressing member for sealing which is disposed on one of coactive parts of a metal mold. The coupler is removably mounted on the other metal mold part. When the metal mold parts are clamped, a peripheral edge portion of the coupler abuts against a portion of the pressing member which surrounds an opening of the pressing member. A flexible printed circuit to which the electrical part is electrically connectable is interposed between the coupler and the pressing member such that terminal portions of the circuit face the inside of the coupler. When the mold parts are clamped, the printed circuit is pressed between the peripheral edge portion of the coupler and the pressing member to be fixed in place and, therefore, the terminal portions of the printed circuit are surely maintained in their predetermined positions despite pressures ascribable to an undiluted solution of foaming resin which is poured into the cavity of the metal mold, caused to foam, and solidified. Further, such a solution is prevented from flowing out of the cavity into the coupler.
摘要:
In an electric component a plastic sheath encloses conductive connections d leaves their terminal ends exposed. In order to keep the conductive connections at specific distances to the plastic sheath and to guarantee that the conductive connections are not exposed at the plastic sheath in intermediate areas, the conductive connections are secured together in spaced relation by a plastic carrier surrounding the conductive connections at spaced regions along their length. The plastic carrier has pins projecting therefrom which have end surfaces which serve to space the conductive connections a true distance from the surface of a mould in which a plastic sheath is moulded around the conductive connections and the plastic carrier. The plastic carrier and the conductive connections are encapsulated with the plastic sheath with the pins properly positioning the conductive carriers within the plastic sheath without forming any undesired openings in the plastic sheath.
摘要:
Metal-plastic laminates are prepared by coating a metal component with a polyurethane adhesion promoter in dissolved or dispersed form, drying the liquid phase and coating with the melt of a thermoplastic by the extrusion coating process.