公开(公告)号：US07645642B2

公开(公告)日：2010-01-12

申请号：US11348542

申请日：2006-02-07

申请人： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

发明人： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

IPC分类号： H01L21/00 ,  H01B1/24 ,  H01B1/06 ,  C08F290/14

CPC分类号： C08J5/121 ,  B29C65/3412 ,  B29C65/3484 ,  B29C66/54 ,  B29C66/71 ,  B29C66/731 ,  B29C66/73113 ,  B29C66/7315 ,  B29C66/7392 ,  B29C66/7394 ,  B29C66/91411 ,  B29C66/919 ,  B29K2063/00 ,  B29K2067/00 ,  B29K2071/00 ,  B29K2081/06 ,  B29K2083/00 ,  B29K2101/10 ,  B29K2101/12 ,  B29K2105/0079 ,  B29K2105/16 ,  B29K2309/08 ,  B29L2031/3061 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/00 ,  B29K2067/003 ,  B29K2081/04

摘要： A method of joining a thermoplastic material to a thermoset material, and a resultant thermoplastic-thermoset composite formed from such method are provided. At least one of the thermoplastic material and the thermoset material includes particles that melt when the thermoplastic material and the thermoset material are heated during the joining operation. The particles further produce a solid bond between the materials after the particles have solidified in the course of cooling after the joining operation.

摘要翻译： 提供了一种将热塑性材料接合到热固性材料的方法，以及由这种方法形成的所得的热塑性热固性复合材料。 热塑性材料和热固性材料中的至少一种包括当在接合操作期间热塑性材料和热固性材料被加热时熔化的颗粒。 颗粒在接合操作后的冷却过程中固化后，颗粒进一步在材料之间产生固态结合。

公开(公告)号：US20090161239A1

公开(公告)日：2009-06-25

申请号：US12158351

申请日：2006-12-18

申请人： Boudewijn Verhaar ,  Bart Dirkx ,  Michael Bauer ,  Funda Sahin Nomaler

发明人： Boudewijn Verhaar ,  Bart Dirkx ,  Michael Bauer ,  Funda Sahin Nomaler

IPC分类号： G02B7/09 ,  H02N2/04 ,  H01L41/22 ,  G03B9/02

CPC分类号： G03B9/02 ,  G02B5/005 ,  G02B26/02 ,  H01L41/0986 ,  Y10T29/42

摘要： An electroactive polymer actuator (10) is disclosed for use in various applications including camera diaphragms and lenses. The actuator (10) converts electrical energy to mechanical energy and comprises, in one embodiment, at least two flexible electrodes (15, 25); a transparent elastic non-conductive material (20) having a substantially constant thickness, the transparent elastic non-conductive material (20) arranged in a manner which causes the transparent elastic non-conductive material (20) to compress in a first direction orthogonal to the thickness in response to an electric field applied to the polymer; and a frame coupled to the at least two electrodes (15, 25) and the transparent elastic non-conductive material (20), the outer frame substantially preventing expansion in a second direction opposite said first direction in response to an electric field applied to the polymer.

摘要翻译： 公开了一种电活性聚合物致动器（10），用于包括照相机隔膜和透镜在内的各种应用。 致动器（10）将电能转换成机械能，并且在一个实施例中包括至少两个柔性电极（15,25）; 具有基本恒定厚度的透明弹性非导电材料（20），所述透明弹性非导电材料（20）以使得所述透明弹性非导电材料（20）沿与第一方向垂直的第一方向 响应于施加到聚合物的电场的厚度; 以及耦合到所述至少两个电极（15,25）和所述透明弹性非导电材料（20）的框架，所述外框架响应于施加到所述第二方向的电场而在与所述第一方向相反的第二方向上基本上防止膨胀 聚合物。

公开(公告)号：US07482198B2

公开(公告)日：2009-01-27

申请号：US11586740

申请日：2006-10-26

申请人： Michael Bauer ,  Edward Fuergut ,  Simon Jerebic ,  Holger Woerner

发明人： Michael Bauer ,  Edward Fuergut ,  Simon Jerebic ,  Holger Woerner

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/486 ,  H01L23/49827 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L24/96 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/92 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H05K1/0373 ,  H05K3/4038 ,  H05K3/4069 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2203/105 ,  H01L2224/96 ,  H01L2224/82

摘要： A method is described for producing through-contacts through a panel-shaped composite body including semiconductor chips and a plastic mass filled with conductive particles. The panel-shaped composite body is introduced between two high-voltage point electrodes. The point electrodes are oriented at positions at which through-contacts are to be introduced through the plastic mass. A high voltage is applied to the point electrodes thereby, forming the through-contacts through the plastic mass.

摘要翻译： 描述了一种用于通过包括半导体芯片和填充有导电颗粒的塑料块的面板形复合体制造穿孔的方法。 板状复合体被引入两个高压点电极之间。 点电极被定向在穿过接触件通过塑料块引入的位置。 因此，高电压施加到点电极，从而通过塑料块形成通孔。

公开(公告)号：US07464603B2

公开(公告)日：2008-12-16

申请号：US11867117

申请日：2007-10-04

申请人： Michael Bauer ,  Angela Kessler ,  Wolfgang Schober ,  Alfred Haimerl ,  Joachim Mahler

发明人： Michael Bauer ,  Angela Kessler ,  Wolfgang Schober ,  Alfred Haimerl ,  Joachim Mahler

IPC分类号： H01L23/02

CPC分类号： G01L19/0069 ,  G01L19/146 ,  G01L19/147 ,  H01L23/49877 ,  H01L23/5389 ,  H01L31/0203 ,  H01L2224/16245 ,  H01L2924/01012 ,  H01L2924/01077 ,  H01L2924/01078 ,  H05K1/0373 ,  H05K1/185 ,  H05K3/105 ,  H05K3/185 ,  H05K2201/0133 ,  H05K2201/0236 ,  H05K2203/107

摘要： A semiconductor sensor component including a housing with a cavity and a sensor chip and a method for producing the same are described herein. The housing includes an opening to the surroundings of the housing and the sensor chip includes a sensor region which faces the opening. The sensor chip is embedded in the cavity of the housing into a rubber-elastic layer with its rear side and its edge sides, where the rubber-elastic layer includes cleavable included organometallic or inorganic metallic complexes. The metals of the complexes lie in a freely accessible manner on the top side of the rubber-elastic layer and form metallic nuclei for wiring lines which electrically connect the sensor region of the sensor chip to contact pads in the cavity of the cavity housing.

摘要翻译： 这里描述了包括具有空腔的壳体和传感器芯片的半导体传感器部件及其制造方法。 壳体包括到壳体的周围的开口，并且传感器芯片包括面向开口的传感器区域。 传感器芯片嵌入壳体的空腔中，其背面和边缘侧面为橡胶弹性层，其中橡胶弹性层包括可切割的有机金属或无机金属络合物。 复合物的金属在橡胶弹性层的顶侧可自由接近的方式形成金属核，用于将传感器芯片的传感器区域与腔室的空腔中的接触垫电连接的布线。

公开(公告)号：US20080297068A1

公开(公告)日：2008-12-04

申请号：US11757009

申请日：2007-06-01

申请人： Paul Koren ,  Stephen Faber ,  Roy Archer ,  Michael Bauer

发明人： Paul Koren ,  Stephen Faber ,  Roy Archer ,  Michael Bauer

IPC分类号： H05B37/02

CPC分类号： H05B33/0863 ,  H05B33/0842 ,  H05B37/0254 ,  H05B37/029

摘要： A system and method for controlling an entertainment system is provided. The system can have at least one light source to generate variable light output and at least one controller coupled to the at least one light source to control the variable light output based on a number of interruptions of power supplied to the apparatus over a pre-determined time period. The variable light output can be a light temperature. The at least one light source can be a plurality of light sources, with the at least one controller having a plurality of addresses and each of the addresses designating one or more of the plurality of light sources to be controlled. The at least one controller can synchronize or unsynchronize the plurality of light sources.

摘要翻译： 提供了一种用于控制娱乐系统的系统和方法。 该系统可以具有至少一个光源以产生可变光输出，并且至少一个控制器耦合到所述至少一个光源，以基于预先确定的提供给所述装置的功率的中断次数来控制可变光输出 时间段。 可变光输出可以是光温。 所述至少一个光源可以是多个光源，所述至少一个控制器具有多个地址，并且每个地址指定要被控制的多个光源中的一个或多个。 所述至少一个控制器可以同步或不同步所述多个光源。

公开(公告)号：US07443019B2

公开(公告)日：2008-10-28

申请号：US11498253

申请日：2006-08-03

申请人： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

发明人： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

IPC分类号： H01L21/56 ,  H01L21/58

CPC分类号： H01L24/83 ,  H01L23/49524 ,  H01L23/49816 ,  H01L24/24 ,  H01L24/25 ,  H01L24/32 ,  H01L24/82 ,  H01L2224/24051 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/24245 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/82103 ,  H01L2224/838 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012

摘要： The invention relates to a semiconductor device with conductor tracks between a semiconductor chip and a circuit carrier, and to a method for producing the same. The conductor tracks extend from contact areas on the top side of the semiconductor chip to contact pads on the circuit carrier. The conductor tracks include an electrically conductive polymer in the semiconductor device.

摘要翻译： 本发明涉及一种在半导体芯片和电路载体之间具有导体轨迹的半导体器件及其制造方法。 导体轨道从半导体芯片的顶侧的接触区域延伸到电路载体上的接触焊盘。 导体轨迹包括半导体器件中的导电聚合物。

公开(公告)号：US20080220567A1

公开(公告)日：2008-09-11

申请号：US11817520

申请日：2006-02-20

申请人： Joachim Mahler ,  Alfred Hannerl ,  Michael Bauer ,  Angela Kessler ,  Wolfgang Schober

发明人： Joachim Mahler ,  Alfred Hannerl ,  Michael Bauer ,  Angela Kessler ,  Wolfgang Schober

IPC分类号： H01L21/56

CPC分类号： H01L23/49894 ,  H01L21/56 ,  H01L23/293 ,  H01L23/3142 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor component is disclosed. In one embodiment, the semiconductor component includes a semiconductor chip, which is arranged on a substrate, and a housing, which at least partially surrounds the semiconductor chip. The substrate is at least partly provided with a layer of polymer foam.

摘要翻译： 公开了半导体部件。 在一个实施例中，半导体部件包括布置在基板上的半导体芯片和至少部分地围绕半导体芯片的壳体。 衬底至少部分地设置有聚合物泡沫层。

公开(公告)号：US20080029874A1

公开(公告)日：2008-02-07

申请号：US11839740

申请日：2007-08-16

申请人： Michael Bauer ,  Edward Fuergut ,  Simon Jerebic ,  Hermann Vilsmeier

发明人： Michael Bauer ,  Edward Fuergut ,  Simon Jerebic ,  Hermann Vilsmeier

IPC分类号： H01L23/52 ,  H01L21/00

CPC分类号： H05K3/3426 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49811 ,  H01L24/02 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3442 ,  H05K2201/0373 ,  H05K2201/10689 ,  H05K2201/10727 ,  Y02P70/613

摘要： A semiconductor component including a surface-mount housing and a method for producing the same are described herein. The semiconductor component includes lead pieces embedded into a plastic housing composition and arranged on an underside of the housing. External contact areas of the lead pieces are free of the plastic housing composition. A structured solderable coating is arranged on the external contact areas that have been kept free of the plastic housing composition, the coating includes a plurality of electrically conductive and mechanically elastic contact elements.

摘要翻译： 本文描述了包括表面安装壳体的半导体部件及其制造方法。 半导体部件包括嵌入塑料外壳组合物中并布置在壳体的下侧上的引线片。 引导件的外部接触区域不含塑料外壳构成。 结构可焊接涂层布置在已经保持没有塑料外壳组合物的外部接触区域上，涂层包括多个导电和机械弹性的接触元件。

公开(公告)号：US20070228567A1

公开(公告)日：2007-10-04

申请号：US11692530

申请日：2007-03-28

申请人： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

发明人： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

IPC分类号： H01L23/48

CPC分类号： H01L24/12 ,  H01L23/3142 ,  H01L23/53238 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/05017 ,  H01L2224/05557 ,  H01L2224/05562 ,  H01L2224/05664 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/45124 ,  H01L2224/48764 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/05552

摘要： A semiconductor chip (1) has a metal coating structure (2) which has on an active upper side (3) of the semiconductor chip (1) at least one lower metal layer (8) with copper or copper alloy, on which a central metal layer (9) with nickel is arranged. The metal coating structure (2) is terminated by an upper metal layer (10) of palladium and/or a precious metal. The central metal layer (9) with nickel and/or nickel phosphide has a rough interface (11) with respect to the plastic package molding compound surrounding the metal coating structure (2).

摘要翻译： 半导体芯片（1）具有在半导体芯片（1）的有源上侧（3）上具有至少一个具有铜或铜合金的下金属层（8）的金属涂层结构（2），在其上具有中心 配置有镍的金属层（9）。 金属涂层结构（2）由钯和/或贵金属的上金属层（10）封端。 具有镍和/或镍磷化物的中心金属层（9）相对于围绕金属涂层结构（2）的塑料封装模塑料具有粗糙界面（11）。

公开(公告)号：US20070187816A1

公开(公告)日：2007-08-16

申请号：US11548066

申请日：2006-10-10

申请人： Michael Bauer ,  Kai Chan

发明人： Michael Bauer ,  Kai Chan

IPC分类号： H01L23/34 ,  H01L21/00

CPC分类号： H01L21/50 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/95 ,  H01L24/97 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/05599 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/92247

摘要： A semiconductor component with a semiconductor chip and an adhesive film, and a method for its production is disclosed. In one embodiment, the semiconductor component has the adhesive film, which is internally prestressed and is adhesive on both faces, between the rear face of the semiconductor chip and a chip connecting surface on a circuit mount.

摘要翻译： 公开了具有半导体芯片和粘合膜的半导体部件及其制造方法。 在一个实施例中，半导体部件具有在半导体芯片的后表面和电路基座之间的芯片连接表面上的内部预应力的粘合剂膜，并且在两个表面上是粘合剂。