公开(公告)号：US20140307394A1

公开(公告)日：2014-10-16

申请号：US14252719

申请日：2014-04-14

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Anthony James LOBIANCO ,  Howard E. CHEN ,  Robert Francis DARVEAUX ,  Hoang Mong NGUYEN ,  Matthew Sean READ ,  Lori Ann DEORIO

IPC: H05K9/00 ,  B23K26/36

CPC classification number: H05K1/0218 ,  B23K26/361 ,  B23K26/362 ,  B23K26/386 ,  B23K26/389 ,  B23K26/40 ,  B23K2103/172 ,  H01L21/565 ,  H01L21/76802 ,  H01L21/76877 ,  H01L23/3121 ,  H01L23/481 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/66 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/6611 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/05554 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H03H9/64 ,  H04B1/3833 ,  H04B1/3838 ,  H04B1/40 ,  H05K1/0216 ,  H05K1/0243 ,  H05K1/181 ,  H05K1/183 ,  H05K3/288 ,  H05K3/30 ,  H05K3/303 ,  H05K9/0022 ,  H05K2201/1006 ,  H05K2201/10083 ,  H05K2201/10098 ,  H05K2201/10287 ,  H05K2201/1056 ,  H05K2203/107 ,  H05K2203/1327 ,  Y10T29/49002 ,  Y10T29/49016 ,  H01L2924/00 ,  H01L2224/45099

Abstract: Disclosed are apparatus and methods related to conformal coating of radio-frequency (RF) modules. In some embodiments, a module can include an overmold formed over an RF component mounted on a packaging substrate. The overmold can also cover a surface-mount device (SMD) such as an RF filter implemented as a chip size surface acoustic wave (SAW) device (CSSD). The module can further include a conductive layer formed over the overmold and configured to provide RF shielding functionality for the module. The conductive layer can be electrically connected to a ground plane of the packaging substrate through the SMD. An opening can be formed in the overmold over the SMD; and the conductive layer can conform to the opening to electrically connect the conductive layer with an upper surface of the SMD and thereby facilitate the grounding connection.

Abstract translation: 公开了与射频（RF）模块的适形涂层相关的装置和方法。 在一些实施例中，模块可以包括形成在安装在包装衬底上的RF部件上的包覆模制件。 包覆模具还可以覆盖实现为芯片尺寸表面声波（SAW）器件（CSSD）的RF滤波器的表面贴装器件（SMD）。 模块还可以包括形成在包覆模制上的导电层，并且被配置为为模块提供RF屏蔽功能。 导电层可以通过SMD电连接到封装衬底的接地平面。 可以在SMD上的包覆模制中形成一个开口; 并且导电层可以符合开口以将导电层与SMD的上表面电连接，从而便于接地连接。

公开(公告)号：US20140104016A1

公开(公告)日：2014-04-17

申请号：US14053170

申请日：2013-10-14

Applicant: Jeffery J. Nummerdor

Inventor： Jeffery J. Nummerdor

IPC: H01P1/20 ,  F16M13/02

CPC classification number: F16M13/02 ,  H01P1/205 ,  H01P1/2056 ,  H03H1/02 ,  H03H7/0138 ,  H05K1/0233 ,  H05K1/0243 ,  H05K1/0271 ,  H05K2201/068 ,  H05K2201/1006

Abstract: A combination RF filter and printed circuit board assembly wherein the RF filter is defined by a block of dielectric material including at least first and second side surfaces. A metal bracket with a plurality of fingers is secured to each of the first and second side surfaces. The fingers on the brackets extend through respective apertures in the printed circuit board and are soldered to the printed circuit board. The brackets relieve and transfer the thermal and mechanical stresses that result from use of a filter and printed circuit board that are made of materials with different thermal and mechanical characteristics and reduce the risk of cracking or damage to the filter, the printed circuit board, and the solder joints during use.

Abstract translation: 一种组合RF滤波器和印刷电路板组件，其中RF滤波器由包括至少第一和第二侧表面的电介质材料块限定。 具有多个指状物的金属支架固定到第一和第二侧表面中的每一个。 托架上的指状物延伸穿过印刷电路板中的相应孔，并被焊接到印刷电路板。 支架减轻并传递由使用由具有不同热和机械特性的材料制成的过滤器和印刷电路板产生的热和机械应力，并降低开裂或损坏过滤器，印刷电路板和 使用时的焊点。

公开(公告)号：US08436248B2

公开(公告)日：2013-05-07

申请号：US11997764

申请日：2006-08-04

Applicant: Alexander Chernyakov ,  Patric Heide ,  Johann Heyen ,  Thomas Von Kerssenbrock

Inventor： Alexander Chernyakov ,  Patric Heide ,  Johann Heyen ,  Thomas Von Kerssenbrock

IPC: H05K1/00

CPC classification number: H05K1/0207 ,  H01L23/3677 ,  H01L23/552 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/09701 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0206 ,  H05K1/0219 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/16 ,  H05K2201/09618 ,  H05K2201/1006 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electrical component that includes a substrate that includes at least one electrical circuit is described herein. The electrical component also includes a heat sink in an aperture through the substrate.

Abstract translation: 本文描述了包括至少一个电路的基板的电气部件。 电气部件还包括穿过基板的孔中的散热器。

公开(公告)号：USRE43957E1

公开(公告)日：2013-02-05

申请号：US13157527

申请日：2011-06-10

Applicant: Taturo Nagai

Inventor： Taturo Nagai

IPC: H01P5/12 ,  H01P3/08

CPC classification number: H03H9/725 ,  H01L2924/19105 ,  H01P1/047 ,  H03H9/0542 ,  H03H9/0576 ,  H03H9/72 ,  H05K1/0243 ,  H05K1/113 ,  H05K1/114 ,  H05K1/117 ,  H05K1/181 ,  H05K2201/1006 ,  H05K2201/10522 ,  H05K2201/10636 ,  Y02P70/611

Abstract: In a high-frequency module, mounting lands arranged to mount at least one filter device having at least one set of an unbalanced terminal and two balanced terminals are provided at one side of a substrate top surface, and mounting lands arranged to mount at least one element electrically connected to the filter device are arranged at the opposite side. At least two of a plurality of connection terminals provided on a substrate bottom surface are respectively connected to conductor patterns connected to via-hole conductors penetrating the substrate within a mounting area for mounting the filter device via connection lines and are arranged at a pitch which is less than the pitch of the via-hole conductors.

公开(公告)号：US08237061B2

公开(公告)日：2012-08-07

申请号：US12508199

申请日：2009-07-23

Applicant: Keith Bryan Hardin ,  Paul Kevin Hall ,  Robert Aaron Oglesbee

Inventor： Keith Bryan Hardin ,  Paul Kevin Hall ,  Robert Aaron Oglesbee

IPC: H05K1/16

CPC classification number: H05K1/184 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0248 ,  H05K1/0251 ,  H05K1/0298 ,  H05K3/4046 ,  H05K2201/09645 ,  H05K2201/1006 ,  H05K2201/10984

Abstract: A Z-directed filter component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained with the PCB. In one embodiment the Z-directed filter component is mounted within the thickness of the PCB allowing other components to be mounted over it. The filter may be T-filter or a Pi-filter within the body of the Z-directed component. The body may also contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body. Methods for mounting Z-directed components are also provided.

Abstract translation: 用于插入印刷电路板的Z向滤波器组件，同时允许电连接到与PCB一起包含的内部导电平面。 在一个实施例中，Z导向的滤波器部件安装在PCB的厚度内，允许其它部件安装在其上。 滤波器可以是Z-导向分量的体内的T滤波器或Pi滤波器。 主体还可以包含一个或多个导体，并且可以包括沿主体长度的至少一部分延伸的一个或多个表面通道或孔。 还提供了用于安装Z向定向部件的方法。

公开(公告)号：US20120196456A1

公开(公告)日：2012-08-02

申请号：US13437856

申请日：2012-04-02

Applicant: Victor H. Renteria ,  Aurelio J. Gutierrez ,  William Mahlerbe ,  Gary L. Hurd ,  Russell L. Machado

Inventor： Victor H. Renteria ,  Aurelio J. Gutierrez ,  William Mahlerbe ,  Gary L. Hurd ,  Russell L. Machado

IPC: H01R12/71

CPC classification number: H01R13/66 ,  H01R12/70 ,  H01R13/6658 ,  H01R13/719 ,  H01R13/7193 ,  H01R24/64 ,  H05K1/0233 ,  H05K1/18 ,  H05K2201/1003 ,  H05K2201/1006 ,  H05K2201/10189 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10568 ,  H05K2201/2036

Abstract: An electrical connector mountable on a printed circuit board. In one embodiment, the electrical connector comprises an insulative housing comprising one or more electronic components, a plurality of electrical conductors in signal communication with the electronic components and adapted to interface with a plug and a plurality of terminals in signal communication with the one or more electronic components. In one aspect, the plurality of terminals are adapted to interface with one or more externally mounted electronic components on the printed circuit board thereby filtering signals passing between the electrical conductors and the printed circuit board, with the externally mounted electronic components mounted within the footprint of the electrical connector. Methods of manufacture for the aforementioned electrical connector and business methods are also disclosed.

Abstract translation: 可安装在印刷电路板上的电连接器。 在一个实施例中，电连接器包括绝缘壳体，该绝缘壳体包括一个或多个电子部件，与电子部件信号通信的多个电导体，并且适于与插头和多个终端进行信号通信，该多个终端与一个或多个 电子元器件。 在一个方面，多个端子适于与印刷电路板上的一个或多个外部安装的电子部件接合，从而过滤在电导体和印刷电路板之间通过的信号，其中外部安装的电子部件安装在 电连接器。 还公开了上述电连接器的制造方法和业务方法。

公开(公告)号：US08169277B2

公开(公告)日：2012-05-01

申请号：US12709038

申请日：2010-02-19

Applicant: John Robert McIntyre ,  Anthony Clement Manicone

Inventor： John Robert McIntyre ,  Anthony Clement Manicone

IPC: H01P5/12 ,  H01P1/22

CPC classification number: H01P5/18 ,  H04B1/52 ,  H05K1/0243 ,  H05K2201/1006 ,  H05K2201/10545

Abstract: An electronic device may include a printed circuit board (PCB) including a ground plane and having first and second opposing surfaces. The electronic device may also include a radio frequency (RF) directional coupler carried by the first surface of the PCB and including a housing and circuitry therein defining an input port, an output port, and first and second monitoring ports. A first monitoring circuit may be carried by the first surface of the PCB and connected to the first monitoring port. The electronic device may also include a via conductor connected to the second monitoring port and extending through the PCB to the second surface thereof. A second monitoring circuit may also be carried by the second surface of the PCB and connected to the via conductor.

Abstract translation: 电子设备可以包括包括接地平面并具有第一和第二相对表面的印刷电路板（PCB）。 电子设备还可以包括由PCB的第一表面承载的射频（RF）定向耦合器，并且包括限定输入端口，输出端口以及第一和第二监视端口的壳体和电路。 第一监视电路可以由PCB的第一表面承载并连接到第一监视端口。 电子设备还可以包括连接到第二监视端口并且穿过PCB延伸到其第二表面的通孔导体。 第二监视电路也可以由PCB的第二表面承载并连接到通孔导体。

公开(公告)号：US07944325B2

公开(公告)日：2011-05-17

申请号：US12352730

申请日：2009-01-13

Applicant: Christian Korden

Inventor： Christian Korden

IPC: H03H7/46 ,  H03H9/52 ,  H03H9/70

CPC classification number: H05K1/0243 ,  H01L23/552 ,  H01L23/66 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H03H9/0571 ,  H03H9/0576 ,  H03H9/542 ,  H03H9/706 ,  H03H9/72 ,  H03H9/725 ,  H05K1/0298 ,  H05K2201/1006 ,  H05K2201/10727 ,  H05K2201/10734 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An electrical module with a first substrate, and a component mounted on the first substrate is specified. The component includes a second substrate and a chip arranged on the second substrate. In the module, a filter circuit is realized that includes shunt arms connected to ground each with at least one parallel resonator. The parallel resonators are arranged on the chip. The ground-side connection of at least two of the shunt arms to each other is realized outside the chip and the second substrate. The ground-side connection of the shunt arms is advantageously realized in the first substrate or on a circuit board on which the first substrate is arranged.

Abstract translation: 规定了具有第一基板的电气模块和安装在第一基板上的部件。 该组件包括布置在第二基板上的第二基板和芯片。 在该模块中，实现了一种滤波电路，其包括连接到每个具有至少一个并联谐振器的接地的并联臂。 并联谐振器布置在芯片上。 在芯片和第二基板的外部实现至少两个分流臂彼此的接地侧连接。 分路臂的接地侧连接有利地在第一基板或布置有第一基板的电路板上实现。

公开(公告)号：US20110107570A1

公开(公告)日：2011-05-12

申请号：US13006052

申请日：2011-01-13

Applicant: Jun-sik HWANG ,  Yun-kwon Park ,  Il-jong Song ,  Byeoung-ju Ha

Inventor： Jun-sik HWANG ,  Yun-kwon Park ,  Il-jong Song ,  Byeoung-ju Ha

IPC: H04R17/00

CPC classification number: H03H9/706 ,  H01L2224/16235 ,  H01L2224/81192 ,  H01L2924/15313 ,  H01L2924/16251 ,  H01P1/213 ,  H03H9/0571 ,  H05K1/0243 ,  H05K1/162 ,  H05K1/165 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/0959 ,  H05K2201/1006 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49165

Abstract: A high-integrated duplexer and a fabrication method thereof. The duplexer has a first filter to pass a signal of a transmitted frequency band, a second filter to pass a signal of a received frequency band, an embedded PCB having the first and second filters bonded on a certain area of a surface of an upper side in a predetermined distance from each other, and an isolation part to prevent a signal interference between the first and second filters, and a packaging substrate to package the entire upper side of the embedded PCB so that the packaging substrate is located above and separated from the first and second filters by a predetermined distance. The fabricated high-integrated duplexer has a small size and high performance.

Abstract translation: 高集成双工器及其制造方法。 双工器具有通过发送频带的信号的第一滤波器，传递接收频带的信号的第二滤波器，具有第一和第二滤波器的嵌入式PCB，该第一和第二滤波器接合在上侧表面的某一区域上 隔离部分，以防止第一和第二滤光器之间的信号干扰，以及封装基板，以封装嵌入式PCB的整个上侧，使得封装基板位于上方并与之分离 第一和第二滤光器预定距离。 制造的高集成双工器具有小尺寸和高性能。

公开(公告)号：US20100244986A1

公开(公告)日：2010-09-30

申请号：US12748832

申请日：2010-03-29

Applicant: Arno KIEFER

Inventor： Arno KIEFER

IPC: H03H7/06

CPC classification number: H03H7/427 ,  H03H1/0007 ,  H05K1/023 ,  H05K1/0233 ,  H05K1/0287 ,  H05K1/029 ,  H05K1/0295 ,  H05K1/117 ,  H05K1/181 ,  H05K2201/09954 ,  H05K2201/1003 ,  H05K2201/1006

Abstract: A filter for filtering of electromagnetic interference, with a base element, with at least one electrical filter component and with at least two input terminal contacts and at least two output terminal contacts for connection of an electric line, the input terminal contacts being connected to the output terminal contacts by conductor paths located on the base element. In the filter, a simple configuration and flexible use are ensured by each conductor path having at least two longitudinal contacts, via which a filter component can be electrically connected to a conductor path such that the electrical connection of the conductor path leads between the two longitudinal contacts by the filter component, and each conductor path has at least one cross contact so that two conductor paths are electrically connected to one another by way of a filter component when the filter component is electrically connected to the cross contacts.

Abstract translation: 一种用于利用基座元件过滤具有至少一个电气滤波器部件并具有至少两个输入端子触点的电磁干扰的滤波器和用于连接电线的至少两个输出端子触点，所述输入端子触点连接到 通过位于基座元件上的导体路径输出端子触点。 在滤波器中，通过具有至少两个纵向触点的每个导体路径确保简单的配置和灵活的使用，通过该至少两个纵向触点，滤波器部件可以电连接到导体路径，使得导体路径的电连接在两个纵向 并且每个导体路径具有至少一个交叉接触，使得当滤波器部件电连接到交叉触头时，两个导体路径通过滤波器部件彼此电连接。