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    Non-metallurgical connection between an integrated circuit and a circuit board or another integrated circuit
    2.
    发明授权
    Non-metallurgical connection between an integrated circuit and a circuit board or another integrated circuit 失效
    集成电路与电路板或其他集成电路之间的非冶金连接

    公开(公告)号：US5834335A

    公开(公告)日：1998-11-10

    申请号：US721801

    申请日：1996-09-27

    申请人： Milton L. Buschbom

    发明人： Milton L. Buschbom

    IPC分类号： H01L23/40 ,  H01L23/498 ,  H05K3/32 ,  H01L21/44

    CPC分类号： H05K3/325 ,  H01L23/4006 ,  H01L23/49827 ,  H01L23/49866 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/01079

    摘要： A method is disclosed for making a non-metallurgical connection between an integrated circuit (16) and either a circuit board (12) or second integrated circuit. In one embodiment, an electrical connection is formed between terminals (28) of an integrated circuit (16) and pads (20) on a circuit board (12) without metallurgically connecting the terminals (28) and pads (20). The integrated circuit (16) can be in either packaged or die form. A clamping mechanism (18, 36) attached to the circuit board (12) clamps the integrated circuit (16) to the circuit board (12).

    摘要翻译： 公开了用于在集成电路（16）和电路板（12）或第二集成电路之间进行非冶金连接的方法。 在一个实施例中，在集成电路（16）的端子（28）和电路板（12）上的焊盘（20）之间形成电连接，而不用冶金地连接端子（28）和焊盘（20）。 集成电路（16）可以是封装或管芯形式。 附接到电路板（12）的夹持机构（18,36）将集成电路（16）夹紧到电路板（12）。

    Plastic chip-scale package having integrated passive components
    3.
    发明授权
    Plastic chip-scale package having integrated passive components 有权
    具有集成无源元件的塑料芯片级封装

    公开(公告)号：US06916689B2

    公开(公告)日：2005-07-12

    申请号：US10419408

    申请日：2003-04-21

    申请人： Samuel D. Pritchett ,  Anthony L. Coyle ,  Milton L. Buschbom

    发明人： Samuel D. Pritchett ,  Anthony L. Coyle ,  Milton L. Buschbom

    IPC分类号： H01L25/18 ,  H01L21/44 ,  H01L21/48

    CPC分类号： H01L25/18 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A semiconductor device has passive components integrated with the circuit and encapsulated in a plastic package for solder ball or leaded attachment. A plastic chip-scale semiconductor device has a substrate made of a plurality of patterned insulating layers alternating with patterned electrically conductive layers, the layers mutually adhering to form the substrate. The layers include a plurality of passive electrical components, such as capacitors, inductors, and resistors, and routing lines. Most routing lines terminate in a first plurality of bondable contact pads and a second plurality of solderable contact pads. The components and lines form a web and are configured mostly in a narrow peripheral band at least partially around a central substrate area, and are operable with high performance in conjunction with an integrated circuit (IC) chip. The chip is attached to the central substrate area and electrically connected to the first plurality of contact pads, respectively, whereby the passive components are integrated with the IC. Plastic encapsulation material surrounds the chip, first plurality of contact pads, and passive components such that the outline of the material is approximately the same as the outline of the chip.

    摘要翻译： 半导体器件具有与电路集成的无源元件，并封装在用于焊球或引线附件的塑料封装中。 塑料芯片级半导体器件具有由多个图案化的绝缘层与图案化的导电层交替的衬底，所述层相互粘附以形成衬底。 这些层包括多个无源电部件，例如电容器，电感器和电阻器以及布线线。 大多数路由线终止于第一多个可结合接触焊盘和第二多个可焊接接触焊盘中。 部件和线形成网状物，并且至少部分地围绕中心基板区域大部分地配置在窄的外围带中，并且与集成电路（IC）芯片结合可高性能地操作。 芯片附接到中央基板区域并分别电连接到第一多个接触焊盘，由此无源部件与IC集成。 塑料封装材料围绕芯片，第一多个接触焊盘和无源部件，使得材料的轮廓与芯片的轮廓大致相同。

    Plastic chip-scale package having integrated passive components
    4.
    发明授权
    Plastic chip-scale package having integrated passive components 有权
    具有集成无源元件的塑料芯片级封装

    公开(公告)号：US06586676B2

    公开(公告)日：2003-07-01

    申请号：US09855879

    申请日：2001-05-15

    申请人： Samuel D. Pritchett ,  Anthony L. Coyle ,  Milton L. Buschbom

    发明人： Samuel D. Pritchett ,  Anthony L. Coyle ,  Milton L. Buschbom

    IPC分类号： H01L2328

    CPC分类号： H01L25/18 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A semiconductor device has passive components integrated with the circuit and encapsulated in a plastic package for solder ball or leaded attachment. A plastic chip-scale semiconductor device has a substrate made of a plurality of patterned insulating layers alternating with patterned electrically conductive layers, the layers mutually adhering to form the substrate. The layers include a plurality of passive electrical components, such as capacitors, inductors, and resistors, and routing lines. Most routing lines terminate in a first plurality of bondable contact pads and a second plurality of solderable contact pads. The components and lines form a web and are configured mostly in a narrow peripheral band at least partially around a central substrate area, and are operable with high performance in conjunction with an integrated circuit (IC) chip. The chip is attached to the central substrate area and electrically connected to the first plurality of contact pads, respectively, whereby the passive components are integrated with the IC. Plastic encapsulation material surrounds the chip, first plurality of contact pads, and passive components such that the outline of the material is approximately the same as the outline of the chip.

    摘要翻译： 半导体器件具有与电路集成的无源元件，并封装在用于焊球或引线附件的塑料封装中。 塑料芯片级半导体器件具有由多个图案化的绝缘层与图案化的导电层交替的衬底，所述层相互粘附以形成衬底。 这些层包括多个无源电部件，例如电容器，电感器和电阻器以及布线线。 大多数路由线终止于第一多个可结合接触焊盘和第二多个可焊接接触焊盘中。 部件和线形成网状物，并且至少部分地围绕中心基板区域大部分地配置在窄的外围带中，并且与集成电路（IC）芯片结合可高性能地操作。 芯片附接到中央基板区域并分别电连接到第一多个接触焊盘，由此无源部件与IC集成。 塑料封装材料围绕芯片，第一多个接触焊盘和无源部件，使得材料的轮廓与芯片的轮廓大致相同。