公开(公告)号：US5689879A

公开(公告)日：1997-11-25

申请号：US357734

申请日：1994-12-16

申请人： Naoyuki Urasaki ,  Kouichi Tsuyama ,  Kiyoshi Hasegawa ,  Shuichi Hatakeyama ,  Akinari Kida ,  Akishi Nakaso ,  Hiroshi Nomura

发明人： Naoyuki Urasaki ,  Kouichi Tsuyama ,  Kiyoshi Hasegawa ,  Shuichi Hatakeyama ,  Akinari Kida ,  Akishi Nakaso ,  Hiroshi Nomura

IPC分类号： H05K3/02 ,  H05K3/06 ,  H05K3/38

CPC分类号： H05K3/025 ,  H05K3/062 ,  H05K2203/0152 ,  H05K2203/0307 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0723 ,  H05K2203/0726 ,  H05K3/383 ,  Y10S428/935 ,  Y10T29/49155 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/1291 ,  Y10T428/12993

摘要： A metal foil for printed wiring boards comprising a first copper layer to be adhered to a resin, a second copper layer having a sufficient strength as a metal layer and a nickel-phosphorus alloy layer containing 1.1% by weight or more of phosphorus formed between the first and second copper layers is suitable for producing printed wiring boards having excellent heat resistance, particularly during production procedures.

摘要翻译： 一种用于印刷电路板的金属箔，包括要粘附到树脂上的第一铜层，具有足够强度作为金属层的第二铜层和含有1.1重量％以上的磷的镍 - 磷合金层， 第一和第二铜层适用于制造具有优异耐热性的印刷电路板，特别是在制造过程中。

公开(公告)号：US5638598A

公开(公告)日：1997-06-17

申请号：US462853

申请日：1995-06-05

申请人： Akishi Nakaso ,  Kouichi Tsuyama ,  Akinari Kida ,  Shuichi Hatakeyama ,  Naoyuki Urasaki

发明人： Akishi Nakaso ,  Kouichi Tsuyama ,  Akinari Kida ,  Shuichi Hatakeyama ,  Naoyuki Urasaki

IPC分类号： H05K3/00 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46 ,  H01K3/10

CPC分类号： H05K3/4069 ,  H05K3/0055 ,  H05K2201/0305 ,  H05K2201/0338 ,  H05K2201/0341 ,  H05K2201/0355 ,  H05K2201/09454 ,  H05K2201/09745 ,  H05K2203/0346 ,  H05K2203/0384 ,  H05K2203/0554 ,  H05K2203/1453 ,  H05K3/06 ,  H05K3/4038 ,  H05K3/4623 ,  H05K3/4652 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A process for producing a wiring board involves laminating a metal foil on both sides of an insulating substrate not completely cured, followed by pressing with heating; drilling holes in the resulting laminate for connecting circuits therein; removing portions of the metal foils in narrow areas around the holes to form hollow portions in the metal foils; and filling a flowable electroconductive substance in the holes and the hollow portions.

摘要翻译： 制造布线板的方法包括在未完全固化的绝缘基板的两侧层压金属箔，然后加热压制; 在所得的层压板中钻孔以在其中连接电路; 在孔周围的狭窄区域中去除金属箔的部分，以在金属箔中形成中空部分; 并在孔和中空部分填充可流动的导电物质。

公开(公告)号：US5444189A

公开(公告)日：1995-08-22

申请号：US77722

申请日：1993-06-17

申请人： Akishi Nakaso ,  Kouichi Tsuyama ,  Akinari Kida ,  Shuichi Hatakeyama ,  Naoyuki Urasaki

发明人： Akishi Nakaso ,  Kouichi Tsuyama ,  Akinari Kida ,  Shuichi Hatakeyama ,  Naoyuki Urasaki

IPC分类号： H05K3/46 ,  H05K1/09 ,  H05K1/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/40 ,  H05K1/00

CPC分类号： H05K1/116 ,  H05K3/0055 ,  H05K3/062 ,  H05K3/4069 ,  H05K1/095 ,  H05K2201/0305 ,  H05K2201/0338 ,  H05K2201/0341 ,  H05K2201/0355 ,  H05K2201/09454 ,  H05K2201/09745 ,  H05K2203/0346 ,  H05K2203/0369 ,  H05K2203/0384 ,  H05K2203/0554 ,  H05K2203/1453 ,  H05K3/06 ,  H05K3/4038 ,  H05K3/4623 ,  H05K3/4652

摘要： A wiring board comprising one or more inner layer circuit substrates and outer circuit layers formed from metal foil layers on both sides of said dinner layer circuit substrates via prepregs, said inner layer circuit substrate comprising an insulating layer and metal foil layers formed on both sides of said insulating layer, at least one inner layer circuit substrate or said outer circuit layers or both having hollow portions in the metal foil layer filled with an electroconductive substance, said wiring board having one or more through-holes at least in the hollow portions and filled with the electroconductive substance, has high reliability and a high wiring density.

摘要翻译： 一种布线板，包括一个或多个内层电路基板和由所述晚餐层电路基板两侧的金属箔层经由预浸料形成的外部电路层，所述内层电路基板包括绝缘层和金属箔层， 所述绝缘层，至少一个内层电路基板或所述外电路层或两者在金属箔层中具有填充有导电物质的中空部分，所述布线板至少在中空部分中具有一个或多个通孔，并填充 与导电物质具有高可靠性和高布线密度。

公开(公告)号：US5403672A

公开(公告)日：1995-04-04

申请号：US59658

申请日：1993-05-12

申请人： Naoyuki Urasaki ,  Kouichi Tsuyama ,  Kiyoshi Hasegawa ,  Shuichi Hatakeyama ,  Akinari Kida ,  Akishi Nakaso ,  Hiroshi Nomura

发明人： Naoyuki Urasaki ,  Kouichi Tsuyama ,  Kiyoshi Hasegawa ,  Shuichi Hatakeyama ,  Akinari Kida ,  Akishi Nakaso ,  Hiroshi Nomura

IPC分类号： H05K3/02 ,  H05K3/06 ,  H05K3/38 ,  B32B15/20 ,  B32B3/30

CPC分类号： H05K3/025 ,  H05K3/062 ,  H05K2203/0152 ,  H05K2203/0307 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0723 ,  H05K2203/0726 ,  H05K3/383 ,  Y10S428/935 ,  Y10T29/49155 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/1291 ,  Y10T428/12993

摘要： A metal foil for printed wiring boards comprising a first copper layer to be adhered to a resin, a second copper layer having a sufficient strength as a metal layer and a nickel-phosphorus alloy layer containing 1.1% by weight or more of phosphorus formed between the first and second copper layers is suitable for producing printed wiring boards having excellent heat resistance, particularly during production procedures.

摘要翻译： 一种用于印刷电路板的金属箔，包括要粘附到树脂上的第一铜层，具有足够强度作为金属层的第二铜层和含有1.1重量％以上的磷的镍 - 磷合金层， 第一和第二铜层适用于制造具有优异耐热性的印刷电路板，特别是在制造过程中。

公开(公告)号：US5879568A

公开(公告)日：1999-03-09

申请号：US870379

申请日：1997-06-06

申请人： Naoyuki Urasaki ,  Kouichi Tsuyama ,  Kazuhito Kobayashi ,  Norio Okano ,  Hiroshi Shimizu ,  Nobuyuki Ogawa ,  Akishi Nakaso ,  Toyoki Ito ,  Daisuke Fujimoto ,  Kazuhisa Otsuka ,  Shigeharu Arike ,  Yoshiyuki Tsuru

发明人： Naoyuki Urasaki ,  Kouichi Tsuyama ,  Kazuhito Kobayashi ,  Norio Okano ,  Hiroshi Shimizu ,  Nobuyuki Ogawa ,  Akishi Nakaso ,  Toyoki Ito ,  Daisuke Fujimoto ,  Kazuhisa Otsuka ,  Shigeharu Arike ,  Yoshiyuki Tsuru

IPC分类号： H05K1/00 ,  H05K3/00 ,  H05K3/02 ,  H05K3/46 ,  B44C1/22

CPC分类号： H05K3/4655 ,  H05K3/0035 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01078 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0554 ,  H05K3/0094 ,  H05K3/025 ,  H05K3/4652 ,  H05K3/4676

摘要： A multilayer printed circuit board small in interlayer thickness, capable of fine wiring, minimized in IVH and BVH diameters, high in strength and also excellent in wire bonding workability can be produced by a process comprising the steps of coating a thermosetting resin varnish compounded with electrically insulating whiskers on a roughened side of a copper foil, semi-curing the resin by heating to form a thermosetting resin layer, integrally laminating it on an interlayer board in which plated through-holes and conductor circudits have been formed, and roughening the cured thermosetting resin layer on the via hole wall surfaces with a roughening agent.

摘要翻译： 可以通过包括以下步骤的方法制备层间厚度小的能够精细布线，IVH和BVH直径最小化，强度高以及引线键合加工性优异的多层印刷电路板，其中包括以下步骤：涂覆电化学复合的热固性树脂清漆 在铜箔的粗糙面上的绝缘晶须，通过加热半固化以形成热固性树脂层，将其整体地层压在已经形成电镀通孔和导体环形的夹层板上，并使固化的热固性树脂 树脂层在通孔壁表面上用粗糙剂。

公开(公告)号：US06197149B1

公开(公告)日：2001-03-06

申请号：US09057522

申请日：1998-04-09

申请人： Kazuhito Kobayashi ,  Yasushi Kumashiro ,  Atsushi Takahashi ,  Koji Morita ,  Takahiro Tanabe ,  Kazunori Yamamoto ,  Akishi Nakaso ,  Shigeharu Arike ,  Kazuhisa Otsuka ,  Naoyuki Urasaki ,  Daisuke Fujimoto ,  Nozomu Takano

发明人： Kazuhito Kobayashi ,  Yasushi Kumashiro ,  Atsushi Takahashi ,  Koji Morita ,  Takahiro Tanabe ,  Kazunori Yamamoto ,  Akishi Nakaso ,  Shigeharu Arike ,  Kazuhisa Otsuka ,  Naoyuki Urasaki ,  Daisuke Fujimoto ,  Nozomu Takano

IPC分类号： C09J500

CPC分类号： H05K3/4655 ,  C09D5/00 ,  H05K1/0373 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0248 ,  H05K2201/0355 ,  H05K2201/0358 ,  Y10T428/24994 ,  Y10T428/249944 ,  Y10T428/249946 ,  Y10T428/249952

摘要： An insulating varnish comprising a resin component, electrical insulating whiskers, and if necessary, one or more additives such as an ion adsorbent, and/or an organic reagent for preventing injury from copper, produced by adding the additives to the resin component and the whiskers, or filtering the whiskers, or milled by using a beads mill or a three-roll mill, or the like, is excellent for producing a multilayer printed circuit board having high wiring density, high reliability and excellent other electrical properties.

摘要翻译： 一种绝缘漆，其包括树脂组分，电绝缘晶须，并且如果需要，可以使用一种或多种添加剂，例如离子吸附剂和/或用于防止铜损伤的有机试剂，其通过将添加剂添加到树脂组分和晶须 或过滤晶须，或通过使用珠磨机或三辊研磨机等进行研磨，对于制造具有高布线密度，高可靠性和优异的其它电性能的多层印刷电路板是优异的。

公开(公告)号：US5690837A

公开(公告)日：1997-11-25

申请号：US576488

申请日：1995-12-21

申请人： Akishi Nakaso ,  Koichi Tsuyama ,  Kazuhisa Otsuka ,  Haruo Ogino ,  Yoshihiro Tamura ,  Teiichi Inada ,  Kazunori Yamamoto ,  Akinari Kida ,  Atsushi Takahashi ,  Yoshiyuki Tsuru ,  Shigeharu Arike

发明人： Akishi Nakaso ,  Koichi Tsuyama ,  Kazuhisa Otsuka ,  Haruo Ogino ,  Yoshihiro Tamura ,  Teiichi Inada ,  Kazunori Yamamoto ,  Akinari Kida ,  Atsushi Takahashi ,  Yoshiyuki Tsuru ,  Shigeharu Arike

IPC分类号： H05K3/00 ,  H05K3/02 ,  H05K3/38 ,  H05K3/46 ,  B44C1/22 ,  C23F1/00

CPC分类号： H05K3/4652 ,  H05K3/0055 ,  H05K2201/0209 ,  H05K2203/063 ,  H05K2203/0773 ,  H05K2203/0789 ,  H05K2203/0793 ,  H05K2203/0796 ,  H05K3/025 ,  H05K3/381

摘要： In a process for producing a multilayer printed circuit board comprising drilling holes for via holes in a composite film material containing at least a copper foil and an insulating half-cured adhesive layer, laminating the resulting film material on an innerlayer circuit substrate, ad electrically connecting an innerlayer circuit with an outer layer copper foil, when an adhesive resin flowed into the holes is roughened, or when a composite film material having a copper foil of less than 12 .mu.m thick formed on a carrier is used, or a special cushion material is further laminated on the laminate of the innerlayer circuit substrate and the film material, electrical connection reliability is enhanced and circuit density can be increased with easy steps.

摘要翻译： 在制造多层印刷电路板的方法中，该多层印刷电路板包括至少包含铜箔和绝缘半固化粘合剂层的复合膜材料中的通孔钻孔，将所得薄膜材料层叠在内层电路基板上，电连接 具有外层铜箔的内层电路当流入孔中的粘合剂树脂被粗糙化时，或者当使用形成在载体上的具有小于12μm厚的铜箔的复合膜材料或特殊的缓冲材料 进一步层压在内层电路基板和膜材料的层压体上，提高了电连接的可靠性，并且通过简单的步骤可以提高电路密度。

公开(公告)号：US06281450B1

公开(公告)日：2001-08-28

申请号：US09446674

申请日：1999-12-27

申请人： Naoyuki Urasaki ,  Yasusi Simada ,  Yoshiyuki Tsuru ,  Akishi Nakaso ,  Itsuo Watanabe

发明人： Naoyuki Urasaki ,  Yasusi Simada ,  Yoshiyuki Tsuru ,  Akishi Nakaso ,  Itsuo Watanabe

IPC分类号： H01R909

CPC分类号： H01L24/32 ,  H01L21/563 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5386 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83051 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/15192 ,  H05K1/114 ,  H05K1/189 ,  H05K3/28 ,  H05K3/323 ,  H05K2201/09509 ,  H05K2201/10674 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

摘要： A substrate for mounting a semiconductor chip having bumps using an adhesive thereon, said substrate being, for instance, provided with an insulating coating having an opening in the semiconductor chip mounting area so that the wiring conductors will not be exposed to the substrate surface near the boundary of the semiconductor chip mounting area, is improved in connection reliability and has high mass productivity.

摘要翻译： 用于使用粘合剂安装具有凸块的半导体芯片的基板，所述基板例如设置有在半导体芯片安装区域中具有开口的绝缘涂层，使得布线导体将不会暴露于靠近基板表面的基板表面 半导体芯片安装面积的边界在连接可靠性方面提高，并且具有高的批量生产率。

公开(公告)号：US20080010819A1

公开(公告)日：2008-01-17

申请号：US11775294

申请日：2007-07-10

申请人： Hidehiro NAKAMURA ,  Akishi Nakaso ,  Shigeharu Arike ,  Fumio Inoue ,  Tetsuya Enomoto ,  Norio Moriike ,  Kousuke Hiroki

发明人： Hidehiro NAKAMURA ,  Akishi Nakaso ,  Shigeharu Arike ,  Fumio Inoue ,  Tetsuya Enomoto ,  Norio Moriike ,  Kousuke Hiroki

IPC分类号： H05K3/30

CPC分类号： H05K3/4617 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/0097 ,  H05K3/06 ,  H05K3/244 ,  H05K3/4038 ,  H05K3/4623 ,  H05K3/4632 ,  H05K3/4647 ,  H05K2201/0141 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where a conductor circuit is connected, and a multi-layer wiring board, a substrate for semiconductor package and a semiconductor package using the connection board, and methods for manufacturing them.

摘要翻译： 本发明提供一种由一层或两层以上的绝缘树脂组合物层形成的连接板，以及形成为在其绝缘树脂组合物层的厚度方向上形成的连接导体， 连接导体电路，并且使用多层布线板，半导体封装用基板和使用该连接基板的半导体封装，以及其制造方法。

公开(公告)号：US06207266B1

公开(公告)日：2001-03-27

申请号：US08975649

申请日：1997-11-21

申请人： Hisashige Kanbara ,  Akishi Nakaso ,  Minoru Tosaka

发明人： Hisashige Kanbara ,  Akishi Nakaso ,  Minoru Tosaka

IPC分类号： H05K900

CPC分类号： H05K9/0096 ,  H01J29/868 ,  Y10T428/25 ,  Y10T428/256

摘要： Provided is bonding film in the form of web which has a high electromagnetic shielding effect for electromagnetic radiation from the front surface of a display device, and other favorable properties such as an infrared blocking property, a transparency, a invisibility and a favorable bonding property. The bonding film typically includes base film, a geometrically patterned electroconductive layer placed over the base film so as to achieve an aperture ratio of 80% of more, and a bonding layer for attaching the assembly to an object. The film may be applied to the surface of a transparent sheet member for the convenience of handling, and such an assembly has a symmetric structure so that the warping of the assembly may be minimized. The bonding film may be interposed between a pair transparent base sheets, or the bonding film may be applied over two sides a transparent base sheet. The assembly may further include an infrared blocking layer and an anti-glare layer.

摘要翻译： 提供了对从显示装置的前表面进行电磁辐射具有高电磁屏蔽效果的卷材形式的接合膜以及诸如红外线阻挡性，透明性，不可见性和良好的粘合性等的其它有利特性。 接合膜通常包括基膜，放置在基膜上的几何图案化的导电层，以达到80％以上的孔径比，以及用于将组件附接到物体的粘合层。 为了便于操作，膜可以施加到透明片材的表面，并且这种组件具有对称结构，使得组件的翘曲可以最小化。 接合膜可以插入在一对透明基片之间，或者接合膜可以在两侧涂覆有透明基片。 组件还可以包括红外阻挡层和防眩层。