-
1.
公开(公告)号:US20140004660A1
公开(公告)日:2014-01-02
申请号:US13539188
申请日:2012-06-29
申请人: Ming-Chung Sung , Yung Ching Chen , Chien-Hsiun Lee , Chen-Hua Yu , Mirng-Ji Lii
发明人: Ming-Chung Sung , Yung Ching Chen , Chien-Hsiun Lee , Chen-Hua Yu , Mirng-Ji Lii
IPC分类号: H01L21/50
CPC分类号: H01L21/4825 , H01L21/4853 , H01L23/49811 , H01L24/11 , H01L24/742 , H01L24/78 , H01L2224/1134 , H01L2224/45144 , H01L2224/742 , H01L2224/78 , H01L2224/78301 , H01L2924/12042 , H01L2924/00014 , H01L2924/00
摘要: Disclosed herein is a system and method for mounting semiconductor packages by forming one or more interconnects, optionally, with a wirebonder, and mounting the interconnects to a mounting pad on a target package. Mounting the interconnect may comprise ultrasonically welding the interconnects to the mounting pads, and the interconnect may be mounted via a mounting node on the end of the interconnect, wherein the mounting node may be formed by an electric flame off process. The interconnects may be trimmed to one or more substantially uniform heights, optionally using a laser or contact-type trimming system, and the tails of the interconnects may be supported during trimming. A top package may be bonded on the trimmed ends of the interconnects. During mounting, a support plate may be used to support the package, and a mask maybe used during interconnect mounting.
摘要翻译: 本文公开了一种用于通过形成一个或多个互连件,可选地用引线键合器安装半导体封装以及将互连件安装到目标封装上的安装焊盘来安装半导体封装件的系统和方法。 安装互连可以包括将互连件超声波焊接到安装焊盘,并且互连可以经由互连端部上的安装节点来安装,其中安装节点可以由电火焰熄灭工艺形成。 互连可以被修剪到一个或多个基本均匀的高度,可选地使用激光或接触式修剪系统,并且在修剪期间可以支撑互连的尾部。 顶部封装可以结合在互连件的修剪端上。 在安装期间,可以使用支撑板来支撑封装,并且在互连安装期间可以使用掩模。
-
公开(公告)号:US20130093084A1
公开(公告)日:2013-04-18
申请号:US13272009
申请日:2011-10-12
申请人: Hsien-Wei Chen , Tsung-Ding Wang , Chien-Hsiun Lee , Hao-Yi Tsai , Mirng-Ji Lii , Chen-Hua Yu
发明人: Hsien-Wei Chen , Tsung-Ding Wang , Chien-Hsiun Lee , Hao-Yi Tsai , Mirng-Ji Lii , Chen-Hua Yu
IPC分类号: H01L23/498
CPC分类号: H01L24/32 , H01L21/563 , H01L23/525 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/73 , H01L24/98 , H01L2224/0401 , H01L2224/05008 , H01L2224/05569 , H01L2224/05572 , H01L2224/10156 , H01L2224/131 , H01L2224/14131 , H01L2224/16225 , H01L2224/16227 , H01L2224/29011 , H01L2224/32052 , H01L2224/32057 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83104 , H01L2924/00014 , H01L2924/014 , H01L2924/00012 , H01L2924/00 , H01L2224/05552
摘要: A package includes a printed circuit board (PCB), and a die bonded to the PCB through solder balls. A re-workable underfill is dispensed in a region between the PCB and the die.
摘要翻译: 封装包括印刷电路板(PCB),以及通过焊球与PCB结合的芯片。 在PCB和模具之间的区域中分配可重新加工的底部填充物。
-
公开(公告)号:US08334170B2
公开(公告)日:2012-12-18
申请号:US12163464
申请日:2008-06-27
申请人: Dean Wang , Chien-Hsiun Lee , Chen-Shien Chen , Clinton Chao , Mirng-Ji Lii , Tjandra Winata Karta
发明人: Dean Wang , Chien-Hsiun Lee , Chen-Shien Chen , Clinton Chao , Mirng-Ji Lii , Tjandra Winata Karta
IPC分类号: H01L23/498 , H01L21/56
CPC分类号: H01L23/49811 , H01L23/481 , H01L24/27 , H01L24/29 , H01L24/33 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/95 , H01L25/0657 , H01L25/50 , H01L2224/131 , H01L2224/16145 , H01L2224/27416 , H01L2224/27436 , H01L2224/27848 , H01L2224/2919 , H01L2224/32145 , H01L2224/73104 , H01L2224/73204 , H01L2224/75744 , H01L2224/8121 , H01L2224/81815 , H01L2224/8321 , H01L2224/83856 , H01L2224/83862 , H01L2224/83986 , H01L2224/9205 , H01L2224/9211 , H01L2224/9221 , H01L2224/94 , H01L2224/95 , H01L2225/06513 , H01L2225/06517 , H01L2225/06527 , H01L2225/06541 , H01L2225/06589 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/1306 , H01L2924/13091 , H01L2924/1461 , H01L2924/181 , H01L2924/3512 , H01L2924/00014 , H01L2924/01014 , H01L2924/00
摘要: A method for fabricating a semiconductor device is provided which includes providing a first device, a second device, and a third device, providing a first coating material between the first device and the second device, the first coating material being uncured, providing a second coating material between the second device and the third device, the second coating material being uncured, and thereafter, curing the first and second coating materials in a same process.
摘要翻译: 提供了一种用于制造半导体器件的方法,其包括提供第一器件,第二器件和第三器件,在第一器件和第二器件之间提供第一涂层材料,第一涂层材料是未固化的,提供第二涂层 第二装置和第三装置之间的材料,第二涂料未固化,然后以相同的方法固化第一和第二涂料。
-
公开(公告)号:US20090321948A1
公开(公告)日:2009-12-31
申请号:US12163464
申请日:2008-06-27
申请人: Dean Wang , Chien-Hsiun Lee , Chen-Shien Chen , Clinton Chao , Mirng-Ji Lii , Tjandra Winata Karta
发明人: Dean Wang , Chien-Hsiun Lee , Chen-Shien Chen , Clinton Chao , Mirng-Ji Lii , Tjandra Winata Karta
IPC分类号: H01L23/498 , H01L21/56
CPC分类号: H01L23/49811 , H01L23/481 , H01L24/27 , H01L24/29 , H01L24/33 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/95 , H01L25/0657 , H01L25/50 , H01L2224/131 , H01L2224/16145 , H01L2224/27416 , H01L2224/27436 , H01L2224/27848 , H01L2224/2919 , H01L2224/32145 , H01L2224/73104 , H01L2224/73204 , H01L2224/75744 , H01L2224/8121 , H01L2224/81815 , H01L2224/8321 , H01L2224/83856 , H01L2224/83862 , H01L2224/83986 , H01L2224/9205 , H01L2224/9211 , H01L2224/9221 , H01L2224/94 , H01L2224/95 , H01L2225/06513 , H01L2225/06517 , H01L2225/06527 , H01L2225/06541 , H01L2225/06589 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/1306 , H01L2924/13091 , H01L2924/1461 , H01L2924/181 , H01L2924/3512 , H01L2924/00014 , H01L2924/01014 , H01L2924/00
摘要: A method for fabricating a semiconductor device is provided which includes providing a first device, a second device, and a third device, providing a first coating material between the first device and the second device, the first coating material being uncured, providing a second coating material between the second device and the third device, the second coating material being uncured, and thereafter, curing the first and second coating materials in a same process.
摘要翻译: 提供了一种用于制造半导体器件的方法,其包括提供第一器件,第二器件和第三器件,在第一器件和第二器件之间提供第一涂层材料,第一涂层材料是未固化的,提供第二涂层 第二装置和第三装置之间的材料,第二涂料未固化,然后以相同的方法固化第一和第二涂料。
-
公开(公告)号:US20080128885A1
公开(公告)日:2008-06-05
申请号:US11565375
申请日:2006-11-30
申请人: Chien-Hsiun Lee , Mirng-Ji Lii
发明人: Chien-Hsiun Lee , Mirng-Ji Lii
IPC分类号: H01L23/48
CPC分类号: H01L21/563 , H01L23/3114 , H01L23/3171 , H01L24/10 , H01L24/13 , H01L2224/05001 , H01L2224/05026 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05568 , H01L2224/056 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/13 , H01L2224/13022 , H01L2224/131 , H01L2224/73203 , H01L2924/00013 , H01L2924/01006 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2224/13099 , H01L2924/00 , H01L2924/00014
摘要: A stress decoupling structure provided underneath the under-ball-metallurgy (UBM) pads of a flip-chip bonding integrated circuit (IC) chip enhances the cyclic fatigue life of the solder joints formed by the solder bumps on the IC chip. The stress decoupling structure is formed from an elastic polymer layer provided over the active surface of the integrated circuit chip. A plurality of conductive metal posts are formed in the elastic polymer layer, extending between one of the contact pads on the active surface of the chip and one of the UBM pads. Solder bumps provided on the UBM pads form the solder joints between the chip and the next level interconnect structure.
摘要翻译: 在倒装芯片接合集成电路(IC)芯片的下球冶金(UBM)焊盘下面提供的应力去耦结构增强了由IC芯片上的焊料凸块形成的焊点的循环疲劳寿命。 应力去耦结构由设置在集成电路芯片的有源表面上的弹性聚合物层形成。 多个导电金属柱形成在弹性聚合物层中,在芯片的有效表面上的一个接触焊盘之一和UBM焊盘之一之间延伸。 UBM焊盘上提供的焊料凸块形成芯片和下一级互连结构之间的焊接点。
-
公开(公告)号:US20070238220A1
公开(公告)日:2007-10-11
申请号:US11393050
申请日:2006-03-29
申请人: Mirng-Ji Lii , Szu Lu , Tjandra Karta , Chien-Hsiun Lee
发明人: Mirng-Ji Lii , Szu Lu , Tjandra Karta , Chien-Hsiun Lee
IPC分类号: H01L21/00
CPC分类号: H01L21/563 , H01L23/295 , H01L23/3128 , H01L2224/05022 , H01L2224/05124 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05184 , H01L2224/05572 , H01L2224/05573 , H01L2224/05644 , H01L2224/05647 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/01019 , H01L2924/01063 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/01327 , H01L2924/15311 , H01L2924/00 , H01L2924/00014
摘要: A method includes joining an integrated circuit die having at least one low-k dielectric layer to a package substrate or printed circuit board using a plurality of solder bumps located between the die and the package substrate or printed circuit board. The low-k dielectric layer has a dielectric constant of about 3.0 or less. The solder bumps have a lead concentration of about 5% or less. A stratified underfill is formed between the die and the package substrate or printed circuit board.
摘要翻译: 一种方法包括使用位于管芯和封装衬底或印刷电路板之间的多个焊料凸块将具有至少一个低k电介质层的集成电路管芯连接到封装衬底或印刷电路板。 低k电介质层的介电常数约为3.0或更小。 焊锡凸块的铅浓度约为5%以下。 在模具和封装衬底或印刷电路板之间形成分层的底部填充物。
-
公开(公告)号:US09768105B2
公开(公告)日:2017-09-19
申请号:US13452589
申请日:2012-04-20
申请人: Mirng-Ji Lii , Chen-Hua Yu , Chien-Hsiun Lee , Yung Ching Chen , Jiun Yi Wu
发明人: Mirng-Ji Lii , Chen-Hua Yu , Chien-Hsiun Lee , Yung Ching Chen , Jiun Yi Wu
IPC分类号: H01L25/07 , H01L21/60 , H01L23/498 , H01L23/538 , H01L23/00 , H01L23/528 , H01L25/10
CPC分类号: H01L23/49838 , H01L23/49811 , H01L23/5283 , H01L23/5386 , H01L24/13 , H01L24/16 , H01L24/20 , H01L24/24 , H01L25/105 , H01L2224/16238 , H01L2224/48091 , H01L2224/48227 , H01L2225/1023 , H01L2225/1058 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要: System and method are disclosed for creating a rigid interconnect between two substrate mounted packages to create a package-on-package assembly. A solid interconnect may have a predetermined length configured to provide a predetermined package separation, may be cylindrical, conical or stepped, may be formed by extrusion, casting, drawing or milling and may have an anti-oxidation coating. The interconnect may be attached to mounting pads on the top and bottom packages via an electrically conductive adhesive, including, but not limited to solder and solder paste. A solder preservative or other anti-oxidation coating may be applied to the mounting pad. A package-on-package assembly with solid interconnects may have a top package configured to accept at least one electronic device, with the solid interconnects mounted between the top package and a bottom package to rigidly hold the package about parallel to each other.
-
8.
公开(公告)号:US09449941B2
公开(公告)日:2016-09-20
申请号:US13178161
申请日:2011-07-07
申请人: Pei-Chun Tsai , Sheng-Yu Wu , Ching-Wen Hsiao , Tin-Hao Kuo , Chen-Shien Chen , Chung-Shi Liu , Chien-Hsiun Lee , Mirng-Ji Lii
发明人: Pei-Chun Tsai , Sheng-Yu Wu , Ching-Wen Hsiao , Tin-Hao Kuo , Chen-Shien Chen , Chung-Shi Liu , Chien-Hsiun Lee , Mirng-Ji Lii
IPC分类号: H01L29/00 , H01L23/00 , H01L25/065 , H01L25/18
CPC分类号: H01L24/73 , H01L25/0652 , H01L25/0657 , H01L25/18 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/16 , H01L2224/16238 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2225/06517 , H01L2225/06562 , H01L2924/00014 , H01L2924/1434 , H01L2924/15311 , H01L2924/00012 , H01L2924/014 , H01L2924/00 , H01L2224/48
摘要: A package-on-package (PoP) comprises a substrate with a plurality of substrate traces, a first function chip on top of the substrate connected to the substrate by a plurality of bond-on-trace connections, and a second function chip on top of the first function chip, directly connected to the substrate. Another package-on-package (PoP) comprises: a substrate with a plurality of substrate traces, a first function chip on top of the substrate connected to the substrate by a plurality of solder mask defined (SMD) connections formed on SMD bonding pads connected to solder bumps, and a second function chip on top of the first function chip, directly connected to the substrate by a plurality of bond-on-trace connections.
摘要翻译: 封装封装(PoP)包括具有多个衬底迹线的衬底,通过多个贴合在轨迹连接与衬底连接的衬底顶部的第一功能芯片,以及顶部上的第二功能芯片 的第一功能芯片,直接连接到基板。 另一个封装封装(PoP)包括:具有多个衬底迹线的衬底,通过在连接的SMD焊盘上形成的多个焊接掩模限定(SMD)连接到衬底的顶部上的第一功能芯片 焊料凸点,以及位于第一功能芯片顶部的第二功能芯片,通过多个贴合在线跟踪连接直接连接到基板。
-
公开(公告)号:US20100314756A1
公开(公告)日:2010-12-16
申请号:US12537001
申请日:2009-08-06
申请人: Mirng-Ji Lii , Chien-Hsiun Lee , Chen-Hua Yu , Shin-Puu Jeng , Chin-Yu Ku
发明人: Mirng-Ji Lii , Chien-Hsiun Lee , Chen-Hua Yu , Shin-Puu Jeng , Chin-Yu Ku
IPC分类号: H01L23/498
CPC分类号: H01L24/05 , H01L24/12 , H01L24/16 , H01L2224/0401 , H01L2224/05022 , H01L2224/05027 , H01L2224/05572 , H01L2224/0558 , H01L2224/056 , H01L2224/13023 , H01L2224/131 , H01L2224/29111 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/05042 , H01L2924/10253 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/00014 , H01L2924/00 , H01L2224/05552
摘要: An integrated circuit structure includes a semiconductor substrate, and a polyimide layer over the semiconductor substrate. An under-bump-metallurgy (UBM) has a first portion over the polyimide layer, and a second portion level with the polyimide layer. A first solder bump and a second solder bump are formed over the polyimide layer, with a pitch between the first solder bump and the second solder bump being no more than 150 μm. A width of the UBM equals one-half of the pitch plus a value greater than 5 μm.
摘要翻译: 集成电路结构包括半导体衬底和半导体衬底上的聚酰亚胺层。 凸块下冶金(UBM)在聚酰亚胺层上具有第一部分,并且具有与聚酰亚胺层的第二部分水平。 第一焊料凸块和第二焊料凸块形成在聚酰亚胺层上,第一焊料凸块和第二焊料凸块之间的间距不超过150μm。 UBM的宽度等于间距的一半加上大于5μm的值。
-
公开(公告)号:US20100273296A1
公开(公告)日:2010-10-28
申请号:US12829017
申请日:2010-07-01
申请人: Hsin-Hui Lee , Mirng-Ji Lii , Chien-Hsiun Lee
发明人: Hsin-Hui Lee , Mirng-Ji Lii , Chien-Hsiun Lee
IPC分类号: H01L21/56
CPC分类号: H01L23/4334 , H01L21/56 , H01L23/3107 , H01L24/19 , H01L24/97 , H01L2224/05548 , H01L2224/05571 , H01L2224/05573 , H01L2224/12105 , H01L2224/16 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/94 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01082 , H01L2924/1305 , H01L2924/1306 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2224/19 , H01L2224/83 , H01L2924/00 , H01L2224/05599 , H01L2224/03
摘要: A method of forming a package structure includes providing a plurality of dies; attaching the plurality of dies onto a heat-dissipating plate; and sawing the heat-dissipating plate into a plurality of packages, each including one of the plurality of dies and a piece of the heat-dissipating plate.
摘要翻译: 形成封装结构的方法包括提供多个管芯; 将多个模具附接到散热板上; 以及将所述散热板锯切成多个封装,每个封装包括所述多个管芯中的一个和所述散热板的一个。
-
-
-
-
-
-
-
-
-