公开(公告)号：US20110180938A1

公开(公告)日：2011-07-28

申请号：US13005741

申请日：2011-01-13

申请人： Kazuya HIRASAWA ,  Yuuji Ootani ,  Akiyoshi Asai ,  Hirokazu Imai ,  Hiroyoshi Kunieda ,  Harumi Kodama ,  Masayuki Onishi ,  Ryo Sakaguchi ,  Kazumi Nakayoshi

发明人： Kazuya HIRASAWA ,  Yuuji Ootani ,  Akiyoshi Asai ,  Hirokazu Imai ,  Hiroyoshi Kunieda ,  Harumi Kodama ,  Masayuki Onishi ,  Ryo Sakaguchi ,  Kazumi Nakayoshi

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L23/4334 ,  C08G77/04 ,  C08G77/20 ,  C08L83/04 ,  H01L23/296 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/49531 ,  H01L24/13 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  C08L83/00 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： In an electronic device, a silicone adhesive bonding first and second members is made from a composition comprising: (A) 100 parts by mass of an organopolysiloxane containing in one molecule at least two alkenyl groups and being free of silicon-bonded hydroxyl and alkoxy groups wherein the content of cyclic siloxanes having 4 to 20 siloxane units is at most 0.1 mass %; (B) an organopolysiloxane containing in one molecule at least two silicon-bonded hydrogen atoms and being free of an alkenyl group, and silicon-bonded hydroxyl and alkoxy groups; (C) at least 0.05 parts by mass of an adhesion promoter; (D) 100 to 2000 parts by mass of a thermally conductive filler; and (E) a hydrosilylation-reaction catalyst. (B) is contained such that the silicon-bonded hydrogen atoms is in the range of 0.5 to 10 mol per 1 mol of the alkenyl groups of (A), and the sum of (B) and (C) is 0.5 to 10 mass % of the sum of (A), (B) and (C).

摘要翻译： 在电子设备中，粘合第一和第二构件的硅氧烷粘合剂由以下组合物制成：（A）100质量份在一分子中含有至少两个烯基并且不含硅键合的羟基和烷氧基的有机聚硅氧烷 其中具有4〜20个硅氧烷单元的环状硅氧烷的含量为0.1质量％以下。 （B）在一个分子中含有至少两个与硅键合的氢原子并且不含烯基的有机聚硅氧烷和与硅键合的羟基和烷氧基; （C）至少0.05质量份粘合促进剂; （D）100〜2000质量份导热性填料; 和（E）氢化硅烷化反应催化剂。 包含（B），使得与（A）的链烯基相比，与硅键合的氢原子为0.5〜10摩尔的范围，（B）和（C）的和为0.5〜10质量％ （A），（B）和（C）的总和的百分比。

公开(公告)号：US07807073B2

公开(公告)日：2010-10-05

申请号：US11798797

申请日：2007-05-17

申请人： Masashi Totokawa ,  Yuji Ootani ,  Hirokazu Imai ,  Akira Shintai

发明人： Masashi Totokawa ,  Yuji Ootani ,  Hirokazu Imai ,  Akira Shintai

IPC分类号： H01L23/58 ,  H01B1/22 ,  H05K3/02 ,  B22F1/00

CPC分类号： H01L24/29 ,  C09J9/02 ,  C09J11/04 ,  H01L24/31 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/8384 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/095 ,  H05K1/113 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T156/1057 ,  Y10T428/29 ,  Y10T428/2982 ,  Y10T428/2991 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/00014

摘要： A conductor composition being able to easily secure the conductivity at the same level as an Ag bulk at low temperature process, a mounting substrate utilizing the conductor composition and a mounting structure utilizing the conductor composition are provided. In a mounting structure, wherein one or more electrodes (11) of a mounting substrate (10) and one or more surface mounting components (20) are connected through a conductor composition (30), and one or more surface wirings (14) of the mounting substrate (10), one or more inner-layer wirings (13) and one or more via conductors (12) are formed with the conductor composition, the conductor composition contains conductive particles with electrical conductivity, and the conductive particles are composed of low crystallized Ag fillers with the crystal size of 10 μm or less.

摘要翻译： 提供一种导体组合物，其能够在低温处理下容易地确保与Ag体积相同的电导率，使用该导体组合物的安装基板和利用导体组合物的安装结构。 在安装结构中，其中安装基板（10）的一个或多个电极（11）和一个或多个表面安装部件（20）通过导体组合物（30）连接，以及一个或多个表面布线（14） 所述安装基板（10），一个或多个内层布线（13）和一个或多个通孔导体（12）由所述导体组合物形成，所述导体组合物包含具有导电性的导电颗粒，并且所述导电颗粒由 结晶尺寸为10μm以下的低结晶性Ag填料。

公开(公告)号：US06326239B1

公开(公告)日：2001-12-04

申请号：US09287016

申请日：1999-04-06

申请人： Yasutomi Asai ,  Hirokazu Imai ,  Yuji Ootani ,  Takashi Nagasaka

发明人： Yasutomi Asai ,  Hirokazu Imai ,  Yuji Ootani ,  Takashi Nagasaka

IPC分类号： H01L2328

CPC分类号： H01L23/544 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H05K1/0306 ,  H05K1/111 ,  H05K3/245 ,  H05K3/305 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/09427 ,  H05K2201/09663 ,  H05K2201/099 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2201/10992 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： A mounting structure includes a laminated ceramic capacitor mounted on a mounting substrate. The laminated ceramic capacitor includes a main body chip made by a ceramic dielectric, internal layer electrodes, and pair of terminal electrodes. The mounting substrate is made by alumina substrate, and has a pair of substrate electrodes made by copper plating. The laminated ceramic capacitor is mounted on the mounting substrate by using an Ag paste. Here, the substrate electrode is set to be smaller than the Ag paste. That is, the Ag paste is extruded from the terminal electrodes and the substrate electrode so as to contact to both of the main body chip and the mounting substrate. Because the Ag paste has a high adhesive strength compared to that when it is bonded with a metal, total adhesive strength can be improved. Consequently, the reliability of mounting can be improved.

摘要翻译： 安装结构包括安装在安装基板上的层叠陶瓷电容器。 层叠陶瓷电容器包括由陶瓷电介质制成的主体芯片，内层电极和一对端子电极。 安装基板由氧化铝基板制成，并具有通过镀铜制成的一对基板电极。 层叠陶瓷电容器通过使用Ag浆料安装在安装基板上。 这里，将基板电极设定为小于Ag糊料。 也就是说，Ag膏从端子电极和基板电极挤出，以便与主体芯片和安装基板接触。 由于Ag糊料与金属粘合时的粘合强度高，所以可以提高总的粘合强度。 因此，可以提高安装的可靠性。

公开(公告)号：US07276185B2

公开(公告)日：2007-10-02

申请号：US10969320

申请日：2004-10-21

申请人： Masashi Totokawa ,  Yuji Ootani ,  Hirokazu Imai ,  Akira Shintai

发明人： Masashi Totokawa ,  Yuji Ootani ,  Hirokazu Imai ,  Akira Shintai

IPC分类号： H01B1/22 ,  B32B15/01 ,  B32B27/14

CPC分类号： H01L24/29 ,  C09J9/02 ,  C09J11/04 ,  H01L24/31 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/8384 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/095 ,  H05K1/113 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T156/1057 ,  Y10T428/29 ,  Y10T428/2982 ,  Y10T428/2991 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/00014

摘要： A conductor composition being able to easily secure the conductivity at the same level as an Ag bulk at low temperature process, a mounting substrate utilizing the conductor composition and a mounting structure utilizing the conductor composition are provided. In a mounting structure, wherein one or more electrodes (11) of a mounting substrate (10) and one or more surface mounting components (20) are connected through a conductor composition (30), and one or more surface wirings (14) of the mounting substrate (10), one or more inner-layer wirings (13) and one or more via conductors (12) are formed with the conductor composition, the conductor composition contains conductive particles with electrical conductivity, and the conductive particles are composed of low crystallized Ag fillers with the crystal size of 10 nm or less.

摘要翻译： 提供一种导体组合物，其能够在低温处理下容易地确保与Ag体积相同的电导率，使用该导体组合物的安装基板和利用导体组合物的安装结构。 在安装结构中，其中安装基板（10）的一个或多个电极（11）和一个或多个表面安装部件（20）通过导体组合物（30）连接，以及一个或多个表面布线（14） 所述安装基板（10），一个或多个内层布线（13）和一个或多个通孔导体（12）由所述导体组合物形成，所述导体组合物包含具有导电性的导电颗粒，并且所述导电颗粒由 结晶尺寸为10nm以下的低结晶性Ag填料。

公开(公告)号：US20140303505A1

公开(公告)日：2014-10-09

申请号：US14356020

申请日：2012-09-10

申请人： Yoichi Toriumi ,  Hideo Kawabe ,  Kenichi Kabasawa ,  Tatsuya Suzuki ,  Hirokazu Imai ,  Masatoshi Ueno

发明人： Yoichi Toriumi ,  Hideo Kawabe ,  Kenichi Kabasawa ,  Tatsuya Suzuki ,  Hirokazu Imai ,  Masatoshi Ueno

IPC分类号： A61B5/00

CPC分类号： A61B5/0075 ,  A61B5/0079 ,  G01N21/474 ,  G01N2021/4761

摘要： There is provided a measuring apparatus, including a light receiving element, provided at a position facing a measurement object region on which is placed a measurement object, which forms an image with light from the measurement object region, light emitting elements, arranged surrounding the light receiving element, which emit light for measuring the measurement object, and reflective optical elements, provided above the light emitting elements, which guide, to the measurement object region, emission light radiated from the light emitting elements. A light receiving surface of the light receiving element and light emission surfaces of the light emitting elements are positioned mutually on a same plane. The emission light radiated from the light emitting elements is reflected by the reflective optical elements, and center lines of the emission light radiated from each of the light emitting elements pass through an approximate center of the measurement object region.

摘要翻译： 提供了一种测量装置，包括：光接收元件，设置在面向测量对象区域的位置，测量对象区域上放置有测量对象的光，其与来自测量对象区域的光形成图像;发光元件，布置在光周围 发射用于测量测量对象的光的接收元件和设置在发光元件上方的反射光学元件，其将从发光元件辐射的发射光引导到测量对象区域。 光接收元件的光接收表面和发光元件的发光表面相互位于同一平面上。 从发光元件照射的发射光被反射光学元件反射，从每个发光元件辐射的发射光的中心线通过测量对象区域的大致中心。

公开(公告)号：US20060107672A1

公开(公告)日：2006-05-25

申请号：US11284179

申请日：2005-11-21

申请人： Hiroshi Oshitani ,  Katsuya Kusano ,  Hirokazu Imai ,  Hirotsugu Takeuchi ,  Mika Saito

发明人： Hiroshi Oshitani ,  Katsuya Kusano ,  Hirokazu Imai ,  Hirotsugu Takeuchi ,  Mika Saito

IPC分类号： F25B19/02 ,  F25B1/06

CPC分类号： B60H1/00571 ,  B60H2001/3297 ,  B60H2001/3298 ,  F25B41/00 ,  F25B2309/061 ,  F25B2341/0012 ,  F25B2400/12 ,  F25B2600/023

摘要： A vapor-compression refrigerant cycle device includes an ejector, a first evaporator for evaporating refrigerant flowing out of a pressure-increasing portion of the ejector, a second evaporator for evaporating refrigerant to be drawn into a refrigerant suction port of the ejector. In the refrigerant cycle device, a refrigerant suction pipe is connected to a refrigerant outlet of the second evaporator and the refrigerant suction port of the ejector, and the surface of the refrigerant suction pipe is covered by an insulating member. Furthermore, the ejector, the first evaporator, the second evaporator and the refrigerant suction pipe are arranged in a passenger compartment of the vehicle.

摘要翻译： 蒸汽压缩式制冷剂循环装置包括喷射器，用于蒸发从喷射器的增压部分流出的制冷剂的第一蒸发器，用于蒸发要吸入喷射器的制冷剂吸入口的制冷剂的第二蒸发器。 在制冷剂循环装置中，制冷剂吸入管连接到第二蒸发器的制冷剂出口和喷射器的制冷剂吸入口，制冷剂吸入管的表面被绝缘构件覆盖。 此外，喷射器，第一蒸发器，第二蒸发器和制冷剂吸入管布置在车辆的乘客舱中。

公开(公告)号：US06731001B2

公开(公告)日：2004-05-04

申请号：US09918803

申请日：2001-08-01

申请人： Kan Kinouchi ,  Mitsuhiro Saitou ,  Takashi Nagasaka ,  Yuji Ootani ,  Hiroyuki Yamakawa ,  Koji Takeuchi ,  Hirokazu Imai ,  Yukihiro Maeda ,  Atsushi Kanamori

发明人： Kan Kinouchi ,  Mitsuhiro Saitou ,  Takashi Nagasaka ,  Yuji Ootani ,  Hiroyuki Yamakawa ,  Koji Takeuchi ,  Hirokazu Imai ,  Yukihiro Maeda ,  Atsushi Kanamori

IPC分类号： H01L2352

CPC分类号： H01L23/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/20753 ,  H01L2924/2076 ,  H05K1/0306 ,  H05K1/141 ,  H05K3/284 ,  H05K3/366 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/92247 ,  H01L2924/00

摘要： Several electronic parts are mounted on several ceramic substrates in a semiconductor device, and are wire bonded to the respective ceramic substrates through bonding wires. The electronic parts and the bonding wires are covered with an enclosing member on every ceramic substrate, and an inside of the enclosing member is filled with silicone gel for sealing. The ceramic substrates are bonded to a radiation fin together, and are mounted on a motherboard perpendicularly to the motherboard.

摘要翻译： 几个电子部件安装在半导体器件中的多个陶瓷基板上，并且通过接合线引线接合到相应的陶瓷基板。 电子部件和接合线在每个陶瓷基板上被封闭构件覆盖，并且封装构件的内部填充有用于密封的硅凝胶。 陶瓷基板一起结合到散热片上，并垂直于母板安装在母板上。

公开(公告)号：US08651699B2

公开(公告)日：2014-02-18

申请号：US13234642

申请日：2011-09-16

申请人： Hideo Kawabe ,  Yoichi Toriumi ,  Kenichi Kabasawa ,  Tatsuya Suzuki ,  Hirokazu Imai ,  Masatoshi Ueno

发明人： Hideo Kawabe ,  Yoichi Toriumi ,  Kenichi Kabasawa ,  Tatsuya Suzuki ,  Hirokazu Imai ,  Masatoshi Ueno

IPC分类号： F21S4/00

CPC分类号： H05K1/189 ,  F21V19/003 ,  F21Y2103/33 ,  F21Y2115/10 ,  G02B21/084 ,  H05K3/0064 ,  H05K2201/056 ,  H05K2201/10106 ,  Y10T156/1043

摘要： A flexible substrate includes a stripe-shaped substrate main body portion; a comb-like portion composed of a plurality of protrusions that extends from one end in the direction perpendicular to the longitudinal direction of the substrate main body portion, in the direction perpendicular to the longitudinal direction; and electronic devices that are arranged on the plurality of protrusions, respectively, in which the substrate main body portion and the comb-like portion are bendable.

摘要翻译： 柔性基板包括条形基板主体部分; 在与所述纵向方向垂直的方向上，从与所述基板主体部的长度方向垂直的方向的一端延伸的多个突起构成的梳状部， 以及分别布置在基板主体部分和梳状部分可弯曲的多个突起上的电子设备。

公开(公告)号：US20120321270A1

公开(公告)日：2012-12-20

申请号：US13517216

申请日：2010-12-22

申请人： Hirokazu Imai ,  Yuutoku Yamashita ,  Hiroshi Yamaguchi ,  Takahiko Kurosawa

发明人： Hirokazu Imai ,  Yuutoku Yamashita ,  Hiroshi Yamaguchi ,  Takahiko Kurosawa

IPC分类号： C09D175/14 ,  C09D143/04 ,  G02B6/00

CPC分类号： C03C25/106 ,  C03C25/1065 ,  C08F290/147 ,  C08G18/10 ,  C08G18/672 ,  C09D175/16 ,  G02B6/02395 ,  G02B6/036 ,  C08G18/2825 ,  C08G18/48 ,  C08G18/42

摘要： A radiation curable resin composition, containing (A) urethane oligomer containing the reactants of an aliphatic polyester or polyether diol and a diisocyanate and a monohydric alcohol, or urethane oligomer obtained by reacting the reactants of an aliphatic polyester or polyether diol and a diisocyanate with a monohydric alcohol and then reacting a hydroxyl group-containing (meth)acrylate, and (B) monofunctional acrylic monomer, and the contained quantity of (C) polyfunctional acrylic monomer is 2 mass % or less is described and claimed.

摘要翻译： 含有（A）含有脂肪族聚酯或聚醚二醇与二异氰酸酯和一元醇的反应物的氨基甲酸酯低聚物或通过使脂肪族聚酯或聚醚二醇与二异氰酸酯的反应物与二异氰酸酯反应得到的氨基甲酸酯低聚物的辐射固化型树脂组合物， 一元醇，然后使含羟基的（甲基）丙烯酸酯和（B）单官能丙烯酸类单体反应，并且含有（C）多官能丙烯酸类单体的含量为2质量％以下。

公开(公告)号：US07357883B2

公开(公告)日：2008-04-15

申请号：US11500307

申请日：2006-08-08

申请人： Yasunori Ninomiya ,  Masashi Totokawa ,  Hirokazu Imai ,  Yukinori Migitaka

发明人： Yasunori Ninomiya ,  Masashi Totokawa ,  Hirokazu Imai ,  Yukinori Migitaka

IPC分类号： H01B1/00 ,  H01B1/12

CPC分类号： H01B1/22 ,  H05K3/321 ,  H05K2201/0218 ,  H05K2201/0257 ,  H05K2201/0272 ,  Y10T428/12882 ,  Y10T428/12903 ,  Y10T428/29 ,  Y10T428/2933

摘要： A conductive adhesive is formed by mixing a plurality of conductive fillers into a thermosetting resin. The conductive filler includes a core material made of copper-based metal, a coating film made of silver and a plurality of particles made of silver. The coating film is provided on the core material to cover the core material, and the particles are provided on a surface of the coating film. Accordingly, a surface of the core material is prevented from being exposed. The conductive adhesive can be suitably used for bonding two members.

摘要翻译： 通过将多种导电填料混合到热固性树脂中形成导电粘合剂。 导电填料包括由铜基金属制成的芯材，由银制成的涂膜和多个由银制成的颗粒。 涂覆膜设置在芯材上以覆盖芯材，并且将颗粒设置在涂膜的表面上。 因此，防止芯材的表面露出。 导电粘合剂可以适合用于粘接两个部件。