公开(公告)号：US06710682B2

公开(公告)日：2004-03-23

申请号：US09971102

申请日：2001-10-03

申请人： Keiji Onishi ,  Akihiro Nanba ,  Hiroki Sato ,  Katsunori Moritoki ,  Yoshihiro Bessho ,  Kunihiro Fujii ,  Kouzou Murakami

发明人： Keiji Onishi ,  Akihiro Nanba ,  Hiroki Sato ,  Katsunori Moritoki ,  Yoshihiro Bessho ,  Kunihiro Fujii ,  Kouzou Murakami

IPC分类号： H03H964

CPC分类号： H03H9/1085 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/15174 ,  H01L2924/181 ,  H03H9/02559 ,  H03H9/0542 ,  H03H9/0547 ,  H03H9/0557 ,  H03H9/059 ,  H03H9/1092 ,  Y10T29/42 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2924/013 ,  H01L2924/01029 ,  H01L2924/01079

摘要： A surface acoustic wave device of the present invention includes a piezoelectric substrate, a plurality of comb electrodes for exciting a surface acoustic wave, disposed on a principal plane of the piezoelectric substrate, a plurality of bumps disposed on the principal plane, and an insulating sheet disposed so as to be opposed to the principal plane, wherein the bumps and the comb electrodes are connected electrically to each other, and the bumps penetrate through the insulating sheet.

摘要翻译： 本发明的声表面波装置包括：压电基板，设置在压电基板的主面上的多个用于激励表面声波的梳形电极，设置在主平面上的多个凸块和绝缘片 被设置为与主平面相对，其中凸块和梳电极彼此电连接，并且凸块穿过绝缘片。

公开(公告)号：US07134198B2

公开(公告)日：2006-11-14

申请号：US10654343

申请日：2003-09-03

申请人： Seiichi Nakatani ,  Yoshihiro Bessho ,  Yasuhiro Sugaya ,  Keiji Onishi

发明人： Seiichi Nakatani ,  Yoshihiro Bessho ,  Yasuhiro Sugaya ,  Keiji Onishi

IPC分类号： H05K3/30

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L23/3107 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/81005 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/187 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/10378 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49146 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05624 ,  H01L2924/00014

摘要： A method for manufacturing an electric element built-in module including flip-chip mounting at least one electric element such as a semiconductor chip or a surface acoustic wave device on a wiring pattern, sealing the electric element with a thermosetting resin composition, and grinding or abrading the thermosetting resin composition and electric element from a side of the electric element opposite that of the wiring pattern. The method provides upper surfaces of the electric element and the thermosetting resin composition that are substantially flush with each other. The method provides an electric element built-in module suitable for high-density packaging with a reduced thickness without damaging the electric element and while maintaining mechanical strength.

摘要翻译： 一种电气元件内置模块的制造方法，其包括在布线图案上安装诸如半导体芯片或表面声波装置的至少一个电气元件的倒装芯片，用热固性树脂组合物密封电气元件，以及研磨或 从电气元件的与布线图案相反的一侧研磨热固性树脂组合物和电气元件。 该方法提供电气元件和热固性树脂组合物的彼此基本齐平的上表面。 该方法提供一种电子元件内置模块，适用于厚度较小的高密度封装，而不会损坏电气元件，同时保持机械强度。

公开(公告)号：US06798121B2

公开(公告)日：2004-09-28

申请号：US09979374

申请日：2001-11-16

申请人： Seiichi Nakatani ,  Yoshihiro Bessho ,  Yasuhiro Sugaya ,  Keiji Onishi

发明人： Seiichi Nakatani ,  Yoshihiro Bessho ,  Yasuhiro Sugaya ,  Keiji Onishi

IPC分类号： H01L4108

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L23/3107 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/81005 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/187 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/10378 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49146 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05624 ,  H01L2924/00014

摘要： At least two electric elements (203) such as semiconductor chips or surface acoustic wave devices are mounted on wiring patterns (201), and the electric elements (203) are sealed with a thermosetting resin composition (204). An upper surface of the at least two electric elements (203) and an upper surface of the thermosetting resin composition (204) are abraded at the same time, thereby forming surfaces substantially flush with each other. Since they are abraded while being sealed with the thermosetting resin composition (204), it is possible to reduce the thickness without damaging the electric elements (203). Also, the electric elements (203) and the wiring patterns (201) can be prevented from being contaminated by an abrasive liquid. In this manner, it is possible to obtain an electric element built-in module whose thickness can be reduced while maintaining its mechanical strength.

摘要翻译： 至少两个电子元件（203）如半导体芯片或表面声波器件安装在布线图案（201）上，电气元件（203）用热固性树脂组合物（204）密封。 所述至少两个电气元件（203）的上表面和所述热固性树脂组合物（204）的上表面同时被磨损，从而形成彼此基本齐平的表面。 由于它们在用热固性树脂组合物（204）密封的同时被磨损，所以可以减小厚度而不损坏电气元件（203）。 此外，可以防止电气元件（203）和布线图案（201）被研磨液体污染。 以这种方式，可以获得能够在保持其机械强度的同时减小其厚度的电子元件内置模块。

公开(公告)号：US5920142A

公开(公告)日：1999-07-06

申请号：US813279

申请日：1997-03-10

申请人： Keiji Onishi ,  Hideki Iwaki ,  Shun-ichi Seki ,  Yutaka Taguchi ,  Tsukasa Shiraishi ,  Yoshihiro Bessho ,  Osamu Kawasaki ,  Kazuo Eda

发明人： Keiji Onishi ,  Hideki Iwaki ,  Shun-ichi Seki ,  Yutaka Taguchi ,  Tsukasa Shiraishi ,  Yoshihiro Bessho ,  Osamu Kawasaki ,  Kazuo Eda

IPC分类号： H03H3/08 ,  H03H9/10 ,  H01L41/08

CPC分类号： H03H9/0509 ,  H03H3/08 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1042 ,  H03H9/1071 ,  H03H9/1085 ,  H03H9/1092 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/45144 ,  H01L2924/00013 ,  H01L2924/09701 ,  H01L2924/16152 ,  Y10T29/42 ,  Y10T29/4913 ,  Y10T29/49146

摘要： The present invention relates to an electronic part used for mobile communications apparatuses and the like, and more particularly to an electronic part, such as an acoustic surface-wave device, a piezoelectric ceramic device or the like, which requires an oscillation space near the surface of the functional device chip thereof, and a method of production thereof. With this method, a space retainer for forming a sealed space at the functional portion of the chip can be hermetically sealed and have high moisture resistance, and the process of forming the space retainer can be carried out easily.The electronic part of the present invention comprises a functional device chip, a space retainer for forming a sealed space at the functional portion of the chip, a circuit substrate to which the chip is secured, electrode interconnection portions for establishing electric connection between the chip and the circuit substrate, and a sealing resin for covering and sealing at least the space retainer, wherein the space retainer comprises a support layer made of a synthetic resin film, provided with an opening enclosing the functional portion and joined onto the main surface, and a cover formed and joined onto the support layer so as to cover the functional portion and form a sealed space between the cover and the functional portion.

公开(公告)号：US6154940A

公开(公告)日：2000-12-05

申请号：US90489

申请日：1998-06-03

申请人： Keiji Onishi ,  Hideki Iwaki ,  Shun-ichi Seki ,  Yutaka Taguchi ,  Tsukasa Shiraishi ,  Yoshihiro Bessho ,  Osamu Kawasaki ,  Kazuo Eda

发明人： Keiji Onishi ,  Hideki Iwaki ,  Shun-ichi Seki ,  Yutaka Taguchi ,  Tsukasa Shiraishi ,  Yoshihiro Bessho ,  Osamu Kawasaki ,  Kazuo Eda

IPC分类号： H03H3/08 ,  H03H9/10 ,  H04R17/00

CPC分类号： H03H9/0509 ,  H03H3/08 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1042 ,  H03H9/1071 ,  H03H9/1085 ,  H03H9/1092 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/45144 ,  H01L2924/00013 ,  H01L2924/09701 ,  H01L2924/16152 ,  Y10T29/42 ,  Y10T29/4913 ,  Y10T29/49146

摘要： The present invention relates to an electronic part used for mobile communications apparatuses and the like, and more particularly to an electronic part, such as an acoustic surface-wave device, a piezoelectric ceramic device or the like, which requires an oscillation space near the surface of the functional device chip thereof, and a method of production thereof. With this method, a space retainer for forming a sealed space at the functional portion of the chip can be hermetically sealed and have high moisture resistance, and the process of forming the space retainer can be carried out easily.The electronic part of the present invention comprises a functional device chip, a space retainer for forming a sealed space at the functional portion of the chip, a circuit substrate to which the chip is secured, electrode interconnection portions for establishing electric connection between the chip and the circuit substrate, and a sealing resin for covering and sealing at least the space retainer, wherein the space retainer comprises a support layer made of a synthetic resin film, provided with an opening enclosing the functional portion and joined onto the main surface, and a cover formed and joined onto the support layer so as to cover the functional portion and form a sealed space between the cover and the functional portion.

摘要翻译： 本发明涉及用于移动通信设备等的电子部件，更具体地涉及需要在表面附近的振荡空间的诸如声表面波器件，压电陶瓷器件等的电子部件 的功能元件芯片及其制造方法。 利用这种方法，在芯片的功能部分处形成密封空间的空间保持器可以被气密地密封并且具有高的耐湿性，并且可以容易地进行形成空间保持器的工艺。 本发明的电子部件包括功能元件芯片，用于在芯片的功能部分形成密封空间的空间保持器，固定有芯片的电路基板，用于建立芯片与芯片之间的电连接的电极互连部分 电路基板和用于至少覆盖和密封空间保持器的密封树脂，其中，所述空间保持器包括由合成树脂膜制成的支撑层，所述支撑层设置有封闭所述功能部分并且接合到所述主表面上的开口，以及 盖形成并接合到支撑层上以覆盖功能部分并在盖和功能部分之间形成密封空间。

公开(公告)号：US06694613B2

公开(公告)日：2004-02-24

申请号：US09873461

申请日：2001-06-05

申请人： Yoshifumi Nakamura ,  Minehiro Itagaki ,  Hiroaki Takezawa ,  Yoshihiro Bessho ,  Tsukasa Shiraishi

发明人： Yoshifumi Nakamura ,  Minehiro Itagaki ,  Hiroaki Takezawa ,  Yoshihiro Bessho ,  Tsukasa Shiraishi

IPC分类号： H05K302

CPC分类号： H01L23/49811 ,  H01L21/4853 ,  H01L2924/0002 ,  H05K1/095 ,  H05K3/4007 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T428/24926 ,  H01L2924/00

摘要： A method for producing a printed-circuit board includes forming via holes that penetrate through a prepreg to whose surface a parting film is applied; filling the via holes with a conducting paste; compressing the prepreg under heat to cure the prepreg and the paste; and then peeling off the parting film. Thus, projection electrodes with a height corresponding to the thickness of the film are formed in a manner such that the projection electrodes are integrated with the via hole conductors.

摘要翻译： 一种印刷电路板的制造方法，其特征在于，具有形成贯通预浸料坯的通孔，该预浸料坯具有分隔膜的表面， 用导电膏填充通孔; 在加热下压制预浸料以固化预浸料和糊料; 然后剥离分离膜。 因此，以使得突起电极与通孔导体一体化的方式形成具有与膜的厚度对应的高度的突起电极。

公开(公告)号：US06569512B2

公开(公告)日：2003-05-27

申请号：US09965768

申请日：2001-09-27

申请人： Hiroaki Takezawa ,  Tsutomu Mitani ,  Minehiro Itagaki ,  Yoshihiro Bessho ,  Kazuo Eda

发明人： Hiroaki Takezawa ,  Tsutomu Mitani ,  Minehiro Itagaki ,  Yoshihiro Bessho ,  Kazuo Eda

IPC分类号： B32B1508

CPC分类号： H05K3/321 ,  B32B7/02 ,  B32B7/12 ,  H05K2201/09909 ,  H05K2201/10636 ,  H05K2201/10984 ,  H05K2203/0783 ,  H05K2203/121 ,  Y02P70/611 ,  Y10S428/901 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T428/24066 ,  Y10T428/24917 ,  Y10T428/2495 ,  Y10T428/24975 ,  Y10T428/269 ,  Y10T428/31678 ,  Y10T428/31681

摘要： In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.

公开(公告)号：US06538315B2

公开(公告)日：2003-03-25

申请号：US09742973

申请日：2000-12-20

申请人： Yoshihiro Bessho ,  Minehiro Itagaki

发明人： Yoshihiro Bessho ,  Minehiro Itagaki

IPC分类号： H01L2304

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： A semiconductor device has (a) a semiconductor component; (b) a circuit substrate; (c) a base material which is placed between the semiconductor component and the circuit substrate; and (d) a conductive paste, which is filled into a hole formed in the base material, for electrically connecting between a terminal electrode of the semiconductor component and an internal connection electrode of the circuit substrate.

摘要翻译： 半导体器件具有（a）半导体元件; （b）电路基板; （c）放置在半导体部件和电路基板之间的基材; 和（d）填充到形成在基材中的孔中的导电膏，用于电连接半导体部件的端子电极和电路基板的内部连接电极。

公开(公告)号：US6088236A

公开(公告)日：2000-07-11

申请号：US878369

申请日：1997-06-18

申请人： Yoshihiro Tomura ,  Yoshihiro Bessho

发明人： Yoshihiro Tomura ,  Yoshihiro Bessho

IPC分类号： H01L21/60 ,  H01L29/41 ,  H01L23/48

CPC分类号： H01L24/11 ,  H01L24/13 ,  H01L2224/1184 ,  H01L2224/13019 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/1379 ,  H01L2224/13839 ,  H01L2224/13844 ,  H01L2224/13847 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/8159 ,  H01L2224/816 ,  H01L2224/81903 ,  H01L2224/83851 ,  H01L24/45 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14

摘要： A semiconductor unit including a circuit board having terminal electrodes on a surface thereof and a semiconductor device having an electrode pad on a first surface, where the semiconductor device is mounted face down on the surface of the circuit board. The semiconductor device has a plurality of bumps formed on the electrode pad, for electrically connecting the electrode pad to the terminal electrodes of the circuit board. Each bump includes a first bump portion and a smaller second bump portion formed on the first bump portion, and each second bump portion has a plurality of irregularities having concave portions extending in various directions. The bonding layer is formed between the second bump portion and the terminal electrode, and includes conductive particles which along with a portion of the bonding layer enter the concave portions of the plurality of irregularities of the bumps. The terminal electrodes may also have a plurality of irregularities having concave portions extending in various directions.

摘要翻译： 一种半导体单元，包括其表面上具有端子电极的电路板和在第一表面上具有电极焊盘的半导体器件，半导体器件被安装在电路板的表面上。 半导体器件具有形成在电极焊盘上的多个凸起，用于将电极焊盘电连接到电路板的端子电极。 每个凸块包括形成在第一凸起部分上的第一凸起部分和较小的第二凸起部分，并且每个第二凸起部分具有多个具有在各个方向上延伸的凹部的凹凸。 接合层形成在第二凸起部和端子电极之间，并且包括与接合层的一部分一起进入凸块的多个凹凸的凹部的导电性粒子。 端子电极也可以具有多个具有在各个方向上延伸的凹部的凹凸。

公开(公告)号：US06774316B1

公开(公告)日：2004-08-10

申请号：US09890145

申请日：2001-07-26

申请人： Takeshi Suzuki ,  Tatsuo Ogawa ,  Satoru Tomekawa ,  Yoshihiro Bessho ,  Tousaku Nishiyama ,  Tetsuyoshi Ogura

发明人： Takeshi Suzuki ,  Tatsuo Ogawa ,  Satoru Tomekawa ,  Yoshihiro Bessho ,  Tousaku Nishiyama ,  Tetsuyoshi Ogura

IPC分类号： H01R1204

CPC分类号： H05K3/462 ,  H05K1/0373 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0116 ,  H05K2201/0212 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/1461 ,  Y10T29/49165

摘要： The present invention aims to provide a wiring substrate highly reliable in insulation and connection and a method for manufacturing the wiring substrate. A wiring substrate having two or more wiring layers, insulation layers interposed between the neighboring wiring layers and containing an organic resin, and a via formed in the insulation layers and extended between neighboring wiring layers. The via including functional substances, as well as some of the voids (first voids) where at least the organic resins from the insulation layers exist and the remaining voids (second voids) where a gas exists.

摘要翻译： 本发明的目的在于提供一种绝缘和连接高度可靠的布线基板和布线基板的制造方法。 具有两层以上布线层的布线基板，位于相邻配线层之间并含有有机树脂的绝缘层，以及形成在绝缘层中并在相邻布线层之间延伸的通孔。 通孔包括功能性物质，以及至少存在绝缘层的有机树脂和存在气体的剩余空隙（第二空隙）的一些空隙（第一空隙）。