公开(公告)号：US5914859A

公开(公告)日：1999-06-22

申请号：US837793

申请日：1997-04-22

申请人： Masaru Takada ,  Kiyotaka Tsukada ,  Morio Nakao

发明人： Masaru Takada ,  Kiyotaka Tsukada ,  Morio Nakao

IPC分类号： H05K1/02 ,  H01L23/36 ,  H01L23/498 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K3/38 ,  H05K3/44 ,  H05K9/00 ,  H05K7/20

CPC分类号： H05K9/0039 ,  H01L23/36 ,  H01L23/49827 ,  H05K3/44 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/1532 ,  H05K2201/066 ,  H05K2201/09554 ,  H05K2201/10666 ,  H05K2203/041 ,  H05K3/0061 ,  H05K3/3447 ,  H05K3/386 ,  Y10T29/49128

摘要： An electronic component mounting base board comprises an insulating substrate provided with a mounting portion for mounting an electronic component and a heat-sink plate disposed on an lower surface of the insulating substrate, in which the insulating substrate is provided with a wiring pattern for signal or power, a grounding pattern and a grounding hole, and the grounding hole is provided on its inner wall with a metal plated film for electrically connecting to the grounding pattern and a solder is filled in an inside of the grounding hole for electrically connecting to the heat-sink plate.

摘要翻译： 电子部件安装基板包括设置有用于安装电子部件的安装部分和设置在绝缘基板的下表面上的散热板的绝缘基板，其中绝缘基板设置有用于信号的布线图案或 电源，接地图案和接地孔，并且接地孔在其内壁上设置有用于电连接到接地图案的金属镀膜，并且焊料填充在接地孔的内部，用于电连接到热 贴板

公开(公告)号：US07339118B1

公开(公告)日：2008-03-04

申请号：US09380994

申请日：1998-03-09

申请人： Masaru Takada ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Hiroyuki Kobayashi ,  Mitsuhiro Kondo

发明人： Masaru Takada ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Hiroyuki Kobayashi ,  Mitsuhiro Kondo

IPC分类号： H05K1/03 ,  H05K3/36

CPC分类号： H01L24/49 ,  H01L23/49822 ,  H01L23/50 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/351 ,  H05K1/021 ,  H05K1/113 ,  H05K1/114 ,  H05K3/0035 ,  H05K3/28 ,  H05K3/3457 ,  H05K3/385 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4697 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2203/0315 ,  H05K2203/0554 ,  H05K2203/1581 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： In a printed wiring board, an odd number (n) of conductive layers (11-13) and insulating layers (21-23) are alternately laminated upon each other. The first conductive layer (11) is a parts connecting layer and the n-th conductive layer (13) is an external connecting layer which is connected to external connecting terminals (7). The second to (n−1)-th conductive layers (12) are current transmitting layers for transmitting internal currents. The surface of the n-th insulating layer (23) in a state where the external connecting terminals (7) are exposed on the surface. It is preferable to make the initial insulating layers of a glass-cloth reinforced prepreg and the external insulating layers of a resin.

摘要翻译： 在印刷电路板中，奇数（n）个导电层（11-13）和绝缘层（21-23）交替层叠。 第一导电层（11）是部分连接层，第n导电层（13）是连接到外部连接端子（7）的外部连接层。 第二到第（n-1）个导电层（12）是用于传输内部电流的电流传输层。 第n绝缘层（23）的表面露出外部连接端子（7）的状态。 优选制作玻璃布预浸料坯的初始绝缘层和树脂的外部绝缘层。

公开(公告)号：US06986917B2

公开(公告)日：2006-01-17

申请号：US10408588

申请日：2003-04-07

申请人： Masaru Takada ,  Hiroyuki Kobayashi ,  Kenji Chihara ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Mitsuhiro Kondo

发明人： Masaru Takada ,  Hiroyuki Kobayashi ,  Kenji Chihara ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Mitsuhiro Kondo

IPC分类号： B05D3/04

CPC分类号： H01L24/32 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/112 ,  H05K1/116 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/027 ,  H05K3/242 ,  H05K3/243 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/428 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09381 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/0959 ,  H05K2201/09781 ,  H05K2203/0554 ,  H05K2203/0571 ,  H05K2203/107 ,  H05K2203/175 ,  Y10S428/901 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

摘要翻译： 在具有导体电路（6）的绝缘板（7）的表面上印刷包括热固性树脂的阻焊剂。 然后将阻焊剂热固化以形成具有低热膨胀系数的绝缘膜（1）。 然后将激光束（2）施加到要形成开口的绝缘膜的部分，以烧掉用于形成开口（10）的相同部分，由此导体电路（6）暴露。 该开口可以通过在其内表面上形成金属电镀膜而形成为导电孔。 优选地，形成外部连接垫以覆盖开口。 通过使用在电镀完成后优选用激光束切断的电镀铅来形成金属涂膜。

公开(公告)号：US07594320B2

公开(公告)日：2009-09-29

申请号：US11260077

申请日：2005-10-27

申请人： Masaru Takada ,  Hiroyuki Kobayashi ,  Kenji Chihara ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Mitsuhiro Kondo

发明人： Masaru Takada ,  Hiroyuki Kobayashi ,  Kenji Chihara ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Mitsuhiro Kondo

IPC分类号： H01K3/10 ,  H05K3/10

CPC分类号： H01L24/32 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/112 ,  H05K1/116 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/027 ,  H05K3/242 ,  H05K3/243 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/428 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09381 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/0959 ,  H05K2201/09781 ,  H05K2203/0554 ,  H05K2203/0571 ,  H05K2203/107 ,  H05K2203/175 ,  Y10S428/901 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

摘要翻译： 在具有导体电路（6）的绝缘板（7）的表面上印刷包括热固性树脂的阻焊剂。 然后将阻焊剂热固化以形成具有低热膨胀系数的绝缘膜（1）。 然后将激光束（2）施加到要形成开口的绝缘膜的部分，以烧掉用于形成开口（10）的相同部分，由此导体电路（6）暴露。 该开口可以通过在其内表面上形成金属电镀膜而形成为导电孔。 优选地，形成外部连接垫以覆盖开口。 通过使用在电镀完成后优选用激光束切断的电镀铅来形成金属涂膜。

公开(公告)号：US20060042824A1

公开(公告)日：2006-03-02

申请号：US11260077

申请日：2005-10-27

申请人： Masaru Takada ,  Hiroyuki Kobayashi ,  Kenji Chihara ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Mitsuhiro Kondo

发明人： Masaru Takada ,  Hiroyuki Kobayashi ,  Kenji Chihara ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Mitsuhiro Kondo

IPC分类号： H05K5/06

CPC分类号： H01L24/32 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/112 ,  H05K1/116 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/027 ,  H05K3/242 ,  H05K3/243 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/428 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09381 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/0959 ,  H05K2201/09781 ,  H05K2203/0554 ,  H05K2203/0571 ,  H05K2203/107 ,  H05K2203/175 ,  Y10S428/901 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

公开(公告)号：US06715204B1

公开(公告)日：2004-04-06

申请号：US09720953

申请日：2001-02-13

申请人： Kiyotaka Tsukada ,  Masaru Takada ,  Kenji Chihara

发明人： Kiyotaka Tsukada ,  Masaru Takada ,  Kenji Chihara

IPC分类号： H05K302

CPC分类号： H05K1/0265 ,  H01L21/486 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K1/113 ,  H05K1/114 ,  H05K3/0035 ,  H05K3/027 ,  H05K3/421 ,  H05K3/4652 ,  H05K2201/0352 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/09736 ,  H05K2201/10674 ,  H05K2203/0353 ,  H05K2203/0554 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49167

摘要： A printed circuit board and a method for manufacturing the same that facilitates the formation of an upper surface pattern and prevents a lower surface metal foil from being damaged when forming a blind via hole with a laser. A lower surface and an upper surface of an insulative substrate (5) are respectively coated with a lower surface metal foil (220) and an upper surface metal foil (210), the thickness of which is less than that of the lower surface metal foil (220). Next, an opening (213) is formed in the upper surface metal foil at a location corresponding to a blind via hole formation portion (35) of the insulative substrate. A blind via hole (3), the bottom of which is the lower surface metal foil, is formed by emitting a laser (8) against the blind via hole formation portion (35) through the opening (213). Then, a metal plating film (23) is applied to the wall of the blind via hole (3), and an upper surface pattern (21) and a lower surface pattern (22) are formed through etching.

摘要翻译： 一种印刷电路板及其制造方法，其有助于形成上表面图案，并且在用激光形成盲孔时防止下表面金属箔被损坏。 绝缘基板（5）的下表面和上表面分别涂覆有下表面金属箔（220）和上表面金属箔（210），其厚度小于下表面金属箔的厚度 （220）。 接着，在与上述绝缘性基板的盲通孔形成部（35）对应的位置，在上表面金属箔上形成有开口部（213）。 通过开口（213）向盲通孔形成部分（35）发射激光器（8），形成底部金属薄片的盲孔（3）。 然后，将金属镀膜（23）施加到盲孔（3）的壁上，通过蚀刻形成上表面图案（21）和下表面图案（22）。

公开(公告)号：US06555208B2

公开(公告)日：2003-04-29

申请号：US09891819

申请日：2001-06-26

申请人： Masaru Takada ,  Hiroyuki Kobayashi ,  Kenji Chihara ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Mitsuhiro Kondo

发明人： Masaru Takada ,  Hiroyuki Kobayashi ,  Kenji Chihara ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Mitsuhiro Kondo

IPC分类号： B32B300

CPC分类号： H01L24/32 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/112 ,  H05K1/116 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/027 ,  H05K3/242 ,  H05K3/243 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/428 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09381 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/0959 ,  H05K2201/09781 ,  H05K2203/0554 ,  H05K2203/0571 ,  H05K2203/107 ,  H05K2203/175 ,  Y10S428/901 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

公开(公告)号：US06284353B1

公开(公告)日：2001-09-04

申请号：US09348935

申请日：1999-07-07

申请人： Masaru Takada ,  Hiroyuki Kobayashi ,  Kenji Chihara ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Mitsuhiro Kondo

发明人： Masaru Takada ,  Hiroyuki Kobayashi ,  Kenji Chihara ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Mitsuhiro Kondo

IPC分类号： B32B300

CPC分类号： H01L24/32 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/112 ,  H05K1/116 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/027 ,  H05K3/242 ,  H05K3/243 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/428 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09381 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/0959 ,  H05K2201/09781 ,  H05K2203/0554 ,  H05K2203/0571 ,  H05K2203/107 ,  H05K2203/175 ,  Y10S428/901 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

公开(公告)号：US20090019693A1

公开(公告)日：2009-01-22

申请号：US12237955

申请日：2008-09-25

申请人： Masaru Takada ,  Hiroyuki Kobayashi ,  Kenji Chihara ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Mitsuhiro Kondo

发明人： Masaru Takada ,  Hiroyuki Kobayashi ,  Kenji Chihara ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Mitsuhiro Kondo

IPC分类号： H05K3/10

CPC分类号： H01L24/32 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/112 ,  H05K1/116 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/027 ,  H05K3/242 ,  H05K3/243 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/428 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09381 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/0959 ,  H05K2201/09781 ,  H05K2203/0554 ,  H05K2203/0571 ,  H05K2203/107 ,  H05K2203/175 ,  Y10S428/901 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

摘要翻译： 在具有导体电路（6）的绝缘板（7）的表面上印刷包括热固性树脂的阻焊剂。 然后将阻焊剂热固化以形成具有低热膨胀系数的绝缘膜（1）。 然后将激光束（2）施加到要形成开口的绝缘膜的部分，以烧掉用于形成开口（10）的相同部分，由此导体电路（6）暴露。 该开口可以通过在其内表面上形成金属电镀膜而形成为导电孔。 优选地，形成外部连接垫以覆盖开口。 通过使用在电镀完成后优选用激光束切断的电镀铅来形成金属涂膜。

公开(公告)号：US06825421B1

公开(公告)日：2004-11-30

申请号：US09380994

申请日：1999-09-13

申请人： Masaru Takada ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Hiroyuki Kobayashi ,  Mitsuhiro Kondo

发明人： Masaru Takada ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Hiroyuki Kobayashi ,  Mitsuhiro Kondo

IPC分类号： H05K103

摘要： In a printed wiring board, an odd number (n) of conductive layers (11-13) and insulating layers (21-23) are alternately laminated upon each other. The first conductive layer (11) is a parts connecting layer and the n-th conductive layer (13) is an external connecting layer which is connected to external connecting terminals (7). The second to (n−1)-th conductive layers (12) are current transmitting layers for transmitting internal currents. The surface of the n-th insulating layer (23) in a state where the external connecting terminals (7) are exposed on the surface. It is preferable to make the initial insulating layers of a glass-cloth reinforced prepreg and the external insulating layers of a resin.