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公开(公告)号：US12069400B2
公开(公告)日：2024-08-20
申请号：US17258087
申请日：2018-11-22
发明人： Yutaka Yoneda
IPC分类号： H01L27/146 , H04N5/33
CPC分类号： H04N5/33 , H01L27/14618
摘要： A sensor module comprising:
A sensor chip (5) is provided on an upper surface of the substrate (1). A lens (7) is provided above the sensor chip (5) such that a light receiving unit of the sensor chip (5) is positioned in a projection area. A lens cap (8) includes a cap body (8a) surrounding the sensor chip (5) to hold the lens (7), and a cap edge part (8b) protruding outward from a lower end part of the cap body (8a). An ultraviolet-curing type bonding agent (9) bonds the upper surface of the substrate (1) and a lower surface of the lens cap (8). A cutout (10) is provided on an outer side surface of the cap edge part (8b). The bonding agent (9) enters in the cutout (10).-
公开(公告)号：US09899345B2
公开(公告)日：2018-02-20
申请号：US15027258
申请日：2015-01-23
发明人： Junji Fujino , Yutaka Yoneda , Shohei Ogawa , Soichi Sakamoto , Mikio Ishihara , Miho Nagai
CPC分类号： H01L24/45 , H01L23/48 , H01L23/49537 , H01L24/36 , H01L24/37 , H01L24/40 , H01L24/48 , H01L24/72 , H01L24/81 , H01L25/07 , H01L25/162 , H01L25/18 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/40095 , H01L2224/40137 , H01L2224/40139 , H01L2224/45014 , H01L2224/45124 , H01L2224/4824 , H01L2224/48472 , H01L2224/73221 , H01L2224/73265 , H01L2224/83801 , H01L2224/8385 , H01L2224/84205 , H01L2224/84214 , H01L2224/84801 , H01L2224/8485 , H01L2224/85205 , H01L2224/85214 , H01L2224/85232 , H01L2924/00014 , H01L2924/10254 , H01L2924/10272 , H01L2924/1033 , H01L2924/1203 , H01L2924/13055 , H01L2924/13091 , H01L2924/1579 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
摘要： An electrode terminal includes: a first drawn-out part to be bonded to a main electrode; and a second drawn-out part that is formed of a plate member in a continuous fashion from one end portion to be positioned opposite to the main electrode with a gap therebetween until another end portion to be connected to an external circuit, so that a portion in the first drawn-out part that is adjacent to a portion therein to be bonded to the main electrode, is bonded to an opposing surface to the main electrode in said one end portion; wherein the first drawn-out part is formed so that the portion to be bonded to the main electrode is away from the opposing surface; and wherein an opening portion corresponding to the main electrode is formed in the second drawn-out part.
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公开(公告)号：US09484294B2
公开(公告)日：2016-11-01
申请号：US14830248
申请日：2015-08-19
IPC分类号： H01L23/498 , H01L23/00 , H01L23/48 , H01L23/373
CPC分类号： H01L23/49838 , H01L23/3735 , H01L23/481 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/83 , H01L24/84 , H01L2224/32225 , H01L2224/37124 , H01L2224/37147 , H01L2224/37599 , H01L2224/83205 , H01L2224/83801 , H01L2224/84205 , H01L2924/00014
摘要： A semiconductor device of the present invention includes a bonding target and an electrode terminal bonded to the bonding target. The electrode terminal and the bonding target are bonded by ultrasonic bonding at a bonding surface to be subjected to bonding. The electrode terminal includes a penetrating hollow part surrounded on at least two sides by the bonding surface.
摘要翻译： 本发明的半导体器件包括接合靶和键合靶的电极端子。 电极端子和接合靶通过超声波接合在接合面上进行接合。 电极端子包括通过接合表面在至少两侧被包围的穿透中空部。
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公开(公告)号：US09433075B2
公开(公告)日：2016-08-30
申请号：US14417370
申请日：2013-08-09
IPC分类号： H05K7/20 , H05K1/02 , H01L23/13 , H01L23/36 , H01L23/373 , H01L23/492 , H01L23/00 , H01L25/18 , H01L23/473 , H01L25/07
CPC分类号： H05K1/0203 , H01L23/13 , H01L23/36 , H01L23/3735 , H01L23/492 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/85 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L2224/04026 , H01L2224/04034 , H01L2224/04042 , H01L2224/0603 , H01L2224/06181 , H01L2224/29111 , H01L2224/32245 , H01L2224/37012 , H01L2224/37147 , H01L2224/4005 , H01L2224/40105 , H01L2224/4024 , H01L2224/4118 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/4824 , H01L2224/48472 , H01L2224/49175 , H01L2224/73263 , H01L2224/73265 , H01L2224/83424 , H01L2224/83447 , H01L2224/8346 , H01L2224/83801 , H01L2224/84447 , H01L2224/84801 , H01L2224/85205 , H01L2224/92247 , H01L2924/10254 , H01L2924/10272 , H01L2924/1033 , H01L2924/1203 , H01L2924/13055 , H01L2924/13091 , H01L2924/15724 , H01L2924/15747 , H01L2924/1576 , H01L2924/16152 , H01L2924/16172 , H01L2924/16251 , H01L2924/181 , H01L2924/19107 , H01L2224/48247 , H01L2924/00012 , H01L2224/291 , H01L2924/014 , H01L2924/00014 , H01L2224/92252 , H01L2224/85 , H01L2224/40499 , H01L2224/8546 , H01L2224/85424 , H01L2224/85447 , H01L2924/01074 , H01L2224/3716 , H01L2224/37124 , H01L2924/01083 , H01L2924/01051 , H01L2924/00 , H01L2924/207 , H01L2224/48624 , H01L2924/00011 , H01L2224/48647 , H01L2224/4866 , H01L2224/48824 , H01L2224/4886 , H01L2224/48747 , H01L2224/48847 , H01L2224/48724 , H01L2224/4876 , H01L2924/013 , H01L2924/01029 , H01L2924/01047 , H01L2924/00013 , H01L2924/2076
摘要： An electric power semiconductor device includes a heat transfer plate. A printed wire board is spaced a predetermined gap apart from the heat transfer plate. An opening portion is provided in the vicinity of an electrode strip formed on the outer side of the printed wire board. An electric power semiconductor element is disposed between the heat transfer plate and the printed wire board, and adhered to the heat transfer plate. A wiring member has one end bonded to a first bonding portion of a main power electrode of the electric power semiconductor element, and the other end is bonded to a second bonding portion. At least part of the second bonding portion is included in a space that extends from the main power electrode to the printed wire board, and the first bonding portion is included in a space that extends from the opening portion.
摘要翻译： 电力半导体装置包括传热板。 印刷线路板与传热板间隔开预定间隙。 在形成在印刷线路板的外侧的电极条的附近设置有开口部。 电力半导体元件设置在传热板和印刷线路板之间，并附着在传热板上。 布线构件的一端与电力半导体元件的主电极的第一接合部分接合，另一端接合到第二接合部。 第二接合部的至少一部分包括在从主电极延伸到印刷线基板的空间中，并且第一接合部包括在从开口部延伸的空间中。
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公开(公告)号：US20150223316A1
公开(公告)日：2015-08-06
申请号：US14417370
申请日：2013-08-09
IPC分类号： H05K1/02
CPC分类号： H05K1/0203 , H01L23/13 , H01L23/36 , H01L23/3735 , H01L23/492 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/85 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L2224/04026 , H01L2224/04034 , H01L2224/04042 , H01L2224/0603 , H01L2224/06181 , H01L2224/29111 , H01L2224/32245 , H01L2224/37012 , H01L2224/37147 , H01L2224/4005 , H01L2224/40105 , H01L2224/4024 , H01L2224/4118 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/4824 , H01L2224/48472 , H01L2224/49175 , H01L2224/73263 , H01L2224/73265 , H01L2224/83424 , H01L2224/83447 , H01L2224/8346 , H01L2224/83801 , H01L2224/84447 , H01L2224/84801 , H01L2224/85205 , H01L2224/92247 , H01L2924/10254 , H01L2924/10272 , H01L2924/1033 , H01L2924/1203 , H01L2924/13055 , H01L2924/13091 , H01L2924/15724 , H01L2924/15747 , H01L2924/1576 , H01L2924/16152 , H01L2924/16172 , H01L2924/16251 , H01L2924/181 , H01L2924/19107 , H01L2224/48247 , H01L2924/00012 , H01L2224/291 , H01L2924/014 , H01L2924/00014 , H01L2224/92252 , H01L2224/85 , H01L2224/40499 , H01L2224/8546 , H01L2224/85424 , H01L2224/85447 , H01L2924/01074 , H01L2224/3716 , H01L2224/37124 , H01L2924/01083 , H01L2924/01051 , H01L2924/00 , H01L2924/207 , H01L2224/48624 , H01L2924/00011 , H01L2224/48647 , H01L2224/4866 , H01L2224/48824 , H01L2224/4886 , H01L2224/48747 , H01L2224/48847 , H01L2224/48724 , H01L2224/4876 , H01L2924/013 , H01L2924/01029 , H01L2924/01047 , H01L2924/00013 , H01L2924/2076
摘要： An electric power semiconductor device includes a heat transfer plate. A printed wire board is spaced a predetermined gap apart from the heat transfer plate. An opening portion is provided in the vicinity of an electrode strip formed on the outer side of the printed wire board. An electric power semiconductor element is disposed between the heat transfer plate and the printed wire board, and adhered to the heat transfer plate. A wiring member has one end bonded to a first bonding portion of a main power electrode of the electric power semiconductor element, and the other end is bonded to a second bonding portion. At least part of the second bonding portion is included in a space that extends from the main power electrode to the printed wire board, and the first bonding portion is included in a space that extends from the opening portion.
摘要翻译： 电力半导体装置包括传热板。 印刷线路板与传热板间隔开预定间隙。 在形成在印刷线路板的外侧的电极条的附近设置有开口部。 电力半导体元件设置在传热板和印刷线路板之间，并附着在传热板上。 布线构件的一端与电力半导体元件的主电极的第一接合部分接合，另一端接合到第二接合部。 第二接合部的至少一部分包括在从主电极延伸到印刷线基板的空间中，并且第一接合部包括在从开口部延伸的空间中。
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公开(公告)号：US12062883B2
公开(公告)日：2024-08-13
申请号：US16965889
申请日：2019-03-12
发明人： Yutaka Yoneda , Junji Fujino , Tadayoshi Hata , Jin Sato
IPC分类号： H01S5/00 , H01S5/022 , H01S5/02315 , H01S5/0237 , H01S5/02375 , H01S5/0239 , H01S5/024 , H01L33/00
CPC分类号： H01S5/02375 , H01S5/022 , H01S5/02315 , H01S5/0237 , H01S5/0239 , H01S5/02476 , H01L33/005 , H01L2933/0066
摘要： A semiconductor module includes a sub-mount having a front surface, a back surface, side surfaces connecting the front surface and the back surface, a semiconductor element soldered onto the front surface of the sub-mount, and a block soldered onto the back surface of the sub-mount. The semiconductor element protrudes outward beyond a first side surface of the sub-mount, a concave portion is formed on each of a second side surface and a third side surface of the sub-mount perpendicular to the first side surface, the concave portion extending from the front surface of the sub-mount toward the back surface of the sub-mount, and the concave portion is disposed to allow a projection of a collet to be held in the concave portion with the front surface of the sub-mount held by suction by the collet.
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公开(公告)号：US11291120B2
公开(公告)日：2022-03-29
申请号：US17052293
申请日：2018-09-07
发明人： Yutaka Yoneda , Takuro Shinada
IPC分类号： H05K1/00 , H05K1/18 , H01S5/02253 , H01S5/02345 , H05K1/02 , H05K1/11 , H01S5/024
摘要： A optical module according to the present invention includes an optical semiconductor device, a package housing the optical semiconductor device, a first pattern provided on an upper surface of the package, a second pattern provided on a side surface continuous with the upper surface of the package, a flexible substrate provided on the first pattern and extending from the upper surface to a side surface side of the package and solder joining the first pattern and the flexible substrate together, wherein the solder is spread between a portion of the flexible substrate, the portion extending from the upper surface to the side surface side of the package, and the second pattern.
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公开(公告)号：US10096570B2
公开(公告)日：2018-10-09
申请号：US15568130
申请日：2016-05-31
发明人： Yutaka Yoneda , Junji Fujino , Kazuyoshi Shige , Yoichi Hironaka
IPC分类号： H01L21/607 , H01L23/00
摘要： An object of the invention is to provide: a manufacturing method for a highly reliable power semiconductor device which prevents breakage of an conductor pattern and an insulating layer, and has bonding strength higher than that by the conventional bonding between the electrode terminal and the conductor pattern; and that power semiconductor device. Breakage of the conductor pattern and the insulating layer is prevented due to inclusion of: a step of laying an electrode terminal on a protrusion provided on a conductor pattern placed on a circuit-face side of a ceramic board so that a center portion of a surface to be bonded of the electrode terminal makes contact with a head portion of the protrusion; a step of pressurizing and ultrasonically vibrating a surface opposite to the surface to be bonded, of the electrode terminal, using an ultrasonic horn, to thereby bond the electrode terminal to the conductor pattern.
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