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    Multilayer printed-circuit board and method of manufacture
    4.
    发明授权
    Multilayer printed-circuit board and method of manufacture 有权
    多层印刷电路板及其制造方法

    公开(公告)号：US06762921B1

    公开(公告)日：2004-07-13

    申请号：US09926476

    申请日：2001-11-09

    申请人： Motoo Asai ,  Kouta Noda ,  Takashi Kariya

    发明人： Motoo Asai ,  Kouta Noda ,  Takashi Kariya

    IPC分类号： H02H322

    CPC分类号： H05K3/4661 ,  H05K3/108 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/385 ,  H05K3/421 ,  H05K2201/0195 ,  H05K2201/09509 ,  Y10T428/24273

    摘要： This invention is to propose a technique of producing a printed wiring board having an excellent adhesion property between an electroless plated film and an electrolytic plated film constituting a conductor circuit through a semi-additive process without causing the peeling of a plating resist and is a printed wiring board comprising conductor circuits formed on a roughened surface of an insulating layer, in which the conductor circuit is constituted with an electroless plated film at the side of the insulating layer and an electrolytic plated film at the opposite side and the electroless plated film located at the side of the insulating layer is formed so as to follow to the roughened surface of the insulating layer. This printed wiring board is produced by a semi-additive method wherein the electroless plated film is formed on the roughened surface of the insulating layer so as to follow to the roughened surface of the insulating layer.

    摘要翻译： 本发明提出一种制造印刷电路板的技术，该印刷电路板在不引起电镀抗蚀剂剥离的情况下，通过半添加工艺，在化学镀膜和构成导体电路的电解电镀膜之间具有优异的粘合性，并且是印刷 布线板包括形成在绝缘层的粗糙表面上的导体电路，其中导体电路由绝缘层侧面的无电解电镀膜和位于绝缘层侧面的电镀电镀膜和位于 绝缘层的一侧形成为与绝缘层的粗糙化表面相邻。 该印刷电路板是通过半附加法制造的，其中无电镀膜形成在绝缘层的粗糙化表面上，以便遵循绝缘层的粗糙化表面。

    Multilayer printed-circuit board and semiconductor device
    10.
    发明授权
    Multilayer printed-circuit board and semiconductor device 有权
    多层印刷电路板和半导体器件

    公开(公告)号：US06534723B1

    公开(公告)日：2003-03-18

    申请号：US09821460

    申请日：2001-04-06

    申请人： Motoo Asai ,  Takashi Kariya

    发明人： Motoo Asai ,  Takashi Kariya

    IPC分类号： H05K103

    CPC分类号： H05K3/4617 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K3/4602 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/09563 ,  H05K2201/096

    摘要： A multilayer printed-circuit board is provided which is formed by stacking one on the other a plurality of circuit boards, each including a hard insulative substrate having a conductor circuit formed on one or either side thereof, and having formed therein via-holes formed through the hard insulative substrate to extend to the conductor circuit and each filled with a conductive substance, with an adhesive applied between the plurality of circuit boards, and heating and pressing the circuit boards together. One of the outermost ones of the stacked circuit boards has formed on the surface thereof conductive bumps each positioned right above the via-hole and electrically connected to the via-hole, and the other outermost one of the stacked circuit boards has formed on the surface thereof conductive pin or balls each positioned right above the via-hole and electrically connected to the via-hole. This multilayer printed-circuit board is used as a package circuit board and electronic components such as LSI chip are mounted on it to form a semiconductor device. The multilayer printed-circuit board is used as a core substrate, and a build-up wiring layer is formed on one or either side of the core multilayer circuit board. Solder bumps are formed on the surface of one outermost conductor circuit of the build-up wiring layer and conductive pins or balls are provided on the surface of the other outermost conductor circuit of the build-up wiring layer. Thus, a multilayer printed-circuit board is provided on which wiring can be made densely and also electronic components can be mounted with a high density.

    摘要翻译： 提供了一种多层印刷电路板，其通过将多个电路板彼此堆叠而形成，每个电路板包括形成在其一侧或两侧上的具有导体电路的硬绝缘基板，并且其中形成有通孔 所述硬绝缘基板延伸到所述导体电路并且各自填充有导电物质，并且将粘合剂施加在所述多个电路板之间，并且将所述电路板加热和加压在一起。 堆叠电路板中最外层的电路板之一在表面上形成有位于通孔正上方的导电凸块，并且电连接到通孔，而另一个最外面的堆叠电路板形成在表面上 其导电针或球各自位于通孔的正上方并电连接到通孔。 该多层印刷电路板用作封装电路板，并且其上安装诸如LSI芯片的电子部件以形成半导体器件。 将多层印刷电路板用作芯基板，并且在芯多层电路板的一侧或任一侧上形成积层布线层。 在叠层布线层的一个最外侧的导体电路的表面上形成有焊料凸点，并且在叠层布线层的另一个最外侧的导体电路的表面设置有导电针或球。 因此，提供一种多层印刷电路板，其上可以致密地制造布线，并且还可以以高密度安装电子部件。