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公开(公告)号：US09633967B2
公开(公告)日：2017-04-25
申请号：US14910355
申请日：2014-10-06
Applicant: NSK Ltd.
Inventor： Takashi Sunaga , Noboru Kaneko , Osamu Miyoshi , Ryoichi Suzuki
IPC: H01L29/66 , H01L27/08 , H01L23/00 , H01L25/07 , H01L25/18 , H01L23/373 , H01L23/498 , H01L23/492 , H01L29/739 , H01L29/78
CPC classification number: H01L24/41 , H01L23/3735 , H01L23/492 , H01L23/49811 , H01L23/49838 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/83 , H01L24/84 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L29/7393 , H01L29/78 , H01L2224/05553 , H01L2224/0603 , H01L2224/2732 , H01L2224/29101 , H01L2224/32227 , H01L2224/32238 , H01L2224/32245 , H01L2224/33181 , H01L2224/352 , H01L2224/35847 , H01L2224/3701 , H01L2224/37011 , H01L2224/37013 , H01L2224/37124 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/37611 , H01L2224/4001 , H01L2224/40095 , H01L2224/40227 , H01L2224/40475 , H01L2224/40499 , H01L2224/4099 , H01L2224/4112 , H01L2224/73263 , H01L2224/83192 , H01L2224/8321 , H01L2224/83424 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/84138 , H01L2224/8421 , H01L2224/84424 , H01L2224/84447 , H01L2224/84801 , H01L2224/84815 , H01L2224/9221 , H01L2924/00015 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15724 , H01L2924/19105 , H01L2924/35121 , H01L2924/365 , H01L2924/00 , H01L2924/00014 , H01L2224/291 , H01L2924/014 , H01L2924/00012 , H01L2924/01047 , H01L2224/29294 , H01L2224/293 , H01L2224/48 , H01L2224/85 , H01L2224/83 , H01L2224/84 , H01L2924/01029 , H01L2924/013 , H01L2924/00013
Abstract: To provide a semiconductor module that has high reliability of electric connection by a solder and is inexpensive. A joint surface of an electrode jointing portion that is opposed to a surface to be jointed of a gate electrode of a bare-chip FET and a joint surface of a substrate jointing portion that is opposed to a surface to be jointed of another wiring pattern include an outgas releasing mechanism that makes outgas generated from a molten solder during solder jointing of a metal plate connector be released from solders interposed between the joint surfaces and the surfaces to be jointed.
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公开(公告)号：US20150076570A1
公开(公告)日：2015-03-19
申请号：US14127187
申请日：2013-05-27
Applicant: NSK LTD.
Inventor： Takashi Sunaga , Noboru Kaneko , Osamu Miyoshi
CPC classification number: H01L24/43 , H01L23/3735 , H01L23/49811 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/75 , H01L24/77 , H01L24/83 , H01L24/84 , H01L24/85 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L29/78 , H01L2224/05553 , H01L2224/0603 , H01L2224/291 , H01L2224/29101 , H01L2224/29294 , H01L2224/293 , H01L2224/32225 , H01L2224/32227 , H01L2224/32238 , H01L2224/33181 , H01L2224/352 , H01L2224/35847 , H01L2224/3701 , H01L2224/37011 , H01L2224/37013 , H01L2224/37147 , H01L2224/40095 , H01L2224/40227 , H01L2224/40475 , H01L2224/40499 , H01L2224/4103 , H01L2224/4112 , H01L2224/41175 , H01L2224/43848 , H01L2224/451 , H01L2224/48091 , H01L2224/48472 , H01L2224/494 , H01L2224/73263 , H01L2224/73265 , H01L2224/75272 , H01L2224/77272 , H01L2224/83191 , H01L2224/83192 , H01L2224/8321 , H01L2224/83424 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/84424 , H01L2224/84447 , H01L2224/84801 , H01L2224/84815 , H01L2224/85 , H01L2224/85815 , H01L2224/9221 , H01L2924/00014 , H01L2924/00015 , H01L2924/01029 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15724 , H01L2924/19105 , H01L2924/3011 , H01L2924/351 , H01L2924/3701 , H05K1/181 , H05K2201/10166 , H05K2201/1031 , H05K2201/10409 , Y02P70/611 , H01L2924/00 , H01L2224/48 , H01L2224/83 , H01L2224/84 , H01L2224/33 , H01L2924/00012 , H01L2224/45099 , H01L2224/48227
Abstract: There is provided a semiconductor module and a method for manufacturing the same which make it possible to joint the electrode of the bare-chip transistor and the wiring pattern on the substrate by solder mounting operation, in the same process of solder mounting operation for mounting the bare-chip transistor or other surface mounting devices on the wiring patterns on the substrate. A semiconductor module includes: a plurality of wiring patterns formed on an insulating layer; a bare-chip transistor mounted on one wiring pattern out of the plurality of wiring patterns via a solder; and a copper connector constituted of a copper plate for jointing an electrode formed on a top surface of the bare-chip transistor and another wiring pattern out of the plurality of wiring patterns via a solder.
Abstract translation: 提供了一种半导体模块及其制造方法，其可以通过焊接安装操作将裸芯片晶体管的电极和布线图案与基板上的布线图案相连接，在相同的焊接安装操作过程中， 裸芯片晶体管或其他表面安装器件在基板上的布线图案上。 半导体模块包括：形成在绝缘层上的多个布线图案; 通过焊料在多个布线图案中安装在一个布线图案上的裸芯片晶体管; 以及铜连接器，其由用于通过焊料将形成在裸芯片晶体管的顶表面上的电极和多个布线图案中的另一布线图案连接的铜板构成。
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公开(公告)号：US09609775B2
公开(公告)日：2017-03-28
申请号：US14435682
申请日：2013-10-25
Applicant: NSK Ltd.
Inventor： Takashi Sunaga , Noboru Kaneko , Osamu Miyoshi
IPC: H05K7/00 , H05K7/02 , H01L25/07 , H01L25/18 , H01L23/373 , H01L23/498 , H01L23/00 , H01L23/14
CPC classification number: H05K7/02 , H01L23/142 , H01L23/3735 , H01L23/49811 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L2224/291 , H01L2224/29294 , H01L2224/293 , H01L2224/32227 , H01L2224/32238 , H01L2224/32245 , H01L2224/33181 , H01L2224/352 , H01L2224/35847 , H01L2224/3701 , H01L2224/37013 , H01L2224/37124 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/40095 , H01L2224/40227 , H01L2224/40475 , H01L2224/40499 , H01L2224/4103 , H01L2224/4112 , H01L2224/48 , H01L2224/73263 , H01L2224/77272 , H01L2224/83191 , H01L2224/83192 , H01L2224/8321 , H01L2224/83424 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/84424 , H01L2224/84447 , H01L2224/84801 , H01L2224/84815 , H01L2224/85 , H01L2224/9221 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/19105 , H01L2924/3011 , H01L2924/351 , H05K1/181 , H05K2201/10166 , H05K2201/1031 , H05K2201/10409 , Y02P70/611 , H01L2924/00015 , H01L2924/00014 , H01L2224/83 , H01L2224/84 , H01L2224/33 , H01L2924/00012 , H01L2924/00
Abstract: To provide a semiconductor module capable of shortening of the manufacturing tact time, reducing the manufacturing costs, and improving assembility. A semiconductor module (30) includes substrate (31) made of metal, an insulating layer (32) formed on the substrate (31), a plurality of wiring patterns (33a to 33d) formed on the insulating layer (32), a bare-chip transistor (35) mounted on a wiring pattern (33a) via a solder (34a); and a metal plate connector (36a, 36b) jointing an electrode (S, G) of the bare-chip transistor (35) and a wiring pattern (33b, 33c) via a solder (34b, 34c). The metal plate connector (36a, 36b) has a bridge shape, and has a flat surface and a center of gravity at a middle portion of the component.
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公开(公告)号：US09397030B2
公开(公告)日：2016-07-19
申请号：US14435690
申请日：2013-10-25
Applicant: NSK Ltd.
Inventor： Takashi Sunaga , Noboru Kaneko , Osamu Miyoshi
IPC: H01L23/495 , B62D5/04 , H01L25/18 , H01L23/00 , H01L25/07
CPC classification number: H01L23/49551 , B62D5/0406 , H01L23/49524 , H01L23/49562 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L2224/29101 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/352 , H01L2224/3701 , H01L2224/37011 , H01L2224/37013 , H01L2224/37147 , H01L2224/40095 , H01L2224/40106 , H01L2224/40159 , H01L2224/40225 , H01L2224/4103 , H01L2224/41175 , H01L2224/73263 , H01L2224/77272 , H01L2224/83192 , H01L2224/8321 , H01L2224/83424 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/84095 , H01L2224/84424 , H01L2224/84447 , H01L2224/84801 , H01L2224/84815 , H01L2224/92246 , H01L2224/92247 , H01L2924/014 , H01L2924/13055 , H01L2924/1306 , H01L2924/15724 , H01L2924/19041 , H01L2924/19105 , H01L2924/351 , H01L2924/00 , H01L2924/1305 , H01L2924/00012 , H01L2924/00014
Abstract: A semiconductor module is provided for shortening a manufacturing tact time, reducing manufacturing costs and for ensuring reliability of a bonding portion. The semiconductor module includes a substrate formed of a metal, an insulating layer formed on the substrate, a plurality of wiring patterns formed on the insulating layer, a bare-chip transistor mounted on one wiring pattern via a solder, and copper connectors that connect electrodes formed on the bear-chip transistor and other wiring patterns via a solder. The copper connectors have a bridge shape, have a width-reduced portion formed in the vicinity of the bonding face to the electrodes, and have a stress-reducing portion formed on the bonding face bonded to the electrode.
Abstract translation: 提供了一种半导体模块，用于缩短制造节拍时间，降低制造成本并确保结合部的可靠性。 半导体模块包括由金属形成的基板，形成在基板上的绝缘层，形成在绝缘层上的多个布线图案，通过焊料安装在一个布线图案上的裸芯片晶体管和连接电极的铜连接器 通过焊料形成在承载芯片晶体管和其它布线图案上。 铜连接器具有桥接形状，在与电极的接合面附近形成有宽度减小部，并且在与电极接合的接合面上形成有应力减小部。
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公开(公告)号：US20150289369A1
公开(公告)日：2015-10-08
申请号：US14435686
申请日：2013-10-25
Applicant: NSK Ltd.
Inventor： Takashi Sunaga , Noboru Kaneko , Osamu Miyoshi
IPC: H05K1/09 , H05K1/18 , H05K1/02 , H01L23/495 , H05K1/05
CPC classification number: H05K1/09 , H01L23/142 , H01L23/3735 , H01L23/49582 , H01L23/49811 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L2224/05553 , H01L2224/0603 , H01L2224/291 , H01L2224/29294 , H01L2224/293 , H01L2224/32227 , H01L2224/32238 , H01L2224/33181 , H01L2224/352 , H01L2224/35847 , H01L2224/3701 , H01L2224/37013 , H01L2224/37147 , H01L2224/40095 , H01L2224/40225 , H01L2224/40227 , H01L2224/40475 , H01L2224/40499 , H01L2224/4103 , H01L2224/4112 , H01L2224/48 , H01L2224/73263 , H01L2224/77272 , H01L2224/83191 , H01L2224/83192 , H01L2224/8321 , H01L2224/83424 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/84424 , H01L2224/84447 , H01L2224/84801 , H01L2224/84815 , H01L2224/85 , H01L2224/9221 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/181 , H01L2924/19105 , H01L2924/3011 , H01L2924/351 , H05K1/0271 , H05K1/05 , H05K1/181 , H05K3/3431 , H05K2201/10166 , H05K2201/1028 , H05K2201/1031 , H05K2201/10409 , H05K2201/10946 , H05K2201/10962 , Y02P70/611 , Y02P70/613 , H01L2924/00015 , H01L2924/00014 , H01L2224/83 , H01L2224/84 , H01L2224/33 , H01L2924/00012 , H01L2924/00
Abstract: A semiconductor module includes a copper connector jointing an electrode formed on a top surface of a bare-chip transistor and a wiring pattern out of plural wiring patterns via a solder. The copper connector includes an electrode jointing portion jointed to the electrode of the bare-chip transistor and a substrate jointing portion arranged to face the electrode-jointing portion and jointed to the wiring pattern. The width W1 of the electrode jointing portion in a direction perpendicular to one direction is smaller than the width W2 of the substrate jointing portion in the direction perpendicular to the one direction.
Abstract translation: 半导体模块包括通过焊料将形成在裸芯片晶体管的顶表面上的电极和多个布线图案中的布线图案连接的铜连接器。 铜连接器包括连接到裸芯片晶体管的电极的电极接合部分和布置成面对电极接合部分并且接合到布线图案的基板接合部分。 电极接合部在与一个方向垂直的方向上的宽度W1小于基板接合部在垂直于该一个方向的方向上的宽度W2。
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Patent Agency Ranking
公开(公告)号：US20150144392A1
公开(公告)日：2015-05-28
申请号：US14401887
申请日：2014-01-15
Applicant: NSK LTD.
Inventor： Takashi Sunaga , Noboru Kaneko , Osamu Miyoshi
CPC classification number: H01R12/523 , H01R12/58 , H01R13/405 , H01R43/24 , H01R2107/00 , H05K1/115 , H05K1/144 , H05K1/181 , H05K3/341 , H05K2201/042 , H05K2201/1028 , H05K2201/10303 , H05K2201/10424 , H05K2201/10522
Abstract: A multipolar connector is provided. It is possible to prevent deformation of a particular pin-shaped terminal of plural pin-shaped terminals arranged in a line in a direction perpendicular to a connection direction of the multipolar connector, and also possible to prevent positional displacements of the particular pin-shaped terminal and other pin-shaped terminals. The multipolar connector (101) includes plural pin-shaped terminals (110) arranged in a line in a direction (arrow X direction) perpendicular to a connection direction (arrow Y direction) of the multipolar connector to extend in the connection direction, and a hold member (120) configured to extend in the direction perpendicular to the connection direction and hold the plural pin-shaped terminals (110) at a predefined pitch.
Abstract translation: 提供多极连接器。 可以防止在垂直于多极连接器的连接方向的方向上排列成一行的多个销状端子的特定销状端子的变形，并且还可以防止特定销状端子的位置偏移 和其他针形端子。 多极连接器（101）包括沿垂直于多极连接器的连接方向（箭头Y方向）的方向（箭头X方向）排列成一列的多个销状端子，沿连接方向延伸， 保持构件（120），其构造成在垂直于连接方向的方向上延伸，并以预定的间距保持多个销状端子（110）。
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公开(公告)号：US11148708B2
公开(公告)日：2021-10-19
申请号：US16349079
申请日：2017-10-19
Applicant: NSK LTD.
Inventor： Masakazu Morimoto , Noboru Kaneko
IPC: B62D5/04 , H05K7/20 , H02K11/33 , H01G9/022 , H01G9/26 , H01G9/00 , H01G9/06 , H01G2/10 , H01G2/08
Abstract: An electronic control device includes: a circuit board including a substrate and an electrolytic capacitor connected to the substrate; a heat sink including a recess that houses the electrolytic capacitor; and heat dissipation material provided in the recess. The electrolytic capacitor has an end surface facing a bottom surface of the recess, and the heat dissipation material is in contact with the end surface and the bottom surface.
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8.发明授权公开(公告)号：US10225927B2
公开(公告)日：2019-03-05
申请号：US15774815
申请日：2016-11-25
Applicant: NSK LTD.
Inventor： Masakazu Morimoto , Noboru Kaneko , Shin Kumagai
Abstract: A substrate provided in proximity to a case for improving heat radiation, and maintaining electrical insulation between the substrate and the case even when the substrate is warped, in the substrate having electronic parts mounted thereon and a case for housing the substrate. A case body of the case has a substrate placement surface for placing the substrate, the substrate placement surface is provided with a protruding portion protruding therefrom, and the substrate is fixed on the substrate placement surface, via a thermal interface material disposed on the substrate placement surface from a periphery of the protruding portion.
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公开(公告)号：US09974178B2
公开(公告)日：2018-05-15
申请号：US15321253
申请日：2015-09-10
Applicant: NSK Ltd.
Inventor： Masakazu Morimoto , Noboru Kaneko , Tadayoshi Osakabe
CPC classification number: H05K1/18 , H01R12/52 , H01R12/57 , H01R12/58 , H01R12/707 , H01R13/405 , H01R43/24 , H01R2201/26 , H05K1/144 , H05K3/3426 , H05K7/1432 , H05K2201/042 , H05K2201/10318
Abstract: Multipolar lead parts having plural leads and a retaining member, wherein the retaining member includes a cylindrical portion so as to cover peripheries of the leads, the cylindrical portion facing in a board direction; wherein the leads each include an upper-side board coupling portion and a lower-side board coupling portion; wherein the lower-side board coupling portion comprises a forward protruding portion that the other end side of each of the leads is bent in a direction orthogonal to an arrangement face of the leads, a vertical portion extending downward from a front end, a solder coupling portion extending backward from a lower end, and a rising portion extending upward from the solder coupling portion; and wherein said rising portion is formed as to have an obtuse angle from said solder coupling portion regardless of a bending angle of said vertical portion with respect to said solder coupling portion.
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公开(公告)号：US09402311B2
公开(公告)日：2016-07-26
申请号：US14435686
申请日：2013-10-25
Applicant: NSK Ltd.
Inventor： Takashi Sunaga , Noboru Kaneko , Osamu Miyoshi
IPC: H05K7/00 , H05K1/09 , H01L25/07 , H01L25/18 , H01L23/373 , H01L23/498 , H01L23/495 , H05K1/02 , H05K1/05 , H05K1/18 , H01L23/00
CPC classification number: H05K1/09 , H01L23/142 , H01L23/3735 , H01L23/49582 , H01L23/49811 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L2224/05553 , H01L2224/0603 , H01L2224/291 , H01L2224/29294 , H01L2224/293 , H01L2224/32227 , H01L2224/32238 , H01L2224/33181 , H01L2224/352 , H01L2224/35847 , H01L2224/3701 , H01L2224/37013 , H01L2224/37147 , H01L2224/40095 , H01L2224/40225 , H01L2224/40227 , H01L2224/40475 , H01L2224/40499 , H01L2224/4103 , H01L2224/4112 , H01L2224/48 , H01L2224/73263 , H01L2224/77272 , H01L2224/83191 , H01L2224/83192 , H01L2224/8321 , H01L2224/83424 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/84424 , H01L2224/84447 , H01L2224/84801 , H01L2224/84815 , H01L2224/85 , H01L2224/9221 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/181 , H01L2924/19105 , H01L2924/3011 , H01L2924/351 , H05K1/0271 , H05K1/05 , H05K1/181 , H05K3/3431 , H05K2201/10166 , H05K2201/1028 , H05K2201/1031 , H05K2201/10409 , H05K2201/10946 , H05K2201/10962 , Y02P70/611 , Y02P70/613 , H01L2924/00015 , H01L2924/00014 , H01L2224/83 , H01L2224/84 , H01L2224/33 , H01L2924/00012 , H01L2924/00
Abstract: A semiconductor module includes a copper connector jointing an electrode formed on a top surface of a bare-chip transistor and a wiring pattern out of plural wiring patterns via a solder. The copper connector includes an electrode jointing portion jointed to the electrode of the bare-chip transistor and a substrate jointing portion arranged to face the electrode-jointing portion and jointed to the wiring pattern. The width W1 of the electrode jointing portion in a direction perpendicular to one direction is smaller than the width W2 of the substrate jointing portion in the direction perpendicular to the one direction.
Abstract translation: 半导体模块包括通过焊料将形成在裸芯片晶体管的顶表面上的电极和多个布线图案中的布线图案连接的铜连接器。 铜连接器包括连接到裸芯片晶体管的电极的电极接合部分和布置成面对电极接合部分并且接合到布线图案的基板接合部分。 电极接合部在与一个方向垂直的方向上的宽度W1小于基板接合部在垂直于该一个方向的方向上的宽度W2。
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