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    Forming partial-depth features in polymer film
    2.
    发明授权
    Forming partial-depth features in polymer film 有权
    在聚合物膜中形成部分深度特征

    公开(公告)号：US07118833B2

    公开(公告)日：2006-10-10

    申请号：US10672201

    申请日：2003-09-26

    申请人： Peter Elenius ,  Michael E. Johnson

    发明人： Peter Elenius ,  Michael E. Johnson

    IPC分类号： G03F9/00 ,  G03C5/00

    CPC分类号： G03F1/50

    摘要： A photomask (1900) for producing partial-depth features (712 and 912) in a photo-imageable polymer layer (412) on a wafer of a chip scale package (200) using exposure tools capable of resolving sizes of a critical dimension or larger, has a plurality of chrome lines (2101–2103). Each chrome line has a width (2105) that is less than the critical dimension, and each chrome line of the plurality of chrome lines is spaced apart less than the critical dimension. The plurality of chrome lines produces a single partial-depth feature, such as a via, through part of a thickness of the polymer layer. Alternatively, the photomask has a plurality of chrome circles (2206), each chrome circle having a diameter less than the critical dimension and being spaced apart less than the critical dimension, which produces the partial-depth feature. The photomask may also have chrome of width greater than the critical dimension and spaced from other chrome by a distance greater than the critical dimension, which produces a full-depth feature through the entire thickness of the polymer film. The partial-depth feature and the full-depth feature are produced substantially simultaneously during a single series of photo-imaging steps. By preselecting a size, shape and distance between the chrome, the photomask is capable of inscribing discernable markings on the polymer layer, of changing the thickness of the polymer layer, and of changing an optical property of the surface of the polymer layer.

    摘要翻译： 一种光掩模（1900），用于使用能够分辨关键尺寸或更大尺寸的曝光工具在芯片级封装（200）的晶片上的可光成像聚合物层（412）中产生部分深度特征（712和912） 具有多条铬线（2101-2103）。 每个铬线具有小于临界尺寸的宽度（2105），并且多个铬线的每个铬线间隔开小于临界尺寸。 多条铬线通过聚合物层的厚度的一部分产生单一部分深度特征，例如通孔。 或者，光掩模具有多个铬圆（2206），每个铬圆的直径小于临界尺寸，并且间隔开小于临界尺寸，产生部分深度特征。 光掩模还可以具有大于临界尺寸的宽度的铬，并且与其它铬隔开大于临界尺寸的距离，其通过聚合物膜的整个厚度产生全深度特征。 部分深度特征和全深度特征在单个系列的光成像步骤期间基本上同时产生。 通过预先选择铬之间的尺寸，形状和距离，光掩模能够在聚合物层上刻划可辨别的标记，改变聚合物层的厚度和改变聚合物层的表面的光学性质。

    Solder bar for high power flip chips
    4.
    发明授权
    Solder bar for high power flip chips 有权
    焊接棒用于大功率倒装芯片

    公开(公告)号：US07057292B1

    公开(公告)日：2006-06-06

    申请号：US09575298

    申请日：2000-05-19

    申请人： Peter Elenius ,  Hong Yang

    发明人： Peter Elenius ,  Hong Yang

    IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

    CPC分类号： H01L23/5386 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/13012 ,  H01L2224/14051 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/10253 ,  H05K3/341 ,  H05K3/3436 ,  H01L2924/00 ,  H01L2924/00012

    摘要： A solder bar compatible with conventional flip chip technology fabrication methods for high power/high current applications includes first and second generally circular solder pads of diameter D formed upon a substrate and connected by a solder bar pad of width BW. The centers of the generally circular solder pads are spaced apart by distance BL (bar length). A mass of solder having volume VB is formed over the first and second generally circular solder pads and over the solder bar pad to form a dog-bone shaped solder bar. The solder bar reaches height H1 above the centers of the first and second generally circular solder pads, and reaching height H2 above the midpoint of the solder bar pad. The values for diameter D, bar length BL, bar width BW, and solder volume VB are selected in such manner that H1 and H2 are approximately equal. Conventional circular (as viewed from above) solder bumps can be formed upon the same substrate; in this case, heights H1 and H2 are made approximately equal to the height of the conventional solder bumps.

    摘要翻译： 与用于高功率/高电流应用的常规倒装芯片技术制造方法兼容的焊料棒包括直径为D的第一和第二通常为圆形的焊盘，其形成在基板上并且通过宽度为BW的焊条焊盘连接。 大致圆形焊盘的中心间隔距离BL（条长度）。 具有体积VB的焊料块形成在第一和第二大致圆形的焊盘之上并且在焊料条焊盘上形成，以形成狗骨形焊料条。 焊料棒在第一和第二大致圆形焊盘的中心之上达到高度H 1，并且在焊料条焊盘的中点之上达到高度H 2。 以H 1和H 2近似相等的方式选择直径D，条长度BL，条宽BW和焊料体积VB的值。 常规的圆形（如上所述）可以在相同的基板上形成焊料凸块; 在这种情况下，H 1和H 2的高度大致等于常规焊料凸块的高度。