Semiconductor package with pocket for sealing material
    1.
    发明授权
    Semiconductor package with pocket for sealing material 失效
    半导体封装带口袋密封材料

    公开(公告)号:US5917246A

    公开(公告)日:1999-06-29

    申请号:US620580

    申请日:1996-03-22

    摘要: A semiconductor package, which secures the protection of circuit elements from the external environment, is disclosed. A single in-line package (SIP) is constructed by fixingly sealing a hybrid integrated circuit component within a casing with epoxy resin. A sleeve is bonded on the surface of a ceramic substrate. The sleeve is formed with silicon rubber into a pocket shape so as to cover respective circuit elements of the hybrid integrated circuit component. In the sleeve is made an opening part. Silicon gel is poured into the sleeve as a fixingly sealing material and cured to seal the respective circuit elements. Terminals downwardly extends in parallel with each other from an end part of the ceramic substrate through an opening part of the casing.

    摘要翻译: 公开了一种确保电路元件与外部环境的保护的半导体封装。 单个在线封装(SIP)是通过将环形树脂固定密封在壳体内的混合集成电路部件构成的。 套筒结合在陶瓷基板的表面上。 套筒由硅橡胶形成为袋形,以覆盖混合集成电路部件的各个电路元件。 在袖子里打开了一部分。 将硅胶作为固定密封材料倒入套筒中并固化以密封各个电路元件。 端子从陶瓷基板的端部通过壳体的开口部向下平行地延伸。

    Electronic circuit device
    2.
    发明授权
    Electronic circuit device 失效
    电子电路装置

    公开(公告)号:US5483217A

    公开(公告)日:1996-01-09

    申请号:US91718

    申请日:1993-07-15

    摘要: An electronic circuit device decreases dispersion in the output of the circuit caused by changes in the resistance of the resistors resulting from stress. Resistor positions are selected on the circuit board so that a change in the circuit output caused by a change in resistance of a first resistor group becomes equal to a change caused by a change in resistance caused by a second resistor group, these changes being in opposite directions so as to cancel each other. Alternately, a plurality of resistors are connected to form a composite resistor such that the effect upon resistance of the composite resistor caused by the resistor having decreased resistance is cancelled by the effect upon resistance of the composite resistor caused by a resistor having an increased resistance.

    摘要翻译: 电子电路装置减少由于应力引起的电阻电阻变化引起的电路输出中的色散。 在电路板上选择电阻器位置,使得由第一电阻器组的电阻变化引起的电路输出的变化等于由第二电阻器组造成的电阻变化引起的变化,这些变化是相反的 方向相互抵消。 或者,连接多个电阻器以形成复合电阻器,使得由具有降低的电阻的电阻器引起的复合电阻器的电阻的影响由于由具有增加的电阻的电阻器引起的复合电阻器的电阻的影响而被抵消。

    Analog to digital converter
    3.
    发明授权
    Analog to digital converter 失效
    模数转换器

    公开(公告)号:US5629702A

    公开(公告)日:1997-05-13

    申请号:US318546

    申请日:1994-10-05

    CPC分类号: H03M1/42

    摘要: An analog to digital converter comprises: first to n.sup.th comparators, having a tandem structure, for comparing an input voltage signal with first to n.sup.th reference voltages and outputting first to n.sup.th bit outputs respectively, said n being a natural number more than one, said first comparator outputting a most significant bit of said first bit output; a first reference voltage generation circuit for generating said first reference voltage; second to n.sup.th reference voltage generation circuits for generating said second to n.sup.th reference voltages, p.sup.th reference voltages being generated in accordance with outputs of said first to (p-1).sup.th comparators, said p being a natural number and l

    摘要翻译: 一种模数转换器包括:具有串联结构的第一至第n比较器,用于将输入电压信号与第一至第n参考电压进行比较,并分别输出第一至第n位输出,所述n为多于一个的自然数,所述第一 比较器输出所述第一位输出的最高有效位; 用于产生所述第一参考电压的第一参考电压产生电路; 用于产生所述第二至第n参考电压的第二至第n参考电压产生电路,根据所述第一至第(p-1)比较器的输出产生第p参考电压,所述p为自然数,l

    Reference voltage generating circuit having reduced current consumption
with varying loads
    8.
    发明授权
    Reference voltage generating circuit having reduced current consumption with varying loads 失效
    参考电压发生电路具有随着负载变化而具有降低的电流消耗

    公开(公告)号:US5719522A

    公开(公告)日:1998-02-17

    申请号:US814935

    申请日:1997-03-12

    CPC分类号: G05F3/222 G11C5/147

    摘要: A variable load current supply unit supplies a current to be consumed by a constant voltage output unit to a power source terminal thereof, and supplies a current to be consumed by a load circuit thereto through a reference voltage output terminal. The constant voltage output unit maintains a potential of the power source terminal thereof, i.e., a potential of the reference voltage output terminal, at a fixed potential. A base potential control unit negatively feeds back changes in the potential on the reference voltage output terminal to a base of an emitter follower transistor in the variable load current supply unit. In this way, when the current consumed by the load current is reduced and the potential on the reference voltage output terminal thereby slightly increases the current supplied by the variable load current supply unit decreases.

    摘要翻译: 可变负载电流供给单元将恒定电压输出单元消耗的电流供给到其电源端子,并通过基准电压输出端子向负载电路供给要消耗的电流。 恒定电压输出单元将电源端子的电位即基准电压输出端子的电位维持在固定电位。 基极电位控制单元将可变负载电流供给单元中的基准电压输出端子上的电位的变化负反馈到射极跟随器晶体管的基极。 以这种方式,当负载电流消耗的电流减小并且参考电压输出端子上的电位稍微增加时,可变负载电流供应单元提供的电流减小。

    ELECTRONIC CONTROL UNIT
    9.
    发明申请
    ELECTRONIC CONTROL UNIT 审中-公开
    电子控制单元

    公开(公告)号:US20120326292A1

    公开(公告)日:2012-12-27

    申请号:US13524149

    申请日:2012-06-15

    IPC分类号: H01L23/34

    摘要: An electronic control unit includes a substrate, a semiconductor module, a heat storage body, an insulator, and a heat sink. The substrate includes a wiring and a land. The semiconductor module includes a semiconductor chip working as a switching element, a terminal electrically coupled with the semiconductor chip and the wiring, a molded resin sealing the semiconductor chip and the terminal, and a heat radiation plate having a surface exposed from the molded resin and transferring heat generated at the semiconductor chip. The heat storage body has a heat capacity required to store the heat generated at the semiconductor chip. The heat storage body is coupled with the heat radiation plate. The insulator is in contact with the heat storage body or the semiconductor module. The heat sink is in contact with the insulator.

    摘要翻译: 电子控制单元包括基板,半导体模块,蓄热体,绝缘体和散热器。 基板包括布线和焊盘。 半导体模块包括用作开关元件的半导体芯片,与半导体芯片和布线电耦合的端子,密封半导体芯片和端子的模制树脂和具有从模制树脂露出的表面的散热板,以及 传递在半导体芯片处产生的热量。 蓄热体具有存储半导体芯片产生的热量所需的热容量。 蓄热体与散热板连接。 绝缘体与蓄热体或半导体模块接触。 散热器与绝缘体接触。