摘要:
A semiconductor package, which secures the protection of circuit elements from the external environment, is disclosed. A single in-line package (SIP) is constructed by fixingly sealing a hybrid integrated circuit component within a casing with epoxy resin. A sleeve is bonded on the surface of a ceramic substrate. The sleeve is formed with silicon rubber into a pocket shape so as to cover respective circuit elements of the hybrid integrated circuit component. In the sleeve is made an opening part. Silicon gel is poured into the sleeve as a fixingly sealing material and cured to seal the respective circuit elements. Terminals downwardly extends in parallel with each other from an end part of the ceramic substrate through an opening part of the casing.
摘要:
An electronic circuit device decreases dispersion in the output of the circuit caused by changes in the resistance of the resistors resulting from stress. Resistor positions are selected on the circuit board so that a change in the circuit output caused by a change in resistance of a first resistor group becomes equal to a change caused by a change in resistance caused by a second resistor group, these changes being in opposite directions so as to cancel each other. Alternately, a plurality of resistors are connected to form a composite resistor such that the effect upon resistance of the composite resistor caused by the resistor having decreased resistance is cancelled by the effect upon resistance of the composite resistor caused by a resistor having an increased resistance.
摘要:
An analog to digital converter comprises: first to n.sup.th comparators, having a tandem structure, for comparing an input voltage signal with first to n.sup.th reference voltages and outputting first to n.sup.th bit outputs respectively, said n being a natural number more than one, said first comparator outputting a most significant bit of said first bit output; a first reference voltage generation circuit for generating said first reference voltage; second to n.sup.th reference voltage generation circuits for generating said second to n.sup.th reference voltages, p.sup.th reference voltages being generated in accordance with outputs of said first to (p-1).sup.th comparators, said p being a natural number and l
摘要:
An operational amplifier charges a charge storage capacitor in response to an input signal supplied to a non-inverting input terminal. When a switching signal is low, NPN transistors disposed in an output open circuit are on. Therefore, output transistors disposed in a push-pull circuit are off and the output signal is cut off. Further, in this situation, the potential of a phase compensation capacitor is held because AC coupling of the phase compensation capacitor does not occur.
摘要:
At least four electrodes are provided on the same surface of a discrete transistor. Among these electrodes, one electrode is set as a base electrode, an electrode neighboring the base electrode in the up-and-down direction is set as an emitter electrode and an electrode neighboring the base electrode in the right-and-left direction is set as a collector electrode. On the same surface, a base electrode is provided at a position which is neither in the up-and-down direction nor in the right-and-left direction with respect to the base electrode. When the discrete transistor having this type of electrode arrangement is mounted on a substrate, one of the base electrodes formed on the substrate is connected to a first wiring, the collector electrode is connected to a second wiring, and the emitter electrode is connected to a third wiring.
摘要:
An electric device includes: a first electric element; a second electric element capable of flowing large current therethrough so that heat is generated in the second electric element; a heat sink; and a first wiring board and a second wiring board, which are disposed on one side of the heat sink. The large current in the second electric element is larger than that in the first electric element. The first wiring board and the second wiring board are separated each other. The first electric element is disposed on the first wiring board, and the second electric element is disposed on the second wiring board.
摘要:
A semiconductor device including a reduced surface field strength type LDMOS transistor which can prevent the breakdown of elements at channel formation portions when a reverse voltage is applied to its drain. A P well and an N well are formed in an N-type substrate to produce a double-well structure, with a source electrode being set to be equal in electric potential to the N-type substrate. The drift region of the N well has a dopant concentration to satisfy the so-called RESURF condition, which can provide a high breakdown voltage a low ON resistance. When a reverse voltage is applied to a drain electrode, a parasitic bipolar transistor comprising the N well, the P well and the N-type substrate develops to form a current-carrying path toward a substrate, so that the element breakdown at the channel formation portions is avoidable at the application of the reverse voltage.
摘要:
A variable load current supply unit supplies a current to be consumed by a constant voltage output unit to a power source terminal thereof, and supplies a current to be consumed by a load circuit thereto through a reference voltage output terminal. The constant voltage output unit maintains a potential of the power source terminal thereof, i.e., a potential of the reference voltage output terminal, at a fixed potential. A base potential control unit negatively feeds back changes in the potential on the reference voltage output terminal to a base of an emitter follower transistor in the variable load current supply unit. In this way, when the current consumed by the load current is reduced and the potential on the reference voltage output terminal thereby slightly increases the current supplied by the variable load current supply unit decreases.
摘要:
An electronic control unit includes a substrate, a semiconductor module, a heat storage body, an insulator, and a heat sink. The substrate includes a wiring and a land. The semiconductor module includes a semiconductor chip working as a switching element, a terminal electrically coupled with the semiconductor chip and the wiring, a molded resin sealing the semiconductor chip and the terminal, and a heat radiation plate having a surface exposed from the molded resin and transferring heat generated at the semiconductor chip. The heat storage body has a heat capacity required to store the heat generated at the semiconductor chip. The heat storage body is coupled with the heat radiation plate. The insulator is in contact with the heat storage body or the semiconductor module. The heat sink is in contact with the insulator.
摘要:
In order to protect semiconductor switching-devices employed in an H bridge circuit against an over-voltage without using a special protection circuit, a control circuit outputs a control signal to a driving circuit for driving the H bridge circuit in order to turn off FETs serving as the semiconductor switching-devices when an over-voltage detection circuit detects the over-voltage applied to the H bridge circuit.