公开(公告)号：US20050069277A1

公开(公告)日：2005-03-31

申请号：US10494932

申请日：2001-11-09

申请人： Terumi Nakazawa ,  Kenji Tabuchi ,  Shuji Eguchi ,  Tsuyoshi Fujita ,  Hidetaka Shigi

发明人： Terumi Nakazawa ,  Kenji Tabuchi ,  Shuji Eguchi ,  Tsuyoshi Fujita ,  Hidetaka Shigi

IPC分类号： G01S7/03 ,  G01S13/34 ,  G01S13/93 ,  H01Q1/32 ,  H01Q1/42 ,  H01Q21/00 ,  H01Q23/00 ,  G02B6/00

CPC分类号： H01Q23/00 ,  G01S7/032 ,  G01S13/348 ,  G01S13/931 ,  G01S2013/9353 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01Q1/3233 ,  H01Q1/42 ,  H01Q21/0087

摘要： An antenna unit for sending out electromagnetic waves of a millimetric-wave band to outside and receiving the wave reflected from a target, and circuits for signal-processing the reflected wave are equipped as a vehicular millimetric-wave radar device. Antenna patterns are formed on a surface of a multilayer base plate formed of plural stacked layers of dielectric plates and an electroconductive layer interposed between each layer. Circuit wiring patterns and electronic components for signal processing of millimetric waves are disposed on the reverse side. Among all the above-mentioned electronic components, only a millimetric-wave signal oscillator, amplifier, and frequency converter are haused in a hermetically sealed section formed in a localized space on a face of the multilayer base plate. The other electronic components are arranged in a non-hermetically structured condition on a periphery of the hermetically sealed section. The above-mentioned oscillator, amplifier, and frequency converter are hermetically sealed in an inert gas atmosphere, whereas at least part of the other electronic components arranged in a non-hermetically structured condition is protected by resin coating. With this configuration, a compact, thin, and highly accurate millimetric-wave radar device is provided at a low cost.

摘要翻译： 天线单元，用于向外部发送毫米波段的电磁波并接收从目标反射的波，以及用于信号处理反射波的电路作为车辆毫米波雷达装置。 天线图案形成在由介电板的多个堆叠层和介于每层之间的导电层形成的多层基板的表面上。 用于毫米波信号处理的电路布线图形和电子部件设置在反面上。 在所有上述电子部件中，只有一个毫米波信号振荡器，放大器和变频器在形成在多层基板的表面上的局部空间中的气密密封部分中。 其他电子部件在气密密封部分的周边上以非气密结构的状态布置。 上述振荡器，放大器和变频器被气密地密封在惰性气体气氛中，而以非气密结构状态布置的其它电子部件的至少一部分被树脂涂覆保护。 通过这种配置，以低成本提供了紧凑，薄型和高精度的毫米波雷达装置。

公开(公告)号：US07445455B2

公开(公告)日：2008-11-04

申请号：US11183972

申请日：2005-07-19

申请人： Takehide Yokozuka ,  Masahide Harada ,  Shiro Yamashita ,  Isamu Yoshida ,  Masahiko Asano ,  Koji Sato ,  Shuji Eguchi ,  Kaoru Uchiyama

发明人： Takehide Yokozuka ,  Masahide Harada ,  Shiro Yamashita ,  Isamu Yoshida ,  Masahiko Asano ,  Koji Sato ,  Shuji Eguchi ,  Kaoru Uchiyama

IPC分类号： H01R12/00

CPC分类号： H05K5/069 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0313 ,  H05K3/3447 ,  H05K5/0069 ,  H05K2201/0999 ,  H05K2201/10189 ,  H05K2201/10977 ,  H05K2201/2009 ,  Y10S439/935 ,  H01L2924/00

摘要： An electronic device comprises a circuit board which has a through hole and uses a resin with a glass transition temperature exceeding 150° C. as a base member, a metal casing which has an opening, and a connector which is fitted to the opening of the metal casing in which a pin of the connector is inserted into the through hole, the pin and the through hole are connected with a conductive member, and a reinforcement member for securing the connector and the board is further provided on the conductive member, thereby improving the reliability of the electronic device.

摘要翻译： 一种电子设备包括具有通孔并使用玻璃化转变温度超过150℃的树脂作为基底的电路板，具有开口的金属外壳和安装在所述开口的连接器 金属壳体，其中连接器的销插入通孔中，销和通孔与导电构件连接，并且还在导电构件上设置用于固定连接器和板的加强构件，从而改善 电子设备的可靠性。

公开(公告)号：US07091620B2

公开(公告)日：2006-08-15

申请号：US11116209

申请日：2005-04-28

申请人： Chuichi Miyazaki ,  Yukiharu Akiyama ,  Masnori Shibamoto ,  Tomoaki Kudaishi ,  Ichiro Anjoh ,  Kunihiko Nishi ,  Asao Nishimura ,  Hideki Tanaka ,  Ryosuke Kimoto ,  Kunihiro Tsubosaki ,  Akio Hasebe ,  Takehiro Ohnishi ,  Noriou Shimada ,  Shuji Eguchi ,  Hiroshi Koyama ,  Akira Nagai ,  Masahiko Ogino

发明人： Chuichi Miyazaki ,  Yukiharu Akiyama ,  Masnori Shibamoto ,  Tomoaki Kudaishi ,  Ichiro Anjoh ,  Kunihiko Nishi ,  Asao Nishimura ,  Hideki Tanaka ,  Ryosuke Kimoto ,  Kunihiro Tsubosaki ,  Akio Hasebe ,  Takehiro Ohnishi ,  Noriou Shimada ,  Shuji Eguchi ,  Hiroshi Koyama ,  Akira Nagai ,  Masahiko Ogino

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/50 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49572 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06136 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/50 ,  H01L2224/85951 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599

摘要： A semiconductor device includes a semiconductor chip formed with connection terminals, an elastic structure interposed between a main surface of the chip and a wiring substrate formed with wirings connected at first ends thereof to the connection terminals, and bump electrodes connected to the other ends of the wirings. The connection terminals may be at a center part or in peripheral part(s) of the chip main surface and both the elastic structure and wiring substrate are not provided at locations of connection terminals. A resin body seals at least the connection terminals and the exposed first ends of wirings (leads). In a scheme in which the connection terminals are located in a peripheral part of the chip main surface, the wiring substrate protrudes beyond the chip boundary where the connection terminals are arranged, and the resin body shape is restricted by the protruding part of the wiring substrate.

公开(公告)号：US06686226B1

公开(公告)日：2004-02-03

申请号：US09562758

申请日：2000-05-02

申请人： Shigeharu Tsunoda ,  Junichi Saeki ,  Isamu Yoshida ,  Kazuya Ooji ,  Michiharu Honda ,  Makoto Kitano ,  Nae Yoneda ,  Shuji Eguchi ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Kenichi Otsuka

发明人： Shigeharu Tsunoda ,  Junichi Saeki ,  Isamu Yoshida ,  Kazuya Ooji ,  Michiharu Honda ,  Makoto Kitano ,  Nae Yoneda ,  Shuji Eguchi ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Kenichi Otsuka

IPC分类号： H01L2144

CPC分类号： H01L24/97 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold, which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.

摘要翻译： 一种半导体塑料封装，更具体地，优选的封装结构和用于制造BGA封装的方法。 树脂密封BGA封装，其中固定支撑半导体部件的支撑框架; 即IC芯片，电路板或电路膜用树脂密封，使用由上半模和下半模组成的模具，下半模具有多个突起，一个在 与每个外部端子对应的位置。 模具具有在其分割元件之间具有通风口的分隔结构。

公开(公告)号：US06586105B2

公开(公告)日：2003-07-01

申请号：US09823976

申请日：2001-04-03

申请人： Shuji Eguchi ,  Masahiko Asano ,  Mutsumi Watanabe ,  Kunito Nakatsuru ,  Hiroatsu Tokuda

发明人： Shuji Eguchi ,  Masahiko Asano ,  Mutsumi Watanabe ,  Kunito Nakatsuru ,  Hiroatsu Tokuda

IPC分类号： B32B2706

CPC分类号： H05K3/284 ,  H01L23/24 ,  H01L24/45 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/85099 ,  H01L2224/85207 ,  H01L2224/8592 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01039 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  Y10S428/901 ,  Y10T428/31663 ,  H01L2924/00014 ,  H01L2924/2076 ,  H01L2924/20753 ,  H01L2924/20752 ,  H01L2924/00

摘要： The invention provides a packaging structure applied to an automotive component having semiconductors and electronic parts mounted on a ceramic base, characterized in that the semiconductors and electronic parts are partly or entirely sealed with a thixotropic silicone gel which has a thixotropy index of about 1.5-3.6 and a penetration depth of about 6-10 mm and a rate of change in viscosity of less than 10% of the initial value.

公开(公告)号：US06515371B2

公开(公告)日：2003-02-04

申请号：US09983177

申请日：2001-10-23

申请人： Yukiharu Akiyama ,  Tomoaki Kudaishi ,  Takehiro Ohnishi ,  Noriou Shimada ,  Shuji Eguchi ,  Asao Nishimura ,  Ichiro Anjo ,  Kunihiro Tsubosaki ,  Chuichi Miyazaki ,  Hiroshi Koyama ,  Masanori Shibamoto ,  Akira Nagai ,  Masahiko Ogino

发明人： Yukiharu Akiyama ,  Tomoaki Kudaishi ,  Takehiro Ohnishi ,  Noriou Shimada ,  Shuji Eguchi ,  Asao Nishimura ,  Ichiro Anjo ,  Kunihiro Tsubosaki ,  Chuichi Miyazaki ,  Hiroshi Koyama ,  Masanori Shibamoto ,  Akira Nagai ,  Masahiko Ogino

IPC分类号： H01L2348

CPC分类号： H01L24/50 ,  H01L23/3114 ,  H01L23/49572 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/1433 ,  H01L2924/3025

摘要： A semiconductor device including a semiconductor chip having connection terminals in a peripheral part of a main surface thereof; an elastic body disposed on the main surface leaving the connection terminals exposed; an insulating tape formed on the elastic body and having openings in areas where the connection terminals are situated; plural leads formed on the top surface of the insulating tape, one end of each lead being connected to one of the connection terminals and the other end being disposed on the elastic body; plural bump electrodes formed on the other ends of the plural leads; and a resin body for sealing the connection terminals and one end of each of the leads, wherein the insulating tape protrudes beyond the chip where the plural connection terminals are arranged, and wherein the shape of the resin body is restricted by the protruding part of the insulating tape.

摘要翻译： 一种半导体器件，包括在其主表面的周边部分中具有连接端子的半导体芯片; 设置在主表面上的弹性体，使连接端子露出; 绝缘带，形成在弹性体上并且在连接端子所在的区域中具有开口; 多个引线形成在绝缘带的顶表面上，每个引线的一端连接到一个连接端子，另一端设置在弹性体上; 形成在多个引线的另一端上的多个凸起电极; 以及用于密封连接端子和每个引线的一端的树脂体，其中绝缘带突出超过设置有多个连接端子的芯片，并且其中树脂体的形状受到 绝缘胶带

公开(公告)号：US6130112A

公开(公告)日：2000-10-10

申请号：US166857

申请日：1998-10-06

申请人： Makoto Kitano ,  Ryuji Kohno ,  Naotaka Tanaka ,  Akihiro Yaguchi ,  Tetsuo Kumazawa ,  Ichiro Anjoh ,  Hideki Tanaka ,  Asao Nishimura ,  Shuji Eguchi ,  Akira Nagai ,  Mamoru Mita

发明人： Makoto Kitano ,  Ryuji Kohno ,  Naotaka Tanaka ,  Akihiro Yaguchi ,  Tetsuo Kumazawa ,  Ichiro Anjoh ,  Hideki Tanaka ,  Asao Nishimura ,  Shuji Eguchi ,  Akira Nagai ,  Mamoru Mita

IPC分类号： H01L21/60 ,  H01L23/04 ,  H01L23/12 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48

CPC分类号： H01L24/50 ,  H01L23/3114 ,  H01L23/49572 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/15787

摘要： A semiconductor device, is provided will semiconductor chips having a plurality of electrodes for external connection, elastomer resin portions formed of an elastomer resin, which are bonded to the semiconductor chip excepting at least some of the plurality of electrodes, a tape layer of resin including tape wiring patterns on the surface thereof, a plurality of solder bumps for bonding the printed wiring pattern to the tape wiring patterns, leads for connecting the plurality of electrodes of the semiconductor chips to the tape wiring patterns, and seal resin for covering the leads and the plurality of electrodes which are connected by the leads. The elastomer resin has a modulus of transverse elasticity not less than 50 MPa and not more than 750 MPa.

公开(公告)号：US6097100A

公开(公告)日：2000-08-01

申请号：US915334

申请日：1997-08-20

申请人： Shuji Eguchi ,  Yasuhide Sugawara ,  Toshiaki Ishii ,  Hiroyoshi Kokaku ,  Akira Nagai ,  Ryou Moteki ,  Ogino Masahiko ,  Masanori Segawa ,  Rie Hattori ,  Nobutake Tsuyuno ,  Takumi Ueno ,  Atsushi Nakamura ,  Asao Nishimura

发明人： Shuji Eguchi ,  Yasuhide Sugawara ,  Toshiaki Ishii ,  Hiroyoshi Kokaku ,  Akira Nagai ,  Ryou Moteki ,  Ogino Masahiko ,  Masanori Segawa ,  Rie Hattori ,  Nobutake Tsuyuno ,  Takumi Ueno ,  Atsushi Nakamura ,  Asao Nishimura

IPC分类号： H01L23/29 ,  H01L23/31 ,  H01L23/495 ,  H01L23/28

CPC分类号： H01L23/4951 ,  H01L23/293 ,  H01L23/3128 ,  H01L2224/05624 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/92 ,  H01L2224/92147 ,  H01L2224/92247 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/181

摘要： A resin encapsulated semiconductor element is encapsulated with resin composition containing an organic compound selected from the group consisting of organobromine compounds, organophosphorus compounds and organonitrogen compounds, an inorganic filler, and a metal borate. The obtained resin encapsulated semiconductor element has the same flame resistance as a conventional semiconductor element which is encapsulated with a resin composition containing a halogen and antimony compound, and furthermore, has remarkably improved reliabilities regarding moisture resistance and storing at a high temperature by effects of the contained metal borate for suppressing generation of or trapping released gas components, such as halogen or phosphorus, and others.

摘要翻译： 树脂封装的半导体元件用含有有机化合物的树脂组合物包封，所述有机化合物选自有机溴化合物，有机磷化合物和有机氮化合物，无机填料和金属硼酸盐。 所获得的树脂封装的半导体元件具有与用含有卤素和锑化合物的树脂组合物封装的常规半导体元件相同的阻燃性，并且还具有显着提高的耐湿性的可靠性和高温下的存储 含有金属硼酸盐，用于抑制诸如卤素或磷的释放气体组分的产生或捕获等。

公开(公告)号：US07359212B2

公开(公告)日：2008-04-15

申请号：US11243319

申请日：2005-10-05

申请人： Takuya Mayuzumi ,  Shuji Eguchi ,  Masahiro Sasaki ,  Kiyoomi Kadoya

发明人： Takuya Mayuzumi ,  Shuji Eguchi ,  Masahiro Sasaki ,  Kiyoomi Kadoya

IPC分类号： H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC分类号： H05K3/284 ,  B29C45/14639 ,  H05K1/0215 ,  H05K3/0061 ,  H05K3/321 ,  H05K3/3447 ,  H05K5/0034 ,  H05K5/0082 ,  H05K7/20854 ,  H05K2201/09054 ,  H05K2201/10189 ,  H05K2201/2036 ,  Y10T29/49146

摘要： A module comprises a metallic terminal pins for connection and a circuit board with electronic components mounted thereon, a circuit board connecting side of the connector. The electronic components and the circuit board with the electronic components mounted thereon are encapsulated with the same resin. A metallic base is united to the module to obtain an electric conduction between the metallic base and the circuit board.

摘要翻译： 模块包括用于连接的金属端子销和安装有电子部件的电路板，连接器的电路板连接侧。 电子部件和安装有电子部件的电路板用相同的树脂封装。 将金属基体与模块结合，以在金属基座和电路板之间获得电导通。

公开(公告)号：US20060234420A1

公开(公告)日：2006-10-19

申请号：US10535857

申请日：2003-06-20

申请人： Takehide Yokozuka ,  Masahide Harada ,  Shiro Yamashita ,  Kaoru Uchiyama ,  Shuji Eguchi ,  Masahiko Asano ,  Koji Sato

发明人： Takehide Yokozuka ,  Masahide Harada ,  Shiro Yamashita ,  Kaoru Uchiyama ,  Shuji Eguchi ,  Masahiko Asano ,  Koji Sato

IPC分类号： H01L21/00

CPC分类号： H05K1/021 ,  H01L23/3677 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/19105 ,  H05K1/0206 ,  H05K1/056 ,  H05K1/182 ,  H05K3/3436 ,  H05K3/4608 ,  H05K2201/10734 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： In an electronic device having an interposer substrate as an MCM structure, heat dissipation properties are enhanced while the reliability of joint between the interposer substrate and a mother board is maintained. In the invention, a metal core base material of great heat capacity and high thermal conductivity is used for both the interposer substrate and the motherboard. Furthermore, a part where a core metal is exposed is provided on at least one of the interposer substrate and the motherboard. A solder joint pad is directly formed on the core metal exposed part, and the interposer substrate is solder-joined to the motherboard.

摘要翻译： 在具有作为MCM结构的中介基板的电子设备中，提高了散热性能，同时保持了插入器基板和母板之间的接合的可靠性。 在本发明中，中间层基板和母板两者都使用具有高热容量和高导热性的金属芯基材。 此外，在内插基板和母板的至少一个上设置有芯金属露出的部分。 在芯金属露出部上直接形成焊点焊盘，并将插入基板与母板焊接。