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公开(公告)号：US08546922B2
公开(公告)日：2013-10-01
申请号：US13246933
申请日：2011-09-28
申请人： Toshiki Furutani , Daiki Komatsu , Nobuya Takahashi , Masatoshi Kunieda , Naomi Fujita , Koichi Tsunoda , Minetaka Oyama , Toshimasa Yano
发明人： Toshiki Furutani , Daiki Komatsu , Nobuya Takahashi , Masatoshi Kunieda , Naomi Fujita , Koichi Tsunoda , Minetaka Oyama , Toshimasa Yano
IPC分类号： H01L23/495 , H05K1/18
CPC分类号： H05K1/185 , H01L21/4846 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/5389 , H01L2224/16225 , H01L2924/15311 , H01L2924/15313 , H05K1/162 , H05K3/4602 , H05K2201/10674
摘要： A wiring board including a core substrate made of an insulative material and having a penetrating portion, a first interlayer insulation layer formed on the surface of the core substrate, a first conductive circuit formed on the surface of the first interlayer insulation layer, a first via conductor formed in the first interlayer insulation layer, and an electronic component accommodated in the penetrating portion of the core substrate and including a semiconductor element, a bump body mounted on the semiconductor element, a conductive circuit connected to the bump body, an interlayer resin insulation layer formed on the conductive circuit, and a via conductor formed in the interlayer resin insulation layer. The first via conductor has a tapering direction which is opposite of a tapering direction of the via conductor in the electronic component.
摘要翻译： 一种布线板，包括由绝缘材料制成并具有穿透部分的芯基板，形成在芯基板的表面上的第一层间绝缘层，形成在第一层间绝缘层的表面上的第一导电电路， 形成在第一层间绝缘层中的导体和容纳在芯基板的穿透部分中并包括半导体元件的电子部件，安装在半导体元件上的凸块体，连接到凸块体的导电电路，层间树脂绝缘体 形成在导电电路上的层，以及形成在层间树脂绝缘层中的通孔导体。 第一通孔导体具有与电子部件中的通路导体的锥形方向相反的锥形方向。
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公开(公告)号：US08698303B2
公开(公告)日：2014-04-15
申请号：US13249838
申请日：2011-09-30
IPC分类号： H01L23/12
CPC分类号： H05K1/113 , H01L21/4857 , H01L21/568 , H01L23/147 , H01L23/28 , H01L23/3128 , H01L23/49822 , H01L23/562 , H01L24/82 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/81005 , H01L2224/81192 , H01L2924/00013 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2924/351 , H05K1/0298 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/014 , H01L2924/00012 , H01L2924/00
摘要： A substrate for mounting a semiconductor includes a first insulation layer having first and second surfaces on the opposite sides and having a penetrating hole penetrating through the first insulation layer, an electrode formed in the penetrating hole in the first insulation layer and having a protruding portion protruding from the second surface of the first insulation layer, a first conductive pattern formed on the first surface of the first insulation layer and connected to the electrode, a second insulation layer formed on the first surface of the first insulation layer and the first conductive pattern and having a penetrating hole penetrating through the second insulating layer, a second conductive pattern formed on the second insulation layer and for mounting a semiconductor element, and a via conductor formed in the penetrating hole in the second insulation layer and connecting the first and second conductive patterns.
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3.发明授权公开(公告)号：US09059187B2
公开(公告)日：2015-06-16
申请号：US13214277
申请日：2011-08-22
IPC分类号： H01L21/48 , H01L23/00 , H01L21/768 , H01L23/522 , H01L21/56 , H01L23/31 , H01L23/498
CPC分类号： H01L23/3114 , H01L21/4853 , H01L21/486 , H01L21/563 , H01L21/568 , H01L21/76804 , H01L21/78 , H01L23/28 , H01L23/29 , H01L23/293 , H01L23/3128 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/5226 , H01L23/562 , H01L24/97 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/81005 , H01L2224/83005 , H01L2224/97 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2924/00 , H01L2224/81 , H01L2224/83
摘要： An electronic component including a wiring board having interlayer insulation layers and conductive patterns, the wiring board having a first surface and a second surface on the opposite side of the first surface, multiple first bumps formed on a first conductive pattern positioned on the first surface of the wiring board among the conductive patterns of the wiring board, a semiconductor element mounted on the first surface of the wiring board through the first bumps, an encapsulating resin encapsulating the semiconductor element and at least a portion of a side surface of the wiring board, the side surface of the wiring board extending between the first surface and second surface of the wiring board, and multiple of second bumps formed on the second surface of the wiring board and connected to a second conductive pattern of the conductive patterns in the wiring board.
摘要翻译： 一种电子部件，包括具有层间绝缘层和导电图案的布线基板，所述布线板具有在所述第一面的相反侧的第一表面和第二表面，形成在位于所述第一表面的第一表面的第一表面上的第一导电图案上的多个第一凸起 布线板的导体图案中的布线板，通过第一凸块安装在布线板的第一表面上的半导体元件，封装半导体元件的封装树脂和布线板的侧面的至少一部分， 所述布线板的所述侧面在所述布线基板的所述第一表面和所述第二表面之间延伸，以及形成在所述布线板的所述第二表面上并连接到所述布线板中的所述导电图案的第二导电图案的多个第二凸块。
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公开(公告)号：US08188378B2
公开(公告)日：2012-05-29
申请号：US12345349
申请日：2008-12-29
IPC分类号： H05K1/11
CPC分类号： H01L23/5386 , H01L21/4857 , H01L21/486 , H01L23/5383 , H01L23/5384 , H01L2224/16 , H01L2924/01004 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/15192 , H01L2924/3011 , Y10T29/49155
摘要： An interposer having a support substrate, a first insulation layer made of an inorganic material and formed over the support substrate, and a second insulation layer formed over the first insulation layer. The first insulation layer has a first land, a second land and a first wiring electrically connecting the first land and the second land. The second insulation layer has a first pad positioned to load a first electronic component, a second pad positioned to load a second electronic component, a second wiring electrically connected to the second pad, a first via conductor electrically connecting the first land and the first pad, and a second via conductor electrically connecting the second land and the second wiring. The first wiring and second wiring electrically connect the first pad and the second pad, and the second wiring has a lower wiring resistance per unit length than the first wiring.
摘要翻译： 具有支撑衬底的中介层，由无机材料制成并形成在支撑衬底上的第一绝缘层，以及形成在第一绝缘层上的第二绝缘层。 第一绝缘层具有第一焊盘，第二焊盘和电连接第一焊盘和第二焊盘的第一布线。 所述第二绝缘层具有第一焊盘，所述第一焊盘定位成装载第一电子部件，第二焊盘定位成装载第二电子部件，电连接到所述第二焊盘的第二焊盘，将所述第一焊盘和所述第一焊盘电连接的第一通孔导体 以及电连接第二焊盘和第二布线的第二通孔导体。 第一布线和第二布线将第一焊盘和第二焊盘电连接，并且第二布线具有比第一布线更低的每单位长度的布线电阻。
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公开(公告)号：US20090173522A1
公开(公告)日：2009-07-09
申请号：US12345349
申请日：2008-12-29
CPC分类号： H01L23/5386 , H01L21/4857 , H01L21/486 , H01L23/5383 , H01L23/5384 , H01L2224/16 , H01L2924/01004 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/15192 , H01L2924/3011 , Y10T29/49155
摘要： An interposer having a support substrate, a first insulation layer made of an inorganic material and formed over the support substrate, and a second insulation layer formed over the first insulation layer. The first insulation layer has a first land, a second land and a first wiring electrically connecting the first land and the second land. The second insulation layer has a first pad positioned to load a first electronic component, a second pad positioned to load a second electronic component, a second wiring electrically connected to the second pad, a first via conductor electrically connecting the first land and the first pad, and a second via conductor electrically connecting the second land and the second wiring. The first wiring and second wiring electrically connect the first pad and the second pad, and the second wiring has a lower wiring resistance per unit length than the first wiring.
摘要翻译： 具有支撑衬底的中介层，由无机材料制成并形成在支撑衬底上的第一绝缘层，以及形成在第一绝缘层上的第二绝缘层。 第一绝缘层具有第一焊盘，第二焊盘和电连接第一焊盘和第二焊盘的第一布线。 所述第二绝缘层具有第一焊盘，所述第一焊盘定位成装载第一电子部件，第二焊盘定位成装载第二电子部件，电连接到所述第二焊盘的第二焊盘，将所述第一焊盘和所述第一焊盘电连接的第一通孔导体 以及电连接第二焊盘和第二布线的第二通孔导体。 第一布线和第二布线将第一焊盘和第二焊盘电连接，并且第二布线具有比第一布线更低的每单位长度的布线电阻。
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6.发明授权公开(公告)号：US09332657B2
公开(公告)日：2016-05-03
申请号：US13629961
申请日：2012-09-28
CPC分类号： H05K3/445 , H01L2924/3511 , H05K1/185 , H05K3/4608 , H05K3/4644 , H05K2201/10015 , Y10T29/4913
摘要： A method for manufacturing a multilayer printed wiring board includes preparing a metal layer having metal member portions and connector portions connecting the metal member portions, forming laminated multilayer structures having electronic components and the metal member portions, respectively, forming cut penetrating holes in the connector portions of the metal layer, respectively, such that the connector portions of the metal layer are cut, and forming interlayer insulation layers on the laminated multilayer structures such that the laminated multilayer structures are interposed between the interlayer insulation layers. The forming of the interlayer insulation layers includes filling the cut penetrating holes with a resin derived from one or more interlayer insulation layers on the laminated multilayer structures.
摘要翻译： 一种多层印刷布线板的制造方法，其特征在于，具备金属部件和连接金属部件的连接部的金属层，分别形成具有电子部件的层叠多层结构体和金属部件部，在连接部中形成切断后的贯通孔 分别切割金属层的连接部分，并在叠层多层结构上形成层间绝缘层，使层压多层结构夹在层间绝缘层之间。 层间绝缘层的形成包括用层叠的多层结构中的一个或多个层间绝缘层衍生的树脂填充切割的通孔。
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7.发明授权Wiring board with built-in electronic component and method for manufacturing the same 有权具有内置电子部件的接线板及其制造方法公开(公告)号：US08466372B2
公开(公告)日：2013-06-18
申请号：US12555438
申请日：2009-09-08
申请人： Shunsuke Sakai , Kenji Sato , Toshiki Furutani
发明人： Shunsuke Sakai , Kenji Sato , Toshiki Furutani
IPC分类号： H05K1/16
CPC分类号： H05K1/0298 , H01L21/568 , H01L23/5389 , H01L24/24 , H01L24/45 , H01L24/48 , H01L24/82 , H01L2224/04105 , H01L2224/24227 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/18162 , H01L2924/19041 , H01L2924/3025 , H05K1/184 , H05K1/185 , H05K3/4602 , H05K2201/09781 , H05K2201/10636 , H05K2201/10674 , H05K2203/0156 , H05K2203/0191 , H05K2203/049 , H05K2203/1469 , Y02P70/611 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A wiring board with a built-in electronic component includes a core substrate having a penetrating hole formed in the core substrate, an electronic component accommodated in the penetrating hole in the core substrate, a conductive pattern layer formed on a first surface of the core substrate and including a first conductive pattern and a second conductive pattern, and an interlayer insulation layer formed over the conductive pattern layer and the first surface of the core substrate. The second conductive pattern is formed adjacent to a periphery of the penetrating hole and contoured such that a sheet for positioning the electronic component in the penetrating hole is laminated horizontally with respect to the first surface of the core substrate over the penetrating hole.
摘要翻译： 具有内置电子部件的布线基板包括芯基板，该芯基板具有形成在芯基板上的贯通孔，容纳在芯基板的贯通孔中的电子部件，形成在芯基板的第一面上的导电图案层 并且包括第一导电图案和第二导电图案，以及形成在导电图案层和芯基板的第一表面之上的层间绝缘层。 第二导电图案邻近穿透孔的周边形成并且成形为使得用于将电子部件定位在穿透孔中的片材相对于芯基板的第一表面在穿孔上水平地层叠。
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公开(公告)号：US20120247818A1
公开(公告)日：2012-10-04
申请号：US13425585
申请日：2012-03-21
申请人： Takema Adachi , Toshiki Furutani , Liyi Chen
发明人： Takema Adachi , Toshiki Furutani , Liyi Chen
CPC分类号： H05K3/445 , H05K3/3478 , H05K3/4661 , H05K2201/09563 , H05K2203/041
摘要： A printed wiring board includes a core substrate, a first conductive layer on a first surface of the substrate, a second conductive layer on a second surface of the substrate, and a through-hole conductor connecting the first and second conductive layers. The substrate has an insulation structure and a metal layer, the metal layer has opening through which the conductor passes and has side wall recessed into the metal layer and forming the opening, the structure has first resin layer on one side of the metal layer, second resin layer on the opposite side and filler filling the opening, the conductor has first portion in the first layer and second portion in the second layer, the first and second portions are connected in the filler, the first portion is tapered from the first toward second conductive layers, and the second portion is tapered from the second toward first conductive layers.
摘要翻译： 印刷布线板包括芯基板，在基板的第一表面上的第一导电层，在基板的第二表面上的第二导电层，以及连接第一和第二导电层的通孔导体。 基板具有绝缘结构和金属层，金属层具有开口，导体通过该开口，并且具有凹入金属层的侧壁并形成开口，该结构在金属层的一侧具有第一树脂层，第二树脂层 树脂层在相对侧，填料填充开口，导体具有第一层中的第一部分和第二层中的第二部分，第一和第二部分连接在填料中，第一部分从第一至第二部分逐渐变细 导电层，第二部分从第二导电层逐渐变细。
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公开(公告)号：US08225503B2
公开(公告)日：2012-07-24
申请号：US12163252
申请日：2008-06-27
申请人： Takashi Kariya , Toshiki Furutani
发明人： Takashi Kariya , Toshiki Furutani
IPC分类号： H05K3/10
CPC分类号： H05K3/428 , H01L21/568 , H01L23/3135 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L2224/04105 , H01L2224/05568 , H01L2224/05573 , H01L2224/12105 , H01L2224/26175 , H01L2224/73204 , H01L2224/83132 , H01L2224/83192 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01093 , H01L2924/14 , H05K1/187 , H05K3/205 , H05K3/243 , H05K3/427 , H05K3/4602 , H05K3/4611 , H05K2201/0341 , H05K2201/0347 , H05K2201/0355 , H05K2201/0959 , H05K2201/0969 , H05K2201/09918 , H05K2201/10674 , H05K2203/0361 , H05K2203/063 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , H01L2224/05599
摘要： A method for manufacturing a board with a built-in electronic element, includes providing a support substrate including a support base and a metal foil, forming a protective film made of a metal material on the metal foil of the support substrate, forming a conductive pattern made of a metal material on the protective film by an additive method, placing an electronic element on the support substrate with the conductive pattern such that a surface of the electronic element where a circuit is formed faces the conductive pattern, covering the electronic element with an insulative resin, etching away the metal foil using a first etching solution such that the protective film is not dissolved by the first etching solution or that the protective film has an etching speed which is slower than an etching speed of the metal foil, and electrically connecting terminals of the electronic element and a part of the conductive pattern.
摘要翻译： 一种用于制造具有内置电子元件的板的方法，包括提供包括支撑基底和金属箔的支撑基板，在支撑基板的金属箔上形成由金属材料制成的保护膜，形成导电图案 通过添加方法在保护膜上由金属材料制成，将电子元件放置在具有导电图案的支撑基板上，使得形成电路的电子元件的表面面向导电图案，用电子元件覆盖电子元件 绝缘树脂，使用第一蚀刻溶液蚀刻掉金属箔，使得保护膜不被第一蚀刻溶液溶解，或者保护膜具有比金属箔的蚀刻速度慢的蚀刻速度，并且电连接 电子元件的端子和导电图案的一部分。
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公开(公告)号：US20110265323A1
公开(公告)日：2011-11-03
申请号：US13183742
申请日：2011-07-15
IPC分类号： H05K3/10
CPC分类号： H01L21/4857 , H01L21/486 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49866 , H01L23/5383 , H01L24/48 , H01L2224/16145 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , H01L2924/15192 , H01L2924/15311 , H01L2924/16152 , H01L2924/19041 , H01L2924/19107 , H01L2924/3011 , Y10T29/49155 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacturing an interposer including forming an inorganic insulating layer over a support substrate, forming a first wiring in or on a surface of the inorganic insulating layer, forming an organic insulating layer over the inorganic insulating layer and the first wiring, forming a second wiring on the organic insulating layer, and forming a conductor portion connecting the second wiring and the first wiring.
摘要翻译： 一种制造插入件的方法，包括在支撑基板上形成无机绝缘层，在无机绝缘层的表面中或表面上形成第一布线，在无机绝缘层和第一布线上形成有机绝缘层，形成第二布线 在有机绝缘层上布线，以及形成连接第二布线和第一布线的导体部分。
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