Abstract:
The present invention relates to a method of bonding a silver based wire to a substrate, particularly a printed circuit board and an IC-substrate, possessing a layer assembly comprising a copper bonding portion and a palladium or palladium alloy layer and a substrate having a silver wire bonded to aforementioned layer assembly.
Abstract:
A patterned electrical conductor having improved resolution and conductivity is obtained by forming a latent image by exposing, to pressure or sensitising radiation according to a desired conductive track pattern, a pressure-sensitive or photosensitive element having a support substrate and a pressure-sensitive or photosensitive material coated thereon, being capable of providing a latent image upon exposure and comprising a pressure-sensitive or photosensitive metal salt dispersed in a binder, which binder is susceptible to decomposition and/or dissolution upon treatment with an enzyme solution, developing the latent image to form a developed image formed by a first metal (e.g. silver) corresponding to the desired conductive track pattern, treating the developed image with an enzyme capable of decomposing or dissolving the binder and electroless plating and/or electroplating the developed metal image with a plating of a second metal (e.g. silver) to improve the conductivity of the developed metal image to form a conductive track according to the desired pattern, wherein the step of treating the developed image with the enzyme is prior to and/or during the plating step(s).
Abstract:
An electroless plating method for use in metal plating on a porous substrate is disclosed. It uses selective contact of the plating metal salt solution with a reducing solution on the activated surface on or inside the porous substrate. This electroless plating method in the setup is useful for unmanned, automatic operation resulting in almost 100 % membrane (pure / composite) with substantially no pinholes or cracks.
Abstract:
A plating apparatus (1) has a steam treatment chamber (18) configured to perform a steam treatment using steam on a surface of a substrate (W), and a plating chamber (24) configured to plate the surface of the substrate subjected to the steam treatment. The plating apparatus also has an acid treatment chamber (20) configured to bring the surface of the substrate subjected to the steam treatment into contact with an acid liquid. The plating apparatus includes a frame (2) housing the steam treatment chamber (18), the acid treatment chamber (20), and the plating chamber (24).
Abstract:
Die vorliegende Erfindung stellt magnetische Kerne und Verfahren zu deren Herstellung bereit, wobei die magnetischen Kerne mindestens zwei Materialien mit unterschiedlichen magnetischen Eigenschaften aufweisen, wobei die Materialien aus einem Ferritmaterial, einem Oxidkeramikmaterial und einem superparamagnetischen Material ausgewählt werden und entlang des magnetischen Kerns abwechselnd in einzelnen Bereichen ausgebildet sind.
Abstract:
An electroless plating method for use in metal plating on a porous substrate is disclosed. It uses selective contact of the plating metal salt solution with a reducing solution on the activated surface on or inside the porous substrate. This electroless plating method in the setup is useful for unmanned, automatic operation resulting in almost 100 % membrane (pure / composite) with substantially no pinholes or cracks.