公开(公告)号：EP0967650A2

公开(公告)日：1999-12-29

申请号：EP99112134.4

申请日：1999-06-23

Applicant: NITTO DENKO CORPORATION

Inventor： Inoue, Yasushi, c/o Nitto Denko Co. ,  Sugimoto, Masakazu, c/o Nitto Denko Co. ,  Nagasawa, Megumu, c/o Nitto Denko Co. ,  Nakamura, Kei, c/o Nitto Denko Co.

IPC: H01L23/498 ,  H01L23/552 ,  H01L23/58

CPC classification number: H05K1/0271 ,  H01L23/3164 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/068 ,  H05K2201/10416 ,  H05K2201/10674 ,  H01L2924/00

Abstract: A circuit board for mounting a bare chip in the form of a flip chip is disclosed. A metallic foil for protecting circuits in a state insulated therefrom is arranged in an area where the bare chip is located.

公开(公告)号：EP0962559A2

公开(公告)日：1999-12-08

申请号：EP99304290.2

申请日：1999-06-02

Applicant: TEIJIN LIMITED

Inventor： Murayama, Sadamitsu, Teijin Ltd, Osaka Res. Center ,  Wada, Masanori, Teijin Ltd, Osaka Research Center ,  Matsui, Michikage, Teijin Ltd, Osaka Res. Center

IPC: D01F6/60 ,  D04H1/42 ,  D04H1/54

CPC classification number: B32B5/26 ,  B29C70/50 ,  B29K2077/10 ,  B29K2105/06 ,  B29K2277/10 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/0253 ,  B32B2262/0269 ,  B32B2262/0276 ,  B32B2457/08 ,  C08J5/046 ,  C08J5/24 ,  D01F6/605 ,  D21H13/26 ,  H05K1/0366 ,  H05K2201/0278 ,  H05K2201/068 ,  Y10S428/902 ,  Y10T428/30 ,  Y10T442/2008 ,  Y10T442/2984 ,  Y10T442/608 ,  Y10T442/674

Abstract: Aromatic polyamide fibers which have a crystalline structure having (1) crystal size (A) in a (110) plane of 7.5 nm, (2) crystal size (B) in a (200) plane of 8.2 nm and (3) a product A × B of 61.50 to 630.00, and exhibit a thermal linear expansion coefficient of -1.0 × 10 -6 /°C to -7.5 × 10 -6 /°C and thus a high dimensional stability even upon moisture-absorbing and desorbing, are useful for forming a resin-reinforcing fiber sheet, a pre-preg containing the fiber sheet, and a laminate for, for example, an electric insulating material or electric circuit board, having an excellent cutting, shaving, perforating or laser processability and capable of forming a smooth cut, shaved or perforated face.

Abstract translation: 具有（1）在（110）面中的晶体尺寸（A）在7.5nm的晶体结构的芳族聚酰胺纤维，（2）在8.2nm的（200）平面中的晶体尺寸（B）和（3）产物 A×B为61.50〜630.00，热线膨胀系数为-1.0×10 -6 /℃至-7.5×10 -6 /℃，因此即使吸湿也具有高的尺寸稳定性 解吸，可用于形成树脂增强纤维片材，含有纤维片材的预浸渍剂和用于例如电绝缘材料或电路板的层压体，具有优异的切割，剃刮，穿孔或激光 可加工性并且能够形成平滑的切割，剃光或穿孔的面。

公开(公告)号：EP0926929A1

公开(公告)日：1999-06-30

申请号：EP98118070.6

申请日：1998-09-24

Applicant: ROBERT BOSCH GMBH

Inventor： Bovensiepen, Kurt ,  Ulmer, Helmut ,  Messarosch, Gerhard

IPC: H05K1/02 ,  H05K1/05

CPC classification number: H05K1/056 ,  H05K1/0271 ,  H05K3/3442 ,  H05K3/4641 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K2201/10416 ,  H05K2201/10727 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T428/24917 ,  Y10T428/24942

Abstract: Um bei einer Mehrlagen-Leiterplatte (1) mit mehreren übereinander angeordneten, durch Isolierstofflagen (20,21,22,23,24,25) getrennten Leiterbahnebenen (10,11,12,13,14) sowie wenigstens einem auf einer der beiden Außenseiten (7,8) der Mehrlagen-Leiterplatte bestückten elektronischen Bauelement (2,3)(insbesondere einem LCCC) und mit wenigstens einem in der Mehrlagen-Leiterplatte zwischen den äußeren Isolierstofflagen angeordneten Kernsubstrat (5), welches die Wärmeausdehnungseigenschaften der Mehrlagen-Leiterplatte zumindest im Erstreckungsbereich des wenigstens einen Bauelementes an die Wärmeausdehnungseigenschaften des Bauelementes weitgehend anpaßt, eine Reduzierung des Gewichts zu erreichen, wird vorgeschlagen, daß zwischen den beiden äußeren Isolierstofflagen (20,25) der Mehrlagen-Leiterplatte (1) ein mit einer Ausnehmung (4) versehenes inneres Lagenteil (30) vorgesehen ist, wobei die laterale Ausdehnung der Ausnehmung in dem inneren Lagenteil (30) in etwa auf den Erstreckungsbereich des wenigstens einen Bauelementes (2,3) beschränkt ist und in die Ausnehmung (4) das wenigstens eine Kernsubstrat (5) eingebracht ist.

Abstract translation: 多层电路板（1）具有位于板内的内层部分（30）中的空腔（4）中的热膨胀匹配芯基板（5）。 多层电路板（1）具有芯基板（5），位于板的两个外绝缘层（20,25）之间的内层部分（30）的空腔（4）中，用于使热膨胀 板的特性与安装在其中一个板外表面（7,8）上的电子部件（2,3），特别是LCCC部件的特性。 优选特征：核心基板（5）是紧密配合在空腔（4）中并且由钼芯或碳纤维芯构成。

公开(公告)号：EP0792463A4

公开(公告)日：1998-06-24

申请号：EP95940718

申请日：1995-11-15

Applicant: FORMFACTOR INC

Inventor： KHANDROS IGOR Y ,  MATHIEU GAETAN L ,  ELDRIDGE BENJAMIN N ,  GRUBE GARY W

IPC: G01R1/06 ,  B23K1/00 ,  B23K20/00 ,  B32B15/08 ,  C23C18/16 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/26 ,  G01R31/28 ,  H01L21/00 ,  H01L21/02 ,  H01L21/288 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H01R12/52 ,  H05K1/14 ,  H05K3/20 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0483 ,  G01R31/2863 ,  H01L21/288 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13582 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45644 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/48844 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2224/48744 ,  H01L2924/20751 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/20754

Abstract: Resilient contact structures (430) are mounted directly to bond pads (410) on semiconductor dies (402a, 402b), prior to the dies (402a, 402b) being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies (402a, 402b) to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies (702, 704) with a circuit board (710) or the like having a plurality of terminals (712) disposed on a surface thereof. Subsequently, the semiconductor dies (402a, 402b) may be singulated from the semiconductor wafer, whereupon the same resilient contact structures (430) can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements (430) of the present invention as the resilient contact structures, burn-in (792) can be performed at temperatures of at least 150 °C, and can be completed in less than 60 minutes.

Abstract translation: 本发明提供一种在从半导体晶片分离之前测试半导体器件（702,704）的方法。 所述方法包括以下步骤：将驻留在半导体晶片上的至少一个半导体器件（702,704）上的多个弹性接触结构（708）直接固定到多个第一端子上，每个所述弹性接触结构 具有尖端并从半导体器件的表面延伸; 将具有多个第二端子（712）的衬底（710）推向半导体器件的表面以实现弹性接触结构的相应的第二端子和尖端之间的多个电连接; 并向衬底的第二端提供信号以锻炼半导体器件。

公开(公告)号：EP0795200A4

公开(公告)日：1997-11-12

申请号：EP95939966

申请日：1995-11-13

Applicant: FORMFACTOR INC

Inventor： KHANDROS IGOR Y ,  MATHIEU GAETAN L ,  ELDRIDGE BENJAMIN N ,  GRUBE GARY W ,  DOZIER THOMAS H

IPC: G01R1/073 ,  B23K1/00 ,  B23K20/00 ,  B23K31/02 ,  C23C18/16 ,  C25D5/08 ,  C25D5/16 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/06 ,  G01R1/067 ,  G01R31/26 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L21/603 ,  H01L21/607 ,  H01L21/66 ,  H01L21/68 ,  H01L23/02 ,  H01L23/12 ,  H01L23/32 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L25/16 ,  H01L25/18 ,  H01R9/00 ,  H01R12/71 ,  H01R13/05 ,  H01R13/24 ,  H01R29/00 ,  H01R33/74 ,  H01R33/76 ,  H01R107/00 ,  H05H1/18 ,  H05K1/14 ,  H05K1/18 ,  H05K3/20 ,  H05K3/24 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07371 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/32 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/2407 ,  H01R13/2464 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075

Abstract: The probe card assembly (500) includes a probe card (502), and a space transformer (506) having resilient contact structures (524) mounted to and extending from terminals (522) on its surface. An interposer (504) is disposed between the space transformer and the probe card. The space transformer and interposer are stacked on the probe card and the resilient contact structures can be arranged to optimise probing of entire wafer.

Abstract translation: 弹性接触结构从支撑基板的顶表面延伸，并且焊球（或其它合适的）接触结构设置在支撑基板的底表面上。 互连元件（110）被用作弹性接触结构并被设置在支撑基板上。 在支撑基板顶上的弹性接触结构中选定的弹性接触结构经由支撑基板连接到支撑基板的底表面上的对应的接触结构。 在旨在接收LGA型半导体封装（304）的实施例中，利用大致垂直于支撑衬底的顶表面的接触力在半导体封装的弹性接触结构和外部连接点之间形成压力接触（ 302）。 在旨在接收BGA型半导体封装（404）的实施例中，利用大致平行于支撑衬底的顶表面的接触力在半导体封装的弹性接触结构和外部连接点之间形成压力接触（ 402）。

公开(公告)号：EP0792519A1

公开(公告)日：1997-09-03

申请号：EP95939967.0

申请日：1995-11-13

Applicant: FORMFACTOR, INC.

Inventor： KHANDROS, Igor, Y. ,  MATHIEU, Gaetan, L.

IPC: G01R31 ,  B23K20 ,  C23C18 ,  C25D7 ,  G01R1 ,  H01L21 ,  H01L23 ,  H01L25 ,  H01R12 ,  H01R13 ,  H01R33 ,  H05K3 ,  H05K7 ,  C25D5 ,  C25D21 ,  H01R107 ,  H05K1

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07371 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/32 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/2407 ,  H01R13/2464 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075

Abstract: The probe card assembly (500) includes a probe card (502), and a space transformer (506) having resilient contact structures (524) mounted to and extending from terminals (522) on its surface. An interposer (504) is disposed between the space transformer and the probe card. The space transformer and interposer are stacked on the probe card and the resilient contact structures can be arranged to optimise probing of entire wafer.

公开(公告)号：EP0792462A1

公开(公告)日：1997-09-03

申请号：EP95939968.0

申请日：1995-11-13

Applicant: FORMFACTOR, INC.

Inventor： KHANDROS, Igor, Y. ,  MATHIEU, Gaetan, L. ,  ELDRIDGE, Benjamin, N. ,  GRUBE, Gary, W.

IPC: G01R31 ,  B23K20 ,  C23C18 ,  C25D7 ,  G01R1 ,  H01L21 ,  H01L23 ,  H01L25 ,  H01R12 ,  H01R13 ,  H01R33 ,  H05K3 ,  H05K7 ,  C25D5 ,  C25D21 ,  H01R107 ,  H05K1

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07371 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/32 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/2407 ,  H01R13/2464 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075

Abstract: The probe card assembly (500) includes a probe card (502), and a space transformer (506) having resilient contact structures (524) mounted to and extending from terminals (522) on its surface. An interposer (504) is disposed between the space transformer and the probe card. The space transformer and interposer are stacked on the probe card and the resilient contact structures can be arranged to optimise probing of entire wafer.

Abstract translation: 探针卡组件（500）包括探针卡（502）和具有安装到其表面上的端子（522）并且在其表面上从端子（522）延伸的弹性接触结构（524）的空间变换器（506）。 插入器（504）设置在空间变换器和探针卡之间。 空间变压器和插入器堆叠在探针卡上，并且可以布置弹性接触结构以优化整个晶片的探测。

公开(公告)号：EP0768334A3

公开(公告)日：1997-06-04

申请号：EP96116329.2

申请日：1996-10-11

Applicant: SUMITOMO CHEMICAL COMPANY LIMITED

Inventor： Takahashi, Tsutomu ,  Tsujimoto, Yoshifumi ,  Kumada, Hiroaki ,  Sato, Hiroyuki

IPC: C08J5/24 ,  C08J5/04 ,  H05K1/03

CPC classification number: B32B15/14 ,  B32B5/022 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2305/026 ,  B32B2457/08 ,  C08J5/04 ,  C08J5/24 ,  H05K1/0366 ,  H05K2201/0116 ,  H05K2201/0129 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/068 ,  Y10S428/901 ,  Y10S428/902 ,  Y10S428/91 ,  Y10T428/24917 ,  Y10T428/24993 ,  Y10T428/24994 ,  Y10T428/249944 ,  Y10T428/249953 ,  Y10T428/249955 ,  Y10T428/2907 ,  Y10T428/2938 ,  Y10T428/2969 ,  Y10T428/2971 ,  Y10T428/30 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31725 ,  Y10T442/2008 ,  Y10T442/2893 ,  Y10T442/2902

Abstract: The present invention provides a lightweight prepreg having uniform formation, low linear thermal expansion coefficient and good mechanical strength, comprising a porous para-oriented aromatic polyamide film and a thermoplastic resin and/or a thermosetting resin, the porous para-oriented aromatic polyamide film being impregnated with the thermoplastic resin and/or the thermosetting resin, a process for producing the same, and a printed circuit substrate/board using the same. A process for producing for producing a prepreg comprising a porous para-oriented aromatic polyamide film and a thermoplastic resin and/or a thermosetting resin, the porous para-oriented aromatic polyamide film being impregnated with the thermoplastic resin and/or thermosetting resin, which comprises the following steps (a) to (d):
step (a) of forming a film-like material from a solution containing 1 to 10% by weight of a para-oriented aromatic polyamide having an inherent viscosity of 1.0 to 2.8 dl/g and 1 to 10% by weight of a chloride of an alkaline metal or an alkaline earth metal in a polar amide solvent or a polar urea solvent; step (b) of maintaining the film-like material at a temperature of not less than 20°C or not more than -5°C to deposit the para-oriented aromatic polyamide from the film-like material; step (c) of immersing the film-like material obtained in the step (b) in an aqueous solution or an alcoholic solution to elute the solvent and the chloride of the alkaline metal or alkaline earth metal, followed by drying to obtain a para-aramid porous film; and step (d) of impregnating the porous film obtained in the step (c) as a substrate with the thermoplastic resin and/or thermosetting resin to produce a prepreg.

Abstract translation: 本发明提供一种具有均匀形成，低线性热膨胀系数和良好机械强度的轻质预浸料坯，其包含多孔对位取向芳香族聚酰胺膜和热塑性树脂和/或热固性树脂，所述多孔对位取向芳香族聚酰胺膜为 浸渍有热塑性树脂和/或热固性树脂，其制造方法以及使用其的印刷电路基板/基板。 一种用于生产包含多孔对位取向芳香族聚酰胺膜和热塑性树脂和/或热固性树脂的预浸料坯的制造方法，所述多孔对位取向芳香族聚酰胺膜浸渍有热塑性树脂和/或热固性树脂，所述方法包括： （a）至（d）：由含有1至10重量％特性粘度为1.0至2.8dl / g的对位芳族聚酰胺的溶液形成膜状材料的步骤（a） 和在极性酰胺溶剂或极性尿素溶剂中的1-10重量％的碱金属或碱土金属的氯化物; 步骤（b）：将膜状材料保持在不低于20℃或不高于-5℃的温度下，以从薄膜状材料沉积对位取向的芳族聚酰胺; 步骤（c）：将步骤（b）中获得的膜状材料浸入水溶液或醇溶液中以洗脱溶剂和碱金属或碱土金属的氯化物，然后干燥，得到对 - 芳族聚酰胺多孔膜; 和将步骤（c）中获得的多孔膜作为基底用热塑性树脂和/或热固性树脂浸渍以制备预浸料坯的步骤（d）。

公开(公告)号：EP0584577B1

公开(公告)日：1996-09-11

申请号：EP93112219.6

申请日：1993-07-30

Applicant: MOLEX INCORPORATED

Inventor： DiViesti, Anthony M.

IPC: H01R23/70 ,  H01R23/72

CPC classification number: H05K3/303 ,  H01R12/7064 ,  H01R12/716 ,  H05K1/0271 ,  H05K2201/068 ,  H05K2201/10189 ,  H05K2201/10568 ,  H05K2201/10598 ,  Y02P70/613 ,  Y10S248/901

公开(公告)号：EP0727931A3

公开(公告)日：1996-09-04

申请号：EP96101387.7

申请日：1996-02-01

Applicant: TEMIC TELEFUNKEN microelectronic GmbH

Inventor： Schuch, Bernhard

IPC: H05K7/20 ,  B60R16/02

CPC classification number: B60R16/0239 ,  H05K1/0206 ,  H05K3/0061 ,  H05K3/3447 ,  H05K3/386 ,  H05K5/0047 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/10189

Abstract: Beschrieben wird ein elektronisches Steuermodul aus einem Substratkörper, einer Schaltungsanordnung mit auf einer Oberflächenseite des Substratkörpers planar aufgebrachten SMD-Halbleiterbauelementen, einem Trägerkörper aus einem Material mit hoher Wärmeleitfähigkeit, auf dem Substratkörper und Schaltungsanordnung angeordnet sind, einem die Schaltungsanordnung und den Substratkörper umschließenden Gehäusekörper sowie einem durch den Gehäusekörper und/oder den Trägerkörper hindurchgeführten Steckeranschlußteil mit mehreren Steckeranschlüssen. Zwischen der der Schaltungsanordnung gegenüberliegenden Oberflächenseite des Substratkörpers und dem Trägerkörper ist eine dünne, gleichmäßige Klebeschicht aus einem hochflexiblen, thermisch stabilen Kleber mit guter Haftfähigkeit und hoher Wärmeleitfähigkeit angeordnet, die eine mechanische Entkopplung von Trägerkörper und Substratkörper (ein unabhängiges thermisches Ausdehnungsverhalten von Substratkörper und Trägerkörper) bewirkt.

Abstract translation: 公开的是从一个基底主体的电子控制模块，施加SMD半导体器件具有在基板主体的平面的表面侧的电路，由具有高导热率的材料制成的支撑体被布置在基板主体和所述电路布置中，该电路装置和基板主体包围外壳主体和上 通过穿过具有多个插头连接的插头连接器部件的壳体和/或载体。 一个高度灵活的，热稳定的粘合剂的薄且均匀的粘接剂层设置有良好的粘合性能和高的热传导性的基板主体和所述支撑体的电路面侧的相反侧之间，支撑体和基板主体（基板主体和支撑体的一个独立的热膨胀特性）的机械去耦 引起。