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公开(公告)号：US06300164B1
公开(公告)日：2001-10-09
申请号：US09559314
申请日：2000-04-27
申请人： Anson J. Call , Stephen Anthony DeLaurentis , Shaji Farooq , Sung Kwon Kang , Sampath Purushothaman , Kathleen Ann Stalter
发明人： Anson J. Call , Stephen Anthony DeLaurentis , Shaji Farooq , Sung Kwon Kang , Sampath Purushothaman , Kathleen Ann Stalter
IPC分类号： H01L2144
CPC分类号： H05K3/3436 , H01L23/49816 , H01L2924/0002 , H05K3/321 , H05K3/3447 , H05K3/4015 , H05K2201/10234 , H05K2201/10333 , H05K2201/10962 , Y02P70/613 , Y10S428/901 , Y10T428/12528 , Y10T428/24917 , Y10T428/256 , H01L2924/00
摘要： A socketable ball grid array structure is disclosed which comprises mechanically rigid (compared to solder alloys) balls coated with noble contact metals joined to the chip carrier terminals by means of a novel electrically conducting adhesive. Because of the nature of the filler that includes conducting particles with a fusible coating and the appropriate selection of the polymer resin used in the adhesive, the balls are attached to the module in a compliant and resilient manner while leaving the majority of the bottom surface of the balls pristine. The array of balls can therefore be plugged into mating sockets in a printed circuit board forming a demountable contact. This facilitates easy removal of the socketable BGA from a board for repair or upgrade purposes as well as allows ease of plugging and unplugging of these BGA's into test and burn-in boards.
摘要翻译： 公开了一种可插座的球栅阵列结构，其包括通过新颖的导电粘合剂机械地刚性（与焊料合金相比）涂覆有接合到芯片载体端子的贵金属接触金属的球。 由于包括具有可熔涂层的导电颗粒和粘合剂中使用的聚合物树脂的适当选择的填料的性质，球以顺应性和弹性方式附着到模块上，同时留下了大部分的底表面 球原始。 因此，球阵可以插入形成可拆卸接触的印刷电路板中的配合插座中。 这样便于从板上轻松取出可插拔的BGA，以进行修理或升级，同时也可以方便地将这些BGA插入测试和老化板。
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公开(公告)号：US06120885A
公开(公告)日：2000-09-19
申请号：US106779
申请日：1998-06-30
申请人： Anson J. Call , Stephen Anthony DeLaurentis , Shaji Farooq , Sung Kwon Kang , Sampath Purushothaman , Kathleen Ann Stalter
发明人： Anson J. Call , Stephen Anthony DeLaurentis , Shaji Farooq , Sung Kwon Kang , Sampath Purushothaman , Kathleen Ann Stalter
CPC分类号： H05K3/3436 , H01L23/49816 , H05K3/4015 , H01L2924/0002 , H05K2201/10234 , H05K2201/10333 , H05K2201/10962 , H05K3/321 , H05K3/3447 , Y02P70/613 , Y10S428/901 , Y10T428/12528 , Y10T428/24917 , Y10T428/256
摘要： A socketable ball grid array structure is disclosed which comprises mechanically rigid (compared to solder alloys) balls coated with noble contact metals joined to the chip carrier terminals by means of a novel electrically conducting adhesive. Because of the nature of the filler that includes conducting particles with a fusible coating and the appropriate selection of the polymer resin used in the adhesive, the balls are attached to the module in a compliant and resilient manner while leaving the majority of the bottom surface of the balls pristine. The array of balls can therefore be plugged into mating sockets in a printed circuit board forming a demountable contact. This facilitates easy removal of the socketable BGA from a board for repair or upgrade purposes as well as allows ease of plugging and unplugging of these BGA's into test and burn-in boards.
摘要翻译： 公开了一种可插座的球栅阵列结构，其包括通过新颖的导电粘合剂机械地刚性（与焊料合金相比）涂覆有接合到芯片载体端子的贵金属接触金属的球。 由于包括具有可熔涂层的导电颗粒和粘合剂中使用的聚合物树脂的适当选择的填料的性质，球以顺应性和弹性方式附着到模块上，同时留下了大部分的底表面 球原始。 因此，球阵可以插入形成可拆卸接触的印刷电路板中的配合插座中。 这样便于从板上轻松取出可插拔的BGA，以进行修理或升级，同时也可以方便地将这些BGA插入测试和老化板。
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3.发明授权公开(公告)号：US06297559B1
公开(公告)日：2001-10-02
申请号：US09107998
申请日：1998-06-30
申请人： Anson J. Call , Stephen Anthony DeLaurentis , Shaji Farooq , Sung Kwon Kang , Sampath Purushothaman , Kathleen Ann Stalter
发明人： Anson J. Call , Stephen Anthony DeLaurentis , Shaji Farooq , Sung Kwon Kang , Sampath Purushothaman , Kathleen Ann Stalter
IPC分类号： H01L2348
CPC分类号： H05K3/3436 , H01L21/4853 , H01L23/49816 , H01L2224/16225 , H01L2924/15311 , H05K3/321 , H05K2201/0129 , H05K2201/0218 , H05K2201/10734 , H05K2201/10992 , H05K2203/041 , H05K2203/0425 , Y02P70/613
摘要： A new interconnection scheme of a ball grid array (BGA) module is disclosed where a solder ball is connected to the BGA module by use of an electrically conducting adhesive The electrically conducting adhesive can be a mixture comprising a polymer resin, no-clean solder flux, a plurality of electrically conducting particles with an electrically conducting fusible coating and others. The solder balls in a BGA module can also be connected to a printed circuit board by use of another electrically conductive adhesive which can be joined at a lower temperature than the first joining to the BGA module. Additionally, an electrically conducting adhesive can be formed into electrically conducting adhesive bumps which interconnect an integrated circuit device to the BGA module.
摘要翻译： 公开了一种球栅阵列（BGA）模块的新的互连方案，其中焊球通过使用导电粘合剂连接到BGA模块。导电粘合剂可以是包含聚合物树脂，不干净焊剂 ，多个具有导电性可熔涂层的导电颗粒。 BGA模块中的焊球也可以通过使用可以在比第一次接合到BGA模块的温度低的温度下接合的另一种导电粘合剂连接到印刷电路板。 此外，导电粘合剂可以形成为将集成电路器件与BGA模块互连的导电粘合剂凸块。
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公开(公告)号：US06559527B2
公开(公告)日：2003-05-06
申请号：US09753819
申请日：2001-01-03
申请人： Peter Jeffrey Brofman , Shaji Farooq , John U. Knickerbocker , Scott Ira Langenthal , Sudipta Kumar Ray , Kathleen Ann Stalter
发明人： Peter Jeffrey Brofman , Shaji Farooq , John U. Knickerbocker , Scott Ira Langenthal , Sudipta Kumar Ray , Kathleen Ann Stalter
IPC分类号： H01L2302
CPC分类号： H01L24/81 , H01L24/11 , H01L24/13 , H01L2224/0401 , H01L2224/05666 , H01L2224/05671 , H01L2224/0603 , H01L2224/06505 , H01L2224/10135 , H01L2224/11002 , H01L2224/11472 , H01L2224/1184 , H01L2224/13017 , H01L2224/13019 , H01L2224/13082 , H01L2224/13111 , H01L2224/13116 , H01L2224/14 , H01L2224/1403 , H01L2224/14051 , H01L2224/141 , H01L2224/14505 , H01L2224/16058 , H01L2224/16238 , H01L2224/81136 , H01L2224/81139 , H01L2224/8121 , H01L2224/81815 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15787 , H01L2924/351 , H05K3/303 , H05K3/3436 , H05K3/3457 , H05K3/3473 , H05K2201/10992 , H05K2201/2036 , H05K2203/0113 , H05K2203/0465 , Y02P70/613 , H01L2924/00 , H01L2924/01083 , H01L2924/013 , H01L2924/00013 , H01L2924/00014
摘要： A method of forming non-spherically shaped solder interconnects, preferably conical, for attachment of electronic components in an electronic module. Preferably, the solder interconnects of the present invention are cone shaped and comprise of depositing a first solder followed by a second solder having a lower reflow temperature than the first solder. Warm placement of the electronic component at a somewhat elevated temperature than room temperature but less than the solder reflow temperature reduces the force required during placement of a semiconductor chip to a substrate. After warm placement, reflow of the module occurs at the lower reflow temperature of the second solder. The conical shape of the solder interconnects are formed by a heated coining die which may also coin a portion of the interconnects with flat surfaces for stand-offs. The ability of the cone shaped solder interconnects to meet the opposing surface of a chip or substrate at different heights accommodates the camber typically associated with chip and substrate surfaces.
摘要翻译： 形成用于将电子部件附接到电子模块中的非球形焊料互连（优选为圆锥形）的方法。 优选地，本发明的焊料互连件是锥形的，并且包括沉积第一焊料，接着是具有比第一焊料低的回流温度的第二焊料。 电子部件在比室温略高的温度但低于焊料回流温度的温度放置降低了将半导体芯片放置到衬底期间所需的力。 在温热放置之后，模块的回流在第二焊料的较低回流温度下发生。 焊接互连的圆锥形由加热的压印模具形成，其也可以将一部分互连件用平坦表面硬化以用于支架。 锥形焊料互连件在不同高度处与芯片或基板的相对表面相遇的能力适应通常与芯片和基板表面相关联的外倾。
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公开(公告)号：US06184062B2
公开(公告)日：2001-02-06
申请号：US09233383
申请日：1999-01-19
申请人： Peter Jeffrey Brofman , Shaji Farooq , John U. Knickerbocker , Scott Ira Langenthal , Sudipta Kumar Ray , Kathleen Ann Stalter
发明人： Peter Jeffrey Brofman , Shaji Farooq , John U. Knickerbocker , Scott Ira Langenthal , Sudipta Kumar Ray , Kathleen Ann Stalter
IPC分类号： H01L2144
CPC分类号： H01L24/81 , H01L24/11 , H01L24/13 , H01L2224/0401 , H01L2224/05666 , H01L2224/05671 , H01L2224/0603 , H01L2224/06505 , H01L2224/10135 , H01L2224/11002 , H01L2224/11472 , H01L2224/1184 , H01L2224/13017 , H01L2224/13019 , H01L2224/13082 , H01L2224/13111 , H01L2224/13116 , H01L2224/14 , H01L2224/1403 , H01L2224/14051 , H01L2224/141 , H01L2224/14505 , H01L2224/16058 , H01L2224/16238 , H01L2224/81136 , H01L2224/81139 , H01L2224/8121 , H01L2224/81815 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15787 , H01L2924/351 , H05K3/303 , H05K3/3436 , H05K3/3457 , H05K3/3473 , H05K2201/10992 , H05K2201/2036 , H05K2203/0113 , H05K2203/0465 , Y02P70/613 , H01L2924/00 , H01L2924/01083 , H01L2924/013 , H01L2924/00013 , H01L2924/00014
摘要： A method of forming non-spherically shaped solder interconnects, preferably conical, for attachment of electronic components in an electronic module. Preferably, the solder interconnects of the present invention are cone shaped and comprise of depositing a first solder followed by a second solder having a lower reflow temperature than the first solder. Warm placement of the electronic component at a somewhat elevated temperature than room temperature but less than the solder reflow temperature reduces the force required during placement of a semiconductor chip to a substrate. After warm placement, reflow of the module occurs at the lower reflow temperature of the second solder. The conical shape of the solder interconnects are formed by a heated coining die which may also coin a portion of the interconnects with flat surfaces for stand-offs. The ability of the cone shaped solder interconnects to meet the opposing surface of a chip or substrate at different heights accommodates the camber typically associated with chip and substrate surfaces.
摘要翻译： 形成用于将电子部件附接到电子模块中的非球形焊料互连（优选为圆锥形）的方法。 优选地，本发明的焊料互连件是锥形的，并且包括沉积第一焊料，接着是具有比第一焊料低的回流温度的第二焊料。 电子部件在比室温略高的温度但低于焊料回流温度的温度放置降低了将半导体芯片放置到衬底期间所需的力。 在温热放置之后，模块的回流在第二焊料的较低回流温度下发生。 焊接互连的圆锥形由加热的压印模具形成，其也可以将一部分互连件用平坦表面硬化以用于支架。 锥形焊料互连件在不同高度处与芯片或基板的相对表面相遇的能力适应通常与芯片和基板表面相关联的外倾。
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公开(公告)号：US06333563B1
公开(公告)日：2001-12-25
申请号：US09587944
申请日：2000-06-06
申请人： Raymond A. Jackson , Anson J. Call , Mark G. Courtney , Stephen A. DeLaurentis , Mukta S. Farooq , Shaji Farooq , Lewis S. Goldmann , Gregory B. Martin , Sudipta K. Ray
发明人： Raymond A. Jackson , Anson J. Call , Mark G. Courtney , Stephen A. DeLaurentis , Mukta S. Farooq , Shaji Farooq , Lewis S. Goldmann , Gregory B. Martin , Sudipta K. Ray
IPC分类号： H01L2940
CPC分类号： H05K1/141 , H01L23/49833 , H01L2224/16 , H01L2924/01322 , H01L2924/09701 , H01L2924/12044 , H01L2924/15311 , H05K3/284 , H05K3/3436 , H05K3/368 , H05K2201/049 , H05K2201/10734 , H05K2201/10977
摘要： The present invention relates generally to an electrical interconnection package and a method thereof. More particularly, the invention encompasses an invention that increases the fatigue life of a Ball Grid Array (BGA) electrical interconnection. This invention structurally couples at least one module to an organic interposer using a high modulus underfill material. The organic interposer is then joined to a organic board using standard joining processes. The inventive module can then be removed from the organic board at any time by moving the organic interposer using standard rework techniques.
摘要翻译： 本发明一般涉及电互连封装及其方法。 更具体地，本发明包括增加球栅阵列（BGA）电互连的疲劳寿命的发明。 本发明使用高模量底部填充材料将至少一个模块结构地耦合到有机插入件。 然后使用标准连接工艺将有机插入物连接到有机基板。 随后可以通过使用标准返工技术移动有机插入件，随时从有机板上移除本发明的模块。
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公开(公告)号：US5532031A
公开(公告)日：1996-07-02
申请号：US827657
申请日：1992-01-29
IPC分类号： H01L23/498 , H05K3/38 , B32B15/04 , H01L23/48
CPC分类号： H05K3/388 , H01L23/49811 , H01L2924/0002 , H01L2924/09701 , Y10T428/12549 , Y10T428/1259 , Y10T428/12715 , Y10T428/12722 , Y10T428/12806 , Y10T428/12889 , Y10T428/12903 , Y10T428/1291 , Y10T428/12944
摘要： A ceramic substrate having an improved I/O pad adhesion layer. The ceramic substrate has an I/O pad for joining to an I/O pin. The I/O pad includes an improved adhesion layer of TiO, followed by layers of Ti (or Ti and Ni) and a solder wettable layer which may be Au or Pt. Also disclosed are low yield stress solders of Sn/Sb, Sn/Ag, Sn/Cu and Sn/Cu/Ti.
摘要翻译： 具有改进的I / O焊盘粘合层的陶瓷衬底。 陶瓷基板具有用于连接到I / O引脚的I / O焊盘。 I / O焊盘包括改进的TiO的粘合层，随后是Ti（或Ti和Ni）层和可以是Au或Pt的焊料可润湿层。 还公开了Sn / Sb，Sn / Ag，Sn / Cu和Sn / Cu / Ti的低屈服应力焊料。
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公开(公告)号：US06283359B1
公开(公告)日：2001-09-04
申请号：US09644486
申请日：2000-08-23
申请人： Peter J. Brofman , Mark G. Courtney , Shaji Farooq , Mario J. Interrante , Raymond A. Jackson , Gregory B. Martin , Sudipta K. Ray , William E. Sablinski , Kathleen A. Stalter
发明人： Peter J. Brofman , Mark G. Courtney , Shaji Farooq , Mario J. Interrante , Raymond A. Jackson , Gregory B. Martin , Sudipta K. Ray , William E. Sablinski , Kathleen A. Stalter
IPC分类号： B23K3102
CPC分类号： H01L24/12 , B23K35/0222 , B23K35/0244 , H01L23/49811 , H01L24/11 , H01L24/16 , H01L2224/1184 , H01L2224/13099 , H01L2924/00013 , H01L2924/01004 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H05K3/3436 , H05K2201/10992 , H05K2203/041 , H05K2203/0415 , H05K2203/0435 , Y02P70/613 , Y10T428/12687 , Y10T428/2991 , H01L2224/29099 , H01L2924/00
摘要： This invention relates to a solder structure which provides enhanced fatigue life properties when used to bond substrates particularly at the second level such as BGA and CGA interconnections. The solder structure is preferably a sphere or column and has a metal layer wettable by solder and the structure is used to make solder connections in electronic components such as joining an electronic module such as a chip connected to a MLC which module is connected to a circuit board. The solder structure preferably has an overcoat of solder on the metal layer to provide a passivation coating to the metal layer to keep it clean from oxidation and corrosion and also provide a wettable surface for attachment of the solder structure to solder on the pads of the substrate being bonded.
摘要翻译： 本发明涉及一种焊料结构，当用于特别是在第二层（例如BGA和CGA互连）的基材上时，其提供增强的疲劳寿命特性。 焊料结构优选是球形或柱状，并且具有可被焊料润湿的金属层，并且该结构用于在电子部件中形成焊接连接，例如连接诸如连接到MLC的芯片的电子模块，该模块连接到电路 板。 焊料结构优选地在金属层上具有焊料的外涂层，以向金属层提供钝化涂层以保持其免于氧化和腐蚀，并且还提供用于将焊料结构附着到衬底的焊盘上的焊料的可润湿表面 被绑定。
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公开(公告)号：US5935404A
公开(公告)日：1999-08-10
申请号：US787071
申请日：1997-01-22
申请人： Shaji Farooq , Suryanarayana Kaja , Hsichang Liu , Karen P. McLaughlin , Gregg B. Monjeau , Kim Hulett Ruffing
发明人： Shaji Farooq , Suryanarayana Kaja , Hsichang Liu , Karen P. McLaughlin , Gregg B. Monjeau , Kim Hulett Ruffing
CPC分类号： H01L21/4885
摘要： A method of performing electrochemistry processes on features and connectors of a substrate includes the application of a shorting layer across the connectors which are in electrical contact with the features, thereby shorting the features and creating an assemblage for which electricity is applied.
摘要翻译： 在衬底的特征和连接器上执行电化学处理的方法包括在与特征电接触的连接器上施加短路层，从而短路特征并产生施加电力的组合。
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10.发明授权
公开(公告)号：US5787578A
公开(公告)日：1998-08-04
申请号：US677257
申请日：1996-07-09
申请人： Shaji Farooq , Suryanarayana Kaja , John U. Knickerbocker , Brenda Peterson , Srinivasan N. Reddy , Rao V. Vallabhaneni , Donald R. Wall
发明人： Shaji Farooq , Suryanarayana Kaja , John U. Knickerbocker , Brenda Peterson , Srinivasan N. Reddy , Rao V. Vallabhaneni , Donald R. Wall
IPC分类号： H01L21/48 , H01L23/498 , H05K3/24 , H01R9/00
CPC分类号： H05K3/248 , H01L21/4846 , H01L21/4867 , H01L23/49883 , H01L2924/0002 , H01L2924/09701 , H05K2203/0285 , H05K3/04 , Y10T29/49149 , Y10T29/49163
摘要： Disclosed is a method of selectively depositing a metallic layer on a metallic feature on a ceramic substrate. The metallic layer preferably may be elemental nickel particles, elemental copper particles, a mixture of copper and nickel particles, or copper/nickel alloy particles. The metallic layer is deposited as a paste mixture which includes the metallic particles and a binder material. Through a subsequent heating step, the metallic layer tightly bonds to the metallic feature but only loosely bonds to the ceramic substrate. Thereafter, an ultrasonic treatment is applied to remove the loosely adhered metallic layer on the ceramic substrate. The metallic layer on the metallic feature, being tightly bonded, is not removed by the ultrasonic treatment.
摘要翻译： 公开了一种在陶瓷基板上的金属特征上选择性地沉积金属层的方法。 金属层优选可以是元素镍颗粒，元素铜颗粒，铜和镍颗粒的混合物，或铜/镍合金颗粒。 金属层以包含金属颗粒和粘合剂材料的糊状混合物沉积。 通过随后的加热步骤，金属层紧密地结合到金属特征，但是仅松散地结合到陶瓷基底。 此后，施加超声波处理以去除陶瓷基板上的松散粘附的金属层。 通过超声波处理，金属层上的紧密结合的金属层不被除去。
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