公开(公告)号：US06541305B2

公开(公告)日：2003-04-01

申请号：US09892806

申请日：2001-06-27

申请人： Mukta G. Farooq ,  Raymond A. Jackson

发明人： Mukta G. Farooq ,  Raymond A. Jackson

IPC分类号： H01L2144

CPC分类号： H01L24/11 ,  H01L21/6835 ,  H01L24/81 ,  H01L2224/10135 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/11334 ,  H01L2224/1183 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3511 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3478 ,  H05K3/3484 ,  H05K2201/10568 ,  H05K2201/2036 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/0465 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2924/00

摘要： A method of joining first and second substrates through a solder element interconnect, the method including the steps of forming solder elements, such as solder balls, in a first array on a first substrate, forming pads of solder paste in a second array on a second substrate wherein the first and second arrays are mirror images of one another, establishing a standoff element on one of the first or second substrates, assembling the first and second substrates such that each of the solder elements on the first substrate are embedded in each of the solder paste pads and the standoff element is interposed between the first and second substrates, heating the first and second substrates at a preferred temperature to cause melting of the solder elements and the solder pads into single solder elements, wherein the standoff controls the separation distance between the first and second substrates.

摘要翻译： 一种通过焊料元件互连连接第一和第二衬底的方法，所述方法包括以下步骤：在第一衬底上以第一阵列形成诸如焊料球的焊料元件，在第二衬底上形成第二阵列中的焊膏焊盘 衬底，其中第一和第二阵列是彼此的镜像，在第一或第二衬底之一上建立支座元件，组装第一和第二衬底，使得第一衬底上的每个焊料元件嵌入每个衬底 焊膏焊盘和支座元件插入在第一和第二基板之间，在优选的温度下加热第一和第二基板，以使焊料元件和焊盘熔化成单个焊料元件，其中支座控制第一和第二基板之间的间隔距离 第一和第二基板。

公开(公告)号：US06719188B2

公开(公告)日：2004-04-13

申请号：US09912192

申请日：2001-07-24

申请人： Mukta G. Farooq ,  Raymond A. Jackson ,  David C. Linnell

发明人： Mukta G. Farooq ,  Raymond A. Jackson ,  David C. Linnell

IPC分类号： B23K1018

CPC分类号： B23K1/018 ,  B23K2101/40 ,  H01L24/98 ,  Y10T29/49815 ,  Y10T29/53274 ,  Y10T29/53283

摘要： A method and apparatus are provided for reworking electronic component assemblies where the components are joined by solder interconnections. A cutting device employing a heated wire, blade or other cutting element is forced against and through the solder interconnections to sever the interconnections. A preferred cutting device employs moving the cutting element transverse to the solder interconnections to also provide a sawing action to the solder interconnections. Another cutting device employs a water jet to provide a high pressure stream of water that cuts and severs the solder interconnections.

摘要翻译： 提供了一种方法和装置，用于重新加工电子部件组件，其中部件通过焊料互连连接。 使用加热的线，刀片或其他切割元件的切割装置被迫抵抗并穿过焊料互连以切断互连。 优选的切割装置采用将切割元件横向于焊接互连件移动以向焊接互连提供锯切动作。 另一切割装置采用水射流来提供高压水流，其切割和切断焊料互连。

公开(公告)号：US6158644A

公开(公告)日：2000-12-12

申请号：US70163

申请日：1998-04-30

申请人： Peter J. Brofman ,  Mark G. Courtney ,  Shaji Farooq ,  Mario J. Interrante ,  Raymond A. Jackson ,  Gregory B. Martin ,  Sudipta K. Ray ,  William E. Sablinski ,  Kathleen A. Stalter

发明人： Peter J. Brofman ,  Mark G. Courtney ,  Shaji Farooq ,  Mario J. Interrante ,  Raymond A. Jackson ,  Gregory B. Martin ,  Sudipta K. Ray ,  William E. Sablinski ,  Kathleen A. Stalter

IPC分类号： H01L23/12 ,  B23K35/02 ,  B23K35/14 ,  H01L21/60 ,  H01L23/498 ,  H05K3/34 ,  B23K35/24 ,  B23K35/26

CPC分类号： H01L24/12 ,  B23K35/0222 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H05K3/3436 ,  B23K35/0244 ,  H01L2224/1184 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0435 ,  Y02P70/613 ,  Y10T428/12687 ,  Y10T428/2991

摘要： This invention relates to a solder structure which provides enhanced fatigue life properties when used to bond substrates particularly at the second level such as BGA and CGA interconnections. The solder structure is preferably a sphere or column and has a metal layer wettable by solder and the structure is used to make solder connections in electronic components such as joining an electronic module such as a chip connected to a MLC which module is connected to a circuit board. The solder structure preferably has an overcoat of solder on the metal layer to provide a passivation coating to the metal layer to keep it clean from oxidation and corrosion and also provide a wettable surface for attachment of the solder structure to solder on the pads of the substrate being bonded.

摘要翻译： 本发明涉及一种焊料结构，当用于特别是在第二层（例如BGA和CGA互连）的基材上时，其提供增强的疲劳寿命特性。 焊料结构优选是球形或柱状，并且具有可被焊料润湿的金属层，并且该结构用于在电子部件中形成焊接连接​​，例如连接诸如连接到MLC的芯片的电子模块，该模块连接到电路 板。 焊料结构优选地在金属层上具有焊料的外涂层，以向金属层提供钝化涂层以保持其免于氧化和腐蚀，并且还提供用于将焊料结构附着到衬底的焊盘上的焊料的可润湿表面 被绑定。

公开(公告)号：US5975409A

公开(公告)日：1999-11-02

申请号：US909865

申请日：1997-08-12

申请人： Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  Shaji Farooq ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  David C. Linnell ,  Gregory B. Martin ,  Frank L. Pompeo ,  Kathleen A. Stalter ,  Hilton T. Toy

发明人： Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  Shaji Farooq ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  David C. Linnell ,  Gregory B. Martin ,  Frank L. Pompeo ,  Kathleen A. Stalter ,  Hilton T. Toy

IPC分类号： H01L21/60 ,  H05K3/34 ,  B23K31/02 ,  B23K37/04

CPC分类号： H01L24/81 ,  H01L24/75 ,  H05K3/3436 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75743 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/30107 ,  H05K2203/0195 ,  H05K2203/0465 ,  H05K2203/082 ,  H05K2203/306 ,  Y02P70/613

摘要： A method and apparatus is provided for forming an elongated solder joint between two soldered substrates of an electronic module by applying a controlled separating force between the two soldered substrates during and/or after heating of the module. The solder joints are plasticized, preferably to the molten state above the liquidus temperature, and are thereby stretched and the module is then cooled to solidify the stretched joints. An apparatus and method are provided which preferably uses a vacuum device as the separating force to stretch the existing solder joints to the desired solder height and configuration which is preferably an hour-glass shape.

摘要翻译： 提供了一种方法和装置，用于在电子模块的两个焊接的基板之间通过在模块的加热期间和/或之后施加受控的分离力来在两个焊接的基板之间形成细长的焊接接头。 焊接接头被塑化，优选地熔化到高于液相线温度的熔融状态，并且由此被拉伸，然后将模块冷却以固化拉伸接头。 提供了一种优选使用真空装置作为将现有焊料接头拉伸到期望的焊料高度和优选为沙漏形状的构造的分离力的装置和方法。

公开(公告)号：US5543584A

公开(公告)日：1996-08-06

申请号：US843684

申请日：1992-02-28

申请人： Edward F. Handford ,  Joseph M. Harvilchuck ,  Mario J. Interrante ,  Raymond A. Jackson ,  Raj N. Master ,  Sudipta K. Ray ,  William E. Sablinski ,  Thomas A. Wassick

发明人： Edward F. Handford ,  Joseph M. Harvilchuck ,  Mario J. Interrante ,  Raymond A. Jackson ,  Raj N. Master ,  Sudipta K. Ray ,  William E. Sablinski ,  Thomas A. Wassick

IPC分类号： H01L21/3205 ,  H01L21/768 ,  H01L23/498 ,  H01L23/52 ,  H01L23/525 ,  H01L23/538 ,  H05K3/00 ,  H05K3/02 ,  H05K3/22 ,  H05K3/34 ,  H05K1/11

CPC分类号： H01L21/76892 ,  H01L23/49866 ,  H01L23/525 ,  H05K3/225 ,  H01L2924/0002 ,  H05K2201/10181 ,  H05K2201/10234 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2203/0769 ,  H05K2203/107 ,  H05K2203/121 ,  H05K2203/173 ,  H05K2203/175 ,  H05K3/0017 ,  H05K3/027 ,  H05K3/34 ,  Y10T29/49124

摘要： The present invention relates generally to a new method of repairing electrical lines, and more particularly to repairing electrical lines having an opening at the module level with devices in place. Various methods and processes are used to repair this open or defective portion in an electrical conductor line. It could be repaired by securing a jumper wire or nugget across the open or the repair could be made by a deposition process, which includes but is not limited to filling the opening with a solder type material or inserting a solder coated electrical wire and heating the solder and allowing the solder to melt and repair the open. One of the attributes of this invention is the ability to repair on a substrate or module on which active components such as chips, and passive components such as pins, capacitors, etc. have been attached. The invention also allows repair of fine line patterns which are normally not repairable by conventional techniques.

摘要翻译： 本发明一般涉及一种修复电线的新方法，更具体地说，涉及在装置的适当位置修复具有模块级开口的电线。 使用各种方法和过程来修复电导体线中的这个开路或有缺陷的部分。 它可以通过将跨接线或熔核固定在整个开口处进行修复，或者可以通过沉积工艺进行修复，该沉积工艺包括但不限于用焊料型材料填充开口或插入焊料涂覆的电线并加热 焊接并允许焊料熔化并修复开路。 本发明的一个特征是在其上附着有诸如引脚，电容器等的诸如芯片和无源部件的有源部件的基板或模块上进行修复的能力。 本发明还允许修复通常不能通过常规技术修复的细线图案。

公开(公告)号：US06335210B1

公开(公告)日：2002-01-01

申请号：US09466607

申请日：1999-12-17

申请人： Mukta S. Farooq ,  Raymond A. Jackson ,  Sarah H. Knickerbocker ,  Sudipta K. Ray

发明人： Mukta S. Farooq ,  Raymond A. Jackson ,  Sarah H. Knickerbocker ,  Sudipta K. Ray

IPC分类号： H01L2166

CPC分类号： G01R31/2863 ,  H01L2224/16225 ,  H01L2924/15311

摘要： The present invention relates generally to a new structure and method for chip burn-in and/or testing. More particularly, the invention encompasses a baseplate that is secured to a delicate chip and a method for such an invention is also disclosed. The inventive baseplate provides an added strength to a complex chip while it is being tested and/or burned-in, and then during normal use the baseplate of this invention is an integrated component of the chip.

摘要翻译： 本发明一般涉及用于芯片老化和/或测试的新结构和方法。 更具体地，本发明包括固定到精细芯片上的底板，并且还公开了用于这种发明的方法。 本发明的基板在被测试和/或燃烧时提供了对复合芯片的附加强度，然后在正常使用期间，本发明的底板是芯片的集成部件。

公开(公告)号：US06278184B1

公开(公告)日：2001-08-21

申请号：US09400783

申请日：1999-09-22

申请人： Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  William E. Sablinski ,  Kathleen A. Stalter ,  Hilton T. Toy ,  Li Wang

发明人： Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  William E. Sablinski ,  Kathleen A. Stalter ,  Hilton T. Toy ,  Li Wang

IPC分类号： H01L2348

CPC分类号： H01L24/12 ,  B23K1/0016 ,  B23K2101/42 ,  H01L23/10 ,  H01L23/50 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/3436 ,  H05K2201/1025 ,  H05K2201/10992 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/00

摘要： A solder preform is provided for forming interconnections between multilayer ceramic substrates comprising an upper layer and lower layer of solder separated by an intermediate layer of a material which is wettable by solder and which does not melt at the temperatures used to reflow the solder and form the connections. The solder preform is used to join the substrates and is particularly useful to simultaneously electrically interconnect the substrates and to form a hermetic seal between the substrates being joined.

公开(公告)号：US6070321A

公开(公告)日：2000-06-06

申请号：US890458

申请日：1997-07-09

申请人： Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  William E. Sablinski ,  Kathleen A. Stalter ,  Hilton T. Toy ,  Li Wang

发明人： Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  William E. Sablinski ,  Kathleen A. Stalter ,  Hilton T. Toy ,  Li Wang

IPC分类号： B23K1/00 ,  B23K35/14 ,  H01L21/60 ,  H01L23/10 ,  H01L23/50 ,  H05K3/34

CPC分类号： H01L24/12 ,  B23K1/0016 ,  H01L23/10 ,  H01L23/50 ,  H01L24/16 ,  H01L24/81 ,  H05K3/3436 ,  B23K2201/42 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K2201/1025 ,  H05K2201/10992 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49144

摘要： A solder preform is provided for forming interconnections between multilayer ceramic substrates comprising an upper layer and lower layer of solder separated by an intermediate layer of a material which is wettable by solder and which does not melt at the temperatures used to reflow the solder and form the connections. The solder preform is used to join the substrates and is particularly useful to simultaneously electrically interconnect the substrates and to form a hermetic seal between the substrates being joined.

摘要翻译： 提供焊料预成型件，用于在多层陶瓷基片之间形成互连，包括上层和下层焊料，该材料由可由焊料润湿的材料的中间层分开，并且在用于回流焊料的温度下不熔化，形成 连接。 焊料预成型件用于连接基板，并且特别可用于同时电连接基板并且在被接合的基板之间形成气密密封。

公开(公告)号：US5964396A

公开(公告)日：1999-10-12

申请号：US909801

申请日：1997-08-12

申请人： Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  Shaji Farooq ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  David C. Linnell ,  Gregory B. Martin ,  Frank L. Pompeo ,  Kathleen A. Stalter ,  Hilton T. Toy

发明人： Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  Shaji Farooq ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  David C. Linnell ,  Gregory B. Martin ,  Frank L. Pompeo ,  Kathleen A. Stalter ,  Hilton T. Toy

IPC分类号： H01L23/12 ,  B23K3/06 ,  H01L21/60 ,  H05K3/34 ,  B23K31/02 ,  B23K37/04

CPC分类号： B23K3/0638 ,  H05K3/3436 ,  B23K2201/36 ,  H01L2924/00013 ,  H01L2924/0002 ,  H05K2203/0195 ,  H05K2203/0465 ,  H05K2203/306 ,  Y02P70/613

摘要： A device is provided for stretching solder interconnection joints between two substrates of an electronic module. The device employs an expandable metal to exert a separating (stretching) force to the two substrates whereby a lifting rod attached to a clamping bridge is cause to move upwards by expansion of the expandable metal raising a first substrate clamped thereto. A lifting bridge in connection with the clamping bridge is caused to move downward to maintain the lifting bridge in contact with the second substrate being interconnected to the first substrate.

摘要翻译： 提供一种用于在电子模块的两个基板之间拉伸焊料互连接头的装置。 该装置使用可膨胀金属对两个基板施加分离（拉伸）力，借此通过膨胀可膨胀金属的方式使附接到夹紧桥的提升杆向上移动，从而提升夹持在其上的第一基板。 引起与夹紧桥连接的升降桥向下运动，以使升降桥与第二基板相互接触而与第一基板互连。

公开(公告)号：US06458623B1

公开(公告)日：2002-10-01

申请号：US09765030

申请日：2001-01-17

申请人： Lewis S. Goldmann ,  Mario J. Interrante ,  Raymond A. Jackson ,  Amy B. Ostrander ,  Charles H. Perry ,  Brenda L. Peterson

发明人： Lewis S. Goldmann ,  Mario J. Interrante ,  Raymond A. Jackson ,  Amy B. Ostrander ,  Charles H. Perry ,  Brenda L. Peterson

IPC分类号： H01L2144

CPC分类号： H01L24/83 ,  H01L23/49827 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/13111 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/30107 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/09472 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0415 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： A method and apparatus is provided for forming an electronic assembly whereby an insulating polymer matrix having a plurality of conductor holes is attached to a first substrate wherein the conductor holes align with a corresponding contact array on the first substrate. Subsequently, a flexible, electrically conductive adhesive is provided within the plurality of conductor holes and a solid conductive material, preferably having a high melting temperature, is attached to at least one end thereof. The insulating polymer matrix with the electrically conductive adhesive and the solid conductive material is then cured at a temperature sufficient to completely cure the matrix to completely surround the electrically conductive adhesive, as well as permanently attaching the matrix and conductive adhesive to the first substrate and permanently attaching the solid conductive material to the conductive adhesive. A second substrate may then be attached to the conductive matrix structure secured to the first substrate by providing a low melting temperature attachment means to the solid conductive material attached to the matrix and subsequently reflowing the assembly to form an electronic assembly adapted with the capability of reworkability.

摘要翻译： 提供了一种用于形成电子组件的方法和装置，由此具有多个导体孔的绝缘聚合物基体附接到第一基底，其中导体孔与第一基底上的对应的接触阵列对准。 随后，在多个导体孔内提供柔性的导电粘合剂，并且其至少一端连接有优选具有高熔融温度的固体导电材料。 然后将具有导电粘合剂和固体导电材料的绝缘聚合物基质在足以完全固化基质以完全包围导电粘合剂的温度下固化，以及将基质和导电粘合剂永久地附着到第一基材上并永久地 将固体导电材料附着到导电粘合剂上。 然后可以通过向连接到基质的固体导电材料提供低熔点温度的附着装置，随后回流组件以形成适于具有再加工性能的电子组件，然后将第二衬底附接到固定到第一衬底的导电矩阵结构 。