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公开(公告)号：US6158644A
公开(公告)日：2000-12-12
申请号：US70163
申请日：1998-04-30
申请人： Peter J. Brofman , Mark G. Courtney , Shaji Farooq , Mario J. Interrante , Raymond A. Jackson , Gregory B. Martin , Sudipta K. Ray , William E. Sablinski , Kathleen A. Stalter
发明人： Peter J. Brofman , Mark G. Courtney , Shaji Farooq , Mario J. Interrante , Raymond A. Jackson , Gregory B. Martin , Sudipta K. Ray , William E. Sablinski , Kathleen A. Stalter
IPC分类号： H01L23/12 , B23K35/02 , B23K35/14 , H01L21/60 , H01L23/498 , H05K3/34 , B23K35/24 , B23K35/26
CPC分类号： H01L24/12 , B23K35/0222 , H01L23/49811 , H01L24/11 , H01L24/16 , H05K3/3436 , B23K35/0244 , H01L2224/1184 , H01L2224/13099 , H01L2924/00013 , H01L2924/01004 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H05K2201/10992 , H05K2203/041 , H05K2203/0415 , H05K2203/0435 , Y02P70/613 , Y10T428/12687 , Y10T428/2991
摘要： This invention relates to a solder structure which provides enhanced fatigue life properties when used to bond substrates particularly at the second level such as BGA and CGA interconnections. The solder structure is preferably a sphere or column and has a metal layer wettable by solder and the structure is used to make solder connections in electronic components such as joining an electronic module such as a chip connected to a MLC which module is connected to a circuit board. The solder structure preferably has an overcoat of solder on the metal layer to provide a passivation coating to the metal layer to keep it clean from oxidation and corrosion and also provide a wettable surface for attachment of the solder structure to solder on the pads of the substrate being bonded.
摘要翻译： 本发明涉及一种焊料结构，当用于特别是在第二层（例如BGA和CGA互连）的基材上时，其提供增强的疲劳寿命特性。 焊料结构优选是球形或柱状，并且具有可被焊料润湿的金属层，并且该结构用于在电子部件中形成焊接连接，例如连接诸如连接到MLC的芯片的电子模块，该模块连接到电路 板。 焊料结构优选地在金属层上具有焊料的外涂层，以向金属层提供钝化涂层以保持其免于氧化和腐蚀，并且还提供用于将焊料结构附着到衬底的焊盘上的焊料的可润湿表面 被绑定。
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公开(公告)号：US06283359B1
公开(公告)日：2001-09-04
申请号：US09644486
申请日：2000-08-23
申请人： Peter J. Brofman , Mark G. Courtney , Shaji Farooq , Mario J. Interrante , Raymond A. Jackson , Gregory B. Martin , Sudipta K. Ray , William E. Sablinski , Kathleen A. Stalter
发明人： Peter J. Brofman , Mark G. Courtney , Shaji Farooq , Mario J. Interrante , Raymond A. Jackson , Gregory B. Martin , Sudipta K. Ray , William E. Sablinski , Kathleen A. Stalter
IPC分类号： B23K3102
CPC分类号： H01L24/12 , B23K35/0222 , B23K35/0244 , H01L23/49811 , H01L24/11 , H01L24/16 , H01L2224/1184 , H01L2224/13099 , H01L2924/00013 , H01L2924/01004 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H05K3/3436 , H05K2201/10992 , H05K2203/041 , H05K2203/0415 , H05K2203/0435 , Y02P70/613 , Y10T428/12687 , Y10T428/2991 , H01L2224/29099 , H01L2924/00
摘要： This invention relates to a solder structure which provides enhanced fatigue life properties when used to bond substrates particularly at the second level such as BGA and CGA interconnections. The solder structure is preferably a sphere or column and has a metal layer wettable by solder and the structure is used to make solder connections in electronic components such as joining an electronic module such as a chip connected to a MLC which module is connected to a circuit board. The solder structure preferably has an overcoat of solder on the metal layer to provide a passivation coating to the metal layer to keep it clean from oxidation and corrosion and also provide a wettable surface for attachment of the solder structure to solder on the pads of the substrate being bonded.
摘要翻译： 本发明涉及一种焊料结构，当用于特别是在第二层（例如BGA和CGA互连）的基材上时，其提供增强的疲劳寿命特性。 焊料结构优选是球形或柱状，并且具有可被焊料润湿的金属层，并且该结构用于在电子部件中形成焊接连接，例如连接诸如连接到MLC的芯片的电子模块，该模块连接到电路 板。 焊料结构优选地在金属层上具有焊料的外涂层，以向金属层提供钝化涂层以保持其免于氧化和腐蚀，并且还提供用于将焊料结构附着到衬底的焊盘上的焊料的可润湿表面 被绑定。
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公开(公告)号：US5975409A
公开(公告)日：1999-11-02
申请号：US909865
申请日：1997-08-12
申请人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Shaji Farooq , Lewis S. Goldmann , Raymond A. Jackson , David C. Linnell , Gregory B. Martin , Frank L. Pompeo , Kathleen A. Stalter , Hilton T. Toy
发明人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Shaji Farooq , Lewis S. Goldmann , Raymond A. Jackson , David C. Linnell , Gregory B. Martin , Frank L. Pompeo , Kathleen A. Stalter , Hilton T. Toy
CPC分类号： H01L24/81 , H01L24/75 , H05K3/3436 , H01L2224/16 , H01L2224/75 , H01L2224/75743 , H01L2224/81801 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/30107 , H05K2203/0195 , H05K2203/0465 , H05K2203/082 , H05K2203/306 , Y02P70/613
摘要： A method and apparatus is provided for forming an elongated solder joint between two soldered substrates of an electronic module by applying a controlled separating force between the two soldered substrates during and/or after heating of the module. The solder joints are plasticized, preferably to the molten state above the liquidus temperature, and are thereby stretched and the module is then cooled to solidify the stretched joints. An apparatus and method are provided which preferably uses a vacuum device as the separating force to stretch the existing solder joints to the desired solder height and configuration which is preferably an hour-glass shape.
摘要翻译： 提供了一种方法和装置，用于在电子模块的两个焊接的基板之间通过在模块的加热期间和/或之后施加受控的分离力来在两个焊接的基板之间形成细长的焊接接头。 焊接接头被塑化，优选地熔化到高于液相线温度的熔融状态，并且由此被拉伸，然后将模块冷却以固化拉伸接头。 提供了一种优选使用真空装置作为将现有焊料接头拉伸到期望的焊料高度和优选为沙漏形状的构造的分离力的装置和方法。
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4.发明授权
公开(公告)号：US5968670A
公开(公告)日：1999-10-19
申请号：US909864
申请日：1997-08-12
申请人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , James H. Covell, II , Shaji Farooq , Lewis S. Goldmann , Raymond A. Jackson , David C. Linnell , Gregory B. Martin , Frank L. Pompeo , Kathleen A. Stalter , Hilton T. Toy
发明人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , James H. Covell, II , Shaji Farooq , Lewis S. Goldmann , Raymond A. Jackson , David C. Linnell , Gregory B. Martin , Frank L. Pompeo , Kathleen A. Stalter , Hilton T. Toy
CPC分类号： H01L24/81 , B23K35/0222 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H05K3/3436 , H01L2224/10135 , H01L2224/13076 , H01L2224/131 , H01L2224/14051 , H01L2224/14505 , H01L2224/16058 , H01L2224/16227 , H01L2224/17051 , H01L2224/81136 , H01L2224/81139 , H01L2224/81801 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/30107 , H05K2201/09781 , H05K2201/10265 , H05K2203/0415 , H05K2203/0465 , H05K2203/306 , Y02P70/613 , Y10T428/12222 , Y10T428/12333 , Y10T428/12486
摘要： A method and apparatus are provided for forming an elongated solder joint between two soldered substrates of an electronic module or an electronic module in the process of being fabricated by using expandable solder bump means disposed between the substrates. The expandable solder bumps means comprise solder having a higher reflow temperature than the solder used to join the substrates and expansion means such as a compressed spring encased within the solder and are activated (expanded) by reflowing at a higher temperature than the melting point temperature of the solder joints.
摘要翻译： 提供了一种方法和装置，用于在通过使用设置在基板之间的可膨胀焊料凸块装置制造过程中，在电子模块或电子模块的两个焊接基板之间形成细长焊接接头。 可膨胀焊料凸点装置包括具有比用于接合基板的焊料更高的回流温度的焊料和诸如包封在焊料内的压缩弹簧的膨胀装置，并且通过在比熔融温度高于 焊点。
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5.发明授权
公开(公告)号：US5964396A
公开(公告)日：1999-10-12
申请号：US909801
申请日：1997-08-12
申请人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Shaji Farooq , Lewis S. Goldmann , Raymond A. Jackson , David C. Linnell , Gregory B. Martin , Frank L. Pompeo , Kathleen A. Stalter , Hilton T. Toy
发明人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Shaji Farooq , Lewis S. Goldmann , Raymond A. Jackson , David C. Linnell , Gregory B. Martin , Frank L. Pompeo , Kathleen A. Stalter , Hilton T. Toy
CPC分类号： B23K3/0638 , H05K3/3436 , B23K2201/36 , H01L2924/00013 , H01L2924/0002 , H05K2203/0195 , H05K2203/0465 , H05K2203/306 , Y02P70/613
摘要： A device is provided for stretching solder interconnection joints between two substrates of an electronic module. The device employs an expandable metal to exert a separating (stretching) force to the two substrates whereby a lifting rod attached to a clamping bridge is cause to move upwards by expansion of the expandable metal raising a first substrate clamped thereto. A lifting bridge in connection with the clamping bridge is caused to move downward to maintain the lifting bridge in contact with the second substrate being interconnected to the first substrate.
摘要翻译： 提供一种用于在电子模块的两个基板之间拉伸焊料互连接头的装置。 该装置使用可膨胀金属对两个基板施加分离（拉伸）力，借此通过膨胀可膨胀金属的方式使附接到夹紧桥的提升杆向上移动，从而提升夹持在其上的第一基板。 引起与夹紧桥连接的升降桥向下运动，以使升降桥与第二基板相互接触而与第一基板互连。
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公开(公告)号：US06253986B1
公开(公告)日：2001-07-03
申请号：US09400784
申请日：1999-09-22
申请人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Lewis S. Goldmann , Raymond A. Jackson , William E. Sablinski , Kathleen A. Stalter , Hilton T. Toy , Li Wang
发明人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Lewis S. Goldmann , Raymond A. Jackson , William E. Sablinski , Kathleen A. Stalter , Hilton T. Toy , Li Wang
IPC分类号： B23K3514
CPC分类号： H01L24/12 , B23K1/0016 , B23K2101/42 , H01L23/10 , H01L23/50 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/06102 , H01L2224/13099 , H01L2224/1403 , H01L2224/81801 , H01L2224/83101 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H05K3/3436 , H05K2201/1025 , H05K2201/10992 , H05K2203/0415 , Y02P70/613 , Y10T29/49144 , H01L2924/00
摘要： A solder preform is provided for forming interconnections between multilayer ceramic substrates comprising an upper layer and lower layer of solder separated by an intermediate layer of a material which is wettable by solder and which does not melt at the temperatures used to reflow the solder and form the connections. The solder preform is used to join the substrates and is particularly useful to simultaneously electrically interconnect the substrates and to form a hermetic seal between the substrates being joined.
摘要翻译： 提供焊料预成型件，用于在多层陶瓷基片之间形成互连，包括上层和下层焊料，该材料由可由焊料润湿的材料的中间层分开，并且在用于回流焊料的温度下不熔化，形成 连接。 焊料预成型件用于连接基板，并且特别可用于同时电连接基板并且在被接合的基板之间形成气密密封。
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公开(公告)号：US06278184B1
公开(公告)日：2001-08-21
申请号：US09400783
申请日：1999-09-22
申请人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Lewis S. Goldmann , Raymond A. Jackson , William E. Sablinski , Kathleen A. Stalter , Hilton T. Toy , Li Wang
发明人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Lewis S. Goldmann , Raymond A. Jackson , William E. Sablinski , Kathleen A. Stalter , Hilton T. Toy , Li Wang
IPC分类号： H01L2348
CPC分类号： H01L24/12 , B23K1/0016 , B23K2101/42 , H01L23/10 , H01L23/50 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/06102 , H01L2224/13099 , H01L2224/1403 , H01L2224/81801 , H01L2224/83101 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H05K3/3436 , H05K2201/1025 , H05K2201/10992 , H05K2203/0415 , Y02P70/613 , Y10T29/49144 , H01L2924/00
摘要： A solder preform is provided for forming interconnections between multilayer ceramic substrates comprising an upper layer and lower layer of solder separated by an intermediate layer of a material which is wettable by solder and which does not melt at the temperatures used to reflow the solder and form the connections. The solder preform is used to join the substrates and is particularly useful to simultaneously electrically interconnect the substrates and to form a hermetic seal between the substrates being joined.
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公开(公告)号：US6070321A
公开(公告)日：2000-06-06
申请号：US890458
申请日：1997-07-09
申请人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Lewis S. Goldmann , Raymond A. Jackson , William E. Sablinski , Kathleen A. Stalter , Hilton T. Toy , Li Wang
发明人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Lewis S. Goldmann , Raymond A. Jackson , William E. Sablinski , Kathleen A. Stalter , Hilton T. Toy , Li Wang
CPC分类号： H01L24/12 , B23K1/0016 , H01L23/10 , H01L23/50 , H01L24/16 , H01L24/81 , H05K3/3436 , B23K2201/42 , H01L2224/0401 , H01L2224/06102 , H01L2224/13099 , H01L2224/1403 , H01L2224/81801 , H01L2224/83101 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H05K2201/1025 , H05K2201/10992 , H05K2203/0415 , Y02P70/613 , Y10T29/49144
摘要： A solder preform is provided for forming interconnections between multilayer ceramic substrates comprising an upper layer and lower layer of solder separated by an intermediate layer of a material which is wettable by solder and which does not melt at the temperatures used to reflow the solder and form the connections. The solder preform is used to join the substrates and is particularly useful to simultaneously electrically interconnect the substrates and to form a hermetic seal between the substrates being joined.
摘要翻译： 提供焊料预成型件，用于在多层陶瓷基片之间形成互连，包括上层和下层焊料，该材料由可由焊料润湿的材料的中间层分开，并且在用于回流焊料的温度下不熔化，形成 连接。 焊料预成型件用于连接基板，并且特别可用于同时电连接基板并且在被接合的基板之间形成气密密封。
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公开(公告)号：US06333563B1
公开(公告)日：2001-12-25
申请号：US09587944
申请日：2000-06-06
申请人： Raymond A. Jackson , Anson J. Call , Mark G. Courtney , Stephen A. DeLaurentis , Mukta S. Farooq , Shaji Farooq , Lewis S. Goldmann , Gregory B. Martin , Sudipta K. Ray
发明人： Raymond A. Jackson , Anson J. Call , Mark G. Courtney , Stephen A. DeLaurentis , Mukta S. Farooq , Shaji Farooq , Lewis S. Goldmann , Gregory B. Martin , Sudipta K. Ray
IPC分类号： H01L2940
CPC分类号： H05K1/141 , H01L23/49833 , H01L2224/16 , H01L2924/01322 , H01L2924/09701 , H01L2924/12044 , H01L2924/15311 , H05K3/284 , H05K3/3436 , H05K3/368 , H05K2201/049 , H05K2201/10734 , H05K2201/10977
摘要： The present invention relates generally to an electrical interconnection package and a method thereof. More particularly, the invention encompasses an invention that increases the fatigue life of a Ball Grid Array (BGA) electrical interconnection. This invention structurally couples at least one module to an organic interposer using a high modulus underfill material. The organic interposer is then joined to a organic board using standard joining processes. The inventive module can then be removed from the organic board at any time by moving the organic interposer using standard rework techniques.
摘要翻译： 本发明一般涉及电互连封装及其方法。 更具体地，本发明包括增加球栅阵列（BGA）电互连的疲劳寿命的发明。 本发明使用高模量底部填充材料将至少一个模块结构地耦合到有机插入件。 然后使用标准连接工艺将有机插入物连接到有机基板。 随后可以通过使用标准返工技术移动有机插入件，随时从有机板上移除本发明的模块。
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公开(公告)号：US5881944A
公开(公告)日：1999-03-16
申请号：US846929
申请日：1997-04-30
申请人： David L. Edwards , Armando S. Cammarano , Jeffrey T. Coffin , Mark G. Courtney , Stephen S. Drofitz, Jr. , Michael J. Ellsworth, Jr. , Lewis S. Goldmann , Sushumna Iruvanti , Frank L. Pompeo , William E. Sablinski , Raed A. Sherif , Hilton T. Toy
发明人： David L. Edwards , Armando S. Cammarano , Jeffrey T. Coffin , Mark G. Courtney , Stephen S. Drofitz, Jr. , Michael J. Ellsworth, Jr. , Lewis S. Goldmann , Sushumna Iruvanti , Frank L. Pompeo , William E. Sablinski , Raed A. Sherif , Hilton T. Toy
CPC分类号： H01L23/10 , B23K35/0238 , B23K35/26 , B23K2201/40 , H01L2224/16 , H01L2224/73253 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/15312 , H01L2924/16152 , H01L2924/163 , Y10T428/12361
摘要： The present invention relates generally to a new scheme of providing a seal band for semi-conductor substrates and chip carriers. More particularly, the invention encompasses a structure and a method that uses a multi-layer metallic seal to provide protection to chips on a chip carrier. This multi-layer metal seal provides both enhanced hermeticity lifetime and environmental protection. For the preferred embodiment the multi-layer metallic seal band is a three layer, solder sandwich structure which is used to create a low cost, high reliability, hermetic seal for the module. This solder sandwich has a high melting temperature thick solder inner core, and lower melting point thin interconnecting solder layers, where the thin interconnecting solder layers may have similar or different melting points.
摘要翻译： 本发明一般涉及为半导体衬底和芯片载体提供密封带的新方案。 更具体地，本发明包括使用多层金属密封件来为芯片载体上的芯片提供保护的结构和方法。 这种多层金属密封提供增强的气密寿命和环境保护。 对于优选实施例，多层金属密封带是用于为模块产生低成本，高可靠性气密密封的三层焊料夹层结构。 该焊料夹层具有较高的熔化温度较厚的焊料内芯和较低熔点的薄互连焊料层，其中薄的互连焊料层可具有相似或不同的熔点。
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