公开(公告)号：US06239489B1

公开(公告)日：2001-05-29

申请号：US09365599

申请日：1999-07-30

Applicant: Tongbi Jiang

Inventor： Tongbi Jiang

IPC: H01L2348

CPC classification number: H01L24/02 ,  H01L2224/0401 ,  H01L2224/45144 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/00

Abstract: The present invention is directed toward an apparatus and method of reinforcement of lead bonding in microelectronics packages. In one embodiment, a microelectronics package includes a microelectronics device having a bond pad, a conductive lead having a first end bonded to the bond pad to form a lead bond, an encapsulating material at least partially disposed about the conductive lead, and a reinforcement portion at least partially disposed about the lead bond and at least partially coupling the first end to the bond pad. The reinforcement portion has a greater modulus of elasticity and/or a greater bond strength than the encapsulating material. During thermal cycling of the microelectronics package, bond liftoff due to CTE mismatch is prevented by the reinforcement portion. The reinforcement portion may include a non-conductive adhesive material that physically secures the conductive lead to the bond pad, or alternately, an electrically conductive adhesive material that both physically and/or electrically couples the conductive lead to the bond pad. In an alternate embodiment, a microelectronics package includes a microelectronics device, an interposer, a plurality of conductive leads and a plurality of bond pads, and the reinforcement portion is disposed about a plurality of lead bonds. In this embodiment, the reinforcement portion may include a non-conductive adhesive material, or an anisotropically conductive material.

Abstract translation: 本发明涉及一种在微电子封装中增强引线键合的装置和方法。 在一个实施例中，微电子封装包括具有接合焊盘的微电子器件，具有接合到接合焊盘以形成引线接合的第一端的导电引线，至少部分地布置在导电引线周围的封装材料，以及加强部分 至少部分地围绕所述引线键设置并且至少部分地将所述第一端耦合到所述接合焊盘。 增强部分具有比封装材料更大的弹性模量和/或更大的粘结强度。 在微电子封装的热循环期间，通过加强部分防止由于CTE失配引起的粘结剥离。 加强部分可以包括非导电粘合剂材料，其将导电引线物理地固定到接合焊盘，或者替代地，导电粘合材料，其将导电引线物理地和/或电耦合到接合焊盘。 在替代实施例中，微电子封装包括微电子器件，插入器，多个导电引线和多个接合焊盘，并且加强部分围绕多个引线键设置。 在该实施例中，加强部分可以包括非导电粘合材料或各向异性导电材料。

公开(公告)号：US06200833B1

公开(公告)日：2001-03-13

申请号：US09433440

申请日：1999-11-04

Applicant: Tongbi Jiang ,  Syed S. Ahmad ,  Walter L. Moden

Inventor： Tongbi Jiang ,  Syed S. Ahmad ,  Walter L. Moden

IPC: H01L2144

CPC classification number: H01L23/49513 ,  H01L23/4951 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73257 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: The present invention is directed to a method of attaching a leadframe to a singulated good die using a wet film adhesive applied in a predetermined pattern on the active surface of the good die, the lead finger of a leadframe, or both. By applying the adhesive only to identified good dice, time and material are saved over a process that applies adhesive to the entire wafer. By attaching the leadframe to the good die with a wet film, it is possible to remove the leadframe from the good die for rework if the good die subsequently tests unacceptable.

公开(公告)号：US6124151A

公开(公告)日：2000-09-26

申请号：US195765

申请日：1998-11-18

Applicant: Tongbi Jiang ,  Jerrold L. King

Inventor： Tongbi Jiang ,  Jerrold L. King

IPC: H01L21/48 ,  H01L23/495 ,  H05K3/34 ,  H01L21/44 ,  H01L21/50

CPC classification number: H01L24/06 ,  H01L21/4821 ,  H01L23/495 ,  H01L23/4951 ,  H01L23/49579 ,  H01L23/49582 ,  H01L24/05 ,  H01L24/49 ,  H01L24/83 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05556 ,  H01L2224/06136 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48664 ,  H01L2224/48699 ,  H01L2224/48764 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/85464 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3426

Abstract: A conductive plastic lead frame and method of manufacturing same suitable for use in IC packaging. In a preferred embodiment, the lead frame is constructed of a plastic or polymer based lead frame structure with an intrinsic conductive polymer coating. In a second embodiment the lead frame is a composite plastic or polymeric material intermixed with an intrinsic conductive polymer coating.

Abstract translation: 一种导电塑料引线框架及其制造方法，适用于IC封装。 在优选实施例中，引线框架由具有本征导电聚合物涂层的基于塑料或聚合物的引线框架结构构成。 在第二实施例中，引线框架是与本征导电聚合物涂层混合的复合塑料或聚合材料。

公开(公告)号：US08436386B2

公开(公告)日：2013-05-07

申请号：US13152572

申请日：2011-06-03

Applicant: Jaspreet Gandhi ,  Tongbi Jiang

Inventor： Jaspreet Gandhi ,  Tongbi Jiang

IPC: H01L33/60 ,  H01L33/48

CPC classification number: H01L33/10 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/46

Abstract: Solid state lighting devices having side reflectivity and associated methods of manufacturing are disclosed herein. In one embodiment, a method of forming a solid state lighting device includes attaching a solid state emitter to a support substrate, mounting the solid state emitter and support substrate to a temporary carrier, and cutting kerfs through the solid state emitter and the substrate to separate individual dies. The solid state emitter can have a first semiconductor material, a second semiconductor material, and an active region between the first and second semiconductor materials. The individual dies can have sidewalls that expose the first semiconductor material, active region and second semiconductor material. The method can further include applying a reflective material into the kerfs and along the sidewalls of the individual dies.

Abstract translation: 本文公开了具有侧反射率和相关制造方法的固态照明装置。 在一个实施例中，形成固态照明装置的方法包括将固态发射器附接到支撑衬底，将固态发射器和支撑衬底安装到临时载体上，以及通过固态发射器和衬底切割缝隙以分离 个人死亡 固态发射器可以具有第一半导体材料，第二半导体材料和第一和第二半导体材料之间的有源区。 各个管芯可以具有露出第一半导体材料，有源区和第二半导体材料的侧壁。 该方法还可以包括将反射材料施加到切口中并且沿着各个模具的侧壁。

公开(公告)号：US20110169154A1

公开(公告)日：2011-07-14

申请号：US13052493

申请日：2011-03-21

Applicant: Young Do Kweon ,  J. Michael Brooks ,  Tongbi Jiang

Inventor： Young Do Kweon ,  J. Michael Brooks ,  Tongbi Jiang

IPC: H01L23/04

CPC classification number: H01L23/3128 ,  H01L21/561 ,  H01L22/20 ,  H01L23/3135 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/48 ,  H01L24/73 ,  H01L24/96 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/20 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1035 ,  H01L2225/1052 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Microelectronic devices and methods for manufacturing microelectronic devices are described herein. An embodiment of one such method includes attaching a plurality of singulated microelectronic dies to a removable support member with an active side of the individual dies facing toward the support member, depositing a flowable material onto the dies and a portion of the removable support member such that the flowable material covers a back side of the individual dies and is disposed between adjacent dies, and removing the support member from the active sides of the dies.

Abstract translation: 本文描述了用于制造微电子器件的微电子器件和方法。 一种这样的方法的实施例包括将多个单独的微电子管芯附接到可移除的支撑构件，其中各个模具的活动侧面向支撑构件，将可流动材料沉积到模具上以及可移除支撑构件的一部分，使得 可流动材料覆盖各个模具的背面并且设置在相邻模具之间，并且从模具的活动侧移除支撑构件。

公开(公告)号：US07977157B2

公开(公告)日：2011-07-12

申请号：US12715293

申请日：2010-03-01

Applicant: Setho Sing Fee ,  Lim Thiam Chye ,  Tongbi Jiang

Inventor： Setho Sing Fee ,  Lim Thiam Chye ,  Tongbi Jiang

IPC: H01L21/50 ,  H01L21/48 ,  H01L21/66 ,  H01L21/44

CPC classification number: H01L24/03 ,  H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05171 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05664 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/81894 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Some embodiments include methods of assembling integrated circuit packages in which at least two different conductive layers are formed over a bond pad region of a semiconductor die, and in which a conductive projection associated with an interposer is bonded through a gold ball to an outermost of the at least two conductive layers. The conductive layers may comprise one or more of silver, gold, copper, chromium, nickel, palladium, platinum, tantalum, titanium, vanadium and tungsten. In some embodiments, the bond pad region may comprise aluminum, an inner of the conductive layers may comprise nickel, an outer of the conductive layers may comprise gold, the conductive projection associated with the interposer may comprise gold; and the thermosonic bonding may comprise gold-to-gold bonding of the interposer projection to a gold ball, and gold-to-gold bonding of the outer conductive layer to the gold ball. Some embodiments include integrated circuit packages.

Abstract translation: 一些实施例包括组装集成电路封装的方法，其中在半导体管芯的接合焊盘区域上形成至少两个不同的导电层，并且其中与插入件相关联的导电突起通过金球结合到 至少两个导电层。 导电层可以包括银，金，铜，铬，镍，钯，铂，钽，钛，钒和钨中的一种或多种。 在一些实施例中，接合焊盘区域可以包括铝，导电层的内部可以包括镍，导电层的外部可以包括金，与中介层相关联的导电突起可以包括金; 并且热超声键合可以包括插入物突起与金球的金 - 金结合，以及外导体层与金球的金 - 金结合。 一些实施例包括集成电路封装。

公开(公告)号：US20100230794A1

公开(公告)日：2010-09-16

申请号：US12402649

申请日：2009-03-12

Applicant: Jin Li ,  Tongbi Jiang

Inventor： Jin Li ,  Tongbi Jiang

IPC: H01L23/52 ,  H01L21/768 ,  H01L21/50 ,  H01L23/498

CPC classification number: H01L21/76898 ,  H01L21/6836 ,  H01L24/16 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05025 ,  H01L2224/05111 ,  H01L2224/05118 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05171 ,  H01L2224/05178 ,  H01L2224/0518 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/0557 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/27416 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2924/013

Abstract: A method for fabricating semiconductor components includes the steps of: providing a semiconductor substrate having a circuit side, a back side and conductive vias; removing portions of the substrate from the back side to expose terminal portions of the conductive vias; depositing a polymer layer on the back side encapsulating the terminal portions; and then planarizing the polymer layer and ends of the terminal portions to form self aligned conductors embedded in the polymer layer. Additional back side elements, such as terminal contacts and back side redistribution conductors, can also be formed in electrical contact with the conductive vias. A semiconductor component includes the semiconductor substrate, the conductive vias, and the back side conductors embedded in the polymer layer. A stacked semiconductor component includes a plurality of components having aligned conductive vias in electrical communication with one another.

Abstract translation: 一种制造半导体器件的方法包括以下步骤：提供具有电路侧，背面和导电通孔的半导体衬底; 从背面去除衬底的部分以暴露导电通孔的端子部分; 在封装端子部分的背侧沉积聚合物层; 然后平面化聚合物层和末端部分的端部以形成嵌入聚合物层中的自对准导体。 附加的背面元件，例如端子触点和背面再分布导体也可以形成为与导电通孔电接触。 半导体部件包括半导体衬底，导电通路和嵌入聚合物层中的背面导体。 堆叠的半导体部件包括具有彼此电连通的对准的导电通孔的多个部件。

公开(公告)号：US07727785B2

公开(公告)日：2010-06-01

申请号：US11269069

申请日：2005-11-07

Applicant: Michael E. Connell ,  Tongbi Jiang

Inventor： Michael E. Connell ,  Tongbi Jiang

IPC: H01L21/00

CPC classification number: H01L21/78 ,  H01L23/562 ,  H01L2224/94 ,  H01L2224/03

Abstract: A method for balancing layer-caused compressive or tensile stress in a semiconductor die, die wafer or similar substrate uses a stress-balancing layer (SBL) attached to an opposite side from a stress-causing layer before the semiconductor die or wafer is significantly warped are provided. The SBL may also serve as, or support, an adhesive layer for die attach and be of a markable material for an enhanced marking method.

Abstract translation: 在半导体管芯，晶片或类似衬底中平衡层引起的压缩或拉伸应力的方法在半导体管芯或晶片显着翘曲之前使用附着在与应力引起层相反的一侧的应力平衡层（SBL） 被提供。 SBL还可以用作或支撑用于管芯附着的粘合剂层，并且是用于增强标记方法的可标记材料。

公开(公告)号：US07696011B2

公开(公告)日：2010-04-13

申请号：US11476467

申请日：2006-06-28

Applicant: Tongbi Jiang ,  Shijian Luo

Inventor： Tongbi Jiang ,  Shijian Luo

IPC: H01L21/44 ,  H01L21/48

CPC classification number: H01L24/12 ,  H01L23/3114 ,  H01L23/3185 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/94 ,  H01L29/0657 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10157 ,  H01L2924/14

Abstract: Methods for applying a dielectric protective layer to a wafer in wafer-level chip-scale package manufacture are disclosed. A flowable dielectric protective material with fluxing capability is applied over the active surface of an unbumped semiconductor wafer to cover active device areas, bond pads, test socket contact locations, and optional pre-scribed wafer street trenches. Preformed solder balls are then disposed over the bond pads, and the wafer is subjected to a heating process to reflow the solder balls and at least partially cure the dielectric protective material. During the heating process, the dielectric protective material provides a fluxing capability to enable the solder balls to wet the bond pads. In other exemplary embodiments, the dielectric protective material is applied over only intended physical contact locations and/or pre-scribed wafer street trenches, in which case the dielectric protective material need not include flux material and may additionally include a filler material.

Abstract translation: 公开了在晶片级芯片级封装制造中向晶片施加电介质保护层的方法。 具有助熔能力的可流动的介电保护材料施加在未凸起的半导体晶片的有源表面上，以覆盖有源器件区域，接合焊盘，测试插座接触位置以及可选的预刻片晶片街道沟槽。 然后将预形成的焊球设置在接合焊盘上方，并且对晶片进行加热处理以回流焊球并且至少部分地固化介电保护材料。 在加热过程中，介电保护材料提供助熔能力，以使焊球能够润湿接合焊盘。 在其它示例性实施例中，介电保护材料仅施加在预期的物理接触位置和/或预划线晶片街道沟槽上，在这种情况下，介电保护材料不需要包括焊剂材料，并且还可以包括填充材料。

公开(公告)号：US07557337B2

公开(公告)日：2009-07-07

申请号：US11257041

申请日：2005-10-25

Applicant: Tongbi Jiang ,  Michael Connell ,  Jin Li

Inventor： Tongbi Jiang ,  Michael Connell ,  Jin Li

IPC: H01J3/14

CPC classification number: H01L27/14627 ,  B33Y80/00

Abstract: An improved image sensor wherein a first micro-lens array comprised of one or more micro-lenses is positioned over a cavity such that incoming light is focused on the photo sensors of the image sensor. The first micro-lens array may collimate and focus incoming light onto the photo sensors of the image sensor, or may collimate incoming light and direct it to a second micro-lens array which then focuses the light onto the photo sensors. A method of fabricating the improved image sensor is also provided wherein the cavity and first micro-lens array are formed by use of a sacrificial material.

Abstract translation: 一种改进的图像传感器，其中由一个或多个微透镜组成的第一微透镜阵列位于空腔上方，使得入射光聚焦在图像传感器的光传感器上。 第一微透镜阵列可以将入射光准直并聚焦到图像传感器的光传感器上，或者可以校准入射光并将其引导到第二微透镜阵列，然后将第二微透镜阵列聚焦到光传感器上。 还提供了一种制造改进的图像传感器的方法，其中腔和第一微透镜阵列通过使用牺牲材料形成。