公开(公告)号：US09859036B2

公开(公告)日：2018-01-02

申请号：US14869503

申请日：2015-09-29

Applicant: FUJIFILM Corporation

Inventor： Yasuaki Matsushita ,  Tokihiko Matsumura

IPC: H01B1/22 ,  H05K1/09 ,  C09D5/24 ,  C09D1/00 ,  C09D7/12 ,  H01B3/44 ,  H05K3/12 ,  H05K3/28

CPC classification number: H01B1/22 ,  C08K3/08 ,  C08K5/02 ,  C08K5/13 ,  C08K5/32 ,  C08K5/3475 ,  C08K5/37 ,  C08K5/46 ,  C08K5/49 ,  C08K5/52 ,  C08K2003/0806 ,  C08K2003/0812 ,  C08K2003/0831 ,  C08K2003/085 ,  C09D1/00 ,  C09D5/24 ,  C09D7/40 ,  H01B3/445 ,  H05K1/09 ,  H05K1/092 ,  H05K3/125 ,  H05K3/282 ,  H05K2201/0269 ,  H05K2201/0338 ,  H05K2201/0769

Abstract: A conductive film forming composition includes a fluorine atom-containing migration inhibitor and a metal particle, with the migration inhibitor including at least one selected from the group consisting of compounds represented by General Formulae (1) to (5), (22) and (23) as well as compounds having a group of General Formula (24) and a group of General Formula (25). The conductive film forming composition makes it possible to form a conductive film excellent in conductive characteristics and ion migration inhibiting function.

公开(公告)号：US09777134B2

公开(公告)日：2017-10-03

申请号：US14557616

申请日：2014-12-02

Applicant: Timur Uenlue

Inventor： Timur Uenlue ,  Wilfried Leirer

IPC: C08K5/00 ,  C08G18/32 ,  C08K5/136 ,  C08K3/00 ,  C08K3/08 ,  C08K5/3432 ,  C08L75/04 ,  B29C67/00 ,  B33Y70/00 ,  C08G18/72

CPC classification number: C08K5/136 ,  B29C64/153 ,  B33Y70/00 ,  C08G18/32 ,  C08G18/72 ,  C08G2140/00 ,  C08K3/015 ,  C08K3/08 ,  C08K5/0058 ,  C08K5/3432 ,  C08K2003/0806 ,  C08K2003/0831 ,  C08K2003/085 ,  C08K2003/0893 ,  C08L75/04 ,  Y10T428/2982 ,  C08K3/005

Abstract: The invention relates to a powdery composition for use in the layer by layer manufacturing of three-dimensional molded bodies. The composition comprises at least one powder made of an aliphatic thermoplastic polyurethane (TPU) and is characterized in that the TPU powder has a melting temperature of less than 135° C. and a melting viscosity at 150° C. of at most 800 Pa·s.

公开(公告)号：US09663644B2

公开(公告)日：2017-05-30

申请号：US14895253

申请日：2014-09-22

Applicant: OTOWA ELECTRIC CO., LTD.

Inventor： Toshihiko Suzuki ,  Kenta Hiwatari ,  Naoyuki Tsukamoto ,  Hideyuki Okinaka

IPC: H01C7/10 ,  C08L23/06 ,  H01C7/12 ,  H01C7/105 ,  C08L77/00 ,  C08K3/04 ,  C08K3/08 ,  C08K3/28 ,  C08K3/34 ,  C08L81/02 ,  H01B1/22 ,  H01B1/24

CPC classification number: C08L23/06 ,  C08K3/04 ,  C08K3/08 ,  C08K3/28 ,  C08K3/34 ,  C08K2003/0806 ,  C08K2003/0831 ,  C08K2003/085 ,  C08K2003/0862 ,  C08L77/00 ,  C08L81/02 ,  C08L2203/20 ,  H01B1/22 ,  H01B1/24 ,  H01C7/10 ,  H01C7/105 ,  H01C7/12

Abstract: Provided is a resin material having non-ohmic properties which has favorable characteristics as a varistor and has a high degree of molding freedom and impact resistance. A resin material 10 comprises: an insulating matrix 11 made of a first resin material; an island-form conductive dispersed phase 12 made of a conductive second resin material which is incompatible with the first resin material and is more wettable to a microvaristor 13 described later than the first resin material is, wherein the island-form conductive dispersed phase is dispersed in an island form in the matrix and has a volume ratio of less than 16% in the whole resin material; and a microvaristor 13 comprising ceramic particles having non-ohmic properties, wherein the ceramic particles are dispersed in the matrix 11 and electrically contacted with each other via the island-form conductive dispersed phase 12.

公开(公告)号：US09598553B2

公开(公告)日：2017-03-21

申请号：US13981620

申请日：2012-01-25

Applicant: Norihiro Yoshida ,  Takao Nishiura

Inventor： Norihiro Yoshida ,  Takao Nishiura

IPC: B01J31/06 ,  C08F297/02 ,  C08F297/04 ,  C08F290/06 ,  C08F290/14 ,  C08K3/08 ,  B22F1/00 ,  B22F9/24 ,  C08L53/00 ,  C08K5/05 ,  C08L29/10 ,  B82Y30/00 ,  C08F297/00

CPC classification number: C08K3/08 ,  B22F1/0018 ,  B22F1/0022 ,  B22F1/0062 ,  B22F9/24 ,  B82Y30/00 ,  C08F116/14 ,  C08F216/125 ,  C08F216/1416 ,  C08F297/00 ,  C08F2216/1433 ,  C08K5/05 ,  C08K9/12 ,  C08K2003/0806 ,  C08K2003/0831 ,  C08K2003/085 ,  C08K2201/011 ,  C08L29/04 ,  C08L29/10 ,  C08L33/12 ,  C08L53/00 ,  C08L83/04 ,  C09D129/10 ,  C23C18/1635 ,  C23C18/40 ,  C23C18/44

Abstract: Provided are a metal nanoparticle composite which exhibits excellent stability over time and retention stability and is useful as a raw material for a metal nanoparticle-dispersed film, a method for producing the composite, a metal nanoparticle dispersion liquid, a composition for forming a metal nanoparticle-dispersed film, and a metal nanoparticle-dispersed film. Disclosed is a metal nanoparticle composite comprising (A) a star-shaped polymer having a central core and arms bonded to the central core, the arms comprising a repeating unit represented by the following formula (1) and a repeating unit represented by the following formula (2); and (B) metal nanoparticles supported thereon: wherein in the formula (1), R1 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; and in the formula (2), R2 represents a methyl group or an ethyl group; and k represents an integer from 1 to 10.

公开(公告)号：US20170066945A1

公开(公告)日：2017-03-09

申请号：US15122583

申请日：2015-09-14

Applicant: BOE TECHNOLOGY GROUP CO., LTD. ,  BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.

Inventor： Yongshan ZHOU ,  Yifeng QIN

IPC: C09J9/02 ,  C08K3/08 ,  C08K3/04 ,  C09J175/04 ,  C09J133/04 ,  C09J163/00 ,  C09J129/14 ,  C09J171/00 ,  C09J11/04 ,  C08K7/16

CPC classification number: C09J9/02 ,  C08G2190/00 ,  C08K9/12 ,  C08K2003/0806 ,  C08K2003/0812 ,  C08K2003/0831 ,  C08K2003/085 ,  C08K2003/0862 ,  C08K2201/001 ,  C08L2203/20 ,  C09J11/04 ,  C09J133/04 ,  C09J163/00 ,  C09J171/00 ,  C09J175/04 ,  C09J201/00 ,  C09J201/02

Abstract: The embodiments of the present disclosure relate to the field of display technologies and provide a conductive adhesive composition, a method for producing the same, a sealant and a display panel, so as to improve the dispersion evenness of conductive particles in the adhesive and ensure excellent conductivity of the conductive adhesive composition, as well as avoid influencing the normal throughput of the adhesive during coating when the doping percentage of conductive particles is high. The conductive adhesive composition comprises: a primary adhesive material; and carrier granules dispersed in the primary adhesive material and having conductive particles adsorbed thereon. The present disclosure is applicable to manufacture a conductive adhesive composition as well as a sealant and a display panel comprising the conductive adhesive composition.

Abstract translation: 本公开的实施例涉及显示技术领域并提供导电粘合剂组合物，其制造方法，密封剂和显示面板，以提高粘合剂中导电颗粒的分散均匀性并确保优异的 导电粘合剂组合物的导电性，并且当导电颗粒的掺杂百分比高时，避免影响涂布期间粘合剂的正常通量。 导电粘合剂组合物包括：主要粘合剂材料; 和分散在主粘合剂材料中并具有吸附在其上的导电颗粒的载体颗粒。 本公开可应用于制造导电粘合剂组合物以及密封剂和包含导电粘合剂组合物的显示面板。

公开(公告)号：US09559227B2

公开(公告)日：2017-01-31

申请号：US14744449

申请日：2015-06-19

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  UNIST Academy-Industry Research Corporation

Inventor： Unjeong Kim ,  Younggeun Roh ,  Yeonsang Park ,  Changwon Lee ,  Soojin Park ,  Seungmin Yoo

IPC: H01L31/0232 ,  H01L31/0352 ,  H01L31/0224 ,  H01L31/028 ,  H01L31/032

CPC classification number: C08J3/212 ,  B01J13/10 ,  B82B1/00 ,  C08J2353/00 ,  C08K3/08 ,  C08K2003/0831 ,  C09D5/24 ,  C09D153/00 ,  G02B5/008 ,  G02B2207/101 ,  H01L31/0224 ,  H01L31/02327 ,  H01L31/028 ,  H01L31/032 ,  H01L31/0352 ,  H01L31/112 ,  H01L31/1127 ,  Y02E10/547 ,  Y10T428/24802 ,  Y10T428/24917

Abstract: Provided are a nanostructure and an optical device including the nanostructure. The nanostructure is formed on a two-dimensional material layer such as graphene and includes nanopatterns having different shapes. The nanopattern may include a first nanopattern and a second nanopattern and may be spherical; cube-shaped; or poly-pyramid-shaped, including a triangular pyramid shape; or polygonal pillar-shaped.

Abstract translation: 提供纳米结构和包括纳米结构的光学器件。 纳米结构形成在诸如石墨烯的二维材料层上，并且包括具有不同形状的纳米图案。 纳米图案可以包括第一纳米图案和第二纳米图案，并且可以是球形的; 立方体形 或多角锥形，包括三角锥形; 或多边形柱状。

公开(公告)号：US20160319165A1

公开(公告)日：2016-11-03

申请号：US15104247

申请日：2014-12-09

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Jeongwan Choi ,  Jeffrey W. McCutcheon

IPC: C09J9/02 ,  B32B7/12 ,  C08K9/02 ,  B32B5/18 ,  C09J7/02 ,  C08K3/08

CPC classification number: C09J9/02 ,  B32B5/18 ,  B32B7/12 ,  B32B2307/202 ,  B32B2405/00 ,  C08K3/08 ,  C08K9/02 ,  C08K2003/0806 ,  C08K2003/0831 ,  C08K2003/085 ,  C08K2003/0862 ,  C08K2201/001 ,  C09J7/22 ,  C09J7/38 ,  C09J2201/122 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2467/005

Abstract: An electrically conductive, single-sided tape includes a conductive adhesive layer and a non-conductive polymeric layer positioned adjacent the conductive adhesive layer. The conductive adhesive layer includes a conductive, porous substrate having a plurality of passageways and an adhesive material positioned within at least a portion of the passageways. Optionally, the adhesive material may include a plurality of conductive particles dispersed within the adhesive material.

Abstract translation: 导电单面胶带包括导电粘合剂层和邻近导电粘合剂层定位的非导电聚合物层。 导电粘合剂层包括具有多个通道的导电多孔基材和位于通道的至少一部分内的粘合剂材料。 可选地，粘合剂材料可以包括分散在粘合剂材料内的多个导电颗粒。

公开(公告)号：US20160183328A1

公开(公告)日：2016-06-23

申请号：US14972840

申请日：2015-12-17

Applicant: E I DU PONT DE NEMOURS AND COMPANY

Inventor： JOHN GRAEME PEPIN ,  JOHN DONALD SUMMERS ,  SEIGI SUH ,  KURT DOUGLAS ROBERTS ,  DANNY E GLENN

IPC: H05B3/03 ,  H05B3/10 ,  H05B3/34 ,  H01C17/28

CPC classification number: H05B3/03 ,  C08G73/101 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/1064 ,  C08G73/1071 ,  C08K3/08 ,  C08K2003/0806 ,  C08K2003/0812 ,  C08K2003/0831 ,  C08K2003/085 ,  C08K2003/0862 ,  C09D179/08 ,  H01C17/06526 ,  H01C17/06586 ,  H01C17/283 ,  H05B3/10 ,  H05B3/146 ,  H05B3/24 ,  H05B3/34 ,  H05B2203/011 ,  H05B2203/013

Abstract: The present invention relates to the design, construction and manufacture of a novel electrical high temperature heater having a polymer thick film conductor paste with which to form an electrode on resistive film.

Abstract translation: 本发明涉及一种具有聚合物厚膜导体膏的新型电高温加热器的设计，构造和制造，以在电阻膜上形成电极。

公开(公告)号：US09346931B2

公开(公告)日：2016-05-24

申请号：US14360598

申请日：2012-11-27

Applicant: FUNDACIÓN CIDETEC

Inventor： Ibón Odriozola ,  Pablo Casuso ,  Natividad Díaz ,  Iraida Loinaz ,  Germán Cabañero ,  Hans-jürgen Grande

IPC: C08K3/08 ,  C08G65/326 ,  C08G65/334 ,  C08L71/02 ,  C07C323/12 ,  C07K14/78 ,  C08B37/08 ,  C08F222/38 ,  C08G18/38 ,  C08G18/76 ,  C08G77/28 ,  C09D133/26 ,  C09D175/08 ,  C09D183/08

CPC classification number: C08K3/08 ,  C07C323/12 ,  C07K14/78 ,  C08B37/0072 ,  C08F222/38 ,  C08G18/3863 ,  C08G18/7657 ,  C08G65/326 ,  C08G65/334 ,  C08G77/28 ,  C08K2003/0806 ,  C08K2003/0831 ,  C08K2003/085 ,  C08L71/02 ,  C08L2203/02 ,  C09D133/26 ,  C09D175/08 ,  C09D183/08

Abstract: It is provided a self-healing polymer network comprising transition metal thiolates, particularly thiolates of a transition metal that is able to self-assemble by metallophilic attractions, and more particularly Au(I), Ag(I), Cu(I) thiolates, or a mixture thereof, and, optionally, disulfide bonds, thiol and other thiolate groups. It is also provided several processes for the preparation of the self-healing polymer networks of the invention, as well as uses thereof.

Abstract translation: 提供了一种自愈性聚合物网络，其包含过渡金属硫醇盐，特别是能够通过金属吸引力自发组装的过渡金属的硫醇盐，更具体地为Au（I），Ag（I），Cu（I）硫醇盐， 或其混合物，和任选的二硫键，硫醇和其它硫醇盐基团。 还提供了用于制备本发明的自愈合聚合物网络的几种方法及其用途。

公开(公告)号：US20160137886A1

公开(公告)日：2016-05-19

申请号：US14937775

申请日：2015-11-10

Applicant: GM Global Technology Operations LLC

Inventor： Ryan C. Sekol ,  Jeffrey A. Abell

IPC: C09J9/02 ,  B32B37/12 ,  B32B37/14 ,  B32B7/14

CPC classification number: C09J9/02 ,  B32B5/024 ,  B32B5/22 ,  B32B5/26 ,  B32B7/06 ,  B32B7/14 ,  B32B37/12 ,  B32B38/10 ,  B32B2262/02 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2264/02 ,  B32B2264/105 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2307/51 ,  B32B2307/748 ,  B32B2405/00 ,  B32B2437/02 ,  B32B2590/00 ,  B32B2605/00 ,  C08K3/04 ,  C08K2003/0806 ,  C08K2003/0831 ,  C08K2003/085 ,  C08K2201/001 ,  C09J7/00 ,  C09J2201/626 ,  C09J2205/102 ,  C09J2483/006

Abstract: Provided is a releasable adhesive system, for joining a first conductive surface and a second conductive surface. The releasable adhesive includes primary material and an embedded material. The primary material includes at least one molecule that is configured to be positioned parallel with at least one molecule of the first conductive surface or the second conductive surface. The embedded material is infused within or affixed to the primary material to form an adhesive structure. The releasable adhesive structure has a conductivity greater than a conductivity of the primary material alone. Also provided is a method for joining the first conductive surface to the second conductive surface using the adhesive structure.

Abstract translation: 提供了一种用于连接第一导电表面和第二导电表面的可释放粘合剂系统。 可释放粘合剂包括主要材料和嵌入材料。 主要材料包括至少一个被配置为与第一导电表面或第二导电表面的至少一个分子平行定位的分子。 将嵌入材料注入或固定到初级材料上以形成粘合剂结构。 可释放粘合剂结构的导电率大于单独的主要材料的导电率。 还提供了使用粘合剂结构将第一导电表面连接到第二导电表面的方法。