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公开(公告)号：US20070003702A1
公开(公告)日：2007-01-04
申请号：US10573622
申请日：2004-08-26
申请人： Fumito Nishida , Timothy Lauer , Udo Pernisz
发明人： Fumito Nishida , Timothy Lauer , Udo Pernisz
IPC分类号： B05D1/36
CPC分类号： H05K3/025 , B05D1/286 , B05D5/067 , B05D7/02 , C23C14/0005 , H05K1/032 , H05K3/388 , H05K2201/0133 , H05K2201/0162 , H05K2201/09118
摘要： A method of preparing a metal-silicone rubber composite, the method comprising the steps of (i) depositing a layer of gold on a surface of a mold; (ii) depositing a primer layer of a metal on the layer of gold, wherein the metal is selected from aluminum, chromium, titanium, and copper, (iii) applying a radiation-curable silicone composition on the primer layer, (iv) curing the silicone composition with radiation to form a silicone rubber, and (v) removing the silicone rubber from the mold, whereby the layer of gold and the primer layer are transferred to the silicone rubber.
摘要翻译： 一种制备金属硅橡胶复合材料的方法，所述方法包括以下步骤：（i）在模具的表面上沉积一层金; （ii）在金层上沉积金属底漆层，其中金属选自铝，铬，钛和铜，（iii）在底漆层上涂敷可辐射固化的硅氧烷组合物，（iv）固化 所述有机硅组合物具有辐射以形成硅橡胶，和（v）从模具中除去硅橡胶，由此将金层和底漆层转移到硅橡胶。
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公开(公告)号：US20060268527A1
公开(公告)日：2006-11-30
申请号：US11431097
申请日：2006-05-10
IPC分类号： H05K7/20
CPC分类号： H05K1/0203 , H05K1/0201 , H05K1/0284 , H05K1/0373 , H05K1/185 , H05K3/202 , H05K3/284 , H05K3/301 , H05K3/3447 , H05K2201/0187 , H05K2201/0209 , H05K2201/0394 , H05K2201/062 , H05K2201/09045 , H05K2201/09063 , H05K2201/09118 , H05K2201/09972 , H05K2201/2036 , H05K2203/1316
摘要： In a lead frame board, while a heat radiation wall member formed by a resin having a relatively high thermal conductivity is provided in a low heat-resistance heat generating component mounting region where a low heat-resistance heat generating component is mounted, heat block wall members formed by resins having relatively low thermal conductivities are provided in a high heat-resistance heat generating component mounting region where a high heat-resistance heat generating component is mounted and in a non-heat generating component mounting region where a non-heat generating component is mounted. Thus, heat block is performed between the low heat-resistance heat generating component mounting region and the high heat-resistance heat generating component mounting region and non-heat generating component mounting region, and a heat radiation function is enhanced in the low heat-resistance heat generating component.
摘要翻译： 在引线框架板中，在安装有低耐热性发热部件的低耐热发热部件安装区域中设置由具有较高导热性的树脂形成的散热壁部件，但是热阻壁 在具有较高耐热发热部件的高耐热发热部件安装区域和非发热部件安装区域中设置具有较低热导率的树脂构成的部件， 被安装。 因此，在低耐热性发热部件安装区域和高耐热发热部件安装区域和非发热部件安装区域之间进行热阻，并且在低耐热性下提高散热功能 发热部件。
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公开(公告)号：US07134882B2
公开(公告)日：2006-11-14
申请号：US10541038
申请日：2004-08-24
申请人： Mitsuru Iida , Mitsutaka Abe , Hidetaka Mori
发明人： Mitsuru Iida , Mitsutaka Abe , Hidetaka Mori
IPC分类号： H01R12/00
CPC分类号： H05K1/119 , H01R13/66 , H01R29/00 , H05K1/0284 , H05K1/141 , H05K1/183 , H05K3/403 , H05K2201/09045 , H05K2201/09118 , H05K2201/10189
摘要： In a connector with a component built-in, a base member is formed of three-dimensional formation circuit substrate, and has a fitting portion that is to be fitted to a connector of counterpart. Terminals electrically connected to a wiring pattern on a mother board, contacts electrically connected to contacts of the connector of counterpart, and a conductive pattern electrically connected to the electronic component are formed on a surface of the base member. Thus, the conductive pattern can easily be modified depending on application, and it is possible to provide complicated wirings. Furthermore, since the electronic component is mounted on the base member, it is possible to make the connector embed a lot of electronic components, and degrees of freedom of design are increased. Still furthermore, the electronic component can be connected by reflow soldering, so that mounting workability of the electronic component is increased.
摘要翻译： 在具有内置部件的连接器中，基部构件由三维形成电路基板形成，并且具有拟配合到对应件的连接器的装配部分。 电连接到母板上的布线图案的端子形成在电连接到对应物的连接器的触点的触点上，并且电连接到电子部件的导电图案形成在基底构件的表面上。 因此，可以根据应用容易地改变导电图案，并且可以提供复杂的布线。 此外，由于电子部件安装在基座部件上，因此能够使连接器嵌入大量的电子部件，能够提高设计自由度。 此外，可以通过回流焊接来连接电子部件，从而提高电子部件的安装加工性。
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94.发明申请公开(公告)号：US20060200958A1
公开(公告)日：2006-09-14
申请号：US11430152
申请日：2006-05-08
申请人： L. deRochemont , Peter Farmer
发明人： L. deRochemont , Peter Farmer
CPC分类号： H01L21/4807 , B32B15/00 , H01L21/4857 , H01L23/142 , H01L23/3677 , H01L23/3735 , H01L23/49822 , H01L23/49833 , H01L23/642 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2221/68377 , H01L2224/16 , H01L2224/16225 , H01L2224/45147 , H01L2224/48472 , H01L2224/49175 , H01L2924/01039 , H01L2924/01057 , H01L2924/01077 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/3025 , H01L2924/3511 , H05K1/0207 , H05K1/0271 , H05K1/0272 , H05K1/0306 , H05K3/0061 , H05K3/202 , H05K3/38 , H05K3/4007 , H05K3/46 , H05K3/4629 , H05K3/4641 , H05K2201/0355 , H05K2201/09118 , H05K2203/0369 , H05K2203/1476 , Y10S428/901 , Y10T29/43 , Y10T29/49128 , Y10T29/4913 , Y10T29/49146 , Y10T29/49169 , Y10T29/49171 , Y10T428/24917 , H01L2924/00 , H01L2924/00014
摘要： Method of manufacture of a composite wiring structure for use with at least one semiconductor device, the structure having a first conductive member upon which the semiconductor device can be mounted for electrical connection thereto. A dielectric member, made of ceramic or organo-ceramic composite material, is bonded to the first conductive member and contains embedded therein a conductive network and a thermal distribution network. A second conductive member may be incorporated with the composite wiring structure, with a capacitor electrically connected between the conductive network and the second conductive member. Bonding between the dielectric member and the conductive members may be in the form of a direct covalent bond formed at a temperature insufficient to adversely effect the structural integrity of the conductive network and the thermal distribution network.
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95.发明授权Method of manufacture of ceramic composite wiring structures for semiconductor devices 失效半导体器件陶瓷复合布线结构的制造方法公开(公告)号：US07047637B2
公开(公告)日：2006-05-23
申请号：US10824723
申请日：2004-04-15
CPC分类号： H01L21/4807 , B32B15/00 , H01L21/4857 , H01L23/142 , H01L23/3677 , H01L23/3735 , H01L23/49822 , H01L23/49833 , H01L23/642 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2221/68377 , H01L2224/16 , H01L2224/16225 , H01L2224/45147 , H01L2224/48472 , H01L2224/49175 , H01L2924/01039 , H01L2924/01057 , H01L2924/01077 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/3025 , H01L2924/3511 , H05K1/0207 , H05K1/0271 , H05K1/0272 , H05K1/0306 , H05K3/0061 , H05K3/202 , H05K3/38 , H05K3/4007 , H05K3/46 , H05K3/4629 , H05K3/4641 , H05K2201/0355 , H05K2201/09118 , H05K2203/0369 , H05K2203/1476 , Y10S428/901 , Y10T29/43 , Y10T29/49128 , Y10T29/4913 , Y10T29/49146 , Y10T29/49169 , Y10T29/49171 , Y10T428/24917 , H01L2924/00 , H01L2924/00014
摘要： Method of manufacture of a composite wiring structure for use with at least one semiconductor device, the structure having a first conductive member upon which the semiconductor device can be mounted for electrical connection thereto. A dielectric member, made of ceramic or organo-ceramic composite material, is bonded to the first conductive member and contains embedded therein a conductive network and a thermal distribution network. A second conductive member may be incorporated with the composite wiring structure, with a capacitor electrically connected between the conductive network and the second conductive member. Bonding between the dielectric member and the conductive members may be in the form of a direct covalent bond formed at a temperature insufficient to adversely effect the structural integrity of the conductive network and the thermal distribution network.
摘要翻译： 一种与至少一个半导体器件一起使用的复合布线结构的制造方法，该结构具有第一导电部件，半导体器件可以安装在该第一导电部件上以与其电连接。 由陶瓷或有机陶瓷复合材料制成的电介质构件被结合到第一导电构件并且包含嵌入其中的导电网络和热分配网络。 第二导电构件可以与复合布线结构结合，电容器电连接在导电网络和第二导电构件之间。 电介质构件和导电构件之间的接合可以是在不足以不利地影响导电网络和热分布网络的结构完整性的温度下形成的直接共价键的形式。
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公开(公告)号：US07026012B2
公开(公告)日：2006-04-11
申请号：US10081768
申请日：2002-02-22
申请人： William T. Chen , Peter M. Moran
发明人： William T. Chen , Peter M. Moran
CPC分类号： C25D5/02 , C23C18/1608 , C23C18/2033 , C23C18/30 , C25D5/56 , H01L2251/105 , H05K3/107 , H05K3/182 , H05K2201/09118 , H05K2203/0108 , H05K2203/0709
摘要： A method of forming a metallic feature on a substrate, comprising the steps of: providing a stamp having a raised region; depositing catalytic particles on a selected area of the stamp, including the raised region thereof; providing a substrate; applying the stamp to the substrate, such that the raised region of the stamp causes a corresponding indented region in the substrate and at least some of the catalytic particles are transferred to a selected area of the substrate; and plating the selected area of the substrate.
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公开(公告)号：US20060042827A1
公开(公告)日：2006-03-02
申请号：US10933009
申请日：2004-09-02
申请人： Wai Chou , Kunquan Sun , Jiaxian Wang , Yanbing Yu , Meng Zhao
发明人： Wai Chou , Kunquan Sun , Jiaxian Wang , Yanbing Yu , Meng Zhao
CPC分类号： H05K1/141 , G06K19/077 , H05K1/0284 , H05K1/0298 , H05K1/117 , H05K1/183 , H05K2201/09018 , H05K2201/09118
摘要： The specification describes PDA (SD/MMC) devices and PDA cards wherein the substrate on which the PDA components are mounted comprises two tiers. Components with a high profile are mounted on the lower tier, and devices with normal or low heights are mounted on the upper tier. The upper tier is contained in the portion of the card conforming to, for example, the 1.4 mm SDA standard thickness, while the lower tier is formed in the portion of the card that allows a larger thickness, for example SDA standard thickness 2.1 mm.
摘要翻译： 本说明书描述了PDA（SD / MMC）设备和PDA卡，其中安装有PDA组件的基板包括两层。 具有高外形的部件安装在下层上，正常或低高度的装置安装在上层。 上层包含在符合例如1.4mm SDA标准厚度的卡的部分中，而下层形成在允许更大厚度的卡片部分中，例如SDA标准厚度2.1mm。
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公开(公告)号：US20060027448A1
公开(公告)日：2006-02-09
申请号：US11192457
申请日：2005-07-28
IPC分类号： H01H9/00
CPC分类号： B60Q5/003 , B60Q1/0082 , B60R21/2037 , B60R21/21658 , B62D1/046 , H05K1/0284 , H05K1/0373 , H05K3/185 , H05K3/381 , H05K2201/0236 , H05K2201/09118 , H05K2201/10053 , H05K2203/095 , H05K2203/107
摘要： A Gas bag module for use in a vehicle occupant restraint device has a plastic generator support. On the generator support a printed circuit is formed by metal deposition. For activating an electrical function element, the printed circuit cooperates with a switching element that is arranged on a section of the generator support.
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公开(公告)号：US20060024005A1
公开(公告)日：2006-02-02
申请号：US11236123
申请日：2005-09-26
申请人： Donald Ice , Stephen Nelson , Darin Douma
发明人： Donald Ice , Stephen Nelson , Darin Douma
IPC分类号： G02B6/36
CPC分类号： H05K3/3405 , G02B6/4201 , G02B6/4245 , G02B6/4246 , G02B6/4255 , G02B6/4292 , H01R13/6315 , H05K1/0278 , H05K1/141 , H05K3/202 , H05K3/3447 , H05K2201/0394 , H05K2201/049 , H05K2201/09118 , H05K2201/10121 , H05K2201/10446 , H05K2201/10757 , H05K2201/10924 , H05K2203/302
摘要： An optical transceiver module having a plurality of optical subassemblies and a printed circuit board is disclosed. The transceiver module includes lead frame connectors for connecting the optical subassemblies to the printed circuit board. The lead frame connectors include a stamped and bent conductive lead structure that is encased in an insert injection molded plastic casing. The plastic casing provides electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. The lead frame connectors connect to the leads associated with the optical subassemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical subassembly and the printed circuit board. The lead frame assemblies are generally more reliable and less expensive than using flexible printed circuit board structures to establish electrical connectivity between optical subassemblies and transceiver printed circuit boards.
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公开(公告)号：US20050239342A1
公开(公告)日：2005-10-27
申请号：US10506019
申请日：2003-10-24
CPC分类号： H05K3/202 , F21K9/00 , F21Y2105/10 , F21Y2115/10 , H05K1/0287 , H05K1/0393 , H05K3/326 , H05K2201/0394 , H05K2201/0397 , H05K2201/09118 , H05K2201/10106 , Y10S362/80
摘要： The present invention provides a light emitting module, comprising: a plurality of thin plate-shaped conductors (2) spaced apart from each other in a first direction; at least one light source (4) connected between at least one pair of adjoining ones of said conductors; and at least one insulating joint member (4) for mechanically joining said plurality of conductors, wherein said at least one insulating joint member exposes both sides of at least a portion of said conductors where said light source is mounted.
摘要翻译： 本发明提供了一种发光模块，包括：在第一方向上彼此间隔开的多个薄板状导体（2）; 至少一个光源（4），连接在至少一对相邻的所述导体之间; 以及用于机械地连接所述多个导体的至少一个绝缘接合构件（4），其中所述至少一个绝缘接合构件暴露所述导体的至少一部分的所述光源安装的两侧。
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