公开(公告)号：US20140209366A1

公开(公告)日：2014-07-31

申请号：US14167280

申请日：2014-01-29

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Kazuyuki Kubota ,  Tomoharu Fujii

IPC: H05K1/18

CPC classification number: H01L23/50 ,  H01L23/58 ,  H01L25/105 ,  H01L2224/16237 ,  H01L2924/15321 ,  H05K1/0271 ,  H05K1/16 ,  H05K1/185 ,  H05K3/108 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/462 ,  H05K3/4644 ,  H05K2201/0162 ,  H05K2201/0187 ,  H05K2201/0195 ,  H05K2201/0218 ,  H05K2201/0355 ,  H05K2201/09536 ,  H05K2201/10037 ,  H05K2201/10151 ,  H05K2203/1461 ,  H05K2203/1469

Abstract: There is provided a wiring board. The wiring board includes: a first insulating layer; a secondary battery on one surface of the first insulating layer; a second insulating layer formed on the secondary battery; a third insulating layer covering the second insulating layer; a first wiring layer on one surface of the third insulating layer; and a via electrically connecting the first wiring layer to an electrode of the secondary battery. A rigidity of the second insulating layer is lower than those of the first and third insulating layers.

Abstract translation: 提供了一个接线板。 布线板包括：第一绝缘层; 在所述第一绝缘层的一个表面上的二次电池; 形成在二次电池上的第二绝缘层; 覆盖所述第二绝缘层的第三绝缘层; 在所述第三绝缘层的一个表面上的第一布线层; 以及将第一布线层电连接到二次电池的电极的通孔。 第二绝缘层的刚性低于第一绝缘层和第三绝缘层的刚性。

公开(公告)号：US20140202742A1

公开(公告)日：2014-07-24

申请号：US14161310

申请日：2014-01-22

Applicant: CAMBRIOS TECHNOLOGIES CORPORATION

Inventor： David Jones ,  Paul Mansky ,  Michael A. Spaid

IPC: H05K1/02 ,  H05K3/02

CPC classification number: H05K3/027 ,  B23K26/0006 ,  B23K26/0619 ,  B23K26/18 ,  B23K26/355 ,  B23K2101/34 ,  B23K2101/40 ,  B23K2103/56 ,  G06F3/044 ,  G06F2203/04103 ,  H01L31/1884 ,  H05K1/0326 ,  H05K1/0393 ,  H05K1/097 ,  H05K1/144 ,  H05K2201/0108 ,  H05K2201/0112 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0162 ,  H05K2201/026 ,  H05K2201/043 ,  H05K2203/108 ,  H05K2203/1142 ,  H05K2203/1572 ,  Y02E10/50

Abstract: Disclosed herein are double-sided transparent conductive films suitable for patterning by laser ablation.

Abstract translation: 本文公开了适用于通过激光烧蚀进行图案化的双面透明导电膜。

公开(公告)号：US08771805B2

公开(公告)日：2014-07-08

申请号：US11270907

申请日：2005-11-10

Applicant: Lucien D. Laude ,  Robert J. Greenberg

Inventor： Lucien D. Laude ,  Robert J. Greenberg

IPC: B05D1/18 ,  B05D3/00 ,  B05D3/06

CPC classification number: H05K3/185 ,  C08J7/12 ,  C08J2383/04 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1657 ,  C23C18/204 ,  C23C18/206 ,  H05K3/28 ,  H05K3/387 ,  H05K2201/0133 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2203/107 ,  H05K2203/1105 ,  Y10T428/26 ,  Y10T428/31663

Abstract: The present invention provides a process for embedding at least one layer of at least one metal trace in a silicone-containing polymer, comprising: a) applying a polymer layer on a substrate; b) thermally treating the polymer; c) irradiating at least one surface area of the polymer with a light beam emitted by an excimer laser; d) immersing the irradiated polymer in at least one autocatalytic bath containing ions of at least one metal, and metallizing the polymer; e) thermally treating the metallized polymer; f) applying a polymer layer covering the thermally treated metallized polymer; and g) thermally treating the metallized covered polymer. The present invention further provides a polymer layer comprising silicone containing oxide particles of SiO2, TiO2, Sb2O3, SnO2, Al2O3, ZnO, Fe2O3, Fe3O4, talc, hydroxyapatite or mixtures thereof and at least one metal trace embedded in said polymer layer.The present invention further provides a flexible electrode array comprising silicone containing oxide particles of SiO2, TiO2, Sb2O3, SnO2, Al2O3, ZnO, Fe2O3, Fe3O4, talc, hydroxyapatite or mixtures thereof and at least one metal trace embedded in said polymer layer.

Abstract translation: 本发明提供了一种在含硅酮聚合物中嵌入至少一层至少一种金属痕迹的方法，包括：a）在基底上施加聚合物层; b）热处理聚合物; c）用由准分子激光器发射的光束照射所述聚合物的至少一个表面积; d）将经辐射的聚合物浸入至少一种含有至少一种金属的离子的自催化浴中，并对聚合物进行金属化; e）热处理金属化聚合物; f）涂覆覆盖热处理的金属化聚合物的聚合物层; 和g）热处理金属化被覆聚合物。 本发明还提供一种聚合物层，其包含含硅氧烷的SiO 2，TiO 2，Sb 2 O 3，SnO 2，Al 2 O 3，ZnO，Fe 2 O 3，Fe 3 O 4，滑石，羟基磷灰石或其混合物的氧化物颗粒，以及嵌入所述聚合物层中的至少一种金属迹线。 本发明还提供一种柔性电极阵列，其包括含硅氧烷的SiO 2，TiO 2，Sb 2 O 3，SnO 2，Al 2 O 3，ZnO，Fe 2 O 3，Fe 3 O 4，滑石，羟基磷灰石或其混合物的氧化物颗粒和嵌入所述聚合物层中的至少一种金属迹线。

公开(公告)号：US20140085884A1

公开(公告)日：2014-03-27

申请号：US14037614

申请日：2013-09-26

Applicant: ROHM CO., LTD.

Inventor： Tomoharu Horio ,  Teruki Ono

IPC: F21K99/00

CPC classification number: F21K9/232 ,  F21K9/238 ,  F21S8/026 ,  F21V3/02 ,  F21V15/00 ,  F21V23/002 ,  F21V23/006 ,  F21V29/74 ,  F21V29/89 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/644 ,  H01L2224/48137 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H05K1/0373 ,  H05K3/282 ,  H05K2201/0162 ,  H05K2201/2054 ,  H01L2924/00012

Abstract: An LED lighting apparatus is disclosed. The LED lighting apparatus includes a board having a principal surface, a plurality of LED chips mounted on the principal surface of the board, and a wiring pattern which is formed on the principal surface of the board and makes electrical conduction with the plurality of LED chips. Further, the LED lighting apparatus includes a frame-like bank which is provided on the principal surface of the board and surrounds the plurality of LED chips. In this case, the wiring pattern has one or more pads having a first portion interposed between the bank and the plurality of LED chips. The LED lighting apparatus further includes a protective layer covering at least a portion of the pads.

Abstract translation: 公开了一种LED照明装置。 LED照明装置包括：具有主面的基板，安装在基板的主面上的多个LED芯片;以及形成在基板的主面上并与多个LED芯片导通的布线图案 。 此外，LED照明装置包括设置在基板的主面上且围绕多个LED芯片的框状的堤。 在这种情况下，布线图案具有一个或多个衬垫，该衬垫具有介于衬底和多个LED芯片之间的第一部分。 LED照明装置还包括覆盖至少一部分垫的保护层。

公开(公告)号：US20140054632A1

公开(公告)日：2014-02-27

申请号：US13968967

申请日：2013-08-16

Applicant: SHAT-R-SHIELD, INC.

Inventor： Robert J. Nolan ,  Jeffery D. Harman, SR.

IPC: H01L33/52

CPC classification number: H01L33/52 ,  H01L33/44 ,  H01L51/5253 ,  H01L2933/0025 ,  H05K3/284 ,  H05K2201/0162 ,  H05K2201/10106 ,  H05K2203/1366

Abstract: A silicone protective coating for an electronic light source and a method for applying the coating over an exposed or outer surface of the electronic light source assembled as part of or mounted to a circuit board or other substrate.

Abstract translation: 一种用于电子光源的硅氧烷保护涂层，以及将该涂层涂覆在电子光源的暴露或外表面上，作为电路板或其他基板的一部分或安装在电路板或其他基板上的方法。

公开(公告)号：US20130251978A1

公开(公告)日：2013-09-26

申请号：US13847457

申请日：2013-03-19

Applicant: IMEC ,  ST. PETERSBURG ELECTROTECHNICAL UNIVERSITY

Inventor： Victor Luchinin ,  Svetlana Goloudina ,  Vyacheslav Pasyuta ,  Alexey Ivanov ,  Mikhail Baklanov ,  Mikhail Krishtab

IPC: B32B37/15

CPC classification number: B32B37/15 ,  B05D1/20 ,  B05D1/208 ,  B32B18/00 ,  B32B27/04 ,  B32B27/281 ,  B32B2260/046 ,  B32B2305/026 ,  B32B2305/07 ,  B32B2307/00 ,  B32B2307/204 ,  B32B2379/08 ,  B32B2457/00 ,  C08G73/1067 ,  C09D179/08 ,  H01L21/02285 ,  H01L21/02318 ,  H05K1/03 ,  H05K3/143 ,  H05K2201/01 ,  H05K2201/0104 ,  H05K2201/0116 ,  H05K2201/0154 ,  H05K2201/0162 ,  Y10T428/249979 ,  Y10T428/249991 ,  C08K5/175

Abstract: Method for pore sealing a porous substrate, comprising: forming a continuous monolayer of a polyimide precursor on a liquid surface, transferring said polyimide precursor monolayer onto the porous substrate with the Langmuir-Blodgett technique, and imidization of the transferred polyimide precursor monolayers, thereby forming a polyimide sealing layer on the porous substrate. Porous substrate having at least one surface on which a sealing layer is provided to seal pores of the substrate, wherein the sealing layer is a polyimide having a thickness of a few monolayers and wherein there is no penetration of the polyimide into the pores.

Abstract translation: 用于孔密封多孔基材的方法，包括：在液体表面上形成聚酰亚胺前体的连续单层，使用Langmuir-Blodgett技术将所述聚酰亚胺前体单层转移到多孔基材上，并将转移的聚酰亚胺前体单层酰亚胺化，从而形成 多孔基材上的聚酰亚胺密封层。 具有至少一个表面的多孔基材，其上设有密封层以密封基材的孔，其中密封层是具有几个单层厚度的聚酰亚胺，并且其中聚酰亚胺不渗透到孔中。

公开(公告)号：US08268940B2

公开(公告)日：2012-09-18

申请号：US12530152

申请日：2008-03-06

Applicant: Akira Mori ,  Kiwamu Tokuhisa ,  Kazuhiko Nakahara ,  Masashi Kaji

Inventor： Akira Mori ,  Kiwamu Tokuhisa ,  Kazuhiko Nakahara ,  Masashi Kaji

IPC: C08L63/00 ,  C08L79/08 ,  C08L83/10 ,  B32B27/28 ,  B32B27/38

CPC classification number: C08G59/4284 ,  C08G59/04 ,  C08G59/245 ,  C08G73/106 ,  C08L63/00 ,  C08L2666/14 ,  C08L2666/22 ,  C09J163/00 ,  C09J179/08 ,  C09J183/10 ,  H05K3/386 ,  H05K2201/0162

Abstract: Disclosed is a halogen- and phosphorus-free flame-retardant adhesive resin composition which can be used in heat contact bonding of adherends at or below 250° C. and is excellent in heat resistance, solder heat resistance after moisture absorption, and processability. Also disclosed is an adhesive film produced from said composition. The flame-retardant adhesive resin composition comprises 65-98% by weight of a silicone unit-containing polyimide resin and 2-35% by weight of an epoxy resin having an acenaphthylene-substituted naphthalene skeleton. The adhesive film produced from the flame-retardant adhesive resin composition is suitable as an adhesive for a laminate for a multiplayer printed circuit board substrate, an adhesive for a hybrid circuit board substrate, and an adhesive for a coverlay film.

Abstract translation: 公开了一种无卤阻燃粘合树脂组合物，其可用于250℃以下的被粘物的热接触粘合，耐热性，吸湿后的耐焊锡性，加工性优异。 还公开了由所述组合物制备的粘合膜。 阻燃性粘合剂树脂组合物包含65-98重量％的含硅氧烷单元的聚酰亚胺树脂和2-35重量％的具有苊烯取代的萘骨架的环氧树脂。 由阻燃粘合树脂组合物制成的粘合膜适用于多层印刷电路板基板，混合电路板基板用粘合剂和覆盖膜用粘合剂的粘合剂。

公开(公告)号：US20120211268A1

公开(公告)日：2012-08-23

申请号：US13400072

申请日：2012-02-19

Applicant: Izhar HALAHMI ,  Ron Helfan ,  Slava Hasin

Inventor： Izhar HALAHMI ,  Ron Helfan ,  Slava Hasin

IPC: H05K1/18 ,  H05K3/00 ,  H05K1/00

CPC classification number: H05K1/053 ,  H05K1/0306 ,  H05K1/036 ,  H05K1/056 ,  H05K3/386 ,  H05K3/388 ,  H05K2201/0162 ,  H05K2201/10106 ,  H05K2201/10143 ,  H05K2203/0315 ,  Y10T29/49124

Abstract: A light and heat resistant circuit board apparatus LHRPCB, comprising: at least one thermally conductive material (TCM) layer adapted to serve as a mechanical and thermal substrate for the LHRPCB; at least one layer of electrically isolating material (EIM) configurable on respective TCM layers, the at least one EIM layer being resistant to UV radiation; at least one electrically conducting layer (ECL) layer configurable above the at least one TCM layer and adapted to be patterned and to selectively conduct electrical current; at least one heat and UV radiation resistant bonding layer (HUVRBL) appliable between respective ECL, TCM, and EIM layers; and at least one electronic component mountable upon the at least one ECL layer, wherein the LHRPCB is adapted to be exposed to light and heat for an extended period.

Abstract translation: 一种耐热耐热电路板装置LHRPCB，包括：至少一个适于用作LHRPCB的机械和热衬底的导热材料（TCM）层; 至少一层电绝缘材料（EIM）可配置在相应的TCM层上，所述至少一个EIM层耐UV辐射; 至少一个导电层（ECL）层，其可配置在所述至少一个TCM层上方，并适于被图案化并选择性地导通电流; 至少一个耐辐射和耐紫外线的结合层（HUVRBL）可应用于相应的ECL，TCM和EIM层之间; 以及至少一个可安装在所述至少一个ECL层上的电子部件，其中所述LHRPCB适于长时间暴露于光和热。

公开(公告)号：US08115322B2

公开(公告)日：2012-02-14

申请号：US12874945

申请日：2010-09-02

Applicant: Motohiro Arifuku ,  Itsuo Watanabe ,  Kouji Motomura ,  Kouji Kobayashi ,  Yasushi Gotoh ,  Tohru Fujinawa

Inventor： Motohiro Arifuku ,  Itsuo Watanabe ,  Kouji Motomura ,  Kouji Kobayashi ,  Yasushi Gotoh ,  Tohru Fujinawa

IPC: C09J9/02 ,  C09J4/06 ,  H01B1/20 ,  H05K3/36 ,  H05K3/32 ,  H01L21/60

CPC classification number: H01L24/83 ,  C09J4/06 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0162 ,  H05K2201/0212 ,  Y10T428/2826 ,  Y10T428/2852 ,  H01L2924/00

Abstract: This invention provides a wiring-terminal-connecting adhesive comprising a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles, and a wiring-terminal-connecting method and a wiring structure which make use of such an adhesive.

Abstract translation: 本发明提供了一种接线端子连接粘合剂，其包括在加热时能够产生自由基的固化剂，可自由基聚合的物质和硅氧烷颗粒，以及使用这种粘合剂的接线端子连接方法和布线结构 。

公开(公告)号：US08098045B2

公开(公告)日：2012-01-17

申请号：US12107294

申请日：2008-04-22

Applicant: Fumitaka Okano

Inventor： Fumitaka Okano

IPC: H02J7/00 ,  H01M2/10

CPC classification number: H05K3/305 ,  H05K3/3421 ,  H05K2201/0162 ,  H05K2201/10446 ,  Y02P70/613 ,  Y10T29/49002

Abstract: A connector device includes a circuit board and a connector body, and the connector body includes a housing and a connection terminal provided inside the housing. A silicon resin is applied to fill a gap between the connector body and the circuit board. The application of the silicon resin can prevent a mold resin used to seal the connector device and a battery pack body from entering from the gap into the housing. Thereby, a connector device reliably establishing conduction and a battery pack applying such a connector device can be obtained.

Abstract translation: 连接器装置包括电路板和连接器主体，连接器本体包括壳体和设置在壳体内部的连接端子。 施加硅树脂以填充连接器主体和电路板之间的间隙。 硅树脂的应用可以防止用于密封连接器装置的模具树脂和电池组体从间隙进入壳体。 因此，可以获得可靠地建立导通的连接器装置和应用这种连接器装置的电池组。