公开(公告)号：US08513799B2

公开(公告)日：2013-08-20

申请号：US12384868

申请日：2009-04-09

Applicant: Joseph Fjelstad

Inventor： Joseph Fjelstad

IPC: H01L23/48

CPC classification number: H01L23/49811 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/72 ,  H01L2224/11 ,  H01L2224/11003 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T29/49126 ,  H01L2224/29099 ,  H01L2924/00

Abstract: A microelectronic unit can include a support structure including a dielectric having oppositely-directed first and second surfaces. A plurality of substantially rigid posts can protrude parallel to one another in a direction beyond the first surface of the support structure. Each post may have a top surface remote from the support structure, and the top surfaces can be substantially coplanar with one another. A microelectronic device having a surface with bond pads can overlie the second surface of the support structure with the bond pad-bearing surface of the microelectronic device facing toward the support structure. Connections can electrically connect the posts with the bond pads.

公开(公告)号：US08338925B2

公开(公告)日：2012-12-25

申请号：US12974744

申请日：2010-12-21

Applicant: Joseph Fjelstad ,  Konstantine Karavakis

Inventor： Joseph Fjelstad ,  Konstantine Karavakis

IPC: H01L23/495 ,  H01L23/48 ,  H01L23/29

CPC classification number: H01L23/3114 ,  H01L23/3121 ,  H01L23/4951 ,  H01L23/498 ,  H01L23/525 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/72 ,  H01L24/82 ,  H01L24/94 ,  H01L2224/0231 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/16 ,  H01L2224/24011 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/274 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/85424 ,  H01L2924/00011 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/48824 ,  H01L2924/00 ,  H01L2924/01004

Abstract: A compliant semiconductor chip package assembly includes a semiconductor chip having a plurality of chip contacts, and a compliant layer having a top surface, a bottom surface and sloping peripheral edges, whereby the bottom surface of the compliant layer overlies a surface of the semiconductor chip. The assembly also includes a plurality of electrically conductive traces connected to the chip contacts of the semiconductor chip, the traces extending along the sloping edges to the top surface of the compliant layer. The assembly may include conductive terminals overlying the semiconductor chip, with the compliant layer supporting the conductive terminals over the semiconductor chip. The conductive traces have first ends electrically connected with the contacts of the semiconductor chip and second ends electrically connected with the conductive terminals. The conductive terminals are movable relative to the semiconductor chip.

Abstract translation: 兼容的半导体芯片封装组件包括具有多个芯片触点的半导体芯片和具有顶表面，底表面和倾斜周边边缘的柔性层，由此柔性层的底表面覆盖在半导体芯片的表面上。 组件还包括连接到半导体芯片的芯片触点的多个导电迹线，迹线沿倾斜边缘延伸到柔性层的顶表面。 组件可以包括覆盖半导体芯片的导电端子，其中柔性层将导电端子支撑在半导体芯片上。 导电迹线具有与半导体芯片的触点电连接的第一端和与导电端子电连接的第二端。 导电端子可相对于半导体芯片移动。

公开(公告)号：US08114711B2

公开(公告)日：2012-02-14

申请号：US12383293

申请日：2009-03-23

Applicant: Joseph Fjelstad

Inventor： Joseph Fjelstad

IPC: H01L21/00

CPC classification number: H01L23/49811 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/72 ,  H01L2224/11 ,  H01L2224/11003 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T29/49126 ,  H01L2224/29099 ,  H01L2924/00

Abstract: A method of treating a component can include providing a component including a plurality of metallic posts extending generally parallel to one another. The providing step can be performed so that the posts have solder on the tips of the posts but not covering other portions of the posts. The method can include reflowing the solder provided on the posts so that the solder coats the posts. The providing step may be performed so that, prior to the reflowing step, the solder covers only the tips of the posts. The providing step can include depositing portions of the solder on a surface of a metallic sheet and etching the sheet from the surface. The plurality of posts may comprise elongated posts.

Abstract translation: 处理部件的方法可以包括提供包括大致平行彼此延伸的多个金属柱的部件。 可以执行提供步骤，使得柱在柱的尖端上具有焊料，但不覆盖柱的其他部分。 该方法可以包括回流设置在柱上的焊料，使得焊料涂覆在柱上。 可以执行提供步骤，使得在回流步骤之前，焊料仅覆盖柱的尖端。 提供步骤可以包括在金属片的表面上沉积焊料的一部分并从表面上蚀刻片。 多个柱可以包括细长的柱。

公开(公告)号：US07528008B2

公开(公告)日：2009-05-05

申请号：US11602034

申请日：2006-11-20

Applicant: Joseph Fjelstad

Inventor： Joseph Fjelstad

IPC: H01L21/44

CPC classification number: H01L23/49811 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/72 ,  H01L2224/11 ,  H01L2224/11003 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T29/49126 ,  H01L2224/29099 ,  H01L2924/00

Abstract: A method of electrically connecting a microelectronic component having a first surface bearing a plurality of contacts. The method including the steps of forming a subassembly by juxtaposing a connection component having a support structure and a plurality of elongated posts extending substantially parallel to one another from a first surface of the support structure with the microelectronic component so that the support structure overlies the surface of the component with the posts extending away from the component and electrically connecting the posts to the contacts of the microelectronic component.

公开(公告)号：US20070046889A1

公开(公告)日：2007-03-01

申请号：US11508451

申请日：2006-08-23

Applicant: Kenneth Miller ,  Michael Fjelstad ,  Joseph Fjelstad

Inventor： Kenneth Miller ,  Michael Fjelstad ,  Joseph Fjelstad

IPC: G02C11/08

CPC classification number: G02C3/003 ,  G02C5/00 ,  G02C5/143 ,  G02C5/16 ,  G02C11/02 ,  G02C2200/02

Abstract: An eyewear assembly having flexible temple elements with counterweights is disclosed. The counterweights and flexible temples can serve several other purposes aside from the disclosed role of supporting eyewear on a wearer's face. Those purposes include ornamental elegance in design and facilitating a natural adjustability around unique personal features for position and comfort. The flexible temple elements provide mechanisms for transmitting electrical, mechanical and photonic power and or signals to the eyewear while the counterweights provide the source for said transmissions from a more convenient location.

Abstract translation: 公开了一种具有配重的柔性镜腿元件的眼镜组件。 除了在佩戴者的脸上支撑眼镜的公开角色之外，配重和灵活的寺庙也可以服务于其他几个目的。 这些目的包括装饰优雅的设计，并促进围绕独特的个人特征的位置和舒适度的自然可调性。 柔性镜腿元件提供用于将电，机械和光子功率和/或信号传输到眼镜的机构，而配重从更方便的位置提供用于所述传输的源。

公开(公告)号：US07138299B2

公开(公告)日：2006-11-21

申请号：US10980381

申请日：2004-11-03

Applicant: Joseph Fjelstad

Inventor： Joseph Fjelstad

IPC: H01L21/44 ,  H01R9/09

CPC classification number: H01L23/49811 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/72 ,  H01L2224/11 ,  H01L2224/11003 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T29/49126 ,  H01L2224/29099 ,  H01L2924/00

Abstract: A method of electrically connecting a microelectronic component having a first surface bearing a plurality of contacts. The method including the steps of forming a subassembly by juxtaposing a connection component having a support structure and a plurality of elongated posts extending substantially parallel to one another from a first surface of the support structure with the microelectronic component so that the support structure overlies the surface of the component with the posts extending away from the component and electrically connecting the posts to the contacts of the microelectronic component.

公开(公告)号：US20060237836A1

公开(公告)日：2006-10-26

申请号：US11474199

申请日：2006-06-23

Applicant: Joseph Fjelstad ,  Konstantine Karavakis

Inventor： Joseph Fjelstad ,  Konstantine Karavakis

IPC: H01L23/52

CPC classification number: H01L23/3114 ,  H01L23/3121 ,  H01L23/4951 ,  H01L23/498 ,  H01L23/525 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/72 ,  H01L24/82 ,  H01L24/94 ,  H01L2224/0231 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/16 ,  H01L2224/24011 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/274 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/85424 ,  H01L2924/00011 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/48824 ,  H01L2924/00 ,  H01L2924/01004

Abstract: A compliant semiconductor chip package assembly includes a a semiconductor chip having a plurality of chip contacts, and a compliant layer having a top surface, a bottom surface and sloping peripheral edges, whereby the bottom surface of the compliant layer overlies a surface of the semiconductor chip. The assembly also includes a plurality of electrically conductive traces connected to the chip contacts of the semiconductor chip, the traces extending along the sloping edges to the top surface of the compliant layer. The assembly may include conductive terminals overlying the semiconductor chip, with the compliant layer supporting the conductive terminals over the semiconductor chip. The conductive traces have first ends electrically connected with the contacts of the semiconductor chip and second ends electrically connected with the conductive terminals. The conductive terminals are movable relative to the semiconductor chip.

Abstract translation: 兼容的半导体芯片封装组件包括具有多个芯片触点的半导体芯片和具有顶表面，底表面和倾斜周边边缘的柔性层，由此柔性层的底表面覆盖在半导体芯片的表面上。 组件还包括连接到半导体芯片的芯片触点的多个导电迹线，迹线沿倾斜边缘延伸到柔性层的顶表面。 组件可以包括覆盖半导体芯片的导电端子，其中柔性层将导电端子支撑在半导体芯片上。 导电迹线具有与半导体芯片的触点电连接的第一端和与导电端子电连接的第二端。 导电端子可相对于半导体芯片移动。

公开(公告)号：US07049929B1

公开(公告)日：2006-05-23

申请号：US10136964

申请日：2002-05-01

Applicant: Joseph Fjelstad

Inventor： Joseph Fjelstad

IPC: H01C1/012

CPC classification number: H01C17/065 ,  H01C7/005 ,  H05K1/115 ,  H05K1/167 ,  H05K3/4076 ,  H05K2201/0317 ,  H05K2201/0338 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2203/0733

Abstract: Circuit panels are provided with resistors in vias extending between the top and bottom surfaces of the panels. The resistors may be formed by depositing a composite in each via, as by depositing a dispersion of a conductive material and a dielectric or by depositing one or more thin layers of a conductor. The resistors may be disposed at interior locations buried within a multilayer circuit board formed by laminating one or more panels having such resistors with one or more additional elements.

Abstract translation: 电路板在电路板的顶表面和底表面之间设有通孔中的电阻。 电阻器可以通过在每个通孔中沉积复合材料形成，如通过沉积导电材料和电介质的分散体或通过沉积导体的一个或多个薄层而形成的。 电阻器可以被布置在埋在多层电路板内的内部位置，所述多层电路板通过层压具有这种电阻器的一个或多个面板与一个或多个附加元件而形成。

公开(公告)号：US20060040522A1

公开(公告)日：2006-02-23

申请号：US11211810

申请日：2005-08-25

Applicant: Thomas Distefano ,  Joseph Fjelstad

Inventor： Thomas Distefano ,  Joseph Fjelstad

IPC: H05K1/00

CPC classification number: H05K3/462 ,  H01L23/49827 ,  H01L23/5385 ,  H01L2924/0002 ,  H01R12/523 ,  H01R12/714 ,  H01R13/2414 ,  H01R43/0256 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/056 ,  H05K1/116 ,  H05K3/0032 ,  H05K3/326 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0195 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1744 ,  H01L2924/00

Abstract: A microelectronic interposer is made by providing a sacrificial layer over the surface of a planar body. Apertures are formed passing through the body and the sacrificial layer. A layer of an electrically conductive structural material is deposited in each of the apertures and over the sacrificial layer, proximate to each aperture to thereby form contacts. The sacrificial layer is removed leaving the contacts with outwardly flaring peripheral portions spaced vertically above the surface of the planar body.

Abstract translation: 通过在平面体的表面上设置牺牲层来制造微电子插入器。 形成穿过身体和牺牲层的孔。 一层导电结构材料沉积在每个孔中并在牺牲层上方，靠近每个孔，从而形成接触。 去除牺牲层，留下接触件，其外部扩张的外围部分在平面体的表面上方垂直地间隔开。

公开(公告)号：US20060034061A1

公开(公告)日：2006-02-16

申请号：US11097450

申请日：2005-04-01

Applicant: Kevin Grundy ,  Gary Yasumura ,  Joseph Fjelstad ,  William Wiedemann ,  Para Segaram

Inventor： Kevin Grundy ,  Gary Yasumura ,  Joseph Fjelstad ,  William Wiedemann ,  Para Segaram

IPC: H01R12/16

CPC classification number: H01R12/52 ,  H01R12/7011 ,  H01R12/7082 ,  H01R12/714 ,  H01R12/716 ,  H01R12/721 ,  H01R13/24 ,  H01R31/06 ,  H05K1/0237 ,  H05K1/14 ,  H05K1/147 ,  H05K3/222 ,  H05K7/1441 ,  H05K2201/044 ,  H05K2201/10189 ,  H05K2201/10356

Abstract: A signal-segregating connector for use in a system having a printed circuit board, a first electrical structure and a second electrical structure. The connector includes a first set of conductive elements to convey signals between the first electrical structure and the printed circuit board, and a second set of conductive elements to convey signals between the first electrical structure and the second electrical structure.