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公开(公告)号：US4410666A
公开(公告)日：1983-10-18
申请号：US228988
申请日：1981-01-27
IPC分类号： C08F2/50 , C08G73/00 , C08G73/06 , C08L79/00 , C09D179/08 , H01B3/30 , H01B3/42 , C08F283/00
CPC分类号： C08G73/00 , C08L79/00 , Y10S525/908
摘要： A curable resin composition comprising a mixture and/or a preliminary reaction product of (a) at least one cyanate compound selected from the group consisting of polyfunctional cyanate esters, prepolymers of the cyanate esters, coprepolymers of the cyanate esters and an amine and mixtures thereof, (b) a polyhydantoin resin and optionally (c) at least one maleimide compound selected from the group consisting of polyfunctional maleimides, prepolymer of the maleimides, coprepolymers of the maleimides and an amine and mixtures thereof is disclosed.
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12.发明授权Glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticity 有权具有高弹性的玻璃纤维基材/热固性树脂覆铜层压板公开(公告)号：US08377544B2
公开(公告)日：2013-02-19
申请号：US12907089
申请日：2010-10-19
CPC分类号： B32B15/14 , B29C70/00 , B29K2309/08 , B32B15/20 , B32B27/04 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2311/12 , B32B2457/08 , H05K1/0366 , H05K2201/0209 , H05K2201/029 , Y10T428/24331 , Y10T428/24917 , Y10T428/24994 , Y10T442/209 , Y10T442/2738 , Y10T442/2951 , Y10T442/2992 , Y10T442/3008 , Y10T442/3341 , Y10T442/3415 , Y10T442/3423
摘要： A copper-clad laminate of a highly-elastic glass fabric base material/thermosetting resin formed of prepreg obtained by impregnating a glass fabric base material made of a glass woven fabric having a thickness of 25 to 150 μm, a weight of 15 to 165 g/m2 and a gas permeability of 1 to 20 cm3/cm2/sec. with a thermosetting resin composition and drying it.
摘要翻译： 一种高弹性玻璃织物基材/热固性树脂的覆铜层压板，由预浸料形成，所述预浸料通过浸渍由玻璃织物制成的玻璃织物基材，所述玻璃织物基材由厚度为25至150μm，重量为15至165g / m 2，透气度为1〜20cm 3 / cm 2 / sec。 用热固性树脂组合物干燥。
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公开(公告)号：US07056585B2
公开(公告)日：2006-06-06
申请号：US10626574
申请日：2003-07-25
IPC分类号： C08K3/22
CPC分类号： C08J5/10 , H05K1/0373 , H05K2201/012 , H05K2201/0209 , H05K2201/0239 , Y10T428/31511 , Y10T428/31529 , Y10T428/31663
摘要： A prepreg comprising a thermosetting resin (D) composition containing, as an essential component, an aluminum hydroxide-boehmite composite (A) obtained by hydrothermal treatment of aluminum hydroxide, and a substrate (I), a laminate using the above prepreg, and a metal-foil-clad laminate using the above laminate.
摘要翻译： 一种预浸料，其包含热固性树脂（D）组合物，其含有通过水热处理氢氧化铝获得的氢氧化铝 - 勃姆石复合材料（A）和基材（I）作为必要成分，使用上述预浸料的层压体，以及 使用上述层叠体的覆盖箔的层叠体。
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公开(公告)号：US06479760B2
公开(公告)日：2002-11-12
申请号：US09973688
申请日：2001-10-11
IPC分类号： H05K116
CPC分类号： H01L24/45 , H01L23/13 , H01L23/49811 , H01L23/49816 , H01L23/49866 , H01L24/48 , H01L24/73 , H01L2224/0401 , H01L2224/05647 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/45 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73204 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01042 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01083 , H01L2924/01105 , H01L2924/014 , H01L2924/04941 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/40252 , H05K1/0373 , H05K1/112 , H05K3/0038 , H05K3/3436 , H05K3/4629 , H05K2201/0209 , H05K2201/09472 , H05K2201/09509 , H05K2201/0979 , Y02P70/613 , Y10T428/24917 , Y10T428/31681 , H01L2924/00012 , H01L2924/00 , H01L2924/0002 , H01L2224/45099 , H01L2224/43
摘要： Provided is a printed wiring board for a chip size scale package, which overcomes the poor adhesion of solder balls to a base material which poor adhesion is caused by a recent decrease in the size of the solder balls, and in the chip size scale package, the distortion of the printed wiring board is decreased and the distortion of a semiconductor package formed by mounting a semiconductor chip on the printed wiring board by wire bonding or flip chip bonding is decreased. The printed wiring board has, as a substrate for a chip scale package, a double-side copper-clad laminate formed of an insulation layer and having copper foils on both surfaces, wherein the double-side copper-clad laminate has an upper copper foil surface and a lower copper foil surface, the upper copper foil surface has a wire bonding or flip chip bonding terminal and has a copper pad in a position where the copper pad can be electrically connected to said wire bonding or flip chip bonding terminal and can be connected to a blind via hole formed in the lower copper surface, the lower copper foil surface has a solder-balls fixing pad in a position corresponding to said copper pad, the solder-balls-fixing pad has at least 2 blind via holes within itself, and the solder-balls-fixing pad connected to a reverse surface of the copper pad with a conductive material is electrically connected with solder balls which are melted and filled in blind via holes so as to be mounded.
摘要翻译： 提供了一种用于芯片尺寸封装的印刷线路板，其克服了焊球对基材的粘附性差，由于焊球的尺寸的最近减小而引起的粘合性差，并且在芯片尺寸尺寸封装中， 印刷电路板的变形减小，并且通过引线接合或倒装芯片接合将半导体芯片安装在印刷线路板上形成的半导体封装的变形减小。 印刷电路板具有作为芯片级封装用基板的双面覆铜层压板，由双面覆铜层压板形成在绝缘层上且两面具有铜箔的双面铜箔叠层体， 表面和较低的铜箔表面，上铜箔表面具有引线键合或倒装芯片接合端子，并且在铜焊盘可以电连接到所述引线接合或倒装芯片接合端子的位置处具有铜焊盘，并且可以 连接到形成在下铜表面的盲孔，下铜箔表面在与所述铜垫相对应的位置具有焊球固定垫，焊球固定垫在其内部具有至少2个盲孔 并且用导电材料连接到铜焊盘的背面的焊球固定焊盘与熔化并填充在盲孔中的焊球电连接以使其隆起。
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15.发明授权Ball grid array type printed wiring board having exellent heat diffusibility and printed wiring board 失效球形阵列型印刷线路板，具有散热性和印刷线路板公开(公告)号：US06396143B1
公开(公告)日：2002-05-28
申请号：US09557974
申请日：2000-04-25
IPC分类号： H01L2334
CPC分类号： H05K1/0204 , H01L21/4857 , H01L21/486 , H01L23/49816 , H01L24/48 , H01L24/49 , H01L2224/05599 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49109 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01019 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H05K1/056 , H05K2201/09054 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012 , H01L2224/45099
摘要： A printed wiring board for a ball grid array type semiconductor plastic package which has excellent heat diffusibility and causes no popcorn phenomenon, and a metal-plate-inserted printed wiring board having wire bonding pads formed at two levels, for use in the ball grid array type semiconductor plastic package.
摘要翻译： 一种用于球栅阵列型半导体塑料封装的印刷线路板，具有优异的热扩散性并且不产生爆米花现象，以及具有形成在两个层面上的引线接合焊盘的金属板插入印刷线路板，用于球栅阵列 型半导体塑料封装。
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公开(公告)号：US4944373A
公开(公告)日：1990-07-31
申请号：US359554
申请日：1989-06-01
申请人： Kazuyuki Ohya , Hidenori Kimbara
发明人： Kazuyuki Ohya , Hidenori Kimbara
CPC分类号： F16D69/026
摘要： An asbestos-free disc brake pad is provided by employing a cyanate ester-based resin composition as binder. The disc brake pad exhibits consistent braking properties over a wide range of operating temperatures and an improved service life. Also the serious pollution problem due to use of asbestos in the conventional brake pads is removed.
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公开(公告)号：US4785034A
公开(公告)日：1988-11-15
申请号：US022054
申请日：1987-03-03
申请人： Morio Gaku , Hidenori Kimbara , Akira Yahagi , Takaaki Osanai
发明人： Morio Gaku , Hidenori Kimbara , Akira Yahagi , Takaaki Osanai
IPC分类号： C08L23/02 , C08K5/13 , C08K5/17 , C08K5/315 , C08K5/34 , C08K7/00 , C08K13/02 , C08L7/00 , C08L21/00 , C08L23/00 , C08L33/00 , C08L33/02 , C08L101/00 , C08K5/16
摘要： A stabilized polyolefin resin composition in which (a) 0.005-5% by weight of at least one monofunctional or polyfunctional cyanate ester compound having at least one cyanato group in its molecule, (b) 0.01-5% by weight of at least one hindered amine ultraviolet absorber and (c) 0.005-2% by weight of at least one hindered phenolic antioxidant are incorporated into a polyolefin resin is disclosed. The resin composition has excellent heat stability and resistance to weathering.
摘要翻译： 一种稳定化的聚烯烃树脂组合物，其中（a）0.005-5重量％的至少一种在其分子中具有至少一个氰酸根的单官能或多官能氰酸酯化合物，（b）0.01-5重量％的至少一个受阻剂 胺类紫外线吸收剂和（c）0.005-2％重量的至少一种受阻酚类抗氧化剂被掺入到聚烯烃树脂中。 树脂组合物具有优异的热稳定性和耐候性。
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公开(公告)号：US4499245A
公开(公告)日：1985-02-12
申请号：US514043
申请日：1983-07-15
IPC分类号： C08F2/50 , C08G73/00 , C08G73/06 , C08L79/00 , C09D179/08 , H01B3/30 , H01B3/42 , C08F283/00
CPC分类号： C08G73/00 , C08L79/00 , Y10S525/908
摘要： A curable resin composition comprising a mixture and/or a preliminary reaction product of (a) at least one cyanate compound selected from the group consisting of polyfunctional cyanate esters, prepolymers of the cyanate esters, coprepolymers of the cyanate esters and an amine and mixtures thereof, (b) a polyhydantoin resin and optionally (c) at least one maleimide compound selected from the group consisting of polyfunctional maleimides, prepolymer of the maleimides, coprepolymers of the maleimides and an amine and mixtures thereof is disclosed.
摘要翻译： 一种可固化树脂组合物，其包含（a）至少一种氰化物化合物的混合物和/或预反应产物，所述氰化物化合物选自多官能氰酸酯，氰酸酯的预聚物，氰酸酯的共聚物和胺及其混合物 ，（b）聚乙内酰脲树脂和任选地（c）至少一种选自多官能马来酰亚胺，马来酰亚胺的预聚物，马来酰亚胺的共聚物和胺及其混合物的马来酰亚胺化合物。
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公开(公告)号：US4820855A
公开(公告)日：1989-04-11
申请号：US109199
申请日：1987-10-16
申请人： Morio Gaku , Hidenori Kimbara
发明人： Morio Gaku , Hidenori Kimbara
IPC分类号： C08G73/06 , C07F9/09 , C07C122/00
CPC分类号： C08G73/0661
摘要： A process for producing a polyfunctional cyanate ester polymer which comprises heating at least one polyfunctional cyanate ester compound having the formula:R--OCN).sub.mwherein m is an integer of at least 2 and R is one or more aromatic organic groups, and the cyanato groups are bonded to the arylene ring, in the presence of a catalytic amount of a dialkyl tin oxide having the formula:R.sup.1 R.sup.2 SnOwherein each of R.sup.1 and R.sup.2 is C.sub.1 -C.sub.30 alkyl is disclosed.
摘要翻译： 一种制备多官能氰酸酯聚合物的方法，该方法包括加热至少一种具有下列通式的多官能氰酸酯化合物：R-OCN）m，其中m为至少2的整数，R为一个或多个芳族有机基团， 在有催化量的式R 1 R 2 SnO的二烷基氧化锡存在下，将R 1和R 2分别为C 1 -C 30烷基的基团键合到亚芳基环上。
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公开(公告)号：US4780507A
公开(公告)日：1988-10-25
申请号：US939772
申请日：1986-11-14
申请人： Morio Gaku , Hidenori Kimbara , Hiroo Muramoto , Shiro Higashida , Fumio Sato
发明人： Morio Gaku , Hidenori Kimbara , Hiroo Muramoto , Shiro Higashida , Fumio Sato
CPC分类号： H05K1/0353 , C08G59/12 , C08G59/4014 , C08L19/006 , C08L63/00 , C08L63/10 , C08L79/06 , Y10T428/31525 , Y10T428/31529 , Y10T428/31645 , Y10T428/31692
摘要： There is disclosed a thermosetting resin composition comprising a thermosetting cyanate ester resin composition (A) and a butadiene based copolymer (B)(i) or an epoxy resin-modified butadiene based copolymer (B)(ii), in which said component (B)(i) or (B)(ii) are used for modifying said component (A), component (A) and (B) being as follows;(A) a cyanate ester thermosetting resin composition comprising a cyanate ester compound selected from the group consisting of,(i) a polyfunctional cyanate ester having at least two cyanate group in its molecule,(ii) prepolymer of the cyanate ester of (i),(iii) coprepolymer of the cyanate ester of (i) and an amine, and(iv) mixtures thereof, and optionally adding another thermosetting resin,(B)(i) a butadiene based copolymer comprising a butadienaromatic vinytl monomer copolymer having 0.5 or more functional groups selected from a group consisting of carboxyl radical, hydroxyl radical, acid anhydride radical, mercapto radical, epoxy radical and amino radical, and a melting point of 10.degree. C. or more, in which 1,2-type content in butadiene structure of copolymer chain is 50% or more,(ii) an epoxy resin-modified butadiene based copolymer comprising said butadiene based copolymer (B)(i) having a carboxyl radical modified with polyfunctional epoxy resin, and having a melting point of 10.degree. C. or more and an epoxy equivalent of 300-8,000.
摘要翻译： PCT No.PCT / JP86 / 00173 Sec。 一九八六年十一月十四日 102（e）1986年11月14日PCT PCT公布1986年4月9日PCT公布。 公开号WO86 / 06085 公开了包含热固性氰酸酯树脂组合物（A）和丁二烯基共聚物（B）（i）或环氧树脂改性丁二烯共聚物（B）（ii）的热固性树脂组合物， ，其中所述组分（B）（i）或（B）（ii）用于改性所述组分（A），组分（A）和（B）如下： （A）氰酸酯热固性树脂组合物，其包含氰酸酯化合物，所述氰酸酯化合物选自：（i）分子中具有至少两个氰酸酯基的多官能氰酸酯，（ii）（i）的氰酸酯的预聚物， ，（iii）（i）的氰酸酯与胺的共聚合物，和（iv）它们的混合物，以及任选地加入另外的热固性树脂，（B）（ⅰ）一种丁二烯基共聚物，其包含具有0.5或6的丁二烯芳族iny单体共聚物， 更多选自羧基，羟基，酸酐基，巯基，环氧基和氨基的官能团，熔点为10℃以上，其中丁二烯中的1,2-型含量 共聚物链的结构为50％以上，（ii）环氧树脂改性丁二烯系共聚物，其含有具有用多官能环氧树脂改性的羧基的丁二烯基共聚物（B）（i），熔点为1 0℃以上，环氧当量300〜8000。
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