专利检索 ap:("Khalil Hosseini" OR "Alexander Koenigsberger" OR "Ralf Otremba" OR "Joachim Mahler" OR "Xaver Schloegel" OR "Klaus Schiess") AND inv:"Joachim Mahler" 第 2 页

11.

发明授权
Method and system for improving reliability of a semiconductor device 有权
标题翻译：提高半导体器件可靠性的方法和系统

公开(公告)号：US08884434B2

公开(公告)日：2014-11-11

申请号：US12890721

申请日：2010-09-27

申请人： Manfred Mengel , Joachim Mahler , Khalil Hosseini

发明人： Manfred Mengel , Joachim Mahler , Khalil Hosseini

IPC分类号： H01L23/48 , H01L23/00 , H01L25/065

CPC分类号： H01L24/33 , H01L24/03 , H01L24/05 , H01L24/10 , H01L24/13 , H01L24/29 , H01L24/32 , H01L24/34 , H01L24/83 , H01L25/0657 , H01L2224/0401 , H01L2224/04026 , H01L2224/04042 , H01L2224/05618 , H01L2224/05647 , H01L2224/13 , H01L2224/13099 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/29298 , H01L2224/32145 , H01L2224/32245 , H01L2224/33181 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2225/06568 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/1461 , H01L2924/3656 , H01L2924/00 , H01L2924/00015 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/37099

摘要： A method and a system for improving reliability of a semiconductor device are provided. In one embodiment, a semiconductor device is provided comprising a semiconductor chip, a metallization layer comprising a metallic material disposed over a surface of the semiconductor chip, and an alloy layer comprising the metallic material disposed over the metallization layer.

摘要翻译： 提供了一种用于提高半导体器件的可靠性的方法和系统。在一个实施例中，提供了包括半导体芯片的半导体器件，包括设置在半导体芯片的表面上的金属材料的金属化层以及包含设置在金属化层上的金属材料的合金层。

12.

发明授权
Electric device package and method of making an electric device package 有权
标题翻译：电气装置封装及电气装置封装方法

公开(公告)号：US08824145B2

公开(公告)日：2014-09-02

申请号：US13492751

申请日：2012-06-08

申请人： Khalil Hosseini , Joachim Mahler

发明人： Khalil Hosseini , Joachim Mahler

IPC分类号： H05K7/20

CPC分类号： F28D15/0233 , F28D15/02 , H01L23/427 , H01L23/473 , H01L23/492 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/83 , H01L24/84 , H01L24/85 , H01L2224/05553 , H01L2224/29101 , H01L2224/2919 , H01L2224/32245 , H01L2224/37028 , H01L2224/3703 , H01L2224/37124 , H01L2224/37147 , H01L2224/37155 , H01L2224/3716 , H01L2224/37194 , H01L2224/37624 , H01L2224/37647 , H01L2224/37655 , H01L2224/40245 , H01L2224/40249 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/48465 , H01L2224/48472 , H01L2224/48479 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83101 , H01L2224/83801 , H01L2224/83805 , H01L2224/8385 , H01L2224/84801 , H01L2224/8485 , H01L2224/92247 , H01L2924/00014 , H01L2924/01322 , H01L2924/0781 , H01L2924/12032 , H01L2924/12042 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , Y10T29/4913 , H01L2924/00 , H01L2924/014 , H01L2924/0665 , H01L2924/00012 , H01L2224/4554

摘要： A system and method for manufacturing an electric device package are disclosed. An embodiment comprises a carrier, a component disposed on the carrier, the component having a first component contact pad, and a first electrical connection between the first component contact pad and a first carrier contact pad, wherein the first electrical connection comprises a first hollow space, the first hollow space comprising a first liquid.

摘要翻译： 公开了一种用于制造电子器件封装的系统和方法。实施例包括载体，设置在载体上的部件，具有第一部件接触焊盘的部件和第一部件接触焊盘与第一载体接触焊盘之间的第一电连接，其中第一电连接包括第一中空空间所述第一中空空间包括第一液体。

13.

发明申请
Electronic Module 审中-公开
标题翻译：电子模块

公开(公告)号：US20130264721A1

公开(公告)日：2013-10-10

申请号：US13440478

申请日：2012-04-05

申请人： Stefan Landau , Joachim Mahler , Khalil Hosseini , Ivan Nikitin , Thomas Wowra , Lukas Ossowski

发明人： Stefan Landau , Joachim Mahler , Khalil Hosseini , Ivan Nikitin , Thomas Wowra , Lukas Ossowski

IPC分类号： H01L23/48 , H01L21/56

CPC分类号： H01L23/3121 , H01L21/563 , H01L23/49524 , H01L23/49562 , H01L23/49572 , H01L23/49575 , H01L24/13 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/73 , H01L24/83 , H01L24/92 , H01L25/16 , H01L2224/0401 , H01L2224/04026 , H01L2224/06181 , H01L2224/131 , H01L2224/16 , H01L2224/16245 , H01L2224/27436 , H01L2224/2902 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/321 , H01L2224/32145 , H01L2224/32245 , H01L2224/37147 , H01L2224/40095 , H01L2224/40245 , H01L2224/73253 , H01L2224/73269 , H01L2224/81191 , H01L2224/83191 , H01L2224/83801 , H01L2224/8485 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/1461 , H01L2924/00012 , H01L2924/00 , H01L2924/00014

摘要： The electronic module includes a first carrier and a first semiconductor chip arranged on the first carrier. A second semiconductor chip is arranged above the first semiconductor chip. A material layer adheres the second semiconductor chip to the first carrier and encapsulates the first semiconductor chip.

摘要翻译： 电子模块包括第一载体和布置在第一载体上的第一半导体芯片。第二半导体芯片布置在第一半导体芯片的上方。材料层将第二半导体芯片粘附到第一载体并封装第一半导体芯片。

14.

发明申请
CHIP-CARRIER, A METHOD FOR FORMING A CHIP-CARRIER AND A METHOD FOR FORMING A CHIP PACKAGE 有权
标题翻译：芯片载体，形成芯片载体的方法和形成芯片封装的方法

公开(公告)号：US20130127031A1

公开(公告)日：2013-05-23

申请号：US13301823

申请日：2011-11-22

申请人： Khalil Hosseini , Joachim Mahler , Anton Prueckl

发明人： Khalil Hosseini , Joachim Mahler , Anton Prueckl

IPC分类号： H01L23/495 , H01L21/768

CPC分类号： H01L23/49503 , H01L23/13 , H01L23/492 , H01L23/49513 , H01L23/49575 , H01L24/29 , H01L24/32 , H01L24/83 , H01L25/072 , H01L25/50 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/32257 , H01L2224/83192 , H01L2924/07802 , H01L2924/0781 , H01L2924/10253 , H01L2924/10272 , H01L2924/1033 , H01L2924/12032 , H01L2924/12042 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15738 , H01L2924/15747 , H01L2924/1576 , H01L2924/00 , H01L2924/01028 , H01L2924/014 , H01L2924/00014

摘要： Various embodiments provide a chip-carrier including, a chip-carrier surface configured to carry a first chip from a first chip bottom side, wherein a first chip top side of the first chip is configured above the chip-carrier surface; and at least one cavity extending into the chip-carrier from the chip-carrier surface; wherein the at least one cavity is configured to carry a second chip from a second chip bottom side, wherein a second chip top side of the second chip is substantially level with the first chip top side. The second chip is electrically insulated from the chip-carrier by an electrical insulation material inside the cavity.

摘要翻译： 各种实施例提供一种芯片载体，其包括：芯片载体表面，被配置为从第一芯片底侧承载第一芯片，其中第一芯片的第一芯片顶侧配置在芯片载体表面之上; 以及从所述芯片载体表面延伸到所述芯片载体中的至少一个空腔; 其中所述至少一个腔被配置为从第二芯片底侧承载第二芯片，其中所述第二芯片的第二芯片顶侧基本上与所述第一芯片顶侧平齐。第二芯片通过腔内的电绝缘材料与芯片载体电绝缘。

15.

发明授权
Layer between interfaces of different components in semiconductor devices 有权
标题翻译：半导体器件中不同元件的界面之间的层

公开(公告)号：US07834467B2

公开(公告)日：2010-11-16

申请号：US11692322

申请日：2007-03-28

申请人： Michael Bauer , Alfred Haimerl , Khalil Hosseini , Angela Kessler , Joachim Mahler , Wolfgang Schober

发明人： Michael Bauer , Alfred Haimerl , Khalil Hosseini , Angela Kessler , Joachim Mahler , Wolfgang Schober

IPC分类号： H01L23/28 , H01L23/495

CPC分类号： H01L23/3142 , B82Y10/00 , H01L23/49586 , H01L24/48 , H01L2224/05599 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01033 , H01L2924/01042 , H01L2924/01055 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H01L2924/351 , Y10S977/742 , Y10S977/785 , Y10S977/831 , H01L2224/45099 , H01L2924/00 , H01L2924/00012

摘要： A layer improves adhesion between interfaces of different components in semiconductor devices. The interface of a first component includes surfaces of a circuit carrier and the interface of a second component includes contact surfaces of a plastic package molding compound. The adhesion-improving layer includes a mixture of polymeric chain molecules and carbon nanotubes.

摘要翻译： 一层改善了半导体器件中不同部件的界面之间的粘附。第一部件的界面包括电路载体的表面，第二部件的界面包括塑料封装模塑料的接触表面。粘附改善层包括聚合链分子和碳纳米管的混合物。

16.

发明授权
Method for electrophoretically depositing a film on an electronic assembly 有权
标题翻译：在电子组件上电泳沉积薄膜的方法

公开(公告)号：US09313897B2

公开(公告)日：2016-04-12

申请号：US13620202

申请日：2012-09-14

申请人： Joachim Mahler , Manfred Mengel , Khalil Hosseini , Franz-Peter Kalz

发明人： Joachim Mahler , Manfred Mengel , Khalil Hosseini , Franz-Peter Kalz

IPC分类号： H05K3/30 , H05K3/28 , H01L23/495 , H01L21/56 , H01L23/31 , H01L23/00

CPC分类号： H01L23/293 , C25D13/06 , C25D13/12 , H01L21/4825 , H01L21/56 , H01L21/565 , H01L23/3107 , H01L23/3114 , H01L23/49513 , H01L23/4952 , H01L23/49562 , H01L23/49582 , H01L23/49586 , H01L23/573 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/84 , H01L24/85 , H01L2224/2919 , H01L2224/32245 , H01L2224/37124 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/40245 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/73263 , H01L2224/73265 , H01L2224/83191 , H01L2224/83192 , H01L2224/83801 , H01L2224/8492 , H01L2224/8592 , H01L2224/92246 , H01L2224/92247 , H01L2924/01322 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/351 , H05K3/284 , H05K2203/135 , Y10T29/49144 , H01L2924/00014 , H01L2924/0665 , H01L2924/00

摘要： A packaged component and a method for making a packaged component are disclosed. In an embodiment the packaged component includes a component carrier having a component carrier contact and a component disposed on the component carrier, the component having a component contact. The packaged component further includes a conductive connection element connecting the component carrier contact with the component contact, an insulating film disposed directly at least on one of a top surface of the component or the conductive connection element, and an encapsulant encapsulating the component carrier, the component and the enclosed conductive connection elements.

摘要翻译： 公开了封装组件和制造封装组件的方法。在一个实施例中，封装部件包括具有部件载体接触件和设置在部件载体上的部件的部件载体，该部件具有部件接触。封装部件还包括将部件载体接触件与部件接触件连接的导电连接元件，直接设置在部件或导电连接元件的顶表面中的至少一个上的绝缘膜，以及封装部件载体的密封剂，组件和封闭的导电连接元件。

17.

发明授权
Chip-package and a method for forming a chip-package 有权
标题翻译：芯片封装和形成芯片封装的方法

公开(公告)号：US09093416B2

公开(公告)日：2015-07-28

申请号：US13304795

申请日：2011-11-28

申请人： Manfred Mengel , Thomas Wowra , Joachim Mahler , Khalil Hosseini

发明人： Manfred Mengel , Thomas Wowra , Joachim Mahler , Khalil Hosseini

IPC分类号： H01L23/495 , H01L23/02 , H01L23/28 , H01L23/29 , H01L23/48 , H01L23/52 , H01L29/40 , H01L23/367 , H01L23/00

CPC分类号： H01L23/3677 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/82 , H01L2224/04105 , H01L2224/32245 , H01L2224/73267 , H01L2224/82005 , H01L2224/82039 , H01L2224/82101 , H01L2224/96 , H01L2924/12032 , H01L2924/12042 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15747 , H01L2924/18162 , H01L2924/00 , H01L2224/82 , H01L2924/00014

摘要： A chip-package includes a chip-carrier configured to carry a chip, the chip arranged over a chip-carrier side, wherein the chip-carrier side is configured in electrical connection with a chip back side; an insulation material including: a first insulation portion formed over a first chip lateral side; a second insulation portion formed over a second chip lateral side, wherein the first chip lateral side and the second chip lateral side each abuts opposite edges of the chip back side; and a third insulation portion formed over at least part of a chip front side, the chip front side including one or more electrical contacts formed within the chip front side; wherein at least part of the first insulation portion is arranged over the chip-carrier side and wherein the first insulation portion is configured to extend in a direction perpendicular to the first chip lateral side further than the chip-carrier.

摘要翻译： 芯片组包括芯片载体，芯片载体被配置为承载芯片，芯片布置在芯片载体侧上，其中芯片载体侧被配置为与芯片背面电连接; 绝缘材料，包括：形成在第一芯片侧面上的第一绝缘部分; 形成在第二芯片侧面上的第二绝缘部，其中所述第一芯片侧面和所述第二芯片侧面各自邻接所述芯片背面的相对边缘; 以及第三绝缘部分，形成在芯片前侧的至少一部分上，所述芯片前侧包括形成在所述芯片前侧内的一个或多个电触头; 其中所述第一绝缘部分的至少一部分布置在所述芯片载体侧上，并且其中所述第一绝缘部分被配置为在垂直于所述第一芯片横向侧的方向上比所述芯片载体更远。

18.

发明授权
Micromechanical semiconductor sensing device 有权
标题翻译：微机械半导体感测装置

公开(公告)号：US09021887B2

公开(公告)日：2015-05-05

申请号：US13329618

申请日：2011-12-19

申请人： Franz-Peter Kalz , Horst Theuss , Bernhard Winkler , Khalil Hosseini , Joachim Mahler , Manfred Mengel

发明人： Franz-Peter Kalz , Horst Theuss , Bernhard Winkler , Khalil Hosseini , Joachim Mahler , Manfred Mengel

IPC分类号： G01B7/16 , B81B7/02 , G01L9/00 , G01L19/00

CPC分类号： B81B7/02 , B81B3/0021 , B81B3/0072 , B81B2201/0235 , B81B2201/0264 , B81C2203/0154 , G01L1/18 , G01L9/0072 , G01L19/0092 , G01L19/02

摘要： Micromechanical semiconductor sensing device comprises a micromechanical sensing structure being configured to yield an electrical sensing signal, and a piezoresistive sensing device provided in the micromechanical sensing structure, said piezoresistive sensing device being arranged to sense a mechanical stress disturbing the electrical sensing signal and being configured to yield an electrical disturbance signal based on the sensed mechanical stress disturbing the electrical sensing signal.

摘要翻译： 微机械半导体感测装置包括被配置为产生电感测信号的微机械感测结构和设置在微机械感测结构中的压阻感测装置，所述压阻感测装置被布置成感测扰动电感测信号的机械应力，并被配置为基于感测到的电感测信号的机械应力产生电干扰信号。