公开(公告)号：US20060078715A1

公开(公告)日：2006-04-13

申请号：US11047646

申请日：2005-02-02

Applicant: Su-Tsai Lu

Inventor： Su-Tsai Lu

IPC: B32B3/00 ,  B05D5/12 ,  H01L23/48

CPC classification number: H05K3/328 ,  H01L21/563 ,  H01L23/4985 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/81012 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81232 ,  H01L2224/81801 ,  H01L2224/81894 ,  H01L2224/83894 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/20 ,  H05K3/321 ,  H05K3/325 ,  H05K2201/035 ,  H05K2201/10659 ,  H05K2201/10674 ,  H05K2203/0285 ,  Y10T428/24917 ,  H01L2924/00

Abstract: A bonding structure of device packaging includes a first substrate and a second substrate. The surfaces of the first substrate have metal pads and a first bonding layer connected to the second substrate whose surfaces have a second bonding layer and electrodes. The first bonding layer is combined with the second bonding layer, and the metal pads are in electrical communications with the electrodes. The second substrate may be a flexible substrate to decrease the strain between the first substrate and the second substrate.

Abstract translation: 器件封装的结合结构包括第一衬底和第二衬底。 第一基板的表面具有金属焊盘和连接到第二基板的第一接合层，其表面具有第二接合层和电极。 第一接合层与第二接合层组合，并且金属焊盘与电极电连通。 第二衬底可以是柔性衬底，以减小第一衬底和第二衬底之间的应变。

公开(公告)号：US06941537B2

公开(公告)日：2005-09-06

申请号：US10067244

申请日：2002-02-07

Applicant: Rebecca A. Jessep ,  David W. Boggs ,  Carolyn McCormick ,  John H. Dungan ,  Daryl A. Sato

Inventor： Rebecca A. Jessep ,  David W. Boggs ,  Carolyn McCormick ,  John H. Dungan ,  Daryl A. Sato

IPC: H01L21/60 ,  H01L23/498 ,  H05K1/02 ,  H05K1/14 ,  H05K3/30 ,  G06F17/50

CPC classification number: H01L24/81 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/1319 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/145 ,  H05K3/303 ,  H05K3/308 ,  H05K2201/09809 ,  H05K2201/10022 ,  H05K2201/10303 ,  H05K2201/1053 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10734 ,  H05K2201/10871 ,  H05K2201/2036 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A standoff device provides predetermined control of a standoff distance between electrical components mounted together with opposing conductive grid array patterns. In an embodiment, a predetermined electrical function is provided by the device to at least one of the electrical components. The standoff device comprises a plurality of rigid one-piece standoff pins which, in an embodiment, contains one or more stops which buttress against the electrical components to serve as a distancing control structure. In an embodiment, the standoff device is integral with one of the electrical components.

Abstract translation: 对接装置提供了通过相对的导电栅格阵列图案安装在一起的电气部件之间的间隔距离的预定控制。 在一个实施例中，预定的电功能由该装置提供给至少一个电气部件。 间隔装置包括多个刚性的一体式支座销，在一个实施例中，该销钉包含一个或多个支撑电气部件以用作隔离控制结构的止挡件。 在一个实施例中，支座装置与电气部件之一是一体的。

公开(公告)号：US20050189640A1

公开(公告)日：2005-09-01

申请号：US11055578

申请日：2005-02-09

Applicant: Kevin Grundy ,  Joseph Fjelstad ,  Gary Yasumura ,  William Wiedemann ,  Para Segaram

Inventor： Kevin Grundy ,  Joseph Fjelstad ,  Gary Yasumura ,  William Wiedemann ,  Para Segaram

IPC: H01L23/02 ,  H01L23/13 ,  H01L23/31 ,  H01L25/10 ,  H05K1/18 ,  H05K3/40

CPC classification number: H01L23/13 ,  H01L23/3107 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/16235 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/85399 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/182 ,  H05K1/183 ,  H05K3/308 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/3447 ,  H05K3/4046 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/0919 ,  H05K2201/092 ,  H05K2201/09845 ,  H05K2201/10189 ,  H05K2201/1053 ,  H05K2201/10545 ,  H05K2201/1059 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10727 ,  H05K2201/10734 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Structures employed by a plurality of packages, printed circuit boards, connectors and interposers to create signal paths which reduce the deleterious signal quality issues associated with the use of through-holes. Disclosed structures can coexist with through-hole implementations.

Abstract translation: 由多个封装，印刷电路板，连接器和插入件采用的结构，以产生减少与使用通孔相关联的有害信号质量问题的信号路径。 公开的结构可以与通孔实现共存。

公开(公告)号：US20050189138A1

公开(公告)日：2005-09-01

申请号：US10623969

申请日：2003-07-21

Applicant: Richard Bardsley

Inventor： Richard Bardsley

IPC: H05K3/32 ,  H05K3/34 ,  H05K1/16 ,  H05K7/02 ,  H05K7/06 ,  H05K13/00

CPC classification number: H05K3/3442 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K3/328 ,  H05K2201/10454 ,  H05K2201/10636 ,  H05K2201/10659 ,  H05K2203/049 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/49179 ,  H01L2924/00014

Abstract: A method of manufacture of an electronic assembly that has a circuit board and an electrical component includes laying a first terminal of the electrical component upon a conductive region of the circuit board, providing solder paste contacting the first terminal of the component and the circuit board, and heating the solder paste so as to liquefy the solder paste thereby permitting a second terminal of the component to rise above the first terminal so as to erect the component substantially perpendicular to the conductive region. The method further includes curing the liquefied solder paste in order to fix the first terminal of the component to the conductive region of the circuit board.

Abstract translation: 一种具有电路板和电气部件的电子组件的制造方法，包括将电气部件的第一端子设置在电路基板的导电区域上，提供与部件的第一端子和电路基板接触的焊膏， 以及加热所述焊膏以液化所述焊膏，从而允许所述部件的第二端部升高到所述第一端子之上，以使所述部件基本垂直于所述导电区域。 该方法还包括固化液化的焊膏以将部件的第一端固定到电路板的导电区域。

公开(公告)号：US20040237298A1

公开(公告)日：2004-12-02

申请号：US10885400

申请日：2004-07-06

Applicant: FCI Americas Technology, Inc

Inventor： Yakov Belopolsky

IPC: B23K031/02

CPC classification number: H05K3/3415 ,  H01L2224/16225 ,  H01L2924/00014 ,  H05K3/244 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3447 ,  H05K3/3463 ,  H05K2201/09781 ,  H05K2201/10659 ,  H05K2201/10734 ,  H05K2203/047 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49165 ,  Y10T29/49222 ,  H01L2224/0401

Abstract: Methods for mounting electrical components on a substrate and securely retaining the components are described. The methods include altering solder paste compositions, interposed between component retentive pins and retentive through holes, during a reflow process. Electronic assemblies including circuit boards and electrical components mounted thereto are also described. In one of the electronic assembly embodiments, materials originally associated with a mounted electrical component migrate into solder paste coupling the electrical component to the circuit board.

Abstract translation: 描述了将电气部件安装在基板上并可靠地保持部件的方法。 所述方法包括在回流过程期间改变介于组分保持性针和保持性通孔之间的焊膏组合物。 还描述了包括电路板和安装在其上的电气部件的电子组件。 在电子组装实施例之一中，最初与安装的电气部件相关联的材料迁移到将电气部件连接到电路板的焊膏中。

公开(公告)号：US06817870B1

公开(公告)日：2004-11-16

申请号：US10459475

申请日：2003-06-12

Applicant: Herman Kwong ,  Aneta Wyrzykowska ,  Luigi Difilippo

Inventor： Herman Kwong ,  Aneta Wyrzykowska ,  Luigi Difilippo

IPC: H01R1200

CPC classification number: H01R12/523 ,  H01R12/57 ,  H01R13/642 ,  H01R13/665 ,  H05K3/3436 ,  H05K3/3447 ,  H05K3/365 ,  H05K3/368 ,  H05K3/429 ,  H05K2201/09472 ,  H05K2201/09536 ,  H05K2201/10659 ,  H05K2203/061 ,  Y10T409/300112 ,  Y10T409/300616

Abstract: A circuit device for interconnecting first and second multilayer circuit boards is described herein. The first multilayer circuit board may include a first plurality of electrically conductive vias of varying depths and the second multilayer circuit board may include a second plurality of electrically conductive vias. The circuit device comprises a first plurality of pins located on a first side of the circuit device corresponding to the first plurality of electrically conductive vias of the first multilayer circuit board, each pin having a length compatible with a depth of a respective one of the first plurality of electrically conductive vias of the first multilayer circuit board. The circuit device further comprises a second plurality of pins located on a second side of the circuit device corresponding to the second plurality of electrically conductive vias of the second multilayer circuit board.

Abstract translation: 本文描述了用于互连第一和第二多层电路板的电路装置。 第一多层电路板可以包括不同深度的第一多个导电通孔，并且第二多层电路板可以包括第二多个导电通孔。 所述电路装置包括位于所述电路装置的第一侧上的与所述第一多层电路板的所述第一多个导电通路相对应的第一多个引脚，每个引脚的长度与所述第一多层电路板 第一多层电路板的多个导电通孔。 所述电路装置还包括位于所述电路装置的第二侧上的与所述第二多层电路板的所述第二多个导电通路相对应的第二多个引脚。

公开(公告)号：US20040174486A1

公开(公告)日：2004-09-09

申请号：US10806097

申请日：2004-03-23

Inventor： Kazuhiro Ogawa ,  Kazuhiko Yanagawa

IPC: G02F001/1343

CPC classification number: G02F1/13452 ,  G02F1/134363 ,  H01L2924/0002 ,  H05K1/117 ,  H05K3/244 ,  H05K3/28 ,  H05K3/323 ,  H05K3/3452 ,  H05K3/361 ,  H05K2201/09709 ,  H05K2201/10659 ,  H05K2201/10681 ,  H01L2924/00

Abstract: A liquid crystal display device which provides reliable connection between a semiconductor device and a printed circuit board includes a liquid crystal display panel, a printed circuit board disposed close to the liquid crystal display panel, and a semiconductor device of a film carrier type which is disposed to lie between the liquid crystal display panel and the printed circuit board, and terminals of the semiconductor device are respectively connected by an anisotropic conductive film to terminals of the printed circuit board that are disposed in opposition to the respective terminals of the semiconductor device.

Abstract translation: 提供半导体器件和印刷电路板之间的可靠连接的液晶显示装置包括液晶显示面板，靠近液晶显示面板设置的印刷电路板，以及设置在薄膜载体型的半导体器件 位于液晶显示面板和印刷电路板之间，并且半导体器件的端子分别通过各向异性导电膜连接到与半导体器件的各个端子相对设置的印刷电路板的端子。

公开(公告)号：US20040121626A1

公开(公告)日：2004-06-24

申请号：US10729710

申请日：2003-12-05

Applicant: FCI Americas Technology, Inc.

Inventor： Yakov Belopolsky

IPC: H01R012/00

CPC classification number: H05K3/3415 ,  H01L2224/16225 ,  H01L2924/00014 ,  H05K3/244 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3447 ,  H05K3/3463 ,  H05K2201/09781 ,  H05K2201/10659 ,  H05K2201/10734 ,  H05K2203/047 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49165 ,  Y10T29/49222 ,  H01L2224/0401

Abstract: Methods for mounting electrical components on a substrate and securely retaining the components are described. The methods include altering solder paste compositions, interposed between component retentive pins and retentive through holes, during a reflow process. Electronic assemblies including circuit boards and electrical components mounted thereto are also described. In one of the electronic assembly embodiments, materials originally associated with a mounted electrical component migrate into solder paste coupling the electrical component to the circuit board.

公开(公告)号：US20030218238A1

公开(公告)日：2003-11-27

申请号：US10391746

申请日：2003-03-20

Inventor： Hiroshi Kikuchi ,  Norio Nakazato ,  Hideko Ando ,  Takashi Suga ,  Satoru Isomura ,  Takashi Kubo ,  Hiroyasu Sasaki ,  Masanori Fukuhara ,  Naotaka Tanaka ,  Fujiaki Nose

IPC: H01L023/02

CPC classification number: H05K1/0243 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15173 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1903 ,  H01L2924/19106 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0219 ,  H05K3/361 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10659 ,  H05K2201/10681 ,  H05K2201/10734 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A high-frequency signal from a tape-shaped line section having a surface layer signal lead and surface layer GND lead disposed on both sides thereof is directly inputted to a semiconductor chip via a signal surface layer wiring of a package substrate and through solder bump electrodes. Alternatively, a high-frequency signal from the semiconductor chip is outputted to the outside via the tape-shaped line section in reverse. Owing to the transmission of the high-frequency signal by only a microstrip line at the whole surface layer of the package substrate, the high-frequency signal can be transmitted by only the microstrip line at the surface layer without through vias or the like. Accordingly, the high-frequency signal can be transmitted without a loss in frequency characteristic, and a high-quality high-frequency signal can be transmitted with a reduction in loss at high-frequency transmission.

Abstract translation: 来自具有布置在其两侧的表面层信号引线和表面层GND引线的带状线段的高频信号经由封装衬底的信号表面层布线直接输入到半导体芯片，并通过焊料凸块电极 。 或者，来自半导体芯片的高频信号经由带状线路部分反向输出到外部。 由于仅在封装衬底的整个表面层处的微带线传输高频信号，所以高频信号可以仅通过表层的微带线传输，而不需要通过通孔等。 因此，可以不损失频率特性来发送高频信号，并且可以在高频率传输时以低损耗的方式发送高质量的高频信号。

公开(公告)号：US06577503B2

公开(公告)日：2003-06-10

申请号：US10191701

申请日：2002-07-08

Applicant: Larry D. Kinsman ,  Jerry M. Brooks ,  Walter L. Moden

Inventor： Larry D. Kinsman ,  Jerry M. Brooks ,  Walter L. Moden

IPC: H05K720

CPC classification number: H05K3/303 ,  H01L23/3675 ,  H01L23/4334 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K2201/09709 ,  H05K2201/10454 ,  H05K2201/10659 ,  H05K2201/10696 ,  Y02P70/613 ,  H01L2924/00

Abstract: A high density vertical surface mount package and thermal carrier therefor including a heat sink.

Abstract translation: 一种高密度垂直表面贴装封装及其热载体，包括散热片。