公开(公告)号：US07772679B2

公开(公告)日：2010-08-10

申请号：US12213660

申请日：2008-06-23

Applicant: Shu-Ming Chang ,  Ying-Ching Shih

Inventor： Shu-Ming Chang ,  Ying-Ching Shih

IPC: H01L21/00

CPC classification number: H01L23/552 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/3025 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: This invention provides a magnetic shielding package structure of a magnetic memory device, in which at least a magnetic memory device is embedded between a magnetic shielding substrate and a magnetic shielding layer. A plurality of through vias is formed in the magnetic shielding substrate or the magnetic shielding layer, and a plurality of conductive contacts passes through the through vias such that electrical connection between the magnetic memory device and the external is established.

Abstract translation: 本发明提供一种磁存储器件的磁屏蔽封装结构，其中至少一个磁存储器件被嵌入在磁屏蔽衬底和磁屏蔽层之间。 在磁屏蔽基板或磁屏蔽层中形成多个通孔，并且多个导电触头通过通孔，从而建立磁存储器件与外部之间的电连接。

公开(公告)号：US20090173529A1

公开(公告)日：2009-07-09

申请号：US12189206

申请日：2008-08-11

Applicant: Yuan-Chang Lee ,  Yu-Hua Chen ,  Ying-Ching Shih ,  Cheng-Ta Ko

Inventor： Yuan-Chang Lee ,  Yu-Hua Chen ,  Ying-Ching Shih ,  Cheng-Ta Ko

IPC: H05K1/11 ,  H05K3/10 ,  H05K1/00

CPC classification number: H05K1/0283 ,  H05K1/185 ,  H05K3/222 ,  H05K2201/0355 ,  H05K2201/10287 ,  H05K2203/0271 ,  Y10T29/49162

Abstract: A circuit structure and a fabrication method thereof manly use a plurality of wires to connect in series a plurality of pads to form a stretchable circuit. Each of the wires has a first end, a second end and an intermediate segment located between the first end and the second end, wherein the first end and the second end are respectively connected to different pads, and the position of the intermediate segment is higher than the positions of the first end and the second end. Since the connection manner of the wires and the pads has 3-D freedoms, the circuit structure can withstand both horizontal and vertical deformations and has an outstanding reliability.

Abstract translation: 一种电路结构及其制造方法，其使用多条电线将多个焊盘串联连接以形成可拉伸电路。 每个电线具有位于第一端和第二端之间的第一端，第二端和中间段，其中第一端和第二端分别连接到不同的焊盘，并且中间段的位置更高 比第一端和第二端的位置。 由于电线和焊盘的连接方式具有3-D自由度，所以电路结构可以承受水平和垂直变形，并且具有突出的可靠性。

公开(公告)号：US08664760B2

公开(公告)日：2014-03-04

申请号：US13343582

申请日：2012-01-04

Applicant: Chen-Hua Yu ,  Shin-Puu Jeng ,  Shang-Yun Hou ,  Cheng-Chieh Hsieh ,  Kuo-Ching Hsu ,  Ying-Ching Shih ,  Po-Hao Tsai ,  Chin-Fu Kao ,  Cheng-Lin Huang ,  Jing-Cheng Lin

Inventor： Chen-Hua Yu ,  Shin-Puu Jeng ,  Shang-Yun Hou ,  Cheng-Chieh Hsieh ,  Kuo-Ching Hsu ,  Ying-Ching Shih ,  Po-Hao Tsai ,  Chin-Fu Kao ,  Cheng-Lin Huang ,  Jing-Cheng Lin

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/11 ,  H01L23/147 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/04 ,  H01L25/50 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05073 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05184 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05686 ,  H01L2224/10145 ,  H01L2224/10156 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/1182 ,  H01L2224/11831 ,  H01L2224/13017 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13565 ,  H01L2224/13578 ,  H01L2224/13686 ,  H01L2224/16058 ,  H01L2224/16145 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/3651 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/01047 ,  H01L2924/049 ,  H01L2924/053 ,  H01L2924/00

Abstract: A device includes a top dielectric layer having a top surface. A metal pillar has a portion over the top surface of the top dielectric layer. A non-wetting layer is formed on a sidewall of the metal pillar, wherein the non-wetting layer is not wettable to the molten solder. A solder region is disposed over and electrically coupled to the metal pillar.

公开(公告)号：US08610285B2

公开(公告)日：2013-12-17

申请号：US13298046

申请日：2011-11-16

Applicant: Chen-Hua Yu ,  Shin-Puu Jeng ,  Shang-Yun Hou ,  Kuo-Ching Hsu ,  Cheng-Chieh Hsieh ,  Ying-Ching Shih ,  Po-Hao Tsai ,  Cheng-Lin Huang ,  Jing-Cheng Lin

Inventor： Chen-Hua Yu ,  Shin-Puu Jeng ,  Shang-Yun Hou ,  Kuo-Ching Hsu ,  Cheng-Chieh Hsieh ,  Ying-Ching Shih ,  Po-Hao Tsai ,  Cheng-Lin Huang ,  Jing-Cheng Lin

IPC: H01L23/498 ,  H01L21/768 ,  H01L23/48 ,  H01L29/40

CPC classification number: H01L24/11 ,  H01L23/147 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/04 ,  H01L25/50 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05073 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05184 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05686 ,  H01L2224/10145 ,  H01L2224/10156 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/1182 ,  H01L2224/11831 ,  H01L2224/13017 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13565 ,  H01L2224/13578 ,  H01L2224/13686 ,  H01L2224/16058 ,  H01L2224/16145 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/3651 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/01047 ,  H01L2924/049 ,  H01L2924/053 ,  H01L2924/00

Abstract: A package component is free from active devices therein. The package component includes a substrate, a through-via in the substrate, a top dielectric layer over the substrate, and a metal pillar having a top surface over a top surface of the top dielectric layer. The metal pillar is electrically coupled to the through-via. A diffusion barrier is over the top surface of the metal pillar. A solder cap is disposed over the diffusion barrier.

Abstract translation: 封装组件不含其中的有源器件。 封装部件包括衬底，衬底中的通孔，衬底上的顶部电介质层，以及在顶部电介质层的顶表面上方具有顶表面的金属柱。 金属柱电连接到通孔。 扩散阻挡层在金属支柱的上表面之上。 焊料帽设置在扩散阻挡层上。

公开(公告)号：US08581418B2

公开(公告)日：2013-11-12

申请号：US12840949

申请日：2010-07-21

Applicant: Weng-Jin Wu ,  Ying-Ching Shih ,  Wen-Chih Chiou ,  Shin-Puu Jeng ,  Chen-Hua Yu

Inventor： Weng-Jin Wu ,  Ying-Ching Shih ,  Wen-Chih Chiou ,  Shin-Puu Jeng ,  Chen-Hua Yu

IPC: H01L23/48

CPC classification number: H01L21/768 ,  H01L21/56 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/147 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/481 ,  H01L23/5384 ,  H01L24/11 ,  H01L24/14 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/06181 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13184 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/81895 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/81805

Abstract: A device includes a first die having a first side and a second side opposite to first side, the first side includes a first region and a second region, and a first metal bump of a first horizontal size formed on the first region of the first side of the first die. A second die is bonded to the first side of the first die through the first metal bump. A dielectric layer is formed over the first side of the first die and includes a first portion directly over the second die, a second portion encircling the second die, and an opening exposing the second region of the first side of the first die. A second metal bump of a second horizontal size is formed on the second region of the first side of the first die and extending into the opening of the dielectric layer. The second horizontal size is greater than the first horizontal size. An electrical component is bonded to the first side of the first die through the second metal bump.

Abstract translation: 一种器件包括具有第一侧和与第一侧相对的第二侧的第一管芯，第一侧包括第一区域和第二区域，以及形成在第一侧面的第一区域上的第一水平尺寸的第一金属凸块 的第一个死亡。 通过第一金属凸块将第二模具结合到第一模具的第一侧。 介电层形成在第一管芯的第一侧上，并且包括直接在第二管芯上方的第一部分，环绕第二管芯的第二部分和暴露第一管芯的第一侧的第二区域的开口。 第二水平尺寸的第二金属凸块形成在第一模具的第一侧的第二区域上并且延伸到电介质层的开口中。 第二个水平尺寸大于第一个水平尺寸。 电子部件通过第二金属凸块接合到第一管芯的第一侧。

公开(公告)号：US08513532B2

公开(公告)日：2013-08-20

申请号：US13033385

申请日：2011-02-23

Applicant: Yu-Hua Chen ,  Ying-Ching Shih

Inventor： Yu-Hua Chen ,  Ying-Ching Shih

IPC: H05K1/00

CPC classification number: H05K1/0283 ,  H01L23/49816 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K1/185 ,  H05K1/189 ,  H05K3/007 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09263 ,  H05K2201/09909 ,  H05K2203/016 ,  H05K2203/0271 ,  Y10T29/49124 ,  H01L2924/00

Abstract: A flexible circuit structure with stretchability comprises a flexible substrate, a metal layer, and a plurality of flexible bumps. The metal layer is formed on the flexible substrate. These flexible bumps are formed on the metal layer and the flexible substrate.

Abstract translation: 具有拉伸性的柔性电路结构包括柔性基板，金属层和多个柔性凸块。 金属层形成在柔性基板上。 这些柔性凸块形成在金属层和柔性基板上。

公开(公告)号：US20130175694A1

公开(公告)日：2013-07-11

申请号：US13345485

申请日：2012-01-06

Applicant: Ying-Ching Shih ,  Szu Wei Lu ,  Jing-Cheng Lin

Inventor： Ying-Ching Shih ,  Szu Wei Lu ,  Jing-Cheng Lin

IPC: H01L21/58 ,  H01L23/485 ,  H01L21/78

CPC classification number: H01L21/6835 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3185 ,  H01L23/49816 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2221/68381 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81192 ,  H01L2224/83005 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/83

Abstract: A method includes forming a dielectric layer over a substrate, forming an interconnect structure over the dielectric layer, and bonding a die to the interconnect structure. The substrate is then removed, and the dielectric layer is patterned. Connectors are formed at a surface of the dielectric layer, wherein the connectors are electrically coupled to the die.

Abstract translation: 一种方法包括在衬底上形成电介质层，在电介质层上形成互连结构，以及将管芯结合到互连结构。 然后去除衬底，并对电介质层进行图案化。 连接器形成在电介质层的表面，其中连接器电耦合到管芯。

公开(公告)号：US08269112B2

公开(公告)日：2012-09-18

申请号：US12189206

申请日：2008-08-11

Applicant: Yuan-Chang Lee ,  Yu-Hua Chen ,  Ying-Ching Shih ,  Cheng-Ta Ko

Inventor： Yuan-Chang Lee ,  Yu-Hua Chen ,  Ying-Ching Shih ,  Cheng-Ta Ko

IPC: H05K1/00 ,  H05K1/09

CPC classification number: H05K1/0283 ,  H05K1/185 ,  H05K3/222 ,  H05K2201/0355 ,  H05K2201/10287 ,  H05K2203/0271 ,  Y10T29/49162

Abstract: A circuit structure and a fabrication method thereof manly use a plurality of wires to connect in series a plurality of pads to form a stretchable circuit. Each of the wires has a first end, a second end and an intermediate segment located between the first end and the second end, wherein the first end and the second end are respectively connected to different pads, and the position of the intermediate segment is higher than the positions of the first end and the second end. Since the connection manner of the wires and the pads has 3-D freedoms, the circuit structure can withstand both horizontal and vertical deformations and has an outstanding reliability.

Abstract translation: 一种电路结构及其制造方法，其使用多条电线将多个焊盘串联连接以形成可拉伸电路。 每个电线具有位于第一端和第二端之间的第一端，第二端和中间段，其中第一端和第二端分别连接到不同的焊盘，并且中间段的位置更高 比第一端和第二端的位置。 由于电线和焊盘的连接方式具有3-D自由度，所以电路结构可以承受水平和垂直变形，并且具有突出的可靠性。

公开(公告)号：US20120043115A1

公开(公告)日：2012-02-23

申请号：US13033385

申请日：2011-02-23

Applicant: Yu-Hua CHEN ,  Ying-Ching SHIH

Inventor： Yu-Hua CHEN ,  Ying-Ching SHIH

IPC: H05K1/03

CPC classification number: H05K1/0283 ,  H01L23/49816 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K1/185 ,  H05K1/189 ,  H05K3/007 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09263 ,  H05K2201/09909 ,  H05K2203/016 ,  H05K2203/0271 ,  Y10T29/49124 ,  H01L2924/00

Abstract: In one example embodiment, a flexible circuit structure with stretchability is provided that includes a flexible substrate, a plurality of flexible bumps formed on the flexible substrate, and a metal layer formed on the plurality of flexible bumps and the flexible substrate.

Abstract translation: 在一个示例实施例中，提供了一种具有拉伸性的柔性电路结构，其包括柔性基板，形成在柔性基板上的多个挠性凸块以及形成在多个柔性凸块和柔性基板上的金属层。

公开(公告)号：US20120018876A1

公开(公告)日：2012-01-26

申请号：US12840949

申请日：2010-07-21

Applicant: Weng-Jin Wu ,  Ying-Ching Shih ,  Wen-Chih Chiou ,  Shin-Puu Jeng ,  Chen-Hua Yu

Inventor： Weng-Jin Wu ,  Ying-Ching Shih ,  Wen-Chih Chiou ,  Shin-Puu Jeng ,  Chen-Hua Yu

IPC: H01L23/485 ,  H01L21/768

CPC classification number: H01L21/768 ,  H01L21/56 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/147 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/481 ,  H01L23/5384 ,  H01L24/11 ,  H01L24/14 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/06181 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13184 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/81895 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/81805

Abstract: A device includes a first die having a first side and a second side opposite to first side, the first side includes a first region and a second region, and a first metal bump of a first horizontal size formed on the first region of the first side of the first die. A second die is bonded to the first side of the first die through the first metal bump. A dielectric layer is formed over the first side of the first die and includes a first portion directly over the second die, a second portion encircling the second die, and an opening exposing the second region of the first side of the first die. A second metal bump of a second horizontal size is formed on the second region of the first side of the first die and extending into the opening of the dielectric layer. The second horizontal size is greater than the first horizontal size. An electrical component is bonded to the first side of the first die through the second metal bump.

Abstract translation: 一种器件包括具有第一侧和与第一侧相对的第二侧的第一管芯，第一侧包括第一区域和第二区域，以及形成在第一侧面的第一区域上的第一水平尺寸的第一金属凸块 的第一个死亡。 通过第一金属凸块将第二模具结合到第一模具的第一侧。 介电层形成在第一管芯的第一侧上，并且包括直接在第二管芯上方的第一部分，环绕第二管芯的第二部分和暴露第一管芯的第一侧的第二区域的开口。 第二水平尺寸的第二金属凸块形成在第一模具的第一侧的第二区域上并且延伸到电介质层的开口中。 第二个水平尺寸大于第一个水平尺寸。 电子部件通过第二金属凸块接合到第一管芯的第一侧。