公开(公告)号：US09608184B2

公开(公告)日：2017-03-28

申请号：US13160680

申请日：2011-06-15

申请人： Naoyuki Urasaki ,  Kanako Yuasa

发明人： Naoyuki Urasaki ,  Kanako Yuasa

IPC分类号： H01L23/44 ,  H01L33/60 ,  H01L33/48 ,  H01L33/38 ,  H01L33/50 ,  H01L33/52 ,  H01L33/62 ,  H01L23/00

CPC分类号： H01L33/60 ,  H01L24/45 ,  H01L24/73 ,  H01L33/38 ,  H01L33/486 ,  H01L33/50 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An optical semiconductor element mounting package that has good adhesion between the resin molding and the lead electrodes and has excellent reliability is provided, as well as an optical semiconductor device using the package is also provided. The optical semiconductor element mounting package having a recessed part that serves as an optical semiconductor element mounting region, wherein the package is formed by integrating: a resin molding composed of a thermosetting light-reflecting resin composition, which forms at least the side faces of the recessed part; and at least a pair of positive and negative lead electrodes disposed opposite each other so as to form part of the bottom face of the recessed part, and there is no gap at a joint face between the resin molding and the lead electrodes.

公开(公告)号：US20110241055A1

公开(公告)日：2011-10-06

申请号：US13160680

申请日：2011-06-15

申请人： Naoyuki Urasaki ,  Kanako Yuasa

发明人： Naoyuki Urasaki ,  Kanako Yuasa

IPC分类号： H01L33/60

CPC分类号： H01L33/60 ,  H01L24/45 ,  H01L24/73 ,  H01L33/38 ,  H01L33/486 ,  H01L33/50 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An optical semiconductor element mounting package that has good adhesion between the resin molding and the lead electrodes and has excellent reliability is provided, as well as an optical semiconductor device using the package is also provided. The optical semiconductor element mounting package having a recessed part that serves as an optical semiconductor element mounting region, wherein the package is formed by integrating: a resin molding composed of a thermosetting light-reflecting resin composition, which forms at least the side faces of the recessed part; and at least a pair of positive and negative lead electrodes disposed opposite each other so as to form part of the bottom face of the recessed part, and there is no gap at a joint face between the resin molding and the lead electrodes.

摘要翻译： 提供了一种光学半导体元件安装封装，其具有树脂模制品和引线电极之间良好的粘合性并且具有优异的可靠性，并且还提供了使用该封装的光学半导体器件。 所述光半导体元件安装封装具有作为光半导体元件安装区域的凹部，其特征在于，所述封装通过以下方式形成：将由热固性光反射树脂组合物构成的树脂成形体形成为至少形成所述 凹陷部分 以及至少一对彼此相对设置的正极和负极引线电极，以形成凹部的底面的一部分，并且在树脂模制品和引线电极之间的接合面处没有间隙。

公开(公告)号：US5879568A

公开(公告)日：1999-03-09

申请号：US870379

申请日：1997-06-06

申请人： Naoyuki Urasaki ,  Kouichi Tsuyama ,  Kazuhito Kobayashi ,  Norio Okano ,  Hiroshi Shimizu ,  Nobuyuki Ogawa ,  Akishi Nakaso ,  Toyoki Ito ,  Daisuke Fujimoto ,  Kazuhisa Otsuka ,  Shigeharu Arike ,  Yoshiyuki Tsuru

发明人： Naoyuki Urasaki ,  Kouichi Tsuyama ,  Kazuhito Kobayashi ,  Norio Okano ,  Hiroshi Shimizu ,  Nobuyuki Ogawa ,  Akishi Nakaso ,  Toyoki Ito ,  Daisuke Fujimoto ,  Kazuhisa Otsuka ,  Shigeharu Arike ,  Yoshiyuki Tsuru

IPC分类号： H05K1/00 ,  H05K3/00 ,  H05K3/02 ,  H05K3/46 ,  B44C1/22

CPC分类号： H05K3/4655 ,  H05K3/0035 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01078 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0554 ,  H05K3/0094 ,  H05K3/025 ,  H05K3/4652 ,  H05K3/4676

摘要： A multilayer printed circuit board small in interlayer thickness, capable of fine wiring, minimized in IVH and BVH diameters, high in strength and also excellent in wire bonding workability can be produced by a process comprising the steps of coating a thermosetting resin varnish compounded with electrically insulating whiskers on a roughened side of a copper foil, semi-curing the resin by heating to form a thermosetting resin layer, integrally laminating it on an interlayer board in which plated through-holes and conductor circudits have been formed, and roughening the cured thermosetting resin layer on the via hole wall surfaces with a roughening agent.

摘要翻译： 可以通过包括以下步骤的方法制备层间厚度小的能够精细布线，IVH和BVH直径最小化，强度高以及引线键合加工性优异的多层印刷电路板，其中包括以下步骤：涂覆电化学复合的热固性树脂清漆 在铜箔的粗糙面上的绝缘晶须，通过加热半固化以形成热固性树脂层，将其整体地层压在已经形成电镀通孔和导体环形的夹层板上，并使固化的热固性树脂 树脂层在通孔壁表面上用粗糙剂。

公开(公告)号：US09673362B2

公开(公告)日：2017-06-06

申请号：US12303188

申请日：2007-05-21

申请人： Naoyuki Urasaki

发明人： Naoyuki Urasaki

IPC分类号： H01L33/00 ,  H01L33/60 ,  H01L33/48 ,  H01L33/38 ,  H01L33/50 ,  H01L33/52 ,  H01L33/62 ,  H01L23/00

CPC分类号： H01L33/60 ,  H01L24/45 ,  H01L24/73 ,  H01L33/38 ,  H01L33/486 ,  H01L33/50 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An optical semiconductor element mounting package that has good adhesion between the resin molding and the lead electrodes and has excellent reliability is provided, as well as an optical semiconductor device using the package is also provided. The optical semiconductor element mounting package having a recessed part that serves as an optical semiconductor element mounting region, wherein the package is formed by integrating: a resin molding composed of a thermosetting light-reflecting resin composition, which forms at least the side faces of the recessed part; and at least a pair of positive and negative lead electrodes disposed opposite each other so as to form part of the bottom face of the recessed part, and there is no gap at a joint face between the resin molding and the lead electrodes.

公开(公告)号：US20090315049A1

公开(公告)日：2009-12-24

申请号：US12303188

申请日：2007-05-21

申请人： Naoyuki Urasaki ,  Kanako Yuasa

发明人： Naoyuki Urasaki ,  Kanako Yuasa

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L24/45 ,  H01L24/73 ,  H01L33/38 ,  H01L33/486 ,  H01L33/50 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An optical semiconductor element mounting package that has good adhesion between the resin molding and the lead electrodes and has excellent reliability is provided, as well as an optical semiconductor device using the package is also provided. The optical semiconductor element mounting package having a recessed part that serves as an optical semiconductor element mounting region, wherein the package is formed by integrating: a resin molding composed of a thermosetting light-reflecting resin composition, which forms at least the side faces of the recessed part; and at least a pair of positive and negative lead electrodes disposed opposite each other so as to form part of the bottom face of the recessed part, and there is no gap at a joint face between the resin molding and the lead electrodes.

摘要翻译： 提供了一种光学半导体元件安装封装，其具有树脂模制品和引线电极之间良好的粘合性并且具有优异的可靠性，并且还提供了使用该封装的光学半导体器件。 所述光半导体元件安装封装具有作为光半导体元件安装区域的凹部，其特征在于，所述封装通过以下方式形成：将由热固性光反射树脂组合物构成的树脂成形体形成为至少形成所述 凹陷部分 以及至少一对彼此相对设置的正极和负极引线电极，以形成凹部的底面的一部分，并且在树脂模制品和引线电极之间的接合面处没有间隙。

公开(公告)号：US5638598A

公开(公告)日：1997-06-17

申请号：US462853

申请日：1995-06-05

申请人： Akishi Nakaso ,  Kouichi Tsuyama ,  Akinari Kida ,  Shuichi Hatakeyama ,  Naoyuki Urasaki

发明人： Akishi Nakaso ,  Kouichi Tsuyama ,  Akinari Kida ,  Shuichi Hatakeyama ,  Naoyuki Urasaki

IPC分类号： H05K3/00 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46 ,  H01K3/10

CPC分类号： H05K3/4069 ,  H05K3/0055 ,  H05K2201/0305 ,  H05K2201/0338 ,  H05K2201/0341 ,  H05K2201/0355 ,  H05K2201/09454 ,  H05K2201/09745 ,  H05K2203/0346 ,  H05K2203/0384 ,  H05K2203/0554 ,  H05K2203/1453 ,  H05K3/06 ,  H05K3/4038 ,  H05K3/4623 ,  H05K3/4652 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A process for producing a wiring board involves laminating a metal foil on both sides of an insulating substrate not completely cured, followed by pressing with heating; drilling holes in the resulting laminate for connecting circuits therein; removing portions of the metal foils in narrow areas around the holes to form hollow portions in the metal foils; and filling a flowable electroconductive substance in the holes and the hollow portions.

摘要翻译： 制造布线板的方法包括在未完全固化的绝缘基板的两侧层压金属箔，然后加热压制; 在所得的层压板中钻孔以在其中连接电路; 在孔周围的狭窄区域中去除金属箔的部分，以在金属箔中形成中空部分; 并在孔和中空部分填充可流动的导电物质。

公开(公告)号：US5444189A

公开(公告)日：1995-08-22

申请号：US77722

申请日：1993-06-17

申请人： Akishi Nakaso ,  Kouichi Tsuyama ,  Akinari Kida ,  Shuichi Hatakeyama ,  Naoyuki Urasaki

发明人： Akishi Nakaso ,  Kouichi Tsuyama ,  Akinari Kida ,  Shuichi Hatakeyama ,  Naoyuki Urasaki

IPC分类号： H05K3/46 ,  H05K1/09 ,  H05K1/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/40 ,  H05K1/00

CPC分类号： H05K1/116 ,  H05K3/0055 ,  H05K3/062 ,  H05K3/4069 ,  H05K1/095 ,  H05K2201/0305 ,  H05K2201/0338 ,  H05K2201/0341 ,  H05K2201/0355 ,  H05K2201/09454 ,  H05K2201/09745 ,  H05K2203/0346 ,  H05K2203/0369 ,  H05K2203/0384 ,  H05K2203/0554 ,  H05K2203/1453 ,  H05K3/06 ,  H05K3/4038 ,  H05K3/4623 ,  H05K3/4652

摘要： A wiring board comprising one or more inner layer circuit substrates and outer circuit layers formed from metal foil layers on both sides of said dinner layer circuit substrates via prepregs, said inner layer circuit substrate comprising an insulating layer and metal foil layers formed on both sides of said insulating layer, at least one inner layer circuit substrate or said outer circuit layers or both having hollow portions in the metal foil layer filled with an electroconductive substance, said wiring board having one or more through-holes at least in the hollow portions and filled with the electroconductive substance, has high reliability and a high wiring density.

摘要翻译： 一种布线板，包括一个或多个内层电路基板和由所述晚餐层电路基板两侧的金属箔层经由预浸料形成的外部电路层，所述内层电路基板包括绝缘层和金属箔层， 所述绝缘层，至少一个内层电路基板或所述外电路层或两者在金属箔层中具有填充有导电物质的中空部分，所述布线板至少在中空部分中具有一个或多个通孔，并填充 与导电物质具有高可靠性和高布线密度。

公开(公告)号：US5403672A

公开(公告)日：1995-04-04

申请号：US59658

申请日：1993-05-12

申请人： Naoyuki Urasaki ,  Kouichi Tsuyama ,  Kiyoshi Hasegawa ,  Shuichi Hatakeyama ,  Akinari Kida ,  Akishi Nakaso ,  Hiroshi Nomura

发明人： Naoyuki Urasaki ,  Kouichi Tsuyama ,  Kiyoshi Hasegawa ,  Shuichi Hatakeyama ,  Akinari Kida ,  Akishi Nakaso ,  Hiroshi Nomura

IPC分类号： H05K3/02 ,  H05K3/06 ,  H05K3/38 ,  B32B15/20 ,  B32B3/30

CPC分类号： H05K3/025 ,  H05K3/062 ,  H05K2203/0152 ,  H05K2203/0307 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0723 ,  H05K2203/0726 ,  H05K3/383 ,  Y10S428/935 ,  Y10T29/49155 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/1291 ,  Y10T428/12993

摘要： A metal foil for printed wiring boards comprising a first copper layer to be adhered to a resin, a second copper layer having a sufficient strength as a metal layer and a nickel-phosphorus alloy layer containing 1.1% by weight or more of phosphorus formed between the first and second copper layers is suitable for producing printed wiring boards having excellent heat resistance, particularly during production procedures.

摘要翻译： 一种用于印刷电路板的金属箔，包括要粘附到树脂上的第一铜层，具有足够强度作为金属层的第二铜层和含有1.1重量％以上的磷的镍 - 磷合金层， 第一和第二铜层适用于制造具有优异耐热性的印刷电路板，特别是在制造过程中。