公开(公告)号：US5831828A

公开(公告)日：1998-11-03

申请号：US71630

申请日：1993-06-03

Applicant: Lawrence R. Cutting ,  Michael A. Gaynes ,  Eric A. Johnson ,  Cynthia S. Milkovich ,  Jeffrey S. Perkins ,  Mark V. Pierson ,  Steven E. Poetzinger ,  Jerzy Zalesinski

Inventor： Lawrence R. Cutting ,  Michael A. Gaynes ,  Eric A. Johnson ,  Cynthia S. Milkovich ,  Jeffrey S. Perkins ,  Mark V. Pierson ,  Steven E. Poetzinger ,  Jerzy Zalesinski

IPC: H01L21/48 ,  H01L23/367 ,  H01L23/538 ,  H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/12 ,  H05K3/34 ,  H05K7/20

CPC classification number: H05K7/20454 ,  H01L21/4857 ,  H01L21/4867 ,  H01L23/3672 ,  H01L23/5387 ,  H05K1/021 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/1216 ,  H05K3/4691 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01322 ,  H05K1/0298 ,  H05K1/182 ,  H05K2201/0154 ,  H05K2201/09063 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/1056 ,  H05K2201/2009 ,  H05K2203/1394 ,  H05K3/3415 ,  H05K3/3452 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: A multi-layer flexible circuit board has thicker regions to which surface-mount-technology (SMT) components (such as flip chips and QFPs) and pin-in-hole (PIH) components are mounted on both sides and which contains conductive through vias between wiring layers. After the SMT components have been mounted to the first side, a screening fixture with a support surface that has cavities conforming the components on the first side, is used to screen solder paste to the other side of the board. The thicker regions are surrounded by thinner regions of the board with fewer wiring layers and preferably fewer or thinner dielectric layers, and which can be bent along a line without bending the thicker regions. A common heat spreader plate with cavities or holes for multiple components is laminated to the thicker regions on one side of the board. The thicker regions have windows in which wire-bond chips are mounted to the heat spreader and the chips are wirebonded to the other side of the board. A thermally conductive adhesive or grease connects between the components and the bottoms of the cavities. Two heat sink plates are bolted together and along with other such heat sink plates are bolted to an enclosure frame to improve thermal performance.

Abstract translation: 多层柔性电路板具有较厚的区域，表面贴装技术（SMT）部件（例如倒装芯片和QFP）和销钉（PIH）部件安装在两侧并且包含导电通孔 布线层之间。 在SMT部件已经安装到第一侧之后，使用具有与第一面上的部件相符合的空腔的支撑表面的屏蔽夹具将焊膏屏蔽到板的另一侧。 较厚的区域由较薄的区域围绕，具有更少的布线层，优选更少或更薄的介电层，并且可以沿着线弯曲而不弯曲较厚的区域。 具有用于多个部件的空腔或孔的普通散热板被层压到板的一侧上较厚的区域。 较厚的区域具有将引线键合芯片安装到散热器的窗口，并且芯片被引线键合到板的另一侧。 导热粘合剂或油脂在部件和空腔的底部之间连接。 两个散热板被螺栓连接在一起，并且与其它这样的散热板一起用螺栓连接到外壳框架以改善热性能。

公开(公告)号：US5759269A

公开(公告)日：1998-06-02

申请号：US470507

申请日：1995-06-06

Applicant: Lawrence R. Cutting ,  Michael A. Gaynes ,  Eric A. Johnson ,  Cynthia S. Milkovich ,  Jeffrey S. Perkins ,  Mark V. Pierson ,  Steven E. Poetzinger ,  Jerzy Zalesinski

Inventor： Lawrence R. Cutting ,  Michael A. Gaynes ,  Eric A. Johnson ,  Cynthia S. Milkovich ,  Jeffrey S. Perkins ,  Mark V. Pierson ,  Steven E. Poetzinger ,  Jerzy Zalesinski

IPC: H01L21/48 ,  H01L23/367 ,  H01L23/538 ,  H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/12 ,  H05K3/34 ,  H05K7/20 ,  B05C13/00

CPC classification number: H05K7/20454 ,  H01L21/4857 ,  H01L21/4867 ,  H01L23/3672 ,  H01L23/5387 ,  H05K1/021 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/1216 ,  H05K3/4691 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01322 ,  H05K1/0298 ,  H05K1/182 ,  H05K2201/0154 ,  H05K2201/09063 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/1056 ,  H05K2201/2009 ,  H05K2203/1394 ,  H05K3/3415 ,  H05K3/3452 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: A screen printing machine comprising a backing plate with holes conforming to components attached to the surface of a flexible circuit board. The machine includes a screen which patterns solder paste on the surface of the circuit board while the circuit board is on the backing plate. Also included is a spring loaded element disposed adjacent to the backing plate which applies a predetermined continuous force to the four corners of the circuit board. This force is applied in a diagonal direction to the corners to stretch the circuit board so that the circuit board is parallel to the backing plate during screening.

Abstract translation: 一种丝网印刷机，其包括具有与附接到柔性电路板的表面的部件相符的孔的背板。 该机器包括在电路板位于背板上时在电路板表面上形成焊膏的屏幕。 还包括弹簧加载元件，其布置成与背板相邻，其向电路板的四个角施加预定的连续力。 该力沿对角方向施加到角部以拉伸电路板，使得电路板在屏蔽期间平行于背板。

公开(公告)号：US5478700A

公开(公告)日：1995-12-26

申请号：US171898

申请日：1993-12-21

Applicant: Michael A. Gaynes ,  George D. Oxx ,  Mark V. Pierson ,  Jerzy Zalesinski

Inventor： Michael A. Gaynes ,  George D. Oxx ,  Mark V. Pierson ,  Jerzy Zalesinski

IPC: B05C5/02 ,  B23K3/06 ,  H01L21/48 ,  H01L21/60 ,  H05K3/12 ,  H05K3/32 ,  H05K3/34 ,  G03F7/16 ,  B05D5/12 ,  B23K31/02

CPC classification number: H01L24/27 ,  B23K3/0692 ,  H01L21/4853 ,  H01L21/4867 ,  H01L24/83 ,  H05K3/1233 ,  H05K3/3484 ,  B23K2201/36 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K2201/0989 ,  H05K2203/0126 ,  H05K2203/043 ,  H05K2203/0568 ,  H05K2203/0577 ,  H05K3/321 ,  H05K3/3452 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: A method of applying bonding agents, such as solder pastes and conductive adhesives, to pad sites in the manufacture of electronic circuits uses a bonding agent injection head which includes a wiping guide, a blade which cooperates with the wiping guide to form an elongate nozzle slit, and an evacuation path ahead of the nozzle slit in a direction of movement of the injection head. A permanent mask with cavity openings is applied around conductive pads on a carrier. The conductive pads correspond to chip attachment sites. The injection head is brought into contact with a surface of the mask, and pressure is applied to a bonding agent in the injection head. The injection head is then moved over the surface of the mask, filling cavity openings with the bonding agent. The evacuation path ahead of the nozzle slit lets air out of the cavity openings as the cavity openings are filled with bonding agent. The injection head is then removed from the surface of the mask. If a solder paste is used, infrared radiation is applied to filled cavity openings to evaporate a paste flux and reflow solder to form solder balls within the cavity openings projecting above the mask. If a conductive adhesive is used, a stencil is applied to the surface of the mask prior to contacting the mask with said injection head. When the cavity openings are filled, the stencil is removed from the mask and the conductive adhesive filling the cavity openings is dried.

Abstract translation: 在电子电路的制造中，将粘合剂（例如焊膏和导电粘合剂）施加到衬垫部位的方法使用粘合剂注射头，其包括擦拭引导件，与擦拭引导件配合形成细长喷嘴狭缝的刀片 以及在注射头的移动方向上的喷嘴狭缝前方的抽空路径。 具有腔体开口的永久性掩模施加在载体上的导电焊盘周围。 导电垫对应于芯片附接位置。 使注射头与掩模的表面接触，并且将压力施加到注射头中的粘合剂。 然后将注射头移动到掩模的表面上，用粘合剂填充空腔开口。 喷嘴狭缝前方的抽空路径使空腔从空腔开口排出，因为空腔开口填充有粘结剂。 然后将注射头从掩模的表面去除。 如果使用焊膏，则将红外线辐射施加到填充的空腔开口，以蒸发浆料焊剂并回流焊料，以在突出在掩模上方的空腔开口内形成焊球。 如果使用导电粘合剂，则在将掩模与所述注射头接触之前，将模板施加到掩模的表面。 当空腔开口被填充时，将模板从掩模中取出，填充空腔开口的导电粘合剂被干燥。

公开(公告)号：US06774472B2

公开(公告)日：2004-08-10

申请号：US10246045

申请日：2002-09-17

Applicant: Mark V. Pierson

Inventor： Mark V. Pierson

IPC: H01L2302

CPC classification number: H01L24/97 ,  H01L23/5385 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/00

Abstract: A method of forming a plurality of individual semiconductor chip modules wherein a plurality of chips are placed in a plurality of chip compartments formed by adhering a support panel to the first surface and a cover panel to the second surface of a stiffener panel having openings defining sidewalls of the chip compartments. The resulting laminated panel structure is then cut into a plurality of modules each having at least one compartment containing at least one chip. Each chip is electrically connected to interior conductive pads on the inner surface of the support panel, and these interior pads in turn are connected by conductive paths to exterior conductive terminals deposited on the outer surface of the support panel. The electrical connections between the chip and the interior conductive pads of the support panel may be encapsulated in a polymeric material before the cover panel is adhered to the stiffener panel.

Abstract translation: 一种形成多个单独的半导体芯片模块的方法，其中将多个芯片放置在通过将支撑板粘附到第一表面而形成的多个芯片隔室中，并且将盖板覆盖到具有限定侧壁的开口的加强板的第二表面 的芯片隔间。 然后将所得的层压板结构切成多个模块，每个模块具有至少一个包含至少一个芯片的隔室。 每个芯片电连接到支撑板的内表面上的内部导电焊盘，并且这些内部衬垫又通过导电路径连接到沉积在支撑板的外表面上的外部导电端子。 在盖板粘附到加强板之前，芯片和支撑板的内部导电焊盘之间的电连接可被封装在聚合材料中。

公开(公告)号：US06674647B2

公开(公告)日：2004-01-06

申请号：US10040740

申请日：2002-01-07

Applicant: Mark V. Pierson ,  Ajit K. Trivedi

Inventor： Mark V. Pierson ,  Ajit K. Trivedi

IPC: H05K710

CPC classification number: H05K3/3436 ,  B23K26/0006 ,  B23K26/361 ,  B23K2101/42 ,  B23K2103/16 ,  H01L23/49816 ,  H01L24/81 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/81026 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/814 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K3/3457 ,  H05K2201/09745 ,  H05K2201/10992 ,  H05K2203/0278 ,  H05K2203/048 ,  Y02P70/613 ,  H01L2924/00

Abstract: Self-aligning combination of a substrate with a chip is provided, using reverse patterns of raised recesses and raised shapes on the respective substrate and chip surfaces. High-force contact bump production is avoided. Reliable contact between a chip and substrate is achieved, with minimized skewing after chip placement.

Abstract translation: 提供了基板与芯片的自对准组合，在相应的基板和芯片表面上使用凸起凹槽和凸起形状的反向图案。 避免了大力接触凸块生产。 实现芯片和基板之间的可靠接触，并且在芯片放置之后使偏移最小化。

公开(公告)号：US06661661B2

公开(公告)日：2003-12-09

申请号：US10040779

申请日：2002-01-07

Applicant: Michael A. Gaynes ,  Howard Victor Mahaney, Jr. ,  Mark V. Pierson

Inventor： Michael A. Gaynes ,  Howard Victor Mahaney, Jr. ,  Mark V. Pierson

IPC: H05K720

CPC classification number: H01L23/3675 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  Y10T29/4935

Abstract: A common heatsink for multiple chips and modules which are spaced on electronic packages, and an arrangement for the formation of precision gaps intermediate two or more chips or modules covered by a common heatsink. Furthermore, a precision tool enables positioning of a common heatsink for multiple chips and modules for electronic packages facilitating the formation of x, y and z-directional compliant thermal interfaces intermediate a plurality of chips and a common heatsink with minimized effects of package tolerances.

Abstract translation: 用于在电子封装上间隔开的多个芯片和模块的共同散热器，以及用于在由公共散热器覆盖的两个或更多个芯片或模块之间形成精密间隙的装置。 此外，精密工具使得能够为用于电子封装的多个芯片和模块的公共散热器定位，便于在多个芯片和共用散热器之间形成x，y和z方向兼容的热接口，并具有最小化的封装公差的影响。

公开(公告)号：US06206997B1

公开(公告)日：2001-03-27

申请号：US09248341

申请日：1999-02-11

Applicant: Frank D. Egitto ,  Michael A. Gaynes ,  Ramesh R. Kodnani ,  Luis J. Matienzo ,  Mark V. Pierson

Inventor： Frank D. Egitto ,  Michael A. Gaynes ,  Ramesh R. Kodnani ,  Luis J. Matienzo ,  Mark V. Pierson

IPC: B32B3112

CPC classification number: B29C59/14 ,  H01L21/56 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A method for bonding heat sinks to packaged electronic components comprises the steps of: (a) exposing to a plasma a surface of a molded polymer formed on a substrate; (b) allowing the plasma to at least partially convert silicon-containing residue on the surface to silica; and (c) bonding an article to the surface by applying an adherent material between the article and the surface. Often, the silicon-containing residue is silicone oil, a mold release compound, which may prevent the formation of a bond when using conventional bonding methods and materials. The silica layer formed on the surface of the molded polymer assists in formation of a proper bond. The plasma may be an oxygen plasma and the adherent material may be selected from either a heat cured silicone-based paste adhesive with a metal oxide filler or a heat cured porous polymer film impregnated with adhesive. In particular, the film may be polytetrafluoroethylene, the adhesive may be polybutadine, and the film may be further impregnated with a metal oxide heat transfer medium, such as zinc oxide. An alternate method comprises applying the porous polymer film without plasma treatment and heat curing the film to form a proper bond.

Abstract translation: 一种用于将散热器粘合到封装的电子部件的方法包括以下步骤：（a）将形成在基底上的模制聚合物的表面暴露于等离子体; （b）允许等离子体至少部分地将表面上的含硅残余物转化为二氧化硅; 和（c）通过在制品和表面之间施加粘附材料将制品粘合到表面上。 通常，含硅残渣是使用常规粘合方法和材料的硅油，脱模剂，可以防止形成粘结。 形成在模塑聚合物表面上的二氧化硅层有助于形成适当的键。 等离子体可以是氧等离子体，并且粘附材料可以选自具有金属氧化物填料的热固化硅氧烷基糊状粘合剂或浸渍有粘合剂的热固化多孔聚合物膜。 特别地，膜可以是聚四氟乙烯，粘合剂可以是聚丁二烯，并且该膜可以进一步用金属氧化物传热介质如氧化锌浸渍。 替代方法包括在不进行等离子体处理的情况下应用多孔聚合物膜并热固化膜以形成适当的键。

公开(公告)号：US06193576B1

公开(公告)日：2001-02-27

申请号：US09082287

申请日：1998-05-19

Applicant: Michael A. Gaynes ,  Allan O. Johnson ,  Ramesh R. Kodnani ,  Mark V. Pierson ,  Edward J. Tasillo

Inventor： Michael A. Gaynes ,  Allan O. Johnson ,  Ramesh R. Kodnani ,  Mark V. Pierson ,  Edward J. Tasillo

IPC: H01J900

CPC classification number: G02F1/13336 ,  Y10S345/903

Abstract: A method for aligning a plurality of thin film transistor tiles for constructing a flat panel display. A coverplate is arranged on a coverplate support. A first layer of a bonding material is applied to at least one of a first side of each of the tiles and a surface of the coverplate on which the tiles are to be secured. The tiles are arranged on the coverplate, such that the first layer of bonding material is arranged between the tiles and the coverplate. The tiles are connected to an alignment apparatus. The tiles are aligned relative to each other and the coverplate. The tiles are at least partially secured to the coverplate.

Abstract translation: 一种用于对准多个用于构建平板显示器的薄膜晶体管瓦片的方法。 盖板安装在盖板支架上。 接合材料的第一层被施加到每个瓷砖的第一侧中的至少一个以及待固定瓷砖的盖板的表面。 瓦片布置在盖板上，使得第一层粘合材料布置在瓦片和盖板之间。 瓦片连接到对准装置。 瓷砖相对于彼此和盖板对准。 瓦片至少部分地固定到盖板上。

公开(公告)号：US06177729B1

公开(公告)日：2001-01-23

申请号：US09303290

申请日：1999-04-03

Applicant: Joseph A. Benenati ,  Claude L. Bertin ,  William T. Chen ,  Thomas E. Dinan ,  Wayne F. Ellis ,  Wayne J. Howell ,  John U. Knickerbocker ,  Mark V. Pierson ,  William R. Tonti ,  Jerzy M. Zalesinski

Inventor： Joseph A. Benenati ,  Claude L. Bertin ,  William T. Chen ,  Thomas E. Dinan ,  Wayne F. Ellis ,  Wayne J. Howell ,  John U. Knickerbocker ,  Mark V. Pierson ,  William R. Tonti ,  Jerzy M. Zalesinski

IPC: H01L2348

CPC classification number: H01L24/16 ,  G01R1/0483 ,  H01L24/11 ,  H01L24/12 ,  H01L24/17 ,  H01L24/83 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/1319 ,  H01L2224/17051 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/111 ,  H05K3/321 ,  H05K2201/0133 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0307 ,  Y10T428/12472 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014

Abstract: An integrated circuit assembly has pads of a chip electrically connected to pads of a substrate with rolling metal balls. A pliable material bonds the balls in movable contact with pads of the chip and substrate. Because the balls are relatively free to move, thermal expansion differences that would ordinarily cause enormous stresses in the attached joints of the prior art, simply cause rolling of the balls of the present invention, avoiding thermal stress altogether. Reliability of the connections is substantially improved as compared with C4 solder bumps, and chips can be safely directly mounted to such substrates as PC boards, despite substantial thermal mismatch.

Abstract translation: 集成电路组件具有与滚动金属球电连接到衬底的焊盘的芯片焊盘。 柔韧的材料将球与芯片和衬底的焊盘可动地接触。 由于球相对自由移动，因此在现有技术的连接接头中通常会引起巨大应力的热膨胀差异简单地导致本发明的滚珠滚动，从而完全避免热应力。 与C4焊料凸块相比，连接的可靠性大大提高，尽管存在大量的热失配，芯片可以安全地直接安装到诸如PC板的基板上。

公开(公告)号：US6142361A

公开(公告)日：2000-11-07

申请号：US458483

申请日：1999-12-09

Applicant: Francis J. Downes, Jr. ,  Robert M. Japp ,  Mark V. Pierson

Inventor： Francis J. Downes, Jr. ,  Robert M. Japp ,  Mark V. Pierson

IPC: H01L21/60 ,  H05K3/30 ,  H05K3/34 ,  B23K1/20 ,  B23K31/02

CPC classification number: H01L24/81 ,  B23K2201/40 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/303 ,  H05K3/3436 ,  Y10T29/4913 ,  Y10T29/53196

Abstract: A method, and associated structure, for adhesively coupling a chip to an organic chip carrier. The chip is attached to a top surface of the organic chip carrier by interfacing a solder bump between a C4 solder structure on the chip and a pad on a top surface of the chip carrier. The melting temperature of the solder bump is less than the melting temperature of the C4 solder structure. A block of ferrous material is placed on a top surface of the chip. A temporary or permanent stiffener of ferrous material is placed on the top surface of the chip carrier. A permanent magnet is coupled to a bottom surface of the chip carrier. Alternatively, an electromagnetic could be utilized instead of the electromagnet. Due to the permanent magnet or the electromagnet, a magnetic force on the stiffener is directed toward the magnet and substantially flattens the first surface of the chip carrier. Similarly, a magnetic force on the block is directed toward the magnet such that the electronic component and the chip carrier are held in alignment. The solder bump is reflowed at a temperature between the melting temperature of the solder bump and the melting temperature of the C4 solder structure. The reflowing reconfigures the solder bump. The magnetic force on the block frictionally clamps the reflowed solder between the C4 solder structure and the pad. The chip and carrier are cooled, resulting in the C4 solder structure being adhesively and conductively coupled to the pad.

Abstract translation: 一种用于将芯片粘合地耦合到有机芯片载体的方法和相关联的结构。 芯片通过在芯片上的C4焊料结构和芯片载体的顶表面上的焊盘之间接合焊料凸块来附接到有机芯片载体的顶表面。 焊料凸点的熔化温度小于C4焊料结构的熔化温度。 将一块黑色金属材料放置在芯片的上表面上。 铁芯材料的临时或永久性加强件被放置在芯片载体的顶表面上。 永磁体耦合到芯片载体的底表面。 或者，可以使用电磁来代替电磁体。 由于永磁体或电磁体，加强件上的磁力被引向磁体并且基本平坦化芯片载体的第一表面。 类似地，块上的磁力指向磁体，使得电子部件和芯片载体保持对准。 在焊料凸块的熔化温度和C4焊料结构的熔化温度之间的温度下回流焊料凸点。 回流重新配置焊料凸块。 块上的磁力摩擦地夹住C4焊料结构和焊盘之间的回流焊料。 芯片和载体被冷却，导致C4焊料结构被粘性地导电耦合到焊盘。