公开(公告)号：US6029344A

公开(公告)日：2000-02-29

申请号：US132843

申请日：1998-08-12

Applicant: Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: B23K20/00 ,  C23C18/16 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H05K1/14 ,  H05K3/20 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10 ,  H01R43/16

CPC classification number: H05K7/1069 ,  B23K20/004 ,  C23C18/1657 ,  C25D7/12 ,  G01R1/0483 ,  G01R1/07357 ,  G01R1/07378 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3426 ,  H05K3/4015 ,  B23K2201/40 ,  C25D21/02 ,  C25D5/08 ,  C25D5/22 ,  H01L21/76897 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L24/45 ,  H01L24/49 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K3/20 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4092 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49204 ,  Y10T29/49224 ,  Y10T29/49609

Abstract: Interconnection elements for electronic components, exhibiting desirable mechanical characteristics (such as resiliency, for making pressure contacts) are formed by shaping an elongate element (core) of a soft material (such as gold) to have a springable shape (including cantilever beam, S-shape, U-shape), and overcoating the shaped elongate element with a hard material (such as nickel and its alloys), to impart a desired spring (resilient) characteristic to the resulting composite interconnection element. A final overcoat of a material having superior electrical qualities (e.g., electrical conductivity and/or solderability) may be applied to the composite interconnection element. The elongate element may be formed from a wire, or from a sheet (e.g., metal foil). The resulting interconnection elements may be mounted to a variety of electronic components, including directly to semiconductor dies and wafers (in which case the overcoat material anchors the composite interconnection element to a terminal (or the like) on the electronic component), may be mounted to support substrates for use as interposers and may be mounted to substrates for use as probe cards or probe card inserts. In one embodiment, a hybrid composite interconnection element is formed by mounting a core to an end of an flat elongate element formed from a sheet, and overcoating at least the core, the flat elongate element providing a "floating" support for the overcoated core, capable of absorbing non-planarities (tolerances) of an electronic component. Methods of fabricating interconnection elements on sacrificial substrates are described. Methods of fabricating tip structures and contact tips at the end of interconnection elements are described.

Abstract translation: 通过将软材料（例如金）的细长元件（芯）成形为具有弹性形状（包括悬臂梁，S形状）形成用于电子部件的互连元件，具有期望的机械特性（例如弹性，用于形成压力接触） 形状，U形），并用硬质材料（例如镍及其合金）涂覆成形的细长元件，以赋予所形成的复合互连元件所需的弹簧（弹性）特性。 可以对复合互连元件施加具有优异电气质量（例如导电性和/或可焊性）的材料的最终外涂层。 细长元件可以由线或者从片材（例如，金属箔）形成。 所得到的互连元件可以安装到各种电子部件，包括直接连接到半导体管芯和晶片（在这种情况下，外罩材料将复合互连元件锚定到电子部件上的端子等），可以被安装 以支撑用作内插件的基板，并且可以安装到用作探针卡或探针卡插入件的基板。 在一个实施例中，通过将芯安装到由片形成的扁平细长元件的端部而形成混合复合互连元件，并且至少覆盖所述芯，所述扁平细长元件为所述外包层芯提供“浮动”支撑， 能够吸收电子部件的非平面性（公差）。 描述了在牺牲基板上制造互连元件的方法。 描述了在互连元件的末端处制造尖端结构和接触尖端的方法。

公开(公告)号：US6011693A

公开(公告)日：2000-01-04

申请号：US977247

申请日：1997-11-24

Applicant: John G. Gore

Inventor： John G. Gore

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/28 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H01L41/053

CPC classification number: H05K1/141 ,  H05K1/0243 ,  H05K3/303 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/3442 ,  H05K3/3447 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/3025 ,  H05K1/0271 ,  H05K2201/049 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09181 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10083 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10727 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10848 ,  H05K2201/10871 ,  H05K2201/10946 ,  H05K2201/10969 ,  H05K2201/10984 ,  H05K2203/041 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/368 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49144

Abstract: A surface mounting stress relief system for mounting a surface mount package such as a leadless ceramic chip carrier on a printed circuit board includes a printed circuit board having a top layer attached to a bottom layer. The top layer includes cavities for exposing top surface portion of the bottom layer which carry a plurality of solder pads. The surface mount package is positioned on the printed circuit board for placing the package bottom surface on a top surface of the printed circuit board between the cavities while positioning package contact pads in spaced relation above corresponding preselected solder pads. A solder column extends between each of the plurality of corresponding solder pads and the selected contact pads for providing an electrical connection. The solder column is formed by applying a solder paste to the solder pads on the printed circuit board, screening a low temperature solder paste onto each of the contact pads of the surface mount package, placing a solder ball onto each pad, and attaching the solder ball to each of the contact pads of the package by passing the package through a reflow oven for reflowing the low temperature solder paste without reflowing the high temperature solder ball.

Abstract translation: 用于将诸如无引线陶瓷芯片载体的表面贴装封装安装在印刷电路板上的表面安装应力消除系统包括具有连接到底层的顶层的印刷电路板。 顶层包括用于暴露底层的顶表面部分的空腔，其承载多个焊盘。 表面安装封装位于印刷电路板上，用于将封装底表面放置在印刷电路板的上表面之间，同时将封装接触焊盘定位在相应的预选焊盘上方。 焊料柱在多个对应的焊盘和所选择的接触焊盘中的每一个之间延伸以提供电连接。 焊料柱通过将焊膏涂布到印刷电路板上的焊盘上而形成，将低温焊膏筛选到表面贴装封装的每个接触焊盘上，将焊球放置在每个焊盘上，并将焊料 通过使包装通过回流炉以回流低温焊膏而不回流高温焊球，从而将其包裹到每个接触焊盘。

公开(公告)号：US5884398A

公开(公告)日：1999-03-23

申请号：US839760

申请日：1997-04-15

Applicant: Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: B23K20/00 ,  C23C18/16 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H05K1/14 ,  H05K3/20 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H01R9/00

CPC classification number: B23K20/004 ,  B23K20/007 ,  C25D7/12 ,  G01R31/2884 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H05K3/326 ,  H05K3/4015 ,  B23K2201/40 ,  C25D21/02 ,  C25D5/08 ,  C25D5/22 ,  G01R31/2886 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13582 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L24/45 ,  H01L24/49 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K3/20 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4092 ,  Y02P70/611 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit board or the like having a plurality of terminals disposed on a surface thereof. Subsequently, the semiconductor dies may be singulated from the semiconductor wafer, whereupon the same resilient contact structures can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements of the present invention as the resilient contact structures, burn-in can be performed at temperatures of at least 150.degree. C., and can be completed in less than 60 minutes.

Abstract translation: 弹性接触结构直接安装在半导体晶片上的接合焊盘上，在裸片与半导体晶片分离（分离）之前。 这使得半导体管芯能够通过具有设置在其表面上的多个端子的电路板等连接到半导体管芯来进行（例如，测试和/或烧入）。 接下来，半导体管芯可以从半导体晶片分离，因此可以使用相同的弹性接触结构来实现半导体管芯和其他电子部件（例如布线基板，半导体封装等）之间的互连。 使用本发明的全金属复合互连元件作为弹性接触结构，可以在至少150℃的温度下进行老化，并且可以在少于60分钟内完成。

公开(公告)号：US5441430A

公开(公告)日：1995-08-15

申请号：US223716

申请日：1994-04-06

Applicant: Jack Seidler

Inventor： Jack Seidler

IPC: H01R4/02 ,  H01R12/52 ,  H01R12/72 ,  H05K3/34 ,  H05K3/36

CPC classification number: H01R12/52 ,  H01R12/728 ,  H05K3/366 ,  H01R4/02 ,  H05K2201/10386 ,  H05K2201/10757 ,  H05K2201/10984 ,  H05K3/3421

Abstract: A clip lead is provided for soldering to and supporting a first substrate vertically on a second substrate which may be horizontal. The terminal end of the clip is configured to form a stable support for the substrate during soldering in a vertical position to the second substrate by being bent at right angles to and extending under the first substrate.

Abstract translation: 提供了一种夹子引线，用于在可以是水平的第二基底上垂直焊接并支撑第一衬底。 夹子的末端被构造成通过在与第一基底成直角并且在第一基底下方弯曲而在与第二基底垂直的位置进行焊接期间为基底形成稳定的支撑。

公开(公告)号：US5198391A

公开(公告)日：1993-03-30

申请号：US897933

申请日：1992-06-15

Applicant: Helmut Rosel ,  Martin Eck

Inventor： Helmut Rosel ,  Martin Eck

IPC: H05K1/18 ,  H01L23/498 ,  H05K1/02 ,  H05K3/34 ,  H05K13/04

CPC classification number: H01L23/49861 ,  H05K13/046 ,  H05K3/3426 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K2201/10727 ,  H05K2201/10757 ,  H05K2201/10924 ,  H05K2201/10946 ,  Y02P70/613 ,  Y10T29/49121 ,  Y10T29/49144

Abstract: A method for electrically bonding surface-mountable integrated circuits (LLCCC-components) onto a printed circuit board. A specially shaped flexible bonding element having a semicircular central portion is used to flexibly connect the LLCCC components to the circuit board so that stresses due to thermal expansion of the components are absorbed.

Abstract translation: 一种将表面贴装集成电路（LLCCC组件）电连接到印刷电路板上的方法。 使用具有半圆形中心部分的特殊形状的柔性接合元件将LLCCC部件柔性地连接到电路板，从而吸收由于部件的热膨胀引起的应力。

公开(公告)号：US5096425A

公开(公告)日：1992-03-17

申请号：US593905

申请日：1990-10-05

Applicant: Hiroyuki Takahashi

Inventor： Hiroyuki Takahashi

IPC: H01C1/14 ,  H01G2/06 ,  H01G4/228 ,  H01L23/495 ,  H03H9/13 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01G2/06 ,  H01C1/14 ,  H01L23/49562 ,  H05K3/308 ,  H01F2027/295 ,  H01L2924/0002 ,  H05K2201/10651 ,  H05K2201/10696 ,  H05K2201/10757 ,  H05K2201/10871 ,  H05K3/3447

Abstract: Pin-shaped or flat-plate-shaped parallel terminals of an electronic or piezoelectric component for being inserted in through holes formed in a printed circuit board. The terminals are electrically connected to electrodes of the electronic component and arranged substantially parallel to each other. Each of the terminals includes a bent portion formed at a location along an axis of each terminal so as to project at least partially in a direction perpendicular to that, and the bent portions are generally at an imaginary surface defined by the terminals.

Abstract translation: 用于插入形成在印刷电路板中的通孔中的电子或压电元件的针形或平板形的平行端子。 端子电连接到电子部件的电极并且基本上彼此平行地布置。 每个端子包括形成在沿着每个端子的轴线的位置处的弯曲部分，以便至少部分地沿垂直于该端子的方向突出，并且弯曲部分通常处于由端子限定的假想表面。

公开(公告)号：US4995156A

公开(公告)日：1991-02-26

申请号：US748390

申请日：1985-06-25

Applicant: Giuseppe R. Pinnavaia

Inventor： Giuseppe R. Pinnavaia

IPC: H05K20060101 ,  H05K1/09 ,  H05K1/11 ,  H05K3/24 ,  H05K3/30 ,  H05K3/32

CPC classification number: H05K3/326 ,  H05K3/308 ,  H05K1/095 ,  H05K1/118 ,  H05K2201/091 ,  H05K2201/1059 ,  H05K2201/10757 ,  H05K2201/10795 ,  H05K2201/10871 ,  H05K2203/1189 ,  H05K2203/1446 ,  H05K2203/1453 ,  H05K3/245 ,  H05K3/306 ,  Y10T29/4913 ,  Y10T29/4914 ,  Y10T29/49837

Abstract: Subject-matter of this invention is a method for assembling components, such as M.O.S, devices and the like, upon printed circuit boards by clinching, such method including the steps of providing a board bearing a printed circuit with places upon which a component is to be assembled; applying the component upon the board with its pins in contact with the places of the circuit among which it is to be assembled; pressing the component in order that the pins are forced to penetrate through the thickness of the board; and clinching the end portions of the pins protruding from the back side of the board.

Abstract translation: 本发明的主题是在印刷电路板上通过铆接来组装诸如MOS，器件等的部件的方法，包括以下步骤：提供带有印刷电路的印刷电路板，其中部件将在其上 组装; 将所述部件施加在所述电路板上，其引脚与要组装的电路的位置接触; 按压组件以使销被迫穿过板的厚度; 并且夹紧从板的背面突出的销的端部。

公开(公告)号：US4949223A

公开(公告)日：1990-08-14

申请号：US373201

申请日：1989-06-30

Applicant: Masayoshi Achiwa

Inventor： Masayoshi Achiwa

IPC: H01L23/50 ,  H05K1/02 ,  H05K3/34 ,  H05K13/04

CPC classification number: H05K3/3426 ,  H05K13/046 ,  H05K1/0271 ,  H05K2201/10689 ,  H05K2201/10757 ,  H05K2203/176 ,  Y02P70/613

Abstract: The present invention is drawn to an electronic component in the form of a packaged semiconductor device or the like, and an electronic apparatus using the same, in which protrusions having a semicircular cross section are formed along the sides of the lower surface of the package, leads of the component include a first curved portion conformed to the contour of a protrusion, a second curved portion conformed to the lower surface of the first curved portion and a linking portion coupling the first and second curved portions. The leads project from the side of the package, and the lower surface of the second curved portion is soldered to the wiring pattern on a printed circuit board. With this structure, if the electronic component becomes defective, the package can be lifted from the surface of the printed circuit board by stretching the external leads, and the solder can be removed very easily. Accordingly, even if multiple electronic components are densely mounted on the printed circuit board, an individual defective electronic component can be easily replaced.

Abstract translation: 本发明涉及一种封装半导体器件等形式的电子元器件及其使用方法的电子设备，其中具有半圆形横截面的突起沿着封装的下表面形成， 部件的引线包括符合突起轮廓的第一弯曲部分，与第一弯曲部分的下表面相符的第二弯曲部分和联接第一和第二弯曲部分的连接部分。 引线从封装的一侧突出，并且第二弯曲部分的下表面焊接到印刷电路板上的布线图案。 利用这种结构，如果电子部件有缺陷，则可以通过拉伸外部引线从印刷电路板的表面抬起封装，并且可以非常容易地去除焊料。 因此，即使多个电子部件密集地安装在印刷电路板上，也可以容易地更换各个有缺陷的电子部件。

公开(公告)号：US4900276A

公开(公告)日：1990-02-13

申请号：US378544

申请日：1989-07-11

Applicant: Ray C. Doutrich

Inventor： Ray C. Doutrich

IPC: H05K3/30 ,  H05K3/34

CPC classification number: H01R12/58 ,  H05K3/308 ,  H05K2201/10189 ,  H05K2201/10757 ,  H05K2201/10878

Abstract: An electrical connector comprising a header with a plurality of terminal pins having means for retaining the header in position during soldering to a printed circuit board. Retention is accomplished by an offset formed as a crimp at the insertion end of at least one pair of terminals. The crimps exert opposite normal forces against one surface of their respective holes to retain the header during soldering.

Abstract translation: 一种电连接器，包括具有多个端子销的集管，所述端头具有用于在焊接到印刷电路板期间将集管保持在适当位置的装置。 通过在至少一对端子的插入端处形成为卷曲的偏移来实现保持。 卷曲对相应孔的一个表面施加相反的法向力，以在焊接期间保持接头。

公开(公告)号：US4827611A

公开(公告)日：1989-05-09

申请号：US173917

申请日：1988-03-28

Applicant: Deepak K. Pai ,  Michael J. Julik ,  Robert W. Fluhrer

Inventor： Deepak K. Pai ,  Michael J. Julik ,  Robert W. Fluhrer

IPC: H01L23/498 ,  H05K1/02 ,  H05K3/34

CPC classification number: H01L23/49811 ,  H05K3/3426 ,  H01F2027/295 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K2201/10727 ,  H05K2201/10757 ,  H05K2201/10924 ,  H05K2201/10946 ,  H05K2201/10984 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49149 ,  Y10T29/49169

Abstract: A compliant S-shaped lead for resiliently supporting an integrated circuit chip package in spaced relation generally parallel to a printed circuit board. The S-lead bends and twists to absorb forces which would otherwise be exerted on solder joints due to temperature cycling and vibration. The symmetrical S-lead self-centers on both the package and PC board to provide minimum stress. The leads are held by a support strip for connection to the chip carrier. Thereafter, the support strip is removed and the carrier positions the leads for connection to the circuit board.

Abstract translation: 一种兼容的S形引线，用于以大体上平行于印刷电路板的间隔关系弹性地支撑集成电路芯片封装。 S引线弯曲和扭曲以吸收否则将由于温度循环和振动而施加在焊点上的力。 封装和PC板上的对称S-lead自我中心，以提供最小的压力。 引线由用于连接到芯片载体的支撑条保持。 此后，移除支撑条，并且载体定位用于连接到电路板的引线。