公开(公告)号：US20070092992A1

公开(公告)日：2007-04-26

申请号：US11552702

申请日：2006-10-25

申请人： Horst Theuss

发明人： Horst Theuss

IPC分类号： H01L21/00 ,  H01L29/788 ,  H01L21/31 ,  H01L21/469

CPC分类号： H01L23/49503 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/17 ,  H01L2224/1703 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/81136 ,  H01L2224/81138 ,  H01L2224/81194 ,  H01L2224/81801 ,  H01L2224/83801 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor substrate, a semiconductor chip and a semiconductor component with areas composed of a stressed monocrystalline material, and a method for production of a semiconductor component is disclosed. In one embodiment, the semiconductor chip includes relatively thick stressed layers achieving reduced switching times. For this purpose, the semiconductor substrate has one or more areas with extrinsic, permanent curvature, with the crystal structure K being compressed and/or widened and/or distorted in these areas.

摘要翻译： 公开了一种半导体衬底，半导体芯片和具有由应力单晶材料构成的区域的半导体元件，以及用于制造半导体元件的方法。 在一个实施例中，半导体芯片包括实现减少的开关时间的相对厚的应力层。 为此，半导体衬底具有一个或多个具有外部永久曲率的区域，晶体结构K在这些区域中被压缩和/或加宽和/或变形。

公开(公告)号：US20050051905A1

公开(公告)日：2005-03-10

申请号：US10898081

申请日：2004-07-23

申请人： Jochen Dangelmaier ,  Horst Theuss

发明人： Jochen Dangelmaier ,  Horst Theuss

IPC分类号： H01L23/31 ,  H01L23/498 ,  H01L23/48

CPC分类号： H01L23/49861 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/3025

摘要： The invention relates to a semiconductor component having a plastic housing which encloses a rewiring structure which has flat conductors embedded in plastic. The flat conductors are formed either by a slotted metal sheet or by elongated contact connecting pads. Arranged on the contact connecting pads are flip-chip contacts of a semiconductor chip within the plastic housing, while external contact pads are connected to the flip-chip contacts via flat conductors or to the semiconductor chip via elongated contact connecting pads.

摘要翻译： 本发明涉及一种具有塑料外壳的半导体部件，该塑料外壳包围一个重新布线结构，该布线结构具有嵌入塑料的扁平导体。 扁平导体由开槽金属片或细长接触连接垫形成。 在接触连接焊盘上布置的是在塑料壳体内的半导体芯片的倒装芯片触点，而外部接触焊盘通过扁平导体连接到倒装芯片触点或通过细长的触点连接焊盘连接到半导体芯片。

公开(公告)号：US06784551B2

公开(公告)日：2004-08-31

申请号：US10238940

申请日：2002-09-10

申请人： Albert Auburger ,  Bernd Stadler ,  Stefan Paulus ,  Horst Theuss

发明人： Albert Auburger ,  Bernd Stadler ,  Stefan Paulus ,  Horst Theuss

IPC分类号： H01L2348

CPC分类号： H01L25/16 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/66 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48237 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/15313 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19103 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic device has a semiconductor chip and a passive component, whose electrical values can be varied. The semiconductor chip is electrically conductively connected to a rewiring structure that, together with the semiconductor chip and with the passive component, is enclosed by a housing made of plastic. A method for producing the electronic device is also described.

摘要翻译： 电子设备具有半导体芯片和无源元件，其电值可以变化。 半导体芯片导电地连接到重新布线结构，其与半导体芯片和被动元件一起被由塑料制成的壳体包围。 还描述了用于制造电子设备的方法。

公开(公告)号：US10107875B2

公开(公告)日：2018-10-23

申请号：US12627848

申请日：2009-11-30

申请人： Klaus Elian ,  Martin Petz ,  Uwe Schindler ,  Horst Theuss ,  Adolf Koller

发明人： Klaus Elian ,  Martin Petz ,  Uwe Schindler ,  Horst Theuss ,  Adolf Koller

IPC分类号： G01R33/09 ,  B82Y25/00 ,  G01D5/244 ,  G01P1/02 ,  G01P3/488 ,  H01L43/02

摘要： An integrated circuit includes a leadframe, and a die having a top surface, a bottom surface, and a plurality of perimeter sides and including at least one magnetic field sensor element disposed proximate to the top surface, wherein the bottom surface is bonded to the leadframe. A molded magnetic material encapsulates the die and at least a portion of the leadframe, and provides a magnetic field substantially perpendicular to the top surface of the die. A non-magnetic material is disposed between the die and the molded magnetic material at least along perimeter sides of the die intersecting a lateral magnetic field component which is parallel to the top surface of the die.

公开(公告)号：US09666452B2

公开(公告)日：2017-05-30

申请号：US13480513

申请日：2012-05-25

申请人： Karl Adolf Dieter Mayer ,  Guenter Tutsch ,  Horst Theuss ,  Manfred Engelhardt ,  Joachim Mahler

发明人： Karl Adolf Dieter Mayer ,  Guenter Tutsch ,  Horst Theuss ,  Manfred Engelhardt ,  Joachim Mahler

IPC分类号： H01L21/44 ,  H01L21/00 ,  H01L21/56 ,  H01L23/00 ,  H01L21/78

CPC分类号： H01L21/561 ,  H01L21/78 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/94 ,  H01L2224/03002 ,  H01L2224/05009 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/0566 ,  H01L2224/05664 ,  H01L2224/05684 ,  H01L2224/06181 ,  H01L2224/49175 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/12032 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/03

摘要： A method for manufacturing a chip package is provided. The method including: holding a carrier including a plurality of dies; forming a separation between the plurality of dies by removing from the carrier one or more portions of the carrier between the plurality of dies; forming an encapsulation material in the removed one or more portions between the plurality of dies; separating the dies through the encapsulation material.

公开(公告)号：US09121885B2

公开(公告)日：2015-09-01

申请号：US12857242

申请日：2010-08-16

申请人： Klaus Elian ,  Horst Theuss ,  Guenther Ruhl

发明人： Klaus Elian ,  Horst Theuss ,  Guenther Ruhl

IPC分类号： G01N27/72 ,  G01R33/07

CPC分类号： G01R33/072 ,  G01N27/72 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10T29/49002 ,  H01L2924/00012

摘要： A sensor package and a method for manufacturing a sensor package are disclosed. An embodiment includes a sensor and a conductive line, wherein the sensor is arranged proximate to the conductive line. The sensor and the conductive line are isolated and at least partially encapsulated. A soft magnet is arranged in, on or around the encapsulation, wherein the soft magnet includes a composition of an insulating material and a material having soft magnetic properties.

摘要翻译： 公开了传感器封装和制造传感器封装的方法。 实施例包括传感器和导线，其中传感器布置成靠近导电线。 传感器和导线被隔离并至少部分封装。 软磁体布置在封装中，之上或周围，其中软磁体包括绝缘材料的组合物和具有软磁性质的材料。

公开(公告)号：US08991253B2

公开(公告)日：2015-03-31

申请号：US13241333

申请日：2011-09-23

申请人： Horst Theuss

发明人： Horst Theuss

IPC分类号： G01P15/08 ,  G01P15/105 ,  G01P15/11 ,  G01P15/12 ,  G01P15/125

CPC分类号： G01P15/08 ,  G01P15/105 ,  G01P15/11 ,  G01P15/123 ,  G01P15/125

摘要： In various embodiments, a microelectromechanical system may include a chip, a substrate, a signal generator, and a fixing structure configured to fix the chip to the substrate. The chip may be fixed in such a way that, upon an acceleration of the microelectromechanical system, the chip is moved relative to the substrate. Furthermore, a signal may be generated by the movement of the chip by means of the signal generator.

摘要翻译： 在各种实施例中，微机电系统可以包括芯片，衬底，信号发生器和被配置为将芯片固定到衬底的固定结构。 芯片可以被固定成使得在微机电系统的加速时芯片相对于衬底移动。 此外，可以通过信号发生器通过芯片的移动来产生信号。

公开(公告)号：US08722462B2

公开(公告)日：2014-05-13

申请号：US12750917

申请日：2010-03-31

申请人： Klaus Elian ,  Beng-Keh See ,  Horst Theuss

发明人： Klaus Elian ,  Beng-Keh See ,  Horst Theuss

IPC分类号： H01L21/00

CPC分类号： H01L21/56 ,  H01L21/561 ,  H01L23/49562 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/48 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/83191 ,  H01L2224/92244 ,  H01L2224/92247 ,  H01L2224/93 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacturing a semiconductor package includes providing a carrier and attaching at least one semiconductor piece to the carrier. An encapsulant is deposited onto the at least one semiconductor piece to form an encapsulated semiconductor arrangement. The encapsulated semiconductor arrangement is then singulated in at least two semiconductor packages, wherein each package includes a semiconductor die separated from the semiconductor piece during singulation.

摘要翻译： 制造半导体封装的方法包括提供载体并将至少一个半导体片附接到载体上。 密封剂沉积在至少一个半导体部件上以形成封装的半导体装置。 封装的半导体布置然后在至少两个半导体封装中被分割，其中每个封装包括在分割期间与半导体块分离的半导体管芯。

公开(公告)号：US08580612B2

公开(公告)日：2013-11-12

申请号：US12370266

申请日：2009-02-12

申请人： Horst Theuss ,  Georg Meyer-Berg

发明人： Horst Theuss ,  Georg Meyer-Berg

IPC分类号： H01L21/00

CPC分类号： H01L23/5389 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00

摘要： A method of manufacturing an array of semiconductor devices comprises providing a first carrier having multiple chip alignment regions. Multiple chips are placed over the multiple chip alignment regions. Then, alignment of the chips to the multiple chip alignment regions is obtained. The multiple chips are then placed on a second carrier. The first carrier is detached from the multiple chips. An encapsulation material is applied to the multiple chips to form an encapsulated array of semiconductor chips. The second carrier is then detached from the encapsulated array of semiconductor devices.

摘要翻译： 制造半导体器件阵列的方法包括提供具有多个芯片对准区域的第一载体。 多个芯片放置在多个芯片对准区域上。 然后，获得芯片与多个芯片取向区域的​​对准。 然后将多个芯片放置在第二载体上。 第一个载体与多个芯片分离。 将封装材料施加到多个芯片以形成半导体芯片的封装阵列。 然后将第二载体从封装的半导体器件阵列分离。

公开(公告)号：US08535983B2

公开(公告)日：2013-09-17

申请号：US13152021

申请日：2011-06-02

申请人： Tze Yang Hin ,  Stefan Martens ,  Werner Simbuerger ,  Helmut Wietschorke ,  Horst Theuss ,  Beng Keh See ,  Ulrich Krumbein

发明人： Tze Yang Hin ,  Stefan Martens ,  Werner Simbuerger ,  Helmut Wietschorke ,  Horst Theuss ,  Beng Keh See ,  Ulrich Krumbein

IPC分类号： H01L21/56

CPC分类号： H01L21/6836 ,  H01L21/568 ,  H01L23/3114 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2221/68327 ,  H01L2221/68368 ,  H01L2221/68372 ,  H01L2224/03002 ,  H01L2224/03003 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16245 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2224/81203 ,  H01L2224/11 ,  H01L2924/00

摘要： In one embodiment a method for manufacturing a semiconductor device comprises arranging a wafer on a carrier, the wafer comprising singulated chips; bonding the singulated chips to a support wafer, and removing the carrier.

摘要翻译： 在一个实施例中，制造半导体器件的方法包括将晶片布置在载体上，所述晶片包括单片化芯片; 将分割的芯片接合到支撑晶片，并移除载体。