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    Curable cyanate ester/acrylic epoxy ester composition
    32.
    发明授权
    Curable cyanate ester/acrylic epoxy ester composition 失效
    可溶性氰酸酯/丙烯酸环氧酯组合物

    公开(公告)号：US4393195A

    公开(公告)日：1983-07-12

    申请号：US175510

    申请日：1980-08-05

    申请人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Satoshi Ayano

    发明人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Satoshi Ayano

    IPC分类号： C08G73/00 ,  C08F220/32 ,  C08G59/40 ,  C08G73/06 ,  C08G73/12 ,  C09D163/00 ,  C09D179/08 ,  C08G83/00

    CPC分类号： C08G73/12 ,  C08F220/32 ,  C08G59/4014

    摘要： A curable resin composition comprising a mixture and/or a preliminary reaction product of (a) polyfunctional cyanate ester, prepolymer of the cyanate ester, or coprepolymer of the cyanate ester and an amine, and (b) acrylic epoxy esters, methacrylic epoxy esters, prepolymers of acrylic epoxy esters, prepolymers methacrylic epoxy esters, coprepolymers of acrylic epoxy esters and methacrylic epoxy esters and mixtures thereof, and a curable resin composition comprising a mixture or a preliminary reaction product of above component (a), above component (b) and (c) a polyfunctional maleimide, prepolymer of the maleimide or coprepolymer of the maleimide and an amine are disclosed. Cured resin having excellent impact-resistance, adhesive power, heat-resistance and chemical resistance can be prepared from the compositions.

    摘要翻译： 一种可固化树脂组合物，其包含（a）多官能氰酸酯，氰酸酯或氰酸酯与胺的共聚物的预聚物的混合物和/或预反应产物，和（b）丙烯酸环氧酯，甲基丙烯酸环氧酯， 丙烯酸环氧酯的预聚物，丙烯酸环氧酯的预聚物，甲基丙烯酸环氧酯，丙烯酸环氧酯和甲基丙烯酸环氧酯的共聚物及其混合物，以及包含上述组分（a），组分（b）和组分（b）上的混合物或预反应产物 （c）多官能马来酰亚胺，马来酰亚胺或马来酰亚胺和胺的共聚物的预聚物。 可以从组合物制备具有优异抗冲击性，粘合力，耐热性和耐化学性的固化树脂。

    Semiconductor package including heat diffusion portion
    33.
    发明授权
    Semiconductor package including heat diffusion portion 失效
    包括热扩散部分的半导体封装

    公开(公告)号：US06350952B1

    公开(公告)日：2002-02-26

    申请号：US09402400

    申请日：1999-10-05

    申请人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Toshihiko Kobayashi

    发明人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Toshihiko Kobayashi

    IPC分类号： H01L2328

    CPC分类号： H01L23/49816 ,  H01L21/4857 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49861 ,  H01L24/48 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

    摘要： Disclosed is a semiconductor plastic package having a structure in which a metal sheet having a size nearly equivalent to a printed wiring board is disposed nearly in the central portion in the thickness direction of the printed wiring board. The metal sheet and a signal propagation conductive circuit on a front surface of the printed wiring board are insulated from each other with a thermosetting resin composition. The conductive circuit on the printed wiring board surface is connected to a conductive circuit formed on an opposite surface of the printed wiring board, or to a conductive circuit pad formed for being connected with solder balls with a conductive through hole. A semiconductor chip, wire and bonding pad are encapsulated with a resin. The semiconductor plastic package has at least one blind via hole made in the opposite surface so as to be directly connected to the metal sheet. The blind via hole has an inner wall rendered thermally conductive. The printed wiring board is provided, on the semiconductor-chip-mounting side, with an elevated metal portion, a plurality of metal protrusions each having the form of a frustum of a pyramid or a cone, or at least one via hole having an inner wall rendered thermally conductive. A process for the production of a printed wiring board used for the above plastic package is also disclosed.

    摘要翻译： 公开了一种半导体塑料封装，其结构是将印刷电路板的尺寸几乎相等的金属板设置在印刷电路板的厚度方向上的中央部分。 印刷电路板的表面上的金属片和信号传导导电电路用热固性树脂组合物彼此绝缘。 印刷电路板表面上的导电电路连接到形成在印刷线路板的相对表面上的导电电路，或连接到形成为与具有导电通孔的焊球相连的导电电路板。 半导体芯片，导线和焊盘用树脂封装。 半导体塑料封装具有在相对表面上形成的至少一个盲通孔，以便直接连接到金属片。 盲孔通孔具有导热的内壁。 印刷电路板在半导体芯片安装侧设置有升高的金属部分，多个金属突起，每个金属突起均具有棱锥体或锥体的截头体形状，或至少一个通孔，其具有内部 壁呈导热性。 还公开了用于制造用于上述塑料封装的印刷电路板的方法。

    Curable resin composition comprising cyanate ester and acrylic alkenyl ester
    35.
    发明授权
    Curable resin composition comprising cyanate ester and acrylic alkenyl ester 失效
    可固化树脂组合物，其包含氰酸酯和丙烯酸烯基酯

    公开(公告)号：US4371689A

    公开(公告)日：1983-02-01

    申请号：US175508

    申请日：1980-08-05

    申请人： Morio Gaku ,  Nobuyuki Ikeguchi

    发明人： Morio Gaku ,  Nobuyuki Ikeguchi

    IPC分类号： C08G59/00 ,  C08F20/40 ,  C08F22/10 ,  C08F283/00 ,  C08G8/28 ,  C08G73/00 ,  C08G73/06 ,  C08L33/00 ,  C08L33/02 ,  C08L63/00 ,  C09D163/00 ,  C09D179/08 ,  C08G83/00 ,  C08G73/10

    CPC分类号： C08G8/28 ,  C08F20/40 ,  C08F22/105 ,  C08F283/00

    摘要： A curable resin composition comprising a mixture and/or a preliminary reaction product of (a) polyfunctional cyanate ester, prepolymer of the cyanate ester, or coprepolymer of the cyanate ester and an amine, and (b) alkenyl acrylic esters, alkenyl methacrylic esters, prepolymers of alkenyl acrylic esters, prepolymers alkenyl methacrylic esters, coprepolymers of alkenyl acrylic esters and alkenyl methacrylic esters and mixtures thereof, and a curable resin composition comprising a mixture or a preliminary reaction product of above component (a), above component (b) and (c) a polyfunctional maleimide, prepolymer of the maleimide or coprepolymer of the maleimide and an amine are disclosed. Cured resin having excellent impact-resistance, adhesive power, heat-resistance and chemical-resistance can be prepared from the compositions.

    摘要翻译： 一种可固化树脂组合物，其包含（a）多官能氰酸酯，氰酸酯或氰酸酯与胺的共聚物的预聚物的混合物和/或预反应产物，和（b）链烯基丙烯酸酯，链烯基甲基丙烯酸酯， 链烯基丙烯酸酯的预聚物，预聚物烯基甲基丙烯酸酯，链烯基丙烯酸酯和链烯基甲基丙烯酸酯的共聚物及其混合物，以及包含上述组分（a），组分（b）和组分（b）上的混合物或预反应产物 （c）多官能马来酰亚胺，马来酰亚胺或马来酰亚胺和胺的共聚物的预聚物。 可以从组合物制备具有优异抗冲击性，粘合力，耐热性和耐化学性的固化树脂。

    Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole
    36.
    发明授权
    Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole 有权
    用激光制作通孔的方法，适合制作孔的覆铜层压板，以及用于制作孔的辅助材料

    公开(公告)号：US06750422B2

    公开(公告)日：2004-06-15

    申请号：US10028734

    申请日：2001-12-28

    申请人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Yasuo Tanaka ,  Yoshihiro Kato

    发明人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Yasuo Tanaka ,  Yoshihiro Kato

    IPC分类号： B23K2600

    CPC分类号： H05K3/0038 ,  B23K26/18 ,  H05K1/0373 ,  H05K3/427 ,  H05K2201/0112 ,  H05K2201/0215 ,  H05K2201/0323 ,  H05K2203/1383

    摘要： A method of making a small-diameter through hole having high reliability with regard to a hole wall at a high rate with the energy of a high-output carbon dioxide gas laser without pre-making any hole in a copper foil, forming or disposing a coating or a sheet of an organic substance containing 3 to 97% by volume of at least one powder selected from the group consisting of a metal compound powder, a carbon powder and metal powder which have a melting point of at least 900° C. and a bond energy of at least 300 KJ/mol on at least a copper foil surface to be irradiated with the carbon dioxide gas laser, and irradiating a surface thereof with necessary pulses of the carbon dioxide gas laser to form the penetration hole, and an auxiliary material for use when a penetration hole is made in the copper-clad laminate with a carbon dioxide gas laser, the auxiliary material being a coating or a sheet of an organic substance containing 3 to 97% by volume of at least one powder selected from the group consisting of a metal compound powder, a carbon powder and metal powder which have a melting point of at least 900° C. and a bond energy of at least 300 KJ/mol.

    摘要翻译： 一种制造小孔直径通孔的方法，其具有高孔率的孔壁，高速率地输出高输出二氧化碳气体激光器的能量，而不在铜箔中预先制造任何孔，形成或布置 包含或含有3至97体积％的至少一种选自熔点为900℃以上的金属化合物粉末，碳粉末和金属粉末的粉末的有机物的片材，以及 至少在300KJ / mol的键能上至少要用二氧化碳气体激光器照射的铜箔表面，并用二氧化碳气体激光器的必要脉冲照射其表面以形成贯通孔，辅助 在用二氧化碳气体激光器在覆铜层压板中形成贯通孔时使用的材料，辅助材料是含有3〜97体积％的至少一种粉末的涂层或片材，所述粉末选自 G 该组合物由金属化合物粉末，碳粉末和金属粉末组成，其熔点至少为900℃，结合能为至少300KJ / mol。

    Semiconductor plastic package and process for the production thereof
    37.
    发明授权
    Semiconductor plastic package and process for the production thereof 有权
    半导体塑料封装及其制造方法

    公开(公告)号：US06720651B2

    公开(公告)日：2004-04-13

    申请号：US10036385

    申请日：2002-01-07

    申请人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Nobuyuki Yamane

    发明人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Nobuyuki Yamane

    IPC分类号： H01L2310

    CPC分类号： H01L23/13 ,  H01L23/3677 ,  H01L24/48 ,  H01L2224/32188 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K1/0204 ,  H05K1/056 ,  H05K3/06 ,  H05K3/44 ,  H05K3/445 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

    摘要： A semiconductor plastic package excellent in heat diffusibility and free of moisture absorption, is structured by fixing a semiconductor chip on one surface of a printed circuit board, connecting a semiconductor circuit conductor to a signal propagation circuit conductor formed on a printed circuit board surface in the vicinity thereof by wire bonding, at least connecting the signal propagation circuit conductor on the printed circuit board surface to a signal propagation circuit conductor formed on the other surface of the printed circuit board or a connecting conductor pad of a solder ball with a through-hole conductor, and encapsulating the semiconductor chip with a resin. The printed circuit board has a metal sheet of nearly the same size as the printed circuit board and is nearly in the center in the thickness direction of the printed circuit board. The metal sheet is insulated from front and reverse circuit conductors with a heat-resistant resin composition, and the metal sheet is provided with a clearance hole having a diameter greater than a diameter of each of at least two through holes. The through-holes are provided in the clearance hole, and a through-hole or through-holes are insulated from the metal sheet with a resin composition, with at least one through-hole being connected to the metal sheet. One surface of the metal sheet is provided with at least one protrusion portion which is of the same size as the semiconductor chip and exposed on a surface, and the semiconductor chip is fixed on the protrusion portion.

    摘要翻译： 通过将半导体芯片固定在印刷电路板的一个表面上，将半导体电路导体连接到形成在印刷电路板表面上的信号传播电路导体，将散热性和吸湿性优异的半导体塑料封装 通过引线接合，至少将印刷电路板表面上的信号传播电路导体连接到形成在印刷电路板的另一个表面上的信号传播电路导体或具有通孔的焊球的连接导体焊盘 导体，并用树脂封装半导体芯片。 印刷电路板具有与印刷电路板几乎相同尺寸的金属片，并且几乎在印刷电路板的厚度方向上的中心。 该金属板与具有耐热树脂组合物的正反电路导体绝缘，并且该金属板设置有直径大于至少两个通孔中的每一个的直径的间隙孔。 通孔设置在间隙孔中，并且通孔或通孔与金属板与树脂组合物绝缘，至少一个通孔连接到金属片。 金属片的一个表面设置有与半导体芯片尺寸相同并且暴露在表面上的至少一个突起部分，并且半导体芯片固定在突出部分上。

    Semiconductor plastic package and process for the production thereof
    38.
    发明授权
    Semiconductor plastic package and process for the production thereof 失效
    半导体塑料封装及其制造方法

    公开(公告)号：US06376908B1

    公开(公告)日：2002-04-23

    申请号：US09207115

    申请日：1998-12-08

    申请人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Nobuyuki Yamane

    发明人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Nobuyuki Yamane

    IPC分类号： H01L2310

    CPC分类号： H01L23/13 ,  H01L23/3677 ,  H01L24/48 ,  H01L2224/32188 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K1/0204 ,  H05K1/056 ,  H05K3/06 ,  H05K3/44 ,  H05K3/445 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

    摘要： A semiconductor plastic package excellent in heat diffusibility and free of moisture absorption, is structured by fixing a semiconductor chip on one surface of a printed circuit board, connecting a semiconductor circuit conductor to a signal propagation circuit conductor formed on a printed circuit board surface in the vicinity thereof by wire bonding, at least connecting the signal propagation circuit conductor on the printed circuit board surface to a signal propagation circuit conductor formed on the other surface of the printed circuit board or a connecting conductor pad of a solder ball with a through-hole conductor, and encapsulating the semiconductor chip with a resin. The printed circuit board has a metal sheet of nearly the same size as the printed circuit board and is nearly in the center in the thickness direction of the printed circuit board. The metal sheet is insulated from front and reverse circuit conductors with a heat-resistant resin composition, and the metal sheet is provided with a clearance hole having a diameter greater than a diameter of each of at least two through holes. The through-holes are provided in the clearance hole, and a through-hole or through-holes are insulated from the metal sheet with a resin composition, with at least one through-hole being connected to the metal sheet. One surface of the metal sheet is provided with at least one protrusion portion which is of the same size as the semiconductor chip and exposed on a surface, and the semiconductor chip is fixed on the protrusion portion.

    摘要翻译： 通过将半导体芯片固定在印刷电路板的一个表面上，将半导体电路导体连接到形成在印刷电路板表面上的信号传播电路导体，将散热性和吸湿性优异的半导体塑料封装 通过引线接合，至少将印刷电路板表面上的信号传播电路导体连接到形成在印刷电路板的另一个表面上的信号传播电路导体或具有通孔的焊球的连接导体焊盘 导体，并用树脂封装半导体芯片。 印刷电路板具有与印刷电路板几乎相同尺寸的金属片，并且几乎在印刷电路板的厚度方向上的中心。 该金属板与具有耐热树脂组合物的正反电路导体绝缘，并且该金属板设置有直径大于至少两个通孔中的每一个的直径的间隙孔。 通孔设置在间隙孔中，并且通孔或通孔与金属板与树脂组合物绝缘，至少一个通孔连接到金属片。 金属片的一个表面设置有与半导体芯片尺寸相同并且暴露在表面上的至少一个突起部分，并且半导体芯片固定在突出部分上。

    Printed wiring board having highly reliably via hole and process for forming via hole
    39.
    发明授权
    Printed wiring board having highly reliably via hole and process for forming via hole 有权
    具有高度可靠的通孔的印刷电路板和用于形成通孔的工艺

    公开(公告)号：US06280641B1

    公开(公告)日：2001-08-28

    申请号：US09321556

    申请日：1999-05-28

    申请人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Yasuo Tanaka

    发明人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Yasuo Tanaka

    IPC分类号： H05K300

    CPC分类号： H05K3/429 ,  B23K26/389 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/385 ,  H05K2201/0112 ,  H05K2201/0215 ,  H05K2201/0323 ,  H05K2201/09518 ,  H05K2201/0969 ,  H05K2203/0315 ,  H05K2203/095 ,  H05K2203/1383 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： Disclosed are a printed wiring board having micro-via holes highly reliable for conduction and a method of making the micro-via hole by providing a coating or sheet of an organic substance containing 3 to 97% by volume of at least one selected from a metal compound powder, a carbon powder or a metal powder having a melting point of at least 900° C. and a bond energy of at least 300 kJ/mol on a copper foil as an outermost layer of a copper-clad laminate having at least two copper layers, or providing a coating or sheet of the same after oxidizing a copper foil as an outermost layer, irradiating the coating or sheet with a carbon dioxide gas laser at an output of 20 to 60 mJ/pulse, thereby removing a micro-via-hole-forming portion of at least the copper foil as the outermost layer, then irradiating micro-via-hole-forming portions of the remaining layers with a carbon dioxide gas laser at an output of 5 to 35 mJ/pulse to make a micro-via hole which does not penetrate through the copper foil in a bottom of the micro-via hole, and electrically connecting the copper foil as the outermost layer and the copper foil in the bottom of the micro-via hole with a metal plating or an electrically conductive coating composition.

    摘要翻译： 公开了一种印刷电路板，其具有高度可靠的导电性的微通孔，以及通过提供含有3〜97体积％的选自金属中的至少一种的有机物的涂层或片材来制造微通孔的方法 复合粉末，碳粉末或熔点至少为900℃的金属粉末和在铜箔上的键能为至少300kJ / mol，作为覆铜层压板的最外层，其具有至少两个 铜层，或者在氧化作为最外层的铜箔之后提供其涂层或片材，用二氧化碳气体激光器以20至60mJ /脉冲的输出照射涂层或片材，从而除去微通孔 至少形成铜箔作为最外层的孔形成部分，然后用5〜35mJ /脉冲的输出用二氧化碳气体激光器照射剩余层的微通孔形成部分，制成微孔 - 通孔不穿铜 油在微通孔的底部，并用金属镀层或导电涂料组合物电连接作为最外层的铜箔和微通孔底部的铜箔。