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    Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole
    1.
    发明授权
    Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole 有权
    用激光制作通孔的方法，适合制作孔的覆铜层压板，以及用于制作孔的辅助材料

    公开(公告)号：US06337463B1

    公开(公告)日：2002-01-08

    申请号：US09271897

    申请日：1999-03-18

    申请人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Yasuo Tanaka ,  Yoshihiro Kato

    发明人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Yasuo Tanaka ,  Yoshihiro Kato

    IPC分类号： B23K2600

    CPC分类号： H05K3/0038 ,  B23K26/18 ,  H05K1/0373 ,  H05K3/427 ,  H05K2201/0112 ,  H05K2201/0215 ,  H05K2201/0323 ,  H05K2203/1383

    摘要： A method of making a small-diameter through hole having high reliability with regard to a hole wall at a high rate with the energy of a high-output carbon dioxide gas laser without pre-making any hole in a copper foil, forming or disposing a coating or a sheet of an organic substance containing 3 to 97% by volume of at least one powder selected from the group consisting of a metal compound powder, a carbon powder and metal powder which have a melting point of at least 900° C. and a bond energy of at least 300 KJ/mol on at least a copper foil surface to be irradiated with the carbon dioxide gas laser, and irradiating a surface thereof with necessary pulses of the carbon dioxide gas laser to form the penetration hole, and an auxiliary material for use when a penetration hole is made in the copper-clad laminate with a carbon dioxide gas laser, the auxiliary material being a coating or a sheet of an organic substance containing 3 to 97% by volume of at least one powder selected from the group consisting of a metal compound powder, a carbon powder and metal powder which have a melting point of at least 900° C. and a bond energy of at least 300 KJ/mol.

    摘要翻译： 一种制造小孔直径通孔的方法，其具有高孔率的孔壁，高速率地输出高输出二氧化碳气体激光器的能量，而不在铜箔中预先制造任何孔，形成或布置 包含或含有3至97体积％的至少一种选自熔点为900℃以上的金属化合物粉末，碳粉末和金属粉末的粉末的有机物的片材，以及 至少在300KJ / mol的键能上至少要用二氧化碳气体激光器照射的铜箔表面，并用二氧化碳气体激光器的必要脉冲照射其表面以形成贯通孔，辅助 在用二氧化碳气体激光器在覆铜层压板中形成贯通孔时使用的材料，辅助材料是含有3〜97体积％的至少一种粉末的涂层或片材，所述粉末选自 G 该组合物由金属化合物粉末，碳粉末和金属粉末组成，其熔点至少为900℃，结合能为至少300KJ / mol。

    Curable resin composition from polyfunctional aromatic ester and maleimide compound
    3.
    发明授权
    Curable resin composition from polyfunctional aromatic ester and maleimide compound 失效
    来自多官能芳族酯和马来酰亚胺化合物的可固化树脂组合物

    公开(公告)号：US4370467A

    公开(公告)日：1983-01-25

    申请号：US165560

    申请日：1980-07-03

    申请人： Morio Gaku ,  Nobuyuki Ikeguchi

    发明人： Morio Gaku ,  Nobuyuki Ikeguchi

    IPC分类号： C08F20/00 ,  C08F2/44 ,  C08F4/28 ,  C08F22/36 ,  C08F22/40 ,  C08G59/00 ,  C08G59/40 ,  C08G59/68 ,  C08G73/00 ,  C08G73/06 ,  C08L79/04 ,  C08G73/12 ,  C08G83/00

    CPC分类号： C08L79/04

    摘要： A curable resin composition comprising (i) a catalytic composite comprising a peroxide and other catalytic component and (ii) a mixture or a preliminary reaction product of (a) a polyfunctional cyanate ester, prepolymer of the cyanate ester or coprepolymer of the cyanate ester and an amine and (b) a polyfunctional maleimide, prepolymer of the maleimide or coprepolymer of the maleimide and an amine and optionally (c) other component is disclosed. The composition cures rapidly at a low temperature and is preferable from view point of quantity production and workability. The composition is excellent in respect of adhering property, heat-resistance, moisture-resistance and chemical-resistance, and is useful for preparing laminated products, molded products, paint, powder paint, adhesive or varnish.

    摘要翻译： 一种可固化树脂组合物，其包含（i）包含过氧化物和其它催化组分的催化复合物和（ii）（a）多官能氰酸酯，氰酸酯或氰酸酯的共聚物的预聚物和氰酸酯的预混合物或预反应产物和 公开了一种胺和（b）多官能马来酰亚胺，马来酰亚胺或马来酰亚胺的共聚单体和胺和任选的（c）其它组分的预聚物。 组合物在低温下快速固化，从量产生和加工性的观点出发优选。 该组合物在粘合性，耐热性，耐湿性和耐化学性方面优异，可用于制备层压产品，模塑产品，油漆，粉末涂料，粘合剂或清漆。

    Semiconductor package including heat diffusion portion
    5.
    发明授权
    Semiconductor package including heat diffusion portion 失效
    包括热扩散部分的半导体封装

    公开(公告)号：US06350952B1

    公开(公告)日：2002-02-26

    申请号：US09402400

    申请日：1999-10-05

    申请人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Toshihiko Kobayashi

    发明人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Toshihiko Kobayashi

    IPC分类号： H01L2328

    CPC分类号： H01L23/49816 ,  H01L21/4857 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49861 ,  H01L24/48 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

    摘要： Disclosed is a semiconductor plastic package having a structure in which a metal sheet having a size nearly equivalent to a printed wiring board is disposed nearly in the central portion in the thickness direction of the printed wiring board. The metal sheet and a signal propagation conductive circuit on a front surface of the printed wiring board are insulated from each other with a thermosetting resin composition. The conductive circuit on the printed wiring board surface is connected to a conductive circuit formed on an opposite surface of the printed wiring board, or to a conductive circuit pad formed for being connected with solder balls with a conductive through hole. A semiconductor chip, wire and bonding pad are encapsulated with a resin. The semiconductor plastic package has at least one blind via hole made in the opposite surface so as to be directly connected to the metal sheet. The blind via hole has an inner wall rendered thermally conductive. The printed wiring board is provided, on the semiconductor-chip-mounting side, with an elevated metal portion, a plurality of metal protrusions each having the form of a frustum of a pyramid or a cone, or at least one via hole having an inner wall rendered thermally conductive. A process for the production of a printed wiring board used for the above plastic package is also disclosed.

    摘要翻译： 公开了一种半导体塑料封装，其结构是将印刷电路板的尺寸几乎相等的金属板设置在印刷电路板的厚度方向上的中央部分。 印刷电路板的表面上的金属片和信号传导导电电路用热固性树脂组合物彼此绝缘。 印刷电路板表面上的导电电路连接到形成在印刷线路板的相对表面上的导电电路，或连接到形成为与具有导电通孔的焊球相连的导电电路板。 半导体芯片，导线和焊盘用树脂封装。 半导体塑料封装具有在相对表面上形成的至少一个盲通孔，以便直接连接到金属片。 盲孔通孔具有导热的内壁。 印刷电路板在半导体芯片安装侧设置有升高的金属部分，多个金属突起，每个金属突起均具有棱锥体或锥体的截头体形状，或至少一个通孔，其具有内部 壁呈导热性。 还公开了用于制造用于上述塑料封装的印刷电路板的方法。

    Curable resin composition
    7.
    发明授权
    Curable resin composition 失效
    可固化树脂组合物

    公开(公告)号：US4383903A

    公开(公告)日：1983-05-17

    申请号：US250897

    申请日：1981-04-03

    申请人： Satoshi Ayano ,  Morio Gaku ,  Nobuyuki Ikeguchi ,  Hidenori Kinbara ,  Yasunari Osaki

    发明人： Satoshi Ayano ,  Morio Gaku ,  Nobuyuki Ikeguchi ,  Hidenori Kinbara ,  Yasunari Osaki

    IPC分类号： C08G73/00 ,  C08F2/20 ,  C08F2/50 ,  C08F283/00 ,  C08F299/02 ,  C08G73/02 ,  C08G73/06 ,  C08J5/24 ,  H05K3/28 ,  G03C1/68 ,  G03C1/70

    CPC分类号： C08F2/20 ,  C08F283/00 ,  C08F299/024 ,  Y10S430/12 ,  Y10S430/128

    摘要： A photo-curable resin composition is disclosed comprising (i) a mixture and/or a preliminary reaction product of (a) at least one cyanate compound selected from the group consisting of polyfunctional cyanate esters, prepolymers of the cyanate esters, coprepolymers of the cyanate esters and an amine and mixtures thereof, (b) at least one compound selected from the group consisting of monomers having at least one olefinically double bond prepolymers of the monomers, liquid rubbers having one or more acryloyl or methacryloyl groups and mixtures thereof and optionally (c) at least one maleimide compound selected from the group consisting of polyfunctional maleimides, prepolymers of the maleimides, coprepolymers of the maleimides and an amine and mixtures thereof and (ii) a photo polymerization initiator or a photo sensitizer.

    摘要翻译： 公开了一种光固化树脂组合物，其包含（i）（a）至少一种氰化物化合物的混合物和/或预反应产物，所述氰化物选自多官能氰酸酯，氰酸酯的预聚物，氰酸的共聚物 酯和胺及其混合物，（b）至少一种选自具有至少一种单体的烯属双键预聚物的单体，具有一个或多个丙烯酰基或甲基丙烯酰基的液体橡胶及其混合物和任选（ c）至少一种选自多官能马来酰亚胺，马来酰亚胺的预聚物，马来酰亚胺的共聚物和胺及其混合物的马来酰亚胺化合物和（ii）光聚合引发剂或光敏剂。

    Curable resin composition comprising cyanate ester and acrylic alkenyl ester
    8.
    发明授权
    Curable resin composition comprising cyanate ester and acrylic alkenyl ester 失效
    可固化树脂组合物，其包含氰酸酯和丙烯酸烯基酯

    公开(公告)号：US4371689A

    公开(公告)日：1983-02-01

    申请号：US175508

    申请日：1980-08-05

    申请人： Morio Gaku ,  Nobuyuki Ikeguchi

    发明人： Morio Gaku ,  Nobuyuki Ikeguchi

    IPC分类号： C08G59/00 ,  C08F20/40 ,  C08F22/10 ,  C08F283/00 ,  C08G8/28 ,  C08G73/00 ,  C08G73/06 ,  C08L33/00 ,  C08L33/02 ,  C08L63/00 ,  C09D163/00 ,  C09D179/08 ,  C08G83/00 ,  C08G73/10

    CPC分类号： C08G8/28 ,  C08F20/40 ,  C08F22/105 ,  C08F283/00

    摘要： A curable resin composition comprising a mixture and/or a preliminary reaction product of (a) polyfunctional cyanate ester, prepolymer of the cyanate ester, or coprepolymer of the cyanate ester and an amine, and (b) alkenyl acrylic esters, alkenyl methacrylic esters, prepolymers of alkenyl acrylic esters, prepolymers alkenyl methacrylic esters, coprepolymers of alkenyl acrylic esters and alkenyl methacrylic esters and mixtures thereof, and a curable resin composition comprising a mixture or a preliminary reaction product of above component (a), above component (b) and (c) a polyfunctional maleimide, prepolymer of the maleimide or coprepolymer of the maleimide and an amine are disclosed. Cured resin having excellent impact-resistance, adhesive power, heat-resistance and chemical-resistance can be prepared from the compositions.

    摘要翻译： 一种可固化树脂组合物，其包含（a）多官能氰酸酯，氰酸酯或氰酸酯与胺的共聚物的预聚物的混合物和/或预反应产物，和（b）链烯基丙烯酸酯，链烯基甲基丙烯酸酯， 链烯基丙烯酸酯的预聚物，预聚物烯基甲基丙烯酸酯，链烯基丙烯酸酯和链烯基甲基丙烯酸酯的共聚物及其混合物，以及包含上述组分（a），组分（b）和组分（b）上的混合物或预反应产物 （c）多官能马来酰亚胺，马来酰亚胺或马来酰亚胺和胺的共聚物的预聚物。 可以从组合物制备具有优异抗冲击性，粘合力，耐热性和耐化学性的固化树脂。