公开(公告)号：US06337463B1

公开(公告)日：2002-01-08

申请号：US09271897

申请日：1999-03-18

申请人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Yasuo Tanaka ,  Yoshihiro Kato

发明人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Yasuo Tanaka ,  Yoshihiro Kato

IPC分类号： B23K2600

CPC分类号： H05K3/0038 ,  B23K26/18 ,  H05K1/0373 ,  H05K3/427 ,  H05K2201/0112 ,  H05K2201/0215 ,  H05K2201/0323 ,  H05K2203/1383

摘要： A method of making a small-diameter through hole having high reliability with regard to a hole wall at a high rate with the energy of a high-output carbon dioxide gas laser without pre-making any hole in a copper foil, forming or disposing a coating or a sheet of an organic substance containing 3 to 97% by volume of at least one powder selected from the group consisting of a metal compound powder, a carbon powder and metal powder which have a melting point of at least 900° C. and a bond energy of at least 300 KJ/mol on at least a copper foil surface to be irradiated with the carbon dioxide gas laser, and irradiating a surface thereof with necessary pulses of the carbon dioxide gas laser to form the penetration hole, and an auxiliary material for use when a penetration hole is made in the copper-clad laminate with a carbon dioxide gas laser, the auxiliary material being a coating or a sheet of an organic substance containing 3 to 97% by volume of at least one powder selected from the group consisting of a metal compound powder, a carbon powder and metal powder which have a melting point of at least 900° C. and a bond energy of at least 300 KJ/mol.

摘要翻译： 一种制造小孔直径通孔的方法，其具有高孔率的孔壁，高速率地输出高输出二氧化碳气体激光器的能量，而不在铜箔中预先制造任何孔，形成或布置 包含或含有3至97体积％的至少一种选自熔点为900℃以上的金属化合物粉末，碳粉末和金属粉末的粉末的有机物的片材，以及 至少在300KJ / mol的键能上至少要用二氧化碳气体激光器照射的铜箔表面，并用二氧化碳气体激光器的必要脉冲照射其表面以形成贯通孔，辅助 在用二氧化碳气体激光器在覆铜层压板中形成贯通孔时使用的材料，辅助材料是含有3〜97体积％的至少一种粉末的涂层或片材，所述粉末选自 G 该组合物由金属化合物粉末，碳粉末和金属粉末组成，其熔点至少为900℃，结合能为至少300KJ / mol。

公开(公告)号：US06265767B1

公开(公告)日：2001-07-24

申请号：US09583148

申请日：2000-05-30

申请人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Toshihiko Kobayashi

发明人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Toshihiko Kobayashi

IPC分类号： H01L2144

CPC分类号： H01L21/486 ,  H01L21/481 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/291 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/10158 ,  H01L2924/12042 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K1/0204 ,  H05K1/0206 ,  H05K1/056 ,  H05K2201/0355 ,  H05K2201/09054 ,  H05K2201/09827 ,  H05K2203/0369 ,  H01L2924/01015 ,  H01L2924/01026 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： There is provided a semiconductor plastic package in the form in which at least one semiconductor chip is mounted on a small-sized printed wiring board, a metal plate for the above package and a method of producing a copper-clad board for the above package. More particularly, there is provided a semiconductor plastic package suitable for relatively high-watt, multi-terminal and high-density semiconductor plastic packages such as a microprocessor, a micro-controller, ASIC and graphic, and a method of producing the same.

摘要翻译： 提供了一种半导体塑料封装，其中至少一个半导体芯片安装在小型印刷线路板，用于上述封装的金属板和用于制造用于上述封装的铜包覆板的方法中。 更具体地，提供了适用于诸如微处理器，微控制器，ASIC和图形的相对高瓦特，多端子和高密度半导体塑料封装的半导体塑料封装及其制造方法。

公开(公告)号：US4370467A

公开(公告)日：1983-01-25

申请号：US165560

申请日：1980-07-03

申请人： Morio Gaku ,  Nobuyuki Ikeguchi

发明人： Morio Gaku ,  Nobuyuki Ikeguchi

IPC分类号： C08F20/00 ,  C08F2/44 ,  C08F4/28 ,  C08F22/36 ,  C08F22/40 ,  C08G59/00 ,  C08G59/40 ,  C08G59/68 ,  C08G73/00 ,  C08G73/06 ,  C08L79/04 ,  C08G73/12 ,  C08G83/00

CPC分类号： C08L79/04

摘要： A curable resin composition comprising (i) a catalytic composite comprising a peroxide and other catalytic component and (ii) a mixture or a preliminary reaction product of (a) a polyfunctional cyanate ester, prepolymer of the cyanate ester or coprepolymer of the cyanate ester and an amine and (b) a polyfunctional maleimide, prepolymer of the maleimide or coprepolymer of the maleimide and an amine and optionally (c) other component is disclosed. The composition cures rapidly at a low temperature and is preferable from view point of quantity production and workability. The composition is excellent in respect of adhering property, heat-resistance, moisture-resistance and chemical-resistance, and is useful for preparing laminated products, molded products, paint, powder paint, adhesive or varnish.

摘要翻译： 一种可固化树脂组合物，其包含（i）包含过氧化物和其它催化组分的催化复合物和（ii）（a）多官能氰酸酯，氰酸酯或氰酸酯的共聚物的预聚物和氰酸酯的预混合物或预反应产物和 公开了一种胺和（b）多官能马来酰亚胺，马来酰亚胺或马来酰亚胺的共聚单体和胺和任选的（c）其它组分的预聚物。 组合物在低温下快速固化，从量产生和加工性的观点出发优选。 该组合物在粘合性，耐热性，耐湿性和耐化学性方面优异，可用于制备层压产品，模塑产品，油漆，粉末涂料，粘合剂或清漆。

公开(公告)号：US20110033659A1

公开(公告)日：2011-02-10

申请号：US12907089

申请日：2010-10-19

申请人： Morio Gaku ,  Hidenori Kimbara ,  Nobuyuki Ikeguchi ,  Masakazu Motegi

发明人： Morio Gaku ,  Hidenori Kimbara ,  Nobuyuki Ikeguchi ,  Masakazu Motegi

IPC分类号： B32B3/24

CPC分类号： B32B15/14 ,  B29C70/00 ,  B29K2309/08 ,  B32B15/20 ,  B32B27/04 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2311/12 ,  B32B2457/08 ,  H05K1/0366 ,  H05K2201/0209 ,  H05K2201/029 ,  Y10T428/24331 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T442/209 ,  Y10T442/2738 ,  Y10T442/2951 ,  Y10T442/2992 ,  Y10T442/3008 ,  Y10T442/3341 ,  Y10T442/3415 ,  Y10T442/3423

摘要： A copper-clad laminate of a highly-elastic glass fabric base material/thermosetting resin formed of prepreg obtained by impregnating a glass fabric base material made of a glass woven fabric having a thickness of 25 to 150 μm, a weight of 15 to 165 g/m2 and a gas permeability of 1 to 20 cm3/cm2/sec. with a thermosetting resin composition and drying it.

摘要翻译： 一种高弹性玻璃织物基材/热固性树脂的覆铜层压板，其由预浸料形成，该浸渍玻璃织物通过浸渍由玻璃织物制成的玻璃织物基材，所述玻璃织物基材由厚度为25至150μm，重量为15至165g / m 2，透气度为1〜20cm 3 / cm 2 / sec。 用热固性树脂组合物干燥。

公开(公告)号：US06350952B1

公开(公告)日：2002-02-26

申请号：US09402400

申请日：1999-10-05

申请人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Toshihiko Kobayashi

发明人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Toshihiko Kobayashi

IPC分类号： H01L2328

CPC分类号： H01L23/49816 ,  H01L21/4857 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49861 ,  H01L24/48 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： Disclosed is a semiconductor plastic package having a structure in which a metal sheet having a size nearly equivalent to a printed wiring board is disposed nearly in the central portion in the thickness direction of the printed wiring board. The metal sheet and a signal propagation conductive circuit on a front surface of the printed wiring board are insulated from each other with a thermosetting resin composition. The conductive circuit on the printed wiring board surface is connected to a conductive circuit formed on an opposite surface of the printed wiring board, or to a conductive circuit pad formed for being connected with solder balls with a conductive through hole. A semiconductor chip, wire and bonding pad are encapsulated with a resin. The semiconductor plastic package has at least one blind via hole made in the opposite surface so as to be directly connected to the metal sheet. The blind via hole has an inner wall rendered thermally conductive. The printed wiring board is provided, on the semiconductor-chip-mounting side, with an elevated metal portion, a plurality of metal protrusions each having the form of a frustum of a pyramid or a cone, or at least one via hole having an inner wall rendered thermally conductive. A process for the production of a printed wiring board used for the above plastic package is also disclosed.

摘要翻译： 公开了一种半导体塑料封装，其结构是将印刷电路板的尺寸几乎相等的金属板设置在印刷电路板的厚度方向上的中央部分。 印刷电路板的表面上的金属片和信号传导导电电路用热固性树脂组合物彼此绝缘。 印刷电路板表面上的导电电路连接到形成在印刷线路板的相对表面上的导电电路，或连接到形成为与具有导电通孔的焊球相连的导电电路板。 半导体芯片，导线和焊盘用树脂封装。 半导体塑料封装具有在相对表面上形成的至少一个盲通孔，以便直接连接到金属片。 盲孔通孔具有导热的内壁。 印刷电路板在半导体芯片安装侧设置有升高的金属部分，多个金属突起，每个金属突起均具有棱锥体或锥体的截头体形状，或至少一个通孔，其具有内部 壁呈导热性。 还公开了用于制造用于上述塑料封装的印刷电路板的方法。

公开(公告)号：US4645805A

公开(公告)日：1987-02-24

申请号：US711291

申请日：1985-03-13

申请人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Hidenori Kimbara

发明人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Hidenori Kimbara

IPC分类号： C09J7/00 ,  C09J167/00 ,  C08L67/02

CPC分类号： C09J167/00 ,  C09J7/00 ,  Y10T428/14

摘要： An adhesive composition comprising at least(A) at least one cyanate ester compound selected from the group consisting of:(i) polyfunctional aromatic cyanate ester monomers having the formulaR--O--C.tbd.N).sub.n wherein n is integer of 2-10 and R is an aromatic organic group, the cyanate groups being bonded to an aromatic ring or said aromatic organic group;(ii) homoprepolymers of (i) and(iii) coprepolymer of (i) and an amine, and(B) at least one thermoplastic saturated polyester resin which is non-crystalline, substantially non-crystalline or of low crystallinity is disclosed. The adhesive composition has excellent heat resistance, moisture resistance and chemical resistance.

公开(公告)号：US4383903A

公开(公告)日：1983-05-17

申请号：US250897

申请日：1981-04-03

申请人： Satoshi Ayano ,  Morio Gaku ,  Nobuyuki Ikeguchi ,  Hidenori Kinbara ,  Yasunari Osaki

发明人： Satoshi Ayano ,  Morio Gaku ,  Nobuyuki Ikeguchi ,  Hidenori Kinbara ,  Yasunari Osaki

IPC分类号： C08G73/00 ,  C08F2/20 ,  C08F2/50 ,  C08F283/00 ,  C08F299/02 ,  C08G73/02 ,  C08G73/06 ,  C08J5/24 ,  H05K3/28 ,  G03C1/68 ,  G03C1/70

CPC分类号： C08F2/20 ,  C08F283/00 ,  C08F299/024 ,  Y10S430/12 ,  Y10S430/128

摘要： A photo-curable resin composition is disclosed comprising (i) a mixture and/or a preliminary reaction product of (a) at least one cyanate compound selected from the group consisting of polyfunctional cyanate esters, prepolymers of the cyanate esters, coprepolymers of the cyanate esters and an amine and mixtures thereof, (b) at least one compound selected from the group consisting of monomers having at least one olefinically double bond prepolymers of the monomers, liquid rubbers having one or more acryloyl or methacryloyl groups and mixtures thereof and optionally (c) at least one maleimide compound selected from the group consisting of polyfunctional maleimides, prepolymers of the maleimides, coprepolymers of the maleimides and an amine and mixtures thereof and (ii) a photo polymerization initiator or a photo sensitizer.

摘要翻译： 公开了一种光固化树脂组合物，其包含（i）（a）至少一种氰化物化合物的混合物和/或预反应产物，所述氰化物选自多官能氰酸酯，氰酸酯的预聚物，氰酸的共聚物 酯和胺及其混合物，（b）至少一种选自具有至少一种单体的烯属双键预聚物的单体，具有一个或多个丙烯酰基或甲基丙烯酰基的液体橡胶及其混合物和任选（ c）至少一种选自多官能马来酰亚胺，马来酰亚胺的预聚物，马来酰亚胺的共聚物和胺及其混合物的马来酰亚胺化合物和（ii）光聚合引发剂或光敏剂。

公开(公告)号：US4371689A

公开(公告)日：1983-02-01

申请号：US175508

申请日：1980-08-05

申请人： Morio Gaku ,  Nobuyuki Ikeguchi

发明人： Morio Gaku ,  Nobuyuki Ikeguchi

IPC分类号： C08G59/00 ,  C08F20/40 ,  C08F22/10 ,  C08F283/00 ,  C08G8/28 ,  C08G73/00 ,  C08G73/06 ,  C08L33/00 ,  C08L33/02 ,  C08L63/00 ,  C09D163/00 ,  C09D179/08 ,  C08G83/00 ,  C08G73/10

CPC分类号： C08G8/28 ,  C08F20/40 ,  C08F22/105 ,  C08F283/00

摘要： A curable resin composition comprising a mixture and/or a preliminary reaction product of (a) polyfunctional cyanate ester, prepolymer of the cyanate ester, or coprepolymer of the cyanate ester and an amine, and (b) alkenyl acrylic esters, alkenyl methacrylic esters, prepolymers of alkenyl acrylic esters, prepolymers alkenyl methacrylic esters, coprepolymers of alkenyl acrylic esters and alkenyl methacrylic esters and mixtures thereof, and a curable resin composition comprising a mixture or a preliminary reaction product of above component (a), above component (b) and (c) a polyfunctional maleimide, prepolymer of the maleimide or coprepolymer of the maleimide and an amine are disclosed. Cured resin having excellent impact-resistance, adhesive power, heat-resistance and chemical-resistance can be prepared from the compositions.

摘要翻译： 一种可固化树脂组合物，其包含（a）多官能氰酸酯，氰酸酯或氰酸酯与胺的共聚物的预聚物的混合物和/或预反应产物，和（b）链烯基丙烯酸酯，链烯基甲基丙烯酸酯， 链烯基丙烯酸酯的预聚物，预聚物烯基甲基丙烯酸酯，链烯基丙烯酸酯和链烯基甲基丙烯酸酯的共聚物及其混合物，以及包含上述组分（a），组分（b）和组分（b）上的混合物或预反应产物 （c）多官能马来酰亚胺，马来酰亚胺或马来酰亚胺和胺的共聚物的预聚物。 可以从组合物制备具有优异抗冲击性，粘合力，耐热性和耐化学性的固化树脂。

公开(公告)号：US06750422B2

公开(公告)日：2004-06-15

申请号：US10028734

申请日：2001-12-28

申请人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Yasuo Tanaka ,  Yoshihiro Kato

发明人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Yasuo Tanaka ,  Yoshihiro Kato

IPC分类号： B23K2600

CPC分类号： H05K3/0038 ,  B23K26/18 ,  H05K1/0373 ,  H05K3/427 ,  H05K2201/0112 ,  H05K2201/0215 ,  H05K2201/0323 ,  H05K2203/1383

摘要： A method of making a small-diameter through hole having high reliability with regard to a hole wall at a high rate with the energy of a high-output carbon dioxide gas laser without pre-making any hole in a copper foil, forming or disposing a coating or a sheet of an organic substance containing 3 to 97% by volume of at least one powder selected from the group consisting of a metal compound powder, a carbon powder and metal powder which have a melting point of at least 900° C. and a bond energy of at least 300 KJ/mol on at least a copper foil surface to be irradiated with the carbon dioxide gas laser, and irradiating a surface thereof with necessary pulses of the carbon dioxide gas laser to form the penetration hole, and an auxiliary material for use when a penetration hole is made in the copper-clad laminate with a carbon dioxide gas laser, the auxiliary material being a coating or a sheet of an organic substance containing 3 to 97% by volume of at least one powder selected from the group consisting of a metal compound powder, a carbon powder and metal powder which have a melting point of at least 900° C. and a bond energy of at least 300 KJ/mol.

摘要翻译： 一种制造小孔直径通孔的方法，其具有高孔率的孔壁，高速率地输出高输出二氧化碳气体激光器的能量，而不在铜箔中预先制造任何孔，形成或布置 包含或含有3至97体积％的至少一种选自熔点为900℃以上的金属化合物粉末，碳粉末和金属粉末的粉末的有机物的片材，以及 至少在300KJ / mol的键能上至少要用二氧化碳气体激光器照射的铜箔表面，并用二氧化碳气体激光器的必要脉冲照射其表面以形成贯通孔，辅助 在用二氧化碳气体激光器在覆铜层压板中形成贯通孔时使用的材料，辅助材料是含有3〜97体积％的至少一种粉末的涂层或片材，所述粉末选自 G 该组合物由金属化合物粉末，碳粉末和金属粉末组成，其熔点至少为900℃，结合能为至少300KJ / mol。

公开(公告)号：US06720651B2

公开(公告)日：2004-04-13

申请号：US10036385

申请日：2002-01-07

申请人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Nobuyuki Yamane

发明人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Nobuyuki Yamane

IPC分类号： H01L2310

CPC分类号： H01L23/13 ,  H01L23/3677 ,  H01L24/48 ,  H01L2224/32188 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K1/0204 ,  H05K1/056 ,  H05K3/06 ,  H05K3/44 ,  H05K3/445 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A semiconductor plastic package excellent in heat diffusibility and free of moisture absorption, is structured by fixing a semiconductor chip on one surface of a printed circuit board, connecting a semiconductor circuit conductor to a signal propagation circuit conductor formed on a printed circuit board surface in the vicinity thereof by wire bonding, at least connecting the signal propagation circuit conductor on the printed circuit board surface to a signal propagation circuit conductor formed on the other surface of the printed circuit board or a connecting conductor pad of a solder ball with a through-hole conductor, and encapsulating the semiconductor chip with a resin. The printed circuit board has a metal sheet of nearly the same size as the printed circuit board and is nearly in the center in the thickness direction of the printed circuit board. The metal sheet is insulated from front and reverse circuit conductors with a heat-resistant resin composition, and the metal sheet is provided with a clearance hole having a diameter greater than a diameter of each of at least two through holes. The through-holes are provided in the clearance hole, and a through-hole or through-holes are insulated from the metal sheet with a resin composition, with at least one through-hole being connected to the metal sheet. One surface of the metal sheet is provided with at least one protrusion portion which is of the same size as the semiconductor chip and exposed on a surface, and the semiconductor chip is fixed on the protrusion portion.

摘要翻译： 通过将半导体芯片固定在印刷电路板的一个表面上，将半导体电路导体连接到形成在印刷电路板表面上的信号传播电路导体，将散热性和吸湿性优异的半导体塑料封装 通过引线接合，至少将印刷电路板表面上的信号传播电路导体连接到形成在印刷电路板的另一个表面上的信号传播电路导体或具有通孔的焊球的连接导体焊盘 导体，并用树脂封装半导体芯片。 印刷电路板具有与印刷电路板几乎相同尺寸的金属片，并且几乎在印刷电路板的厚度方向上的中心。 该金属板与具有耐热树脂组合物的正反电路导体绝缘，并且该金属板设置有直径大于至少两个通孔中的每一个的直径的间隙孔。 通孔设置在间隙孔中，并且通孔或通孔与金属板与树脂组合物绝缘，至少一个通孔连接到金属片。 金属片的一个表面设置有与半导体芯片尺寸相同并且暴露在表面上的至少一个突起部分，并且半导体芯片固定在突出部分上。