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113 条记录 (耗时 0.062 秒)

    Electromagnetic-wave-shielding light-transmitting window member and method for producing the same
    31.
    发明申请
    Electromagnetic-wave-shielding light-transmitting window member and method for producing the same 失效
    电磁波屏蔽透光窗构件及其制造方法

    公开(公告)号：US20070036888A1

    公开(公告)日：2007-02-15

    申请号：US11431608

    申请日：2006-05-11

    申请人： Tatsuya Funaki ,  Hidefumi Kotsubo ,  Kiyomi Sasaki

    发明人： Tatsuya Funaki ,  Hidefumi Kotsubo ,  Kiyomi Sasaki

    IPC分类号： B05D5/12

    CPC分类号： H05K9/0005 ,  C03C17/34 ,  C03C2217/476 ,  C03C2217/479 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1868 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/204 ,  C23C18/206 ,  C23C18/2066 ,  C23C18/31 ,  H01J2211/446 ,  H05K9/0096

    摘要： An ultraviolet-curable resin paste containing an electroless plating catalyst is applied by printing to a surface of a transparent substrate 1, and the resulting printed pattern 2 is cured by irradiation of ultraviolet light to form a resin pattern 3. Subsequently, a plating layer 4 is deposited on the resin pattern 3 by electroless plating treatment to form a conductive pattern 5. The resin pattern 3 to be subjected to the electroless plating treatment has an uncured layer 3A provided on a surface thereof. During the electroless plating treatment, the uncured layer 3A is eroded in the plating bath and particles of the catalyst are exposed. It is possible to form a satisfactory plating layer 4 using the exposed catalyst particles as nuclei. By using the ultraviolet-curable resin paste, a good conductive pattern having excellent adhesion to the transparent substrate can be formed with high accuracy, efficiently, and at low cost.

    摘要翻译： 通过印刷将含有化学镀催化剂的紫外线固化树脂糊剂施加到透明基板1的表面，并且通过紫外线的照射使得到的印刷图案2固化以形成树脂图案3。 随后，通过化学镀处理在树脂图案3上沉积镀层4以形成导电图案5。 要进行化学镀处理的树脂图案3具有设置在其表面上的未固化层3A。 在化学镀处理期间，未镀层3A在电镀槽中被侵蚀，并且催化剂的颗粒被暴露。 可以使用暴露的催化剂颗粒作为核形成令人满意的镀层4。 通过使用紫外线固化树脂浆料，可以以高精度，高效率，低成本地形成对透明基板具有优异粘合性的良好导电图案。

    Method of plating nonconductor product
    33.
    发明申请
    Method of plating nonconductor product 失效
    非导体产品电镀方法

    公开(公告)号：US20040219374A1

    公开(公告)日：2004-11-04

    申请号：US10486169

    申请日：2004-02-04

    发明人： Hideo Honma ,  Atsushi Kawahara ,  Akira Teranishi

    IPC分类号： B32B015/04 ,  B05D003/06

    CPC分类号： C23C18/1868 ,  C23C18/2033 ,  C23C18/204 ,  C23C18/206 ,  C23C18/208 ,  H05K3/181 ,  Y10S438/903 ,  Y10T428/31678

    摘要： A nonconductor product is soaked in a solution suspending semiconducting powder and is subjected to light irradiation in the solution so that the polar group is formed on the surface of the nonconductor product, and then electroless plating is performed on the surface on which the polar group is formed. A resin product is subjected to electroless plating after ultraviolet treatment in which ultraviolet rays are irradiated through water or a solution is performed. Further, electroless plating or electroplating with a different or the same kind of metal is performed on the electroless-plated layer formed by electroless plating. With the method like this, the plated nonconductor product which does not cause the problems such as environmental pollution and waste liquid treatment, and whose surface and the plated coating is firmly adhered to each other, and, when a resin product is used as a subject to be plated, deformation by heat of the resin product can be prevented, and moreover, adherent strength of the plated coating can be improved.

    摘要翻译： 将非导体产物浸泡在悬浮半导体粉末的溶液中，并在溶液中进行光照射，使得极性基团形成在非导体产品的表面上，然后在极性基团的表面上进行无电镀 形成。 紫外线处理后，通过水或溶液照射紫外线，对树脂制品进行化学镀。 此外，通过无电解电镀形成的化学镀层进行化学镀或具有不同或相同种类的金属的电镀。 采用这样的方法，不会引起诸如环境污染和废液处理等问题的电镀非导体产品，并且其表面和镀层彼此牢固地粘合，并且当树脂产品用作主体 可以防止树脂制品的热变形，并且可以提高镀覆层的粘附强度。

    Method for applying metal catalyst patterns onto ceramic for electroless copper deposition
    34.
    发明授权
    Method for applying metal catalyst patterns onto ceramic for electroless copper deposition 失效
    将金属催化剂图案用于无电镀铜沉积的方法

    公开(公告)号：US5139818A

    公开(公告)日：1992-08-18

    申请号：US710864

    申请日：1991-06-06

    申请人： Andrew M. Mance

    发明人： Andrew M. Mance

    IPC分类号： C04B41/51 ,  C04B41/52 ,  C04B41/88 ,  C04B41/89 ,  C23C18/16 ,  C23C18/18 ,  C23C18/30 ,  H05K3/18

    CPC分类号： C04B41/009 ,  C04B41/5122 ,  C04B41/52 ,  C04B41/88 ,  C04B41/89 ,  C23C18/14 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1865 ,  C23C18/1868 ,  C23C18/1879 ,  C23C18/30 ,  H05K3/185 ,  C04B2111/00844 ,  C23C18/1653

    摘要： Photochemical and electroless metallization techniques have been combined to create high resolution circuits with line widths and spaces of about one mil on alumina substrates. In this process, small amounts of a xylene-soluble platinum metallo-organic compound are first applied to the surface of the alumina substrate. A mask is then used to selectively expose the platinum metallo-organic compound to ultraviolet light in the areas that are to be metallized, so as to transform the platinum metallo-organic compound into a xylene-insoluble form. After a xylene rinse removes the original soluble platinum compound from the unexposed areas, the substrate is fired in air at about 450.degree. C. for about five minutes, so as to pyrolize the insoluble, irradiated platinum metallo-organic compound into catalytically active platinum. This is followed by electroless deposition of copper onto the ultraviolet-treated regions where the catalytically active platinum resides.

    摘要翻译： 光化学和无电镀金属化技术已经被组合起来以产生线路宽度和氧化铝基底上约1密耳空间的高分辨率电路。 在该方法中，首先将少量二甲苯可溶的铂金属有机化合物施加到氧化铝基材的表面。 然后使用掩模选择性地将铂金属有机化合物暴露于要金属化的区域中的紫外光，以将铂金属有机化合物转化为二甲苯不溶性形式。 在二甲苯冲洗后，从未曝光区域除去原始的可溶性铂化合物，将底物在约450℃的空气中焙烧约5分钟，以将不溶性的被照射的铂金属有机化合物热解成催化活性铂。 然后将铜无电沉积到紫外线处理的区域，其中催化活性铂所在的区域。

    PRODUCTION METHOD FOR PLATED SUBSTRATE
    36.
    发明公开
    PRODUCTION METHOD FOR PLATED SUBSTRATE 审中-公开

    公开(公告)号：US20240295028A1

    公开(公告)日：2024-09-05

    申请号：US18572323

    申请日：2022-06-21

    申请人： National University Corporation, Iwate University

    发明人： Jing SANG ,  Hiroki MURAOKA ,  Hidetoshi HIRAHARA

    IPC分类号： C23C18/18 ,  C03C17/10 ,  C23C18/16 ,  C23C18/32

    CPC分类号： C23C18/1893 ,  C03C17/10 ,  C23C18/1639 ,  C23C18/1868 ,  C23C18/32 ,  C03C2217/261 ,  C03C2218/111 ,  C03C2218/31

    摘要： Provided is a production method for a plated substrate, comprising: providing a photoreactive bonding agent on a surface of a substrate made of glass or silicon; irradiating the surface of the substrate, on which the photoreactive bonding agent is provided, with light to allow the surface of the substrate and the photoreactive bonding agent to be bonded to each other; after the irradiation, removing by washing the photoreactive bonding agent that is not bonded to the surface of the substrate; after the first washing, providing a catalyst that binds to the photoreactive bonding agent; after the catalyst provision, removing by washing the catalyst that does not bind to the photoreactive bonding agent; and disposing a conductive substance on the photoreactive bonding agent by an electroless plating process after the second washing, the catalyst binding to the photoreactive bonding agent.

    METHOD FOR FORMING ELECTRONIC ELEMENT
    38.
    发明申请
    METHOD FOR FORMING ELECTRONIC ELEMENT 审中-公开
    形成电子元件的方法

    公开(公告)号：US20160005514A1

    公开(公告)日：2016-01-07

    申请号：US14324888

    申请日：2014-07-07

    申请人： EPISTAR CORPORATION

    发明人： Jai-Tai KUO ,  Yu-Hsi SUNG ,  Po-Chang CHEN

    IPC分类号： H01B13/00 ,  C23C18/16 ,  C25D5/34 ,  C23C18/18

    CPC分类号： C25D5/34 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1868 ,  C25D5/024 ,  H01L21/4846 ,  H01L21/486 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Disclosed is a method for forming an electronic element. The method for forming an electronic element comprises: providing a first substrate comprising a compound comprising a metallic element and a non-metallic element; performing a first treatment by a laser radiation in a first region of the first substrate; and forming a first electrically conductive layer in the first region radiated by the laser.

    摘要翻译： 公开了一种形成电子元件的方法。 形成电子元件的方法包括：提供包括包含金属元素和非金属元素的化合物的第一基底; 在所述第一基板的第一区域中通过激光辐射进行第一处理; 以及在由所述激光辐射的所述第一区域中形成第一导电层。

    PROCESS OF DEPOSITING A METALLIC PATTERN ON A MEDIUM
    40.
    发明申请
    PROCESS OF DEPOSITING A METALLIC PATTERN ON A MEDIUM 有权
    在介质上沉积金属图案的过程

    公开(公告)号：US20150305168A1

    公开(公告)日：2015-10-22

    申请号：US14647377

    申请日：2013-11-27

    申请人： DSM IP ASSETS B.V.

    发明人： Franciscus Wilhelmus Maria GELISSEN ,  Raul Marcelino PEREZ GRATEROL

    IPC分类号： H05K3/38 ,  H05K3/18 ,  H05K3/00 ,  H05K1/03

    CPC分类号： H05K3/387 ,  B41M2205/08 ,  C23C14/048 ,  C23C14/28 ,  C23C14/584 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1868 ,  C23C18/1882 ,  H05K1/0353 ,  H05K3/0032 ,  H05K3/182 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0108 ,  H05K2203/072 ,  H05K2203/107

    摘要： Process of depositing a metallic pattern on a medium, said process comprising: generating pulsed laser beams from a pulsed laser source, wherein the laser beams have a wavelength for which the medium is substantially transparent, focussing the laser beams onto a target layer comprising inorganic particles, dispersed in a laser light degradable/combustible organic matrix, said target layer producing ejecta in response to an interaction of said laser beams and said target layer, accumulating at least a portion of said ejecta on said medium within the desired pattern, providing the pattern by electroless metal plating. The invention further relates to a transparent medium comprising a metallic pattern wherein the adhesion between the metallic pattern and the medium is at least 5N/cm.

    摘要翻译： 在介质上沉积金属图案的过程，所述方法包括：从脉冲激光源产生脉冲激光束，其中激光束具有介质基本上透明的波长，将激光束聚焦到包含无机颗粒的靶层上 ，分散在激光可降解/可燃的有机基质中，所述目标层响应于所述激光束和所述目标层的相互作用而产生喷射，在所述图案内将所述介质的至少一部分积聚在所述介质上， 通过无电镀金属电镀。 本发明还涉及包含金属图案的透明介质，其中金属图案和介质之间的粘附力为至少5N / cm。