公开(公告)号：US20170171987A1

公开(公告)日：2017-06-15

申请号：US15368946

申请日：2016-12-05

申请人： Rohm and Haas Electronic Materials LLC

发明人： Donald E. Cleary

IPC分类号： H05K3/42 ,  C23C18/32 ,  B01J31/26 ,  C23C18/48 ,  H05K3/18 ,  B01J31/06 ,  C23C18/38 ,  C23C18/50

CPC分类号： H05K3/422 ,  B01J31/06 ,  B01J31/26 ,  C23C18/1831 ,  C23C18/1879 ,  C23C18/2066 ,  C23C18/30 ,  C23C18/32 ,  C23C18/38 ,  C23C18/48 ,  C23C18/50 ,  H05K3/181 ,  H05K2203/0709

摘要： Catalysts include nanoparticles of catalytic metal and starch as a stabilizer in molar ratios which enable stabilization of the catalyst during storage and during electroless metal plating. The catalysts are environmentally friendly and are tin free. The catalysts adhere well to dielectric materials of printed circuit boards including the walls of through-holes.

公开(公告)号：US20170156216A9

公开(公告)日：2017-06-01

申请号：US14477855

申请日：2014-09-04

申请人： Rohm and Haas Electronic Materials LLC

发明人： Feng Liu ,  Maria Rzeznik

IPC分类号： H05K3/18 ,  C23C18/40 ,  B01J31/22 ,  C23C18/50 ,  C23C18/16 ,  C23C18/30 ,  C23C18/34

CPC分类号： H05K3/181 ,  B01J31/181 ,  B01J31/2295 ,  B01J2231/005 ,  B01J2531/824 ,  C23C18/1641 ,  C23C18/1658 ,  C23C18/166 ,  C23C18/2086 ,  C23C18/24 ,  C23C18/285 ,  C23C18/30 ,  C23C18/32 ,  C23C18/34 ,  C23C18/38 ,  C23C18/40 ,  C23C18/50 ,  H05K3/422 ,  H05K2203/0709

摘要： Pyrazine derivatives which contain one or more electron donating groups on the ring are used as catalytic metal complexing agents in aqueous alkaline environments to catalyze electroless metal plating on metal clad and un-clad substrates. The catalysts are monomers and free of tin and antioxidants.

公开(公告)号：US09650534B2

公开(公告)日：2017-05-16

申请号：US14111396

申请日：2012-04-11

申请人： Keisuke Kojima

发明人： Keisuke Kojima

IPC分类号： C09D125/00 ,  C08F12/00 ,  C23C18/16 ,  C09D125/06 ,  C08F12/26 ,  C08F12/30 ,  C08F12/32 ,  C23C18/28 ,  C23C18/30 ,  C23C18/18 ,  C23C18/20 ,  C08L101/00 ,  C08J7/04 ,  C23C18/32 ,  C23C18/42 ,  C23C18/38 ,  C23C18/52 ,  C08G83/00

CPC分类号： C09D125/06 ,  C08F12/26 ,  C08F12/30 ,  C08F12/32 ,  C08F2438/03 ,  C08G83/006 ,  C08J7/047 ,  C08J2367/02 ,  C08J2400/202 ,  C08L101/005 ,  C23C18/1608 ,  C23C18/1831 ,  C23C18/1834 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/206 ,  C23C18/2066 ,  C23C18/285 ,  C23C18/30 ,  C23C18/32 ,  C23C18/38 ,  C23C18/42 ,  C23C18/52 ,  Y10T428/12063

摘要： There is provided a novel, environmentally friendly primer for use in the pretreatment steps in electroless plating, which can be easily used in fewer steps with a lower cost. A primer for forming a metallic plating film on a substrate by electroless plating, the primer including: a hyperbranched polymer having an ammonium group at a molecular terminal and a weight-average molecular weight of 500 to 5,000,000; and a metal fine particle.

公开(公告)号：US20170107348A1

公开(公告)日：2017-04-20

申请号：US15126361

申请日：2015-03-23

申请人： DSM IP ASSETS B.V.

发明人： Ren BAO ,  Robert Hendrik Catharina JANSSEN

IPC分类号： C08K3/22 ,  B29B7/90 ,  B29B9/06 ,  B29C45/00 ,  H05K3/10 ,  C23C18/38 ,  C23C18/16 ,  B29B7/48 ,  H05K1/03 ,  H05K1/09 ,  C08K7/14 ,  C23C18/20

CPC分类号： C08K3/22 ,  B29B7/48 ,  B29B7/90 ,  B29B9/06 ,  B29C45/0001 ,  B29C45/0005 ,  B29K2101/12 ,  B29K2105/12 ,  B29K2309/08 ,  C08K3/24 ,  C08K7/02 ,  C08K7/14 ,  C08K2003/2265 ,  C08K2201/001 ,  C23C18/1641 ,  C23C18/1689 ,  C23C18/204 ,  C23C18/38 ,  H05K1/032 ,  H05K1/09 ,  H05K3/10

摘要： Present application discloses a thermoplastic composition comprising a) 42.5 wt. % to 94 wt. % of thermoplastic matrix resin; b) 1 wt. % to 7.5 wt. % of a laser direct structuring additive; and c) 5 wt. % to 50 wt. % fibrous reinforcement agent; wherein the wt. % is relative to the total weight of the composition; wherein the laser direct structuring additive is represented by formula ZnxNi(1-x)Fe2O4, wherein the x is higher than 0.60 and lower than 0.85; wherein the composition is capable of being plated after being activated using a laser.

公开(公告)号：US20170084396A1

公开(公告)日：2017-03-23

申请号：US15354465

申请日：2016-11-17

申请人： AVX Corporation

发明人： Andrew P. Ritter ,  Robert H. Heistand, II ,  John L. Galvagni ,  Sriram Dattaguru

IPC分类号： H01G4/30 ,  H01G4/06 ,  H01G4/228 ,  H01C17/28 ,  C25D7/00 ,  C23C18/38 ,  C23C18/16 ,  C23C28/02 ,  C25D3/56 ,  C25D5/34 ,  H01G4/012 ,  H01F41/04

CPC分类号： H01G4/30 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/32 ,  C23C18/38 ,  C23C18/48 ,  C23C28/021 ,  C23C28/023 ,  C25D3/56 ,  C25D5/02 ,  C25D5/34 ,  C25D7/00 ,  H01C1/14 ,  H01C7/008 ,  H01C7/10 ,  H01C17/28 ,  H01F41/04 ,  H01G4/005 ,  H01G4/008 ,  H01G4/012 ,  H01G4/06 ,  H01G4/12 ,  H01G4/228 ,  H01G4/232 ,  H05K3/02 ,  H05K3/403 ,  H05K2201/09709 ,  Y10T29/417 ,  Y10T29/42 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/49099 ,  Y10T29/49101

摘要： Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on top and bottom sides of a monolithic structure can facilitate the formation of wrap-around plated terminations. The disclosed technology may be utilized with a plurality of monolithic multilayer components, including interdigitated capacitors, multilayer capacitor arrays, and integrated passive components. A variety of different plating techniques and termination materials may be employed in the formation of the subject self-determining plated terminations.

公开(公告)号：US20170084372A1

公开(公告)日：2017-03-23

申请号：US15085931

申请日：2016-03-30

申请人： Apple Inc.

发明人： Katie L. Sassaman ,  Wai Man Raymund Kwok ,  Amy Qian ,  Andrea L. Blakemore

IPC分类号： H01F7/02 ,  C23C18/38 ,  C23C18/16 ,  C23C18/42 ,  C23C18/31 ,  H01F41/02 ,  C23C18/48

CPC分类号： H01F7/021 ,  C23C18/1635 ,  C23C18/1651 ,  C23C18/1689 ,  C23C18/31 ,  C23C18/38 ,  C23C18/42 ,  C23C18/48 ,  H01F7/0221 ,  H01F41/0253 ,  H01F41/026 ,  Y10T428/12861 ,  Y10T428/12882 ,  Y10T428/1291 ,  Y10T428/24942

摘要： Coatings for magnetic materials, such as rare earth magnets, are described. The coatings are designed to reduce or prevent the release of one or both of nickel and cobalt from the coatings or from the underlying magnetic material. The coatings are designed to resist corrosion and release of nickel and cobalt when exposed to moist conditions. The coatings are also designed to be robust enough to withstand damage due to scratch forces. In some embodiments, the coatings include multiple layers of one or of metal and non-metal materials. The coated magnets are well suited for use in the manufacture of wearable consumer products.

公开(公告)号：US09587315B2

公开(公告)日：2017-03-07

申请号：US14571410

申请日：2014-12-16

申请人： Deepak Shukla ,  Kevin M. Donovan

发明人： Deepak Shukla ,  Kevin M. Donovan

IPC分类号： C08F2/50 ,  C08K5/3432 ,  C08K5/45 ,  C23C18/16 ,  C23C18/31 ,  C23C18/18 ,  C09D11/101 ,  C23C18/20 ,  C23C18/30 ,  G06F3/044 ,  C23C18/38 ,  H05K3/18

CPC分类号： C23C18/1603 ,  C09D11/037 ,  C09D11/101 ,  C09D11/52 ,  C23C18/1605 ,  C23C18/1608 ,  C23C18/1637 ,  C23C18/182 ,  C23C18/1831 ,  C23C18/1868 ,  C23C18/1879 ,  C23C18/204 ,  C23C18/30 ,  C23C18/31 ,  C23C18/38 ,  G06F3/041 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K3/185

摘要： A non-aqueous metal catalytic composition includes (a) a complex of silver and an oxime comprising reducible silver ions in an amount of at least 2 weight %, (b) a silver ion photoreducing composition in an amount of at least 1 weight %, and (c) a photocurable component, a non-curable polymer, or a combination of a photocurable component and a non-curable polymer. This non-aqueous metal catalytic composition can be used to form silver metal particles in situ during suitable reducing conditions. The silver metal can be provided in a suitable layer or pattern on a substrate, which can then be subsequently subjected to electroless plating to form electrically-conductive layers or patterns for use in various articles or as touch screen displays in electronic devices.

摘要翻译： 非水性金属催化剂组合物包括（a）含有至少2重量％量的可还原银离子的银和肟的配合物，（b）至少1重量％的银离子光还原组合物， 和（c）可光固化组分，不可固化聚合物，或光固化性组分和不可固化聚合物的组合。 该非水金属催化剂组合物可用于在合适的还原条件下原位形成银金属颗粒。 银金属可以以合适的层或图案提供在基底上，然后可随后对其进行化学镀以形成用于各种制品的导电层或图案或用作电子设备中的触摸屏显示器。

公开(公告)号：US20170009350A1

公开(公告)日：2017-01-12

申请号：US14791902

申请日：2015-07-06

申请人： Carbodeon Ltd Oy

发明人： Vesa MYLLYMAKI ,  Niko ROSTEDT

IPC分类号： C23C18/34 ,  C23C18/16

CPC分类号： C23C18/34 ,  C23C18/1662 ,  C23C18/1696 ,  C23C18/1844 ,  C23C18/32 ,  C23C18/36 ,  C23C18/38 ,  C23C18/42 ,  C23C18/48 ,  C23C18/50 ,  C25D3/04 ,  C25D3/12 ,  C25D3/20 ,  C25D3/38 ,  C25D3/46 ,  C25D3/48 ,  C25D3/50 ,  C25D5/12 ,  C25D5/18 ,  C25D5/34 ,  C25D5/50 ,  C25D15/00

摘要： The present invention relates to metal plating solution comprising at least one source of metal ions and detonation nanodiamonds, wherein the detonation nanodiamonds are substantially free of negatively charged functionalities, and to a method for producing the solution. The present invention further relates to metal plating method and to a metallic coating comprising metal and detonation nanodiamonds substantially free of negatively charged functionalities.

摘要翻译： 本发明涉及包含至少一种金属离子源和引爆纳米金刚石的金属电镀溶液，其中爆炸纳米金刚石基本上没有带负电荷的官能团，以及制备溶液的方法。 本发明还涉及金属镀覆方法和金属涂层，其包含基本上不带负电荷的金属的金属和爆炸纳米金刚石。

公开(公告)号：US09519219B2

公开(公告)日：2016-12-13

申请号：US14661235

申请日：2015-03-18

申请人： Eastman Kodak Company

发明人： Thomas B. Brust ,  Grace Ann Bennett ,  Catherine A. Falkner

IPC分类号： G03F7/00 ,  G03F7/06

CPC分类号： G03F7/06 ,  B05D7/04 ,  C08F8/42 ,  C08K2003/0806 ,  C09D5/14 ,  C09D7/67 ,  C09D7/68 ,  C23C18/1608 ,  C23C18/1851 ,  C23C18/1889 ,  C23C18/1893 ,  C23C18/2006 ,  C23C18/208 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/36 ,  C23C18/38 ,  C23C18/40 ,  C23C18/44 ,  G03F7/0388 ,  G03F7/20 ,  G03F7/40

摘要： Silver-containing compositions contain a water-soluble complex of a reactive polymer with either reducible silver ions or silver nanoparticles, the reactive polymer comprising: (a) greater than 1 mol % of recurring units comprising sulfonic acid or sulfonate groups, (b) at least 5 mol % of recurring units comprising a pendant group capable of crosslinking via [2+2] photocycloaddition, and optionally (c) at least 1 mol % of recurring units comprising a pendant amide, hydroxyl, lactam, phosphonic acid, or carboxylic acid group, all amounts based on the total recurring units in the reactive polymer. Other silver-containing compositions contain a water-insoluble complex of a reacted polymer with either reducible silver ions or silver nanoparticles. The reacted polymers are derived from the reactive polymers.

摘要翻译： 含银组合物含有反应性聚合物与可还原银离子或银纳米颗粒的水溶性络合物，反应性聚合物包含：（a）大于1mol％的包含磺酸或磺酸盐基团的重复单元，（b） 至少5摩尔％的包含能够通过[2 + 2]光环加成交联的侧基的重复单元和任选地（c）至少1摩尔％的包含酰胺，羟基，内酰胺，膦酸或羧酸的重复单元的重复单元 组，基于反应性聚合物中的总重复单元的所有量。 其它含银组合物含有反应聚合物与可还原银离子或银纳米颗粒的水不溶性络合物。 反应的聚合物衍生自反应性聚合物。

公开(公告)号：US20160332153A1

公开(公告)日：2016-11-17

申请号：US15221705

申请日：2016-07-28

申请人： Rohm and Haas Electronic Materials LLC

发明人： Feng LIU ,  Maria Anna RZEZNIK

IPC分类号： B01J33/00 ,  B01J23/50 ,  B01J35/00 ,  C23C18/50 ,  C23C18/30 ,  C23C18/32 ,  C23C18/38 ,  C23C18/40 ,  B01J23/44 ,  C23C18/34

CPC分类号： B01J33/00 ,  B01J23/40 ,  B01J23/44 ,  B01J23/48 ,  B01J23/50 ,  B01J35/0013 ,  B01J37/16 ,  C23C18/1607 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/32 ,  C23C18/34 ,  C23C18/38 ,  C23C18/40 ,  C23C18/48 ,  C23C18/50

摘要： Aqueous catalysts of nanoparticles of precious metals and stabilizers of flavonoid derivatives are used to electrolessly plate metal on non-conductive substrates. Such substrates include printed circuit boards.

摘要翻译： 使用贵金属纳米颗粒和类黄酮衍生物稳定剂的水性催化剂在非导电基材上无电镀金属。 这样的基板包括印刷电路板。