公开(公告)号：US06504705B2

公开(公告)日：2003-01-07

申请号：US09976438

申请日：2001-10-11

申请人： Mikinari Shimada ,  Yasuhiko Nakada ,  Seiichi Nakatani ,  Seigo Shiraishi ,  Hiroyuki Handa ,  Akihiro Ishikawa

发明人： Mikinari Shimada ,  Yasuhiko Nakada ,  Seiichi Nakatani ,  Seigo Shiraishi ,  Hiroyuki Handa ,  Akihiro Ishikawa

IPC分类号： H01G904

CPC分类号： H01G9/15 ,  H01G11/48 ,  H01G11/56 ,  H01L2224/16227 ,  H05K1/141 ,  H05K1/162 ,  H05K1/185 ,  H05K2201/0187 ,  H05K2201/0323 ,  H05K2201/0329 ,  H05K2203/0315 ,  Y02E60/13 ,  Y10T29/417

摘要： In an electrolytic capacitor of the present invention, a dielectric layer is provided on a surface of a valve metal element for an anode having a capacitor forming part and an electrode lead part, and further, a solid electrolyte layer and a charge collecting layer for a cathode are provided in this order thereon. The capacitor forming part and the electrode lead part of the valve metal element for an anode have rough surface layers on their surfaces, and are compressed in the thickness direction of the rough surface layers. Further, a region other than the electrode lead part and the charge collecting element for cathode is molded with a molding material. Exposed portions of the electrode lead part and the charge collecting element for cathode function as electrode terminals, respectively.

公开(公告)号：US06486006B2

公开(公告)日：2002-11-26

申请号：US09927164

申请日：2001-08-10

申请人： Koichi Hirano ,  Seiichi Nakatani

发明人： Koichi Hirano ,  Seiichi Nakatani

IPC分类号： H01L2144

CPC分类号： H01L24/81 ,  H01L21/486 ,  H01L23/13 ,  H01L23/293 ,  H01L23/295 ,  H01L23/3114 ,  H01L23/3737 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15787 ,  H01L2924/18161 ,  H01L2924/3011 ,  H01L2924/00

摘要： A thermal conductive sheet including at least 70-95 weight parts of inorganic filler and 5-30 weight parts of thermosetting resin composition and having flexibility in an uncured state is prepared. Through-holes are formed in the thermal conductive sheet and a conductive resin composition is filled in the through-holes. The thermal conductive sheet and a semiconductor chip are overlapped to match positions of the through-holes formed in the thermal conductive sheet with those of the electrodes formed on the semiconductor chip. The thermal conductive sheet and the semiconductor chip are compressed while being heated and the thermal conductive sheet is cured and integrated with the semiconductor chip. An external lead electrode is formed on the thermal conductive sheet at a side opposite to the surface where the semiconductor chip is overlapped, and that is connected with the conductive resin composition. According to the above-mentioned configuration, a semiconductor package that is not required to be sealed by resin, and is excellent in reliability, air-tightness and thermal conductivity can be realized.

公开(公告)号：US06392525B1

公开(公告)日：2002-05-21

申请号：US09472252

申请日：1999-12-27

申请人： Junichi Kato ,  Osamu Inoue ,  Seiichi Nakatani ,  Koichi Hirano ,  Toshiyuki Asahi

发明人： Junichi Kato ,  Osamu Inoue ,  Seiichi Nakatani ,  Koichi Hirano ,  Toshiyuki Asahi

IPC分类号： H01F2724

CPC分类号： H01F27/022 ,  H01F3/08 ,  H01F27/34 ,  H01F2017/048

摘要： A magnetic element including: a composite magnetic member A containing a metallic magnetic powder in an amount of 50-70 vol. % and a thermosetting resin in an amount of 50-30 vol. %; a magnetic member B that is at least one selected from a ferrite sintered body and a pressed-powder magnetic body of a metallic magnetic powder; and a coil. The magnetic element is characterized in that a magnetic path determined by an arrangement of the coil passes the magnetic member A and the magnetic member B in series and the coil is embedded in the magnetic member A. The present invention also provides a method for manufacturing the magnetic element.

摘要翻译： 一种磁性元件，包括：含有50-70体积％的金属磁性粉末的复合磁性体A。 ％和热固性树脂，其量为50-30vol。 ％; 磁性体B，其是选自铁氧体烧结体和金属磁性粉末的压粉体磁体中的至少一种; 和线圈。 磁性元件的特征在于，由线圈的布置确定的磁路通过磁性构件A和磁性构件B串联，并且线圈被嵌入在磁性构件A中。本发明还提供了一种用于制造 磁性元件。

公开(公告)号：US06355131B1

公开(公告)日：2002-03-12

申请号：US09495902

申请日：2000-02-02

申请人： Seiichi Nakatani ,  Hiroyuki Handa

发明人： Seiichi Nakatani ,  Hiroyuki Handa

IPC分类号： B32B3120

CPC分类号： B32B15/08 ,  B32B27/20 ,  B32B2305/74 ,  B32B2307/302 ,  B32B2311/12 ,  B32B2457/08 ,  H01L23/145 ,  H01L23/49833 ,  H01L23/49861 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0373 ,  H05K1/056 ,  H05K3/0058 ,  H05K3/202 ,  H05K3/4069 ,  H05K3/4092 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/0355 ,  Y10S428/901 ,  Y10T156/1034 ,  Y10T156/1056 ,  Y10T156/1057 ,  Y10T156/109 ,  Y10T156/1092 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/257 ,  Y10T428/258 ,  Y10T428/265 ,  Y10T428/31681 ,  Y10T428/31692 ,  H01L2924/00

摘要： A thermally conductive substrate having a structure in which inorganic filler for improving the thermal conductivity and thermosetting resin composition are included. The thermosetting resin composition has a flexibility in the not-hardened state, and becomes rigid after hardening. The thermally conductive substrate has excellent thermal radiation characteristics. The method of manufacturing the thermally conductive substrate includes: piling up (a) the thermally conductive sheets comprising 70 to 95 weight parts of an inorganic filler, and 4.9 to 28 weight parts of a thermosetting resin composition, the thermosetting resin composition comprising at least one thermosetting resin, a hardener and a hardening accelerator, and (b) lead frame on which a wiring is formed; thermal pressing the pile; filling the thermally conductive sheet to the surface of the lead frame; hardening the thermosetting resin; cutting excess sections of the thermally conductive substrate; and processing the bending perpendicularly for making a removable electrode.

公开(公告)号：US06329045B1

公开(公告)日：2001-12-11

申请号：US09505988

申请日：2000-02-17

申请人： Koichi Hirano ,  Seiichi Nakatani ,  Hiroyuki Handa

发明人： Koichi Hirano ,  Seiichi Nakatani ,  Hiroyuki Handa

IPC分类号： B32B3100

CPC分类号： B29C43/18 ,  B29K2101/10 ,  B29L2031/3061 ,  C04B26/10 ,  C04B2111/00844 ,  C04B2111/92 ,  C08K3/01 ,  C09K5/14 ,  H01L2924/0002 ,  H05K1/0373 ,  H05K3/022 ,  H05K3/202 ,  H05K2201/0209 ,  H05K2201/09118 ,  Y10S428/901 ,  Y10T428/24802 ,  Y10T428/24909 ,  Y10T428/24917 ,  Y10T428/252 ,  Y10T428/31529 ,  C04B14/303 ,  C04B20/008 ,  C04B20/1037 ,  C04B40/0071 ,  C04B40/0082 ,  C04B40/0616 ,  C04B41/4572 ,  C04B41/51 ,  C04B14/304 ,  C04B14/325 ,  H01L2924/00

摘要： A composition for substrate materials according to the present invention includes 70-95 wt. % of inorganic powder and 5-30 wt. % of thermosetting resin composition and is in a finely crushed condition. The composition for substrate materials is prepared, for example, by crushing into fine pieces and mixing the inorganic powder and the thermosetting resin composition. A heat conductive substrate is provided with an insulator body formed by heating and pressurizing said composition for substrate materials and a wiring pattern is provided in such a condition that it is exposed on the surface of the insulator body. A process for manufacturing the heat conductive substrate comprises forming said composition for substrate materials into the insulator body by casting the above mentioned composition for substrate materials into a metal mold to be heated and pressurized so that said thermosetting resin is cured.

摘要翻译： 根据本发明的用于基材的组合物包含70-95wt。 ％的无机粉末和5-30wt。 ％的热固性树脂组合物，并且处于细碎的状态。 用于基材的组合物例如通过粉碎成细片并混合无机粉末和热固性树脂组合物来制备。 导热基板设置有通过对基板材料的所述组合物进行加热和加压而形成的绝缘体，并且以暴露于绝缘体的表面的状态设置布线图案。 制造导热基材的方法包括通过将上述用于基材的组合物浇铸到待加热和加压的金属模具中以使所述热固性树脂固化，从而将用于基材的所述组合物形成绝缘体。

公开(公告)号：US06300686B1

公开(公告)日：2001-10-09

申请号：US09158299

申请日：1998-09-22

申请人： Koichi Hirano ,  Seiichi Nakatani

发明人： Koichi Hirano ,  Seiichi Nakatani

IPC分类号： H01L2348

CPC分类号： H01L24/81 ,  H01L21/486 ,  H01L23/13 ,  H01L23/293 ,  H01L23/295 ,  H01L23/3114 ,  H01L23/3737 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15787 ,  H01L2924/18161 ,  H01L2924/3011 ,  H01L2924/00

摘要： A thermal conductive sheet including at least 70-95 weight parts of inorganic filler and 5-30 weight parts of thermosetting resin composition and having flexibility in an uncured state is prepared. Through-holes are formed in the thermal conductive sheet and a conductive resin composition is filled in the through-holes. The thermal conductive sheet and a semiconductor chip are overlapped to match positions of the through-holes formed in the thermal conductive sheet with those of the electrodes formed on the semiconductor chip. The thermal conductive sheet and the semiconductor chip are compressed while being heated and the thermal conductive sheet is cured and integrated with the semiconductor chip. An external lead electrode is formed on the thermal conductive sheet at a side opposite to the surface where the semiconductor chip is overlapped, and that is connected with the conductive resin composition. According to the above-mentioned configuration, a semiconductor package that is not required to be sealed by resin, and is excellent in reliability, air-tightness and thermal conductivity can be realized.

摘要翻译： 制备包含至少70-95重量份无机填料和5-30重量份热固性树脂组合物并且具有未固化状态的柔性的导热片。 在导热片中形成通孔，在通孔中填充导电性树脂组合物。 重叠导热片和半导体芯片，以匹配形成在导热片中的通孔的位置与形成在半导体芯片上的电极的位置。 导热片和半导体芯片被加热时被压缩，并且导热片被固化并与半导体芯片集成。 在导热片上与半导体芯片重叠的表面相对的一侧形成外部引线电极，并与导电树脂组合物连接。 根据上述结构，可以实现不需要被树脂密封并且可靠性，气密性和导热性优异的半导体封装。

公开(公告)号：US6108903A

公开(公告)日：2000-08-29

申请号：US582930

申请日：1996-01-04

申请人： Seiichi Nakatani ,  Akihito Hatakeyama ,  Kouji Kawakita ,  Hiroshi Sogou ,  Tatsuo Ogawa ,  Tamao Kojima

发明人： Seiichi Nakatani ,  Akihito Hatakeyama ,  Kouji Kawakita ,  Hiroshi Sogou ,  Tatsuo Ogawa ,  Tamao Kojima

IPC分类号： H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H05K3/10 ,  H05K3/36

CPC分类号： H05K3/462 ,  H01R12/523 ,  H05K3/4069 ,  H05K2201/0116 ,  H05K2201/0355 ,  H05K2201/09536 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/1461 ,  H05K3/4623 ,  H05K3/4652 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24917

摘要： A connecting member of circuit substrates includes an organic porous base material provided with tackfree films on both sides, through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films. This structure enables inner-via-hole connection and can therefore attain a connecting member of circuit substrates and an electrical connector of high reliability and high quality. By using a connecting member of circuit substrates including the organic porous base material provided with tackfree films on both sides and through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films, it is possible to form a high-multilayer substrate easily from double sided boards or four-layer substrates which can be manufactured rather stably. In addition to that, since the conductive paste is filled up to the surface of the tackfree films, the conductive paste sticks out from the surface of the organic porous base material when the tackfree films are separated. As a result, the filled amount of the conductive substance increases after the lamination, and thus, the connection resistance is reduced considerably.

摘要翻译： 电路基板的连接构件包括在两侧设置有无粘性薄膜的有机多孔基材，设置在要求位置的通孔，其填充有导电树脂组合物直到无粘膜的表面。 这种结构能够实现内通孔连接，从而可以获得电路基板的连接构件和高可靠性和高质量的电连接器。 通过使用包括在两侧设置有无粘膜的有机多孔基材的电路基板的连接构件，以及设置在填充有导电树脂组合物的所需位置的通孔，直到无粘膜的表面，可以形成 来自可以制造得相当稳定的双面板或四层基板的高多层基板。 除此之外，由于导电膏被填充到无粘性膜的表面，所以当无粘性膜分离时，导电糊从有机多孔基材的表面突出出来。 结果，在层压之后导电物质的填充量增加，因此连接电阻显着降低。

公开(公告)号：US5888627A

公开(公告)日：1999-03-30

申请号：US865055

申请日：1997-05-29

申请人： Seiichi Nakatani

发明人： Seiichi Nakatani

IPC分类号： H05K1/11 ,  B32B27/12 ,  H05K1/03 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46 ,  B32B9/00 ,  B32B31/20 ,  H05K3/02

CPC分类号： H05K3/462 ,  B32B27/12 ,  B32B38/00 ,  H05K3/4069 ,  B32B2038/047 ,  B32B2457/08 ,  B32B38/145 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0278 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/1461 ,  H05K3/386 ,  H05K3/4623 ,  H05K3/4652 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49135 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49153 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/249953 ,  Y10T428/249996

摘要： It is an object of the present invention to provide a highly reliable printed circuit board subject to little bowing or twisting of the substrate, wherein the substrate and metal wiring are securely bonded together, and stable electrical and mechanical connection is achieved between the metal wiring and electroconductive resin paste filled into the through holes, and to provide a method of manufacture for same. The present invention relates to a printed circuit board having a multilayer wiring structure comprising a plurality of sheet substrates consisting of resin component layers containing an inorganic filler formed onto both sides of an organic nonwoven fabric material, and two or more circuit patterns, wherein through holes are formed in the sheet substrates in the thickness direction thereof and an electroconductive resin component is filled into the through holes, forming electrical connection between each of the electrode layers, and to a method of manufacture for same.

摘要翻译： 本发明的目的是提供一种经受基板弯曲或弯曲的高度可靠的印刷电路板，其中基板和金属布线牢固地结合在一起，并且在金属布线和金属布线之间实现了稳定的电气和机械连接 导电树脂浆料填充到通孔中，并提供其制造方法。 本发明涉及具有多层布线结构的印刷电路板，该多层布线结构包括由有机无纺布材料的两面形成的含无机填料的树脂成分层构成的多个片状基材，以及两个以上的电路图形， 在片材基板的厚度方向上形成，并且导电树脂部件被填充到通孔中，在每个电极层之间形成电连接，以及其制造方法。

公开(公告)号：US5622590A

公开(公告)日：1997-04-22

申请号：US430484

申请日：1995-04-28

申请人： Yoshinobu Kunitomo ,  Makoto Nozu ,  Yasuyuki Sakashita ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Keiji Saeki ,  Yoshifumi Kitayama

发明人： Yoshinobu Kunitomo ,  Makoto Nozu ,  Yasuyuki Sakashita ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Keiji Saeki ,  Yoshifumi Kitayama

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/13 ,  H01L23/29 ,  H01L23/485 ,  B32B7/12 ,  B29C65/54 ,  H01L21/58 ,  H05K3/32

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L23/13 ,  H01L23/295 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/92125 ,  H01L2224/92247 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/16152 ,  H01L2924/351

摘要： The top surface of an insulating substrate is formed with a plurality of electrodes for bump connection, while the undersurface of the insulating substrate is formed with external terminals which are arranged in an array. On the insulating substrate is provided a semiconductor chip. The undersurface of the semiconductor chip is formed with bump electrodes. The electrodes for bump connection are electrically connected to the bump electrodes by means of a conductive adhesive. The space between the semiconductor chip and the insulating substrate is filled with a resin which integrates the above two and dissipates heat generated from the semiconductor chip.

摘要翻译： 绝缘基板的上表面形成有用于凸起连接的多个电极，而绝缘基板的下表面形成有排列成阵列的外部端子。 在绝缘基板上设置半导体芯片。 半导体芯片的下表面形成有凸块电极。 用于凸块连接的电极通过导电粘合剂电连接到凸块电极。 半导体芯片和绝缘基板之间的空间填充有上述两者的树脂，并散发由半导体芯片产生的热量。

公开(公告)号：US5550408A

公开(公告)日：1996-08-27

申请号：US408965

申请日：1995-03-23

申请人： Yoshinobu Kunitomo ,  Makoto Nozu ,  Yasuyuki Sakashita ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Keiji Saeki ,  Yoshifumi Kitayama

发明人： Yoshinobu Kunitomo ,  Makoto Nozu ,  Yasuyuki Sakashita ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Keiji Saeki ,  Yoshifumi Kitayama

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/13 ,  H01L23/29 ,  H01L23/485 ,  H01L23/28

CPC分类号： H01L21/563 ,  H01L23/13 ,  H01L23/295 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83805 ,  H01L2224/92125 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/16152 ,  H01L2924/351

摘要： The top surface of an insulating substrate is formed with a plurality of electrodes for bump connection, while the undersurface of the insulating substrate is formed with external terminals which are arranged in a matrix. On the insulating substrate is provided a semiconductor chip. The undersurface of the semiconductor chip is formed with bump electrodes. The electrodes for bump connection are electrically connected to the bump electrodes by means of a conductive adhesive. The space between the semiconductor chip and the insulating substrate is filled with a resin which integrates the above two and dissipates heat generated from the semiconductor chip.

摘要翻译： 绝缘基板的上表面形成有用于凸起连接的多个电极，而绝缘基板的下表面形成有排列成矩阵的外部端子。 在绝缘基板上设置半导体芯片。 半导体芯片的下表面形成有凸块电极。 用于凸块连接的电极通过导电粘合剂电连接到凸块电极。 半导体芯片和绝缘基板之间的空间填充有上述两者的树脂，并散发由半导体芯片产生的热量。