Abstract:
Methods and systems for depositing a thin film are disclosed. The methods and systems can be used to deposit a film having a uniform thickness on a substrate surface that has a non-planar three-dimensional geometry, such as a curved surface. The methods involve the use of a deposition source that has a shape in accordance with the non-planar three-dimensional geometry of the substrate surface. In some embodiments, multiple layers of films are deposited onto each other forming multi-layered coatings. In some embodiments, the multi-layered coatings are antireflective (AR) coatings for windows or lenses.
Abstract:
A process for modifying a surface of a substrate is provided that includes supplying electrons to an electrically isolated anode electrode of a closed drift ion source. The anode electrode has an anode electrode charge bias that is positive while other components of the closed drift ion source are electrically grounded or support an electrical float voltage. The electrons encounter a closed drift magnetic field that induces ion formation. Anode contamination is prevented by switching the electrode charge bias to negative in the presence of a gas, a plasma is generated proximal to the anode electrode to clean deposited contaminants from the anode electrode. The electrode charge bias is then returned to positive in the presence of a repeat electron source to induce repeat ion formation to again modify the surface of the substrate. An apparatus for modification of a surface of a substrate by this process is provided.
Abstract:
It is a technical challenge to provide a small-sized ion source excellent in operability. An ion source of the present invention includes: a cylindrical insulation tube (2) opened upward and opened at part of its lower surface; a plurality of hollow cylindrical permanent magnets (3), provided on the outer peripheral surface of the insulation tube to be arranged in a row in the axial direction of the insulation tube; a gas supplying means (34, 35, 20) for supplying gas into the insulation tube; a cathode electrode, at the tip end of which a fitting unit (19) for fitting of a solid material (18) there to is formed; an annular anode electrode (5), which is fitted to an opening in the lower surface of the insulation tube; an upper frame (6), which blocks the upper portion of the insulation tube and suspends the cathode electrode so as to allow the fitting unit to approach the anode electrode; and a lower frame (7), in which an extraction port (37) is formed for extracting ions emitted from the anode electrode, and on which the insulation tube is mounted.
Abstract:
The present invention relates to an improved ion source comprising a magnetron and cathode in a first housing and a cold cathode in a second housing. The second housing generally comprises a Penning cell to collimate an ion beam arising from the first housing. This arrangement provides an ion source capable of ejecting sputtered ions of the cold cathode magnetron discharge into a highly collimated, positive ion beam having low emittance angles. The invention also provides a cold cathode target for use in an ion source, and in particular, to an ion source having single or multiple targets of desired materials and/or dimensions to provide a rich source of boron ions in a manner allowing operation of the ion source free of producing significant toxic effects or corrosion. The invention also relates to a cold cathode target comprising a boron-containing material selected from the group consisting of a boron alloy, a boride, and mixtures thereof. The invention also relates to ion sources which comprise a single solid cathode disc or a multiple or array of solid cathode discs, or having a bore through on axis, in which the cathode is made of conductive materials such as metals, alloys and metal compounds. Example materials include indium, aluminum and indium phosphide. The ion source can be a source of positive gas ions.
Abstract:
A sputter deposition source for depositing a material on a substrate is described. The sputter deposition source includes an array of magnetron sputter cathodes arranged in a row for coating the substrate in a deposition area on a front side of the array. At least one magnetron sputter cathode of the array includes a first rotary target rotatable around a first rotation axis (A1); and a first magnet assembly arranged in the first rotary target and configured to provide a closed plasma racetrack (P) on a surface of the first rotary target that extends along the first rotation axis (A1) on a first side and on a second side of the at least one magnetron sputter cathode. Further described is a magnetron sputter cathode for a sputter deposition source and a method of depositing a material on a substrate.
Abstract:
A method for manufacturing a sputtering target with which an oxide semiconductor film with a small amount of defects can be formed is provided. Alternatively, an oxide semiconductor film with a small amount of defects is formed. A method for manufacturing a sputtering target is provided, which includes the steps of: forming a polycrystalline In-M-Zn oxide (M represents a metal chosen among aluminum, titanium, gallium, yttrium, zirconium, lanthanum, cesium, neodymium, and hafnium) powder by mixing, sintering, and grinding indium oxide, an oxide of the metal, and zinc oxide; forming a mixture by mixing the polycrystalline In-M-Zn oxide powder and a zinc oxide powder; forming a compact by compacting the mixture; and sintering the compact.
Abstract:
In various embodiments, eroded sputtering targets are partially refurbished by spray-depositing particles of target material to at least partially fill certain regions (e.g., regions of deepest erosion) without spray-deposition within other eroded regions (e.g., regions of less erosion). The partially refurbished sputtering targets may be sputtered after the partial refurbishment without substantive changes in sputtering properties (e.g., sputtering rate) and/or properties of the sputtered films.
Abstract:
To provide an ion gun of a penning discharge type capable of achieving a milling rate which is remarkably higher than that in the related art, an ion milling device including the same, and an ion milling method.An ion generation unit includes a cathode that emits electrons, an anode that is provided within the ion generation unit and has an inner diameter of 5.2 mm or less, and magnetic-field generation means using a permanent magnet of which a maximum energy product ranges from 110 kJ/m3 to 191 kJ/m3.