公开(公告)号：US09672987B2

公开(公告)日：2017-06-06

申请号：US14664260

申请日：2015-03-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Soo Park ,  Min Cheol Park

IPC: H01G4/30 ,  H01G4/228 ,  H01G4/06 ,  H01G4/232 ,  H01G4/012 ,  H01G4/38 ,  H01G4/12 ,  H05K3/34

CPC classification number: H01G4/30 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/385 ,  H05K1/0306 ,  H05K1/111 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A multilayer ceramic capacitor and a board having the same are provided. The multilayer ceramic capacitor includes external electrodes disposed on both end surfaces of a ceramic body and a mounting surface to be spaced apart from each other in a width direction, respectively, first internal electrodes connected to the left and right external electrodes, second internal electrodes having lead-out portions to be connected to the external electrodes disposed on the mounting surface. The ceramic body includes a first region positioned in a center portion thereof in the width direction and second regions positioned in both side portions in the width direction, with the first region therebetween, the plurality of first internal electrodes are disposed in the first region, and the first and second internal electrodes are alternately disposed in the second regions.

公开(公告)号：US20170154731A1

公开(公告)日：2017-06-01

申请号：US15252906

申请日：2016-08-31

Applicant: Taiyo Yuden Co., Ltd.

Inventor： Mikio Tahara ,  Tomoaki Nakamura ,  Kayoko Hirayama ,  Reiko Shimoda

IPC: H01G4/30 ,  H01G4/232 ,  H05K1/18

CPC classification number: H01G4/30 ,  H01G4/232 ,  H05K1/18 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611

Abstract: An electronic component includes: a chip having first and second end surfaces oriented in a direction of a first axis, first and second main surfaces oriented in a direction of a second axis orthogonal to the first axis, first and second side surfaces oriented in a direction of a third axis orthogonal to the first and second axes, and first and second external electrodes respectively covering the first and second end surfaces and each extending to the first and second main surfaces and side surfaces; a covering portion covering the chip from the first main surface toward the second main surface; and exposed portions provided to the second main surface, including regions where the first and second external electrodes are exposed without being covered with the covering portion, and being pushed out toward the first main surface along ridges connecting the first and second end surfaces and side surfaces.

公开(公告)号：US09664569B2

公开(公告)日：2017-05-30

申请号：US14714005

申请日：2015-05-15

Applicant: Google Inc.

Inventor： Adam Mittleman ,  Ian Charles Smith ,  Daniel Adam Warren ,  William Raeming Dong ,  Jeff Wheeler

IPC: G01N21/00 ,  G01J5/06 ,  H05K1/02 ,  G01J5/00 ,  G01J5/10 ,  G01J5/02 ,  G01J5/04 ,  G08B13/189

CPC classification number: G01J5/06 ,  G01J5/0014 ,  G01J5/0205 ,  G01J5/04 ,  G01J5/10 ,  G08B13/189 ,  G08B13/191 ,  H05K1/0201 ,  H05K1/0298 ,  H05K2201/09063 ,  H05K2201/093 ,  H05K2201/09363 ,  H05K2201/0969 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10522 ,  H05K2201/10575 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A multilayered circuit board having a metal-free region vertically extending through at least a portion of a conductive layer, which lies generally parallel to a horizontal plane, vertically spaced from an outer surface. Heat-emitting and heat-sensitive components are mounted on the outer surface. The heat-emitting component is vertically and laterally spaced from the metal-free region, whereas the heat-sensitive component is vertically spaced and laterally aligned within the metal-free region such that the metal-free region is a thermal barrier that shields heat-sensitive component from radial heat flowing from the heat-emitting component.

公开(公告)号：US09655229B2

公开(公告)日：2017-05-16

申请号：US14938900

申请日：2015-11-12

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Tae-Hong Min ,  Myung-Sam Kang ,  Young-Gwan Ko

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/46 ,  H05K3/44

CPC classification number: H05K1/0206 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/2518 ,  H01L2924/15311 ,  H05K1/0203 ,  H05K1/0207 ,  H05K1/0231 ,  H05K1/185 ,  H05K3/445 ,  H05K3/4602 ,  H05K3/4608 ,  H05K2201/0323 ,  H05K2201/09136 ,  H05K2201/10015 ,  H05K2201/10416 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A circuit board includes a first thermally conductive structure comprising a cavity or a recess portion. At least a portion of the first thermally conductive structure is inserted into an insulating part. An electronic device comprising a portion thereof inserted in the cavity or the recess portion.

公开(公告)号：US09648739B2

公开(公告)日：2017-05-09

申请号：US14558614

申请日：2014-12-02

Applicant: CANON KABUSHIKI KAISHA

Inventor： Takashi Aoki ,  Yasuhiro Sawada

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  H05K3/34

CPC classification number: H05K1/111 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/09272 ,  H05K2201/09427 ,  H05K2201/09727 ,  H05K2201/0979 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10651 ,  Y02P70/611

Abstract: An electronic component mounting structure includes a first land, a second land making a pair with the first land, an electronic component having a chip shape and including a first electrode connected to the first land and a second electrode connected to the second land, a first wiring pattern connected to the first land, and a second wiring pattern connected to the second land and including a first partial pattern overlapping a portion of a body of the electronic component in planar view, the portion being not covered with the pair of electrodes, a second partial pattern formed integral with the first partial pattern and overlapping the first electrode of the electronic component in planar view, and a third partial pattern formed integral with the second partial pattern and parallel to the first wiring pattern.

公开(公告)号：US09640321B2

公开(公告)日：2017-05-02

申请号：US14536032

申请日：2014-11-07

Applicant: TDK Corporation

Inventor： Sunao Masuda ,  Katsumi Kobayashi ,  Akitoshi Yoshii

IPC: H01G2/10 ,  H01G4/30 ,  H01G4/38 ,  H01G2/06 ,  H01G4/232 ,  H01G4/12 ,  H05K3/34

CPC classification number: H01G2/106 ,  H01G2/06 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H01G4/38 ,  H05K3/3426 ,  H05K2201/1053 ,  H05K2201/10537 ,  H05K2201/10636 ,  H05K2201/10946 ,  Y02P70/611

Abstract: A ceramic electronic component with metal terminals comprising a chip component of approximately parallelepiped shape having a pair of terminal electrodes, and a pair of metal terminal parts provided in accordance with the terminal electrodes. The terminal electrode is formed by wrapping around a part of side faces from an end face of the chip component. The metal terminal part comprises a connecting part connecting to the terminal electrode and including a connecting face extending approximately parallel to the end face, plurality of joint parts connecting to the connecting part and including a joint face extending in a different direction of the connecting face, and plurality of mounting parts connecting to the joint parts and including a mounting part upper face extending approximately parallel to any one of the side faces which is different direction of the joint face by taking predetermined spaces.

公开(公告)号：US09635760B1

公开(公告)日：2017-04-25

申请号：US15000941

申请日：2016-01-19

Applicant: ALCATEL-LUCENT CANADA INC.

Inventor： Alex L. Chan ,  Paul J. Brown

IPC: H05K7/10 ,  H05K1/11 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K1/113 ,  H05K1/0231 ,  H05K1/0295 ,  H05K1/114 ,  H05K3/0005 ,  H05K3/3452 ,  H05K3/4038 ,  H05K2201/099 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10734 ,  Y02P70/611

Abstract: A printed circuit board design for 0204 reverse geometry capacitor use between vias on a tight-pitch Ball Grid Array is disclosed. The printed circuit board design for 0204 reverse geometry capacitor use between vias on a tight-pitch Ball Grid Array provides component landing pads sized to accommodate an 0204 surface mount component within a 1.2 mm by 1.0 mm rectangular spacing. The printed circuit board design for 0204 reverse geometry capacitor use between vias on a tight-pitch Ball Grid Array is particularly useful for overcoming the problem of component placement on tight-pitch arrays known in the art.

公开(公告)号：US09607762B2

公开(公告)日：2017-03-28

申请号：US14149474

申请日：2014-01-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Byoung Hwa Lee ,  Doo Young Kim ,  Hai Joon Lee ,  Jin Man Jung

IPC: H01G4/005 ,  H01G4/30 ,  H01G2/06 ,  H05K1/18

CPC classification number: H01G4/005 ,  H01G2/06 ,  H01G4/30 ,  H05K1/185 ,  H05K2201/10636 ,  Y02P70/611

Abstract: There is provided a multilayer ceramic electronic part to be embedded in a board including: a ceramic body including dielectric layers; an active layer including a plurality of first and second internal electrodes; upper and lower cover layers disposed on and below the active layer, respectively; and first and second external electrodes formed on both end portions of the ceramic body, wherein a first internal electrode positioned at an outermost position among the first electrodes is connected to the first external electrode by at least one first via extended to at least one of first and second main surfaces of the ceramic body, and a second internal electrode positioned at an outermost position among the second internal electrodes is connected to the second external electrode by at least one second via extended to at least one of first and second main surfaces of the ceramic body.

公开(公告)号：US20170048982A1

公开(公告)日：2017-02-16

申请号：US15336941

申请日：2016-10-28

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shota ISHIHARA ,  Tetsuya ODA ,  Tatsunori KAN ,  Kenichi ATSUCHI

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K1/185 ,  H05K1/111 ,  H05K3/284 ,  H05K3/34 ,  H05K3/3442 ,  H05K2201/09663 ,  H05K2201/10431 ,  H05K2201/10507 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K2201/10977 ,  H05K2203/048 ,  H05K2203/1316 ,  Y02P70/611 ,  Y02P70/613

Abstract: A bridge section 12 is disposed in an area where mounting sections 11 are opposed to each other such that it is displaced toward a predetermined side. Accordingly, even if the line width of the bridge section 12 is formed larger than that in the related art, the self-alignment phenomenon can occur appropriately in a reflow process. It is thus possible to provide a resin-sealed module having high resin-charging properties and including a circuit substrate on which the bridge section 12 is not broken even if the size of a common land electrode 10 is reduced in accordance with a smaller size of a circuit component 5 and on which a sufficient gap between plural circuit components 5 mounted on the circuit substrate is reliably secured.

Abstract translation: 桥接部分12设置在安装部分11彼此相对的区域中，使得其朝向预定侧移位。 因此，即使桥接部12的线宽比现有技术中的线宽大，也可以在回流工序中适当地进行自对准现象。 因此，可以提供具有高树脂充电性能的树脂密封模块，并且包括电路基板，其中桥接部分12也不会破坏，即使根据较小尺寸的共同接地电极10的尺寸减小 电路部件5可靠地确保安装在电路基板上的多个电路部件5之间的充分的间隙。

公开(公告)号：US09532468B2

公开(公告)日：2016-12-27

申请号：US14549951

申请日：2014-11-21

Applicant: IBIDEN Co., Ltd.

Inventor： Masatoshi Kunieda ,  Makoto Terui ,  Ryoujiro Tominaga ,  Takashi Kariya

IPC: H05K1/09 ,  H05K1/11 ,  H05K3/46 ,  H05K1/02 ,  H05K1/18 ,  H05K3/24 ,  H05K3/34

CPC classification number: H05K3/4682 ,  H01L2224/16227 ,  H05K1/0256 ,  H05K1/0265 ,  H05K1/09 ,  H05K1/112 ,  H05K1/113 ,  H05K1/114 ,  H05K1/185 ,  H05K3/243 ,  H05K3/244 ,  H05K3/3436 ,  H05K2201/0352 ,  H05K2201/0391 ,  H05K2201/0761 ,  H05K2201/0769 ,  H05K2201/094 ,  H05K2201/09736 ,  H05K2201/0989 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2201/2081 ,  H05K2203/1394 ,  Y02P70/611 ,  Y10T29/49155

Abstract: A wiring board includes a first resin insulating layer, conductor pads on the first insulating layer including first and second conductor pads, a second resin insulating layer on the first insulating layer covering the first and second pads, an outermost conductor layer on the second insulating layer including first and second outermost wiring layers, via conductors through the second insulating layer including a first via conductor connecting the first wiring layer and first pad and a second via conductor connecting the second wiring layer and second pad, and a solder resist layer on the second insulating layer such that the solder resist layer is covering the first wiring layer and has one or more openings exposing the second wiring layer. The first wiring layer includes first main metal, and the second wiring layer includes second main metal which is different from the first metal of the first wiring layer.

Abstract translation: 布线基板包括第一树脂绝缘层，第一绝缘层上包括第一和第二导体焊盘的导体焊盘，覆盖第一和第二焊盘的第一绝缘层上的第二树脂绝缘层，第二绝缘层上的最外层导体层 包括第一和第二最外面布线层，通过第二绝缘层的通孔导体包括连接第一布线层和第一焊盘的第一通孔导体和连接第二布线层和第二焊盘的第二通孔导体，以及在第二绝缘层上的阻焊层 绝缘层，使得阻焊层覆盖第一布线层并且具有暴露第二布线层的一个或多个开口。 第一布线层包括第一主金属，第二布线层包括与第一布线层的第一金属不同的第二主金属。