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101 条记录 (耗时 0.033 秒)

    Electronic package with filled blinds vias
    52.
    发明授权
    Electronic package with filled blinds vias 有权
    带盲孔通孔的电子包装

    公开(公告)号：US07084509B2

    公开(公告)日：2006-08-01

    申请号：US10263909

    申请日：2002-10-03

    申请人： Frank D. Egitto ,  Elizabeth Foster ,  Raymond T. Galasco ,  Voya R. Markovich ,  Manh-Quan Tam Nguyen

    发明人： Frank D. Egitto ,  Elizabeth Foster ,  Raymond T. Galasco ,  Voya R. Markovich ,  Manh-Quan Tam Nguyen

    IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

    CPC分类号： H05K1/115 ,  H01L21/486 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/4602 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2203/0733 ,  H01L2924/00

    摘要： The density of electronic packaging and the electrical reliability of the sub-assemblies utilizing stacked blind vias are improved by providing a blind, landless via in a first dielectric layer laminated to a conductive metal core serving as a ground plane or a power plane. A hole is provided through the dielectric layer extending to the core. A metal, such as copper, is deposited electrolytically using the metal core as the cathode, or electrolessly without seeding into the hole. The metal is deposited on the core and progressively builds in the hole to the depth required for the via. A second dielectric layer is laminated to the first, and is provided with a second layer blind via aligned with the first via. This second via may be formed by conventional plating techniques. Multiple dielectric layers with stacked blind vias can be assembled in this manner.

    摘要翻译： 通过在层叠到用作接地平面或电源平面的导电金属芯的第一介电层中提供盲目的无地通孔来改善电子封装的密度和利用堆叠盲孔的子组件的电可靠性。 通过延伸到芯的电介质层提供孔。 使用金属芯作为阴极电解沉积诸如铜的金属，或者无电渗入孔中。 金属沉积在芯上并逐渐建立在孔中以达到通孔所需的深度。 第二电介质层被层压到第一电介质层，并且具有与第一通孔对准的第二层盲孔。 该第二通孔可以由常规电镀技术形成。 可以以这种方式组装具有堆叠的盲孔的多个电介质层。

    Laser excision of laminate chip carriers
    55.
    发明授权
    Laser excision of laminate chip carriers 失效
    激光切割层压芯片载体

    公开(公告)号：US06509546B1

    公开(公告)日：2003-01-21

    申请号：US09526034

    申请日：2000-03-15

    申请人： Frank D. Egitto ,  John S. Kresge

    发明人： Frank D. Egitto ,  John S. Kresge

    IPC分类号： B23K2618

    CPC分类号： H05K3/0038 ,  B23K26/40 ,  B23K2101/34 ,  B23K2103/02 ,  B23K2103/05 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/172 ,  B23K2103/42 ,  B23K2103/50 ,  H01L21/78 ,  H05K1/056 ,  H05K3/0052 ,  H05K3/44 ,  H05K2201/09036 ,  H05K2201/0909

    摘要： A method and associated structure for excising laminate chip carriers from a panel that has a thickness less than about 100 mils. A laser beam is focused on a surface of the panel, and the panel is moved relative to the laser beam in a geometric pattern, such that cells of the panel (e.g., chip carriers) are excised from the panel. The laser parameters include a wavelength between about 500 nanometers and about 600 nanometers, a pulse width greater than about 100 nanoseconds and less than about 350 nanoseconds, an average power of at least about 1 watt, a pulse repetition rate between about 5,000 pulses/sec and about 20,000 pulses/sec, and a target diameter (D) between about 2 microns and about 30 microns. The kerf width between adjacent excised cells is between about 2 microns and about 75 microns. The width of an excised cell is at least 5 mm. A displacement between successive pulses of the laser beam is less than about 2D. The panel may comprise a layered structure that includes an organic layer and a metal layer. The laser includes, inter alia, a lasant of Nd:YAG, Nd:YLF, Nd:YAP, or Nd:YVO4. The method of the present invention wastes less panel area by at least a factor of about 13 than does the mechanical excising techniques of the related art.

    摘要翻译： 一种用于从厚度小于约100密耳的面板切割层压芯片载体的方法和相关结构。 激光束聚焦在面板的表面上，并且面板以几何图案相对于激光束移动，使得面板的单元（例如，芯片载体）从面板上被切除。 激光参数包括约500纳米至约600纳米之间的波长，大于约100纳秒且小于约350纳秒的脉冲宽度，至少约1瓦特的平均功率，约5,000脉冲/秒之间的脉冲重复率 和约20,000脉冲/秒，目标直径（D）在约2微米至约30微米之间。 相邻切割细胞之间的切口宽度在约2微米至约75微米之间。 切除的细胞的宽度至少为5mm。 激光束的连续脉冲之间的位移小于约2D。 面板可以包括层状结构，其包括有机层和金属层。 激光器尤其包括Nd：YAG，Nd：YLF，Nd：YAP或Nd：YVO4的农民。 与现有技术的机械切除技术相比，本发明的方法比面板面积少了约13倍。