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    Flexible Circuit Electrode Array
    51.
    发明申请
    Flexible Circuit Electrode Array 有权
    柔性电路电极阵列

    公开(公告)号：US20090264972A1

    公开(公告)日：2009-10-22

    申请号：US12163658

    申请日：2008-06-27

    申请人： David Daomin Zhou ,  Robert J. Greenberg ,  Jordan Matthew Neysmith ,  Boon-Khai Ng ,  James Singleton Little

    发明人： David Daomin Zhou ,  Robert J. Greenberg ,  Jordan Matthew Neysmith ,  Boon-Khai Ng ,  James Singleton Little

    IPC分类号： A61N1/05 ,  B29C70/88 ,  B05D5/12

    CPC分类号： A61N1/0543 ,  A61N1/0541 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/118 ,  H05K3/28 ,  H05K2201/0133 ,  H05K2201/0195 ,  Y10T156/1002

    摘要： A flexible circuit electrode array, which comprises: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and a partial or entire coating of the base and top layer by a soft polymer.A method of preparing a flexible circuit electrode array, comprising: (a) providing a first soft polymer layer; (b) depositing a first a base layer on the first soft polymer layer; (c) providing a metal thin film on the base layer; (d) depositing a top polymer layer on the metal thin film; (e) providing holes in the top polymer layer; (f) depositing a second soft polymer layer on the top polymer layer; (g) providing holes in the second soft polymer layer for bond pads and electrodes; and (h) preparing electrodes in the provided holes.A method of preparing a flexible circuit electrode array, comprising: (a) providing a first soft polymer layer; (b) depositing a first a base layer on the first soft polymer layer; (c) providing a metal thin film on the base layer; (d) depositing a top polymer layer on the metal thin film; (e) depositing a second soft polymer layer on the top polymer layer; (f) providing holes in the second soft polymer layer and in the top polymer layer for bond pads and electrodes; and (g) preparing electrodes in the provided holes.

    摘要翻译： 一种柔性电路电极阵列，包括：聚合物基层; 沉积在所述聚合物基层上的金属痕迹，包括适于刺激神经组织的电极; 沉积在所述聚合物基底层和所述金属迹线上的聚合物顶层; 以及通过软聚合物的基底和顶层的部分或全部涂层。 一种制备柔性电路电极阵列的方法，包括：（a）提供第一软聚合物层; （b）在第一软聚合物层上沉积第一基底层; （c）在基层上提供金属薄膜; （d）在金属薄膜上沉积顶部聚合物层; （e）在顶部聚合物层中提供孔; （f）在顶部聚合物层上沉积第二软聚合物层; （g）在第二软聚合物层中为接合焊盘和电极提供孔; 和（h）在所提供的孔中制备电极。 一种制备柔性电路电极阵列的方法，包括：（a）提供第一软聚合物层; （b）在第一软聚合物层上沉积第一基底层; （c）在基层上提供金属薄膜; （d）在金属薄膜上沉积顶部聚合物层; （e）在顶部聚合物层上沉积第二软聚合物层; （f）在第二软聚合物层和顶部聚合物层中提供用于接合焊盘和电极的孔; 和（g）在所提供的孔中制备电极。

    Wireless Visual Prosthesis with Remote Driver and Coil
    53.
    发明申请
    Wireless Visual Prosthesis with Remote Driver and Coil 有权
    无线视觉假肢与远程驱动器和线圈

    公开(公告)号：US20110313486A1

    公开(公告)日：2011-12-22

    申请号：US13163506

    申请日：2011-06-17

    申请人： Richard Agustin Castro ,  Robert J. Greenberg

    发明人： Richard Agustin Castro ,  Robert J. Greenberg

    IPC分类号： A61F9/08 ,  A61N1/372

    CPC分类号： A61N1/36046 ,  A61N1/086 ,  G01R33/4806

    摘要： The present invention is wireless visual prosthesis with a remote driver for the external coils this, among other things, provides for a magnetic resonance image (MRI) safe visual prosthesis. fMRI is an effective tool for analyzing cortical responses to neural stimulation, such as from a visual prosthesis. However, the external electronics of a visual prosthesis cannot operate in a MRI field. The present invention provides a radio frequency shielded link between a video processing unit, driver circuitry and the coils used for communicating with the implantable portion of the visual prosthesis.

    摘要翻译： 本发明是具有用于外部线圈的远程驱动器的无线视觉假体，其特征在于提供磁共振图像（MRI）安全视觉假体。 fMRI是用于分析皮层对神经刺激的反应的有效工具，例如从视觉假体。 然而，视觉假体的外部电子学不能在MRI领域中操作。 本发明提供了一种在视频处理单元，驱动器电路和用于与视觉假体的可植入部分通信的线圈之间的射频屏蔽连接。

    Flexible circuit electrode array device and a method for backside processing of a flexible circuit electrode device
    54.
    发明授权
    Flexible circuit electrode array device and a method for backside processing of a flexible circuit electrode device 有权
    柔性电路电极阵列器件及柔性电路电极器件的背面处理方法

    公开(公告)号：US08738149B2

    公开(公告)日：2014-05-27

    申请号：US13397604

    申请日：2012-02-15

    申请人： Qingfang Yao ,  Jordan Matthew Nevsmith ,  Neil Hamilton Talbot ,  James Singleton Little ,  Robert J. Greenberg

    发明人： Qingfang Yao ,  Jordan Matthew Nevsmith ,  Neil Hamilton Talbot ,  James Singleton Little ,  Robert J. Greenberg

    IPC分类号： A61N1/04

    CPC分类号： A61N1/05 ,  A61N1/0541 ,  A61N1/0543 ,  B23K26/361 ,  B23K26/362

    摘要： The invention involves a flexible circuit electrode array device comprising: a polymer layer; wherein the polymer layer includes one or more metal traces, an electrode array; one or more bond pads; and the electrode array is located on the opposite side of the polymer layer.The invention further involves a method for backside processing of a flexible circuit electrode device, comprising: applying polymer film on a substrate; processing the front side; releasing the polymer film from substrate; flipping over the polymer film and fixing it onto the substrate; processing the backside; and final releasing of the polymer film from the substrate.The invention further involves a method for backside processing of a flexible circuit electrode device, comprising: processing the front side without releasing the polymer; processing the backside by sacrificial substrate method, or by laser drilling method; and releasing the polymer film from the substrate.

    摘要翻译： 本发明涉及一种柔性电路电极阵列器件，包括：聚合物层; 其中所述聚合物层包括一个或多个金属迹线，电极阵列; 一个或多个接合垫; 并且电极阵列位于聚合物层的相对侧上。 本发明还涉及一种用于柔性电路电极器件的背面处理的方法，包括：在基底上施加聚合物膜; 正面加工; 从基材中释放聚合物膜; 翻转在聚合物膜上并将其固定在基底上; 处理背面; 并从基底中最终释放聚合物膜。 本发明还涉及一种用于柔性电路电极器件的背面处理的方法，包括：处理前侧而不释放聚合物; 通过牺牲基板方法或通过激光钻孔方法处理背面; 并从基板上释放聚合物膜。

    Flexible circuit electrode array and method of manufacturing the same
    57.
    发明授权
    Flexible circuit electrode array and method of manufacturing the same 有权
    柔性电路电极阵列及其制造方法

    公开(公告)号：US08322027B1

    公开(公告)日：2012-12-04

    申请号：US11926498

    申请日：2007-10-29

    申请人： Robert J. Greenberg ,  Neil Hamilton Talbot ,  Jordan Matthew Neysmith ,  Jerry Ok

    发明人： Robert J. Greenberg ,  Neil Hamilton Talbot ,  Jordan Matthew Neysmith ,  Jerry Ok

    IPC分类号： H05K3/00 ,  H05K3/10 ,  H05K1/00

    CPC分类号： H05K3/06 ,  A61N1/0543 ,  H05K1/118 ,  H05K3/0041 ,  H05K3/28 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0154 ,  H05K2201/0317 ,  H05K2203/0554 ,  H05K2203/0789 ,  H05K2203/0793 ,  H05K2203/095 ,  H05K2203/1163 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49155

    摘要： A method for manufacturing a flexible circuit electrode array, comprising: a) depositing a metal trace layer containing a base coating layer, a conducting layer and a top coating layer on said insulator polymer base layer; b) applying a layer of photoresist on said metal trace layer and patterning said metal trace layer and forming metal traces on said insulator polymer base layer; c) activating said insulator polymer base layer and depositing a top insulator polymer layer and forming one single insulating polymer layer with said base insulator polymer layer; d) applying a thin metal layer and a layer of photoresist on the surface of said insulator polymer layer and selective etching said insulator layer and said top coating layer to obtain at least one via; and e) filling said via with electrode material. A layer of polymer is laid down. A layer of metal is applied to the polymer and patterned to create electrodes and leads for those electrodes. A second layer of polymer is applied over the metal layer and patterned to leave openings for the electrodes, or openings are created later by means such as laser ablation. Hence the array and its supply cable are formed of a single body. Alternatively, multiple alternating layers of metal and polymer may be applied to obtain more metal traces within a given width.The method provides an excellent adhesion between the polymer base layer and the polymer top layer and insulation of the trace metals and electrodes.

    摘要翻译： 一种制造柔性电路电极阵列的方法，包括：a）在所述绝缘体聚合物基底层上沉积包含基底涂层，导电层和顶部涂层的金属迹线层; b）在所述金属迹线层上施加一层光致抗蚀剂，并图案化所述金属迹线层并在所述绝缘体聚合物基底层上形成金属迹线; c）激活所述绝缘体聚合物基层并沉积顶部绝缘体聚合物层并与所述基础绝缘体聚合物层形成单个绝缘聚合物层; d）在所述绝缘体聚合物层的表面上施加薄金属层和光致抗蚀剂层，并选择性地蚀刻所述绝缘体层和所述顶部涂层以获得至少一个通孔; 和e）用电极材料填充所述通孔。 放置一层聚合物。 将一层金属施加到聚合物上并图案化以产生用于那些电极的电极和引线。 将第二层聚合物施加在金属层上并图案化以留下电极的开口，或稍后通过诸如激光烧蚀的手段产生开口。 因此阵列及其供电电缆由单体形成。 或者，可以施加金属和聚合物的多个交替层以在给定宽度内获得更多的金属迹线。 该方法提供了聚合物基底层和聚合物顶层之间的极好的粘合性，并且痕迹金属和电极的绝缘性。