公开(公告)号：US20150356918A1

公开(公告)日：2015-12-10

申请号：US14830486

申请日：2015-08-19

Applicant: LuxVue Technology Corporation

Inventor： Kapil V. Sakariya ,  Andreas Bibl ,  Kelly McGroddy

IPC: G09G3/32 ,  H01L25/16 ,  H01L25/075

CPC classification number: G09G3/3426 ,  G09G3/2088 ,  G09G3/32 ,  G09G3/3216 ,  G09G3/3233 ,  G09G3/3266 ,  G09G2300/0828 ,  G09G2300/0842 ,  G09G2300/0857 ,  G09G2310/08 ,  G09G2320/029 ,  G09G2330/028 ,  H01L25/0753 ,  H01L25/167 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices.

Abstract translation: 描述发光组件。 在一个实施例中，一个或多个发光二极管（LED）器件和一个或多个微控制器被结合到衬底的同一侧，一个或多个微控制器用于切换和驱动一个或多个LED器件。

公开(公告)号：US20150333221A1

公开(公告)日：2015-11-19

申请号：US14278778

申请日：2014-05-15

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  Dariusz Golda

IPC: H01L33/20 ,  H01L33/52 ,  H01L33/62 ,  H01L33/44 ,  H01L33/08 ,  H01L27/15

CPC classification number: H01L25/167 ,  G09F9/301 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1266 ,  H01L27/15 ,  H01L27/153 ,  H01L27/156 ,  H01L2221/68318 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/16227 ,  H01L2224/24101 ,  H01L2224/24105 ,  H01L2224/24227 ,  H01L2224/245 ,  H01L2224/27462 ,  H01L2224/2747 ,  H01L2224/291 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/32227 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2224/81005 ,  H01L2224/81192 ,  H01L2224/81424 ,  H01L2224/81438 ,  H01L2224/81444 ,  H01L2224/81466 ,  H01L2224/81486 ,  H01L2224/8149 ,  H01L2224/81805 ,  H01L2224/81825 ,  H01L2224/8183 ,  H01L2224/82005 ,  H01L2224/82102 ,  H01L2224/82104 ,  H01L2224/82106 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/83424 ,  H01L2224/83438 ,  H01L2224/83444 ,  H01L2224/83466 ,  H01L2224/83486 ,  H01L2224/8349 ,  H01L2224/83805 ,  H01L2224/83825 ,  H01L2224/8383 ,  H01L2224/92224 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15156 ,  H01L2924/18161 ,  H01L2924/18162 ,  H05K1/189 ,  H05K3/4682 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/01074 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0781 ,  H01L2924/01038 ,  H01L2924/053 ,  H01L2924/06 ,  H01L2924/01006 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01042 ,  H01L2924/01022 ,  H01L2924/01071 ,  H01L2224/81 ,  H01L2224/82 ,  H01L2224/83

Abstract: A flexible display panel and method of formation with a sacrificial release layer are described. The method of manufacturing a flexible display system includes forming a sacrificial layer on a carrier substrate. A flexible display substrate is formed on the sacrificial layer, with a plurality of release openings that extend through the flexible display substrate to the sacrificial layer. An array of LEDs and a plurality of microchips are transferred onto the flexible display substrate to form a flexible display panel. The sacrificial layer is selectively removed such that the flexible display panel attaches to the carrier substrate by a plurality of support posts. The flexible display panel is removed from the carrier substrate and is electrically coupled with display components to form a flexible display system.

Abstract translation: 描述了柔性显示面板及其形成方法。 柔性显示系统的制造方法包括在载体基板上形成牺牲层。 在牺牲层上形成柔性显示基板，其中多个释放开口延伸穿过柔性显示基板至牺牲层。 将LED阵列和多个微芯片转移到柔性显示基板上以形成柔性显示面板。 选择性地去除牺牲层，使得柔性显示面板通过多个支撑柱附接到载体基板。 柔性显示面板从载体基板移除并与显示部件电耦合以形成柔性显示系统。

公开(公告)号：US09159700B2

公开(公告)日：2015-10-13

申请号：US13842721

申请日：2013-03-15

Applicant: LuxVue Technology Corporation

Inventor： Kapil V. Sakariya ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L23/00 ,  H01L27/12

CPC classification number: H01L25/167 ,  H01L24/24 ,  H01L24/29 ,  H01L24/75 ,  H01L24/82 ,  H01L24/83 ,  H01L24/95 ,  H01L27/1214 ,  H01L33/06 ,  H01L33/38 ,  H01L33/42 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29118 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/73267 ,  H01L2224/75281 ,  H01L2224/75282 ,  H01L2224/75725 ,  H01L2224/7598 ,  H01L2224/83193 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2224/92244 ,  H01L2924/01322 ,  H01L2924/10156 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. An array of micro LED devices are bonded to the corresponding array of bottom electrodes within the array of bank openings. An array of top electrode layers are formed electrically connecting the array of micro LED devices to a ground line in the non-pixel area.

Abstract translation: 描述显示面板和形成显示面板的方法。 显示面板可以包括包括像素区域和非像素区域的薄膜晶体管基板。 像素区域包括堤开口的阵列和堤开口阵列内的一组底部电极。 一组微型LED器件结合到阵列阵列内的相应阵列的底部电极。 形成将微型LED器件的阵列电连接到非像素区域中的接地线的顶部电极层的阵列。

公开(公告)号：US20150273700A1

公开(公告)日：2015-10-01

申请号：US14723231

申请日：2015-05-27

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  John A. Higginson ,  Hsin-Hua Hu

IPC: B25J15/00

CPC classification number: B41J2/385 ,  B25J15/0052 ,  B25J15/0085 ,  B41J2/39 ,  B81B2201/038 ,  B81C99/002 ,  H01L21/67144 ,  H01L21/6835 ,  H01L24/75 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/0079 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/29036 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/7565 ,  H01L2224/7598 ,  H01L2224/83815 ,  H01L2224/83855 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2924/00014

Abstract: A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.

Abstract translation: 公开了一种兼容的微器件传送头和头阵列。 在一个实施例中，微装置转移头包括可偏转到基底基板和弹簧部分之间的空间中的弹簧部分。

公开(公告)号：US20150216042A1

公开(公告)日：2015-07-30

申请号：US14681707

申请日：2015-04-08

Applicant: LuxVue Technology Corporation

Inventor： Dariusz Golda ,  Andreas Bibl

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/03 ,  H01L21/683 ,  H05K1/11

CPC classification number: H01L21/6833 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L2221/68368 ,  H01L2924/00 ,  H01L2924/0002 ,  H05K1/0284 ,  H05K1/03 ,  H05K1/09 ,  H05K1/115 ,  H05K2201/09036

Abstract: A micro device transfer head array and method of forming a micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect. A dielectric layer covers a top surface of each mesa structure.

Abstract translation: 描述了从SOI衬底形成微器件传输阵列的微器件转移头阵列和方法。 在一个实施例中，微器件传送头阵列包括基底衬底和基底衬底上的图案化硅层。 图案化硅层可以包括硅互连和与硅互连电连接的硅电极阵列。 每个硅电极包括突出在硅互连上方的台面结构。 介电层覆盖每个台面结构的顶面。

公开(公告)号：US09035279B2

公开(公告)日：2015-05-19

申请号：US13937000

申请日：2013-07-08

Applicant: LuxVue Technology Corporation

Inventor： Hsin-Hua Hu ,  Kevin K. C. Chang ,  Andreas Bibl

IPC: H01L29/06 ,  H01L33/08 ,  H01L33/04

CPC classification number: H01L33/62 ,  H01L24/75 ,  H01L24/83 ,  H01L24/95 ,  H01L25/0753 ,  H01L27/15 ,  H01L27/156 ,  H01L33/005 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/04 ,  H01L33/06 ,  H01L33/08 ,  H01L33/32 ,  H01L33/60 ,  H01L2224/83005 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A method and structure for stabilizing an array of micro devices is disclosed. A stabilization layer includes an array of stabilization cavities and array of stabilization posts. Each stabilization cavity includes sidewalls surrounding a stabilization post. The array of micro devices is on the array of stabilization posts. Each micro device in the array of micro devices includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.

公开(公告)号：US20150076528A1

公开(公告)日：2015-03-19

申请号：US14027875

申请日：2013-09-16

Applicant: LuxVue Technology Corporation

Inventor： Clayton Ka Tsun Chan ,  Andreas Bibl

IPC: H01L33/48 ,  H01L27/15

CPC classification number: H01L24/00 ,  B81C1/00873 ,  B81C2201/0194 ,  H01L21/6835 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/156 ,  H01L33/0079 ,  H01L2221/68368 ,  H01L2224/0345 ,  H01L2224/03848 ,  H01L2224/04026 ,  H01L2224/05016 ,  H01L2224/05023 ,  H01L2224/05083 ,  H01L2224/05117 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/0519 ,  H01L2224/05562 ,  H01L2224/05564 ,  H01L2224/05568 ,  H01L2224/05638 ,  H01L2224/05644 ,  H01L2224/05669 ,  H01L2224/05688 ,  H01L2224/06181 ,  H01L2224/2745 ,  H01L2224/29005 ,  H01L2224/29007 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/32145 ,  H01L2224/32227 ,  H01L2224/83005 ,  H01L2224/83409 ,  H01L2224/83411 ,  H01L2224/83444 ,  H01L2224/83815 ,  H01L2224/83825 ,  H01L2224/8383 ,  H01L2224/9212 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01079 ,  H01L2924/01032 ,  H01L2924/01028 ,  H01L2924/0781 ,  H01L2224/034 ,  H01L2224/274 ,  H01L2924/014 ,  H01L2224/83

Abstract: A method and structure for forming an array of micro devices is disclosed. An array of micro devices is formed over an array of stabilization posts included in a stabilization layer. Patterned sacrificial spacers are formed between the stabilization posts and between the micro devices. The patterned sacrificial spacers are disposed upon the patterned sacrificial spacers.

Abstract translation: 公开了一种用于形成微器件阵列的方法和结构。 在包括在稳定层中的稳定柱的阵列上形成微器件阵列。 图案化的牺牲间隔物形成在稳定柱之间和微型器件之间。 图案化的牺牲隔离物设置在图案化的牺牲间隔物上。

公开(公告)号：US20140355168A1

公开(公告)日：2014-12-04

申请号：US13909892

申请日：2013-06-04

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  Dariusz Golda

IPC: H01L21/683 ,  H01L21/768

CPC classification number: H01L21/6833 ,  B81C99/002 ,  H01L21/6835 ,  H01L21/76802 ,  H01L21/76877 ,  H01L21/76898 ,  H01L24/75 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00

Abstract: Micro pick up arrays for transferring micro devices from a carrier substrate are disclosed. In an embodiment, a micro pick up array includes a compliant contact for delivering an operating voltage from a voltage source to an array of electrostatic transfer heads. In an embodiment, the compliant contact is moveable relative to a base substrate of the micro pick up array.

Abstract translation: 公开了用于从载体衬底传送微器件的微拾取阵列。 在一个实施例中，微拾取阵列包括用于将工作电压从电压源传送到静电转印头阵列的柔性接触件。 在一个实施例中，柔性接触件可相对于微拾取阵列的基底基板移动。

公开(公告)号：US08789573B2

公开(公告)日：2014-07-29

申请号：US13708686

申请日：2012-12-07

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

IPC: B29C65/50 ,  B32B43/00 ,  B32B38/18 ,  B32B37/00 ,  B30B5/00 ,  B30B15/34

CPC classification number: H01L29/167 ,  B32B38/18 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/83 ,  H01L24/95 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/75725 ,  H01L2224/7598 ,  H01L2224/83005 ,  H01L2224/97 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2933/0066 ,  Y10T156/1153 ,  Y10T156/17 ,  Y10T156/1705 ,  Y10T156/1707 ,  Y10T156/1744 ,  Y10T156/1749 ,  Y10T156/1776 ,  Y10T156/1911 ,  H01L2224/83 ,  H01L2924/00

Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

Abstract translation: 公开了一种传送微型装置和微型装置阵列的方法。 承载连接到接合层的微型器件的载体衬底被加热到低于接合层的液相线温度的温度，并且转移头被加热到高于接合层的液相线温度的温度。 当微型装置与转印头接触时，来自转印头的热量转移到粘结层中以至少部分地熔化粘结层。 施加到转印头的电压产生从载体衬底拾取微器件的夹持力。

公开(公告)号：US20140169924A1

公开(公告)日：2014-06-19

申请号：US13715557

申请日：2012-12-14

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： Dariusz Golda ,  John A. Higginson ,  Andreas Bibl

IPC: H01L21/683

CPC classification number: H01L24/75 ,  H01L24/97 ,  H01L25/167 ,  H01L33/00 ,  H01L2224/75725 ,  H01L2224/75843 ,  H01L2224/7598 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/351 ,  Y10T279/23 ,  H01L2924/00

Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a micro pick up array mount includes a pivot platform to allow a micro pick up array to automatically align with a carrier substrate. Deflection of the pivot platform may be detected to control further movement of the micro pick up array.

Abstract translation: 公开了用于从载体衬底传送微器件的系统和方法。 在一个实施例中，微拾取阵列安装件包括枢轴平台，以允许微拾取阵列自动对准载体衬底。 可以检测枢轴平台的偏转以控制微拾取阵列的进一步移动。