公开(公告)号：US20050205291A1

公开(公告)日：2005-09-22

申请号：US11079371

申请日：2005-03-15

申请人： Yoshihisa Yamashita ,  Hiroki Yabe ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Satoru Tomekawa ,  Toshio Fujii ,  Seiji Karashima

发明人： Yoshihisa Yamashita ,  Hiroki Yabe ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Satoru Tomekawa ,  Toshio Fujii ,  Seiji Karashima

IPC分类号： H01L21/60 ,  H05K1/00 ,  H05K1/11 ,  H05K3/10 ,  H05K3/20 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46

CPC分类号： H05K3/4084 ,  G03G15/225 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H05K1/0393 ,  H05K3/102 ,  H05K3/1266 ,  H05K3/20 ,  H05K3/207 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/0376 ,  H05K2203/0143 ,  H05K2203/0195 ,  H05K2203/0517 ,  H05K2203/1189 ,  H05K2203/1572 ,  H01L2924/00

摘要： A process for producing a flexible substrate comprising of a film, an insulating resin layer, and a wiring pattern, said process comprising the steps of: (a) preparing a sheet member comprising, (i) the film, (ii) the insulating resin layer formed on each of a front face of said film and a rear face of said film which face is opposite to said front face, and (iii) a front-sided wiring pattern embedded in said insulating resin layer formed on said front face of said film, and a rear-sided wiring pattern embedded in the insulating resin layer formed on said rear face of said film; and (b) pressing a part of at least one of said front-sided wiring pattern and said rear-sided wiring pattern into the inside of said sheet member so that a part of said front-sided wiring pattern and a part of said rear-sided wiring pattern are jointed to each other to form a junction.

摘要翻译： 一种制造柔性基材的方法，包括膜，绝缘树脂层和布线图案，所述方法包括以下步骤：（a）制备片状部件，其包括：（i）膜，（ii）绝缘树脂 所述膜的前表面上形成的层和所述膜的与所述前表面相对的背面，以及（iii）嵌入在所述绝缘树脂层的所述前表面上形成的所述绝缘树脂层中的前侧布线图案 膜和嵌入在形成在所述膜的所述背面上的绝缘树脂层中的背面布线图案; 和（b）将所述前侧布线图案和所述背面布线图案中的至少一个的一部分压入所述片状构件的内部，使得所述前侧布线图案的一部分和所述背面布线图案的一部分， 双面布线图案彼此连接以形成结。

公开(公告)号：US20050196095A1

公开(公告)日：2005-09-08

申请号：US11041101

申请日：2005-01-21

申请人： Seiji Karashima ,  Seiichi Nakatani ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Takashi Ichiryu

发明人： Seiji Karashima ,  Seiichi Nakatani ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Takashi Ichiryu

IPC分类号： G02B6/12 ,  G02B6/00 ,  G02B6/122 ,  G02B6/36 ,  G02B6/42 ,  H05K1/02

CPC分类号： G02B6/4249 ,  G02B6/3608 ,  G02B6/3636 ,  G02B6/3668 ,  G02B6/3676 ,  G02B6/3692 ,  G02B6/4214 ,  H05K1/0274 ,  H05K2203/167

摘要： A fabrication method for an optical transmission channel board includes a first step of forming on a substrate a layer containing an electrically conductive material, and a second step of patterning said layer containing an electrically conductive material formed on said substrate, and thereby forming circuit patterns at least a part of which is used as an electric circuit and at least a part of which positionally regulates an optical transmission channel.

摘要翻译： 用于光传输通道板的制造方法包括在衬底上形成含有导电材料的层的第一步骤，以及第二步骤，使包含形成在所述衬底上的导电材料的层的图案化，从而形成电路图案 其中至少一部分用作电路，其中至少一部分位置地调节光传输通道。

公开(公告)号：US07748110B2

公开(公告)日：2010-07-06

申请号：US11826758

申请日：2007-07-18

申请人： Toshiyuki Asahi ,  Seiji Karashima ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Tousaku Nishiyama ,  Koichi Hirano ,  Osamu Shibata ,  Takeshi Nakayama ,  Yoshiyuki Saito

发明人： Toshiyuki Asahi ,  Seiji Karashima ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Tousaku Nishiyama ,  Koichi Hirano ,  Osamu Shibata ,  Takeshi Nakayama ,  Yoshiyuki Saito

IPC分类号： H05K3/36

CPC分类号： H05K3/403 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01R12/52 ,  H01R13/2414 ,  H05K1/0218 ,  H05K1/0284 ,  H05K1/141 ,  H05K1/145 ,  H05K1/182 ,  H05K3/20 ,  H05K3/3442 ,  H05K3/361 ,  H05K3/366 ,  H05K3/368 ,  H05K2201/043 ,  H05K2201/048 ,  H05K2201/049 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/09036 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K2203/302 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49208 ,  H01L2924/00

摘要： A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surface to the lower surface through the side surface.

摘要翻译： 可以在没有通孔形成步骤的情况下制造连接构件。 连接构件包括绝缘基板，其具有上表面，与上表面相对的下表面和连接这些表面的侧表面; 以及至少一个通过侧面从上表面延伸到下表面的布线。

公开(公告)号：US07689129B2

公开(公告)日：2010-03-30

申请号：US11201234

申请日：2005-08-10

申请人： Seiji Karashima ,  Seiichi Nakatani ,  Yoshiyuki Saito

发明人： Seiji Karashima ,  Seiichi Nakatani ,  Yoshiyuki Saito

IPC分类号： H04B10/00

CPC分类号： G06F15/16 ,  H04L12/00

摘要： A parallel computation apparatus as a multiprocessor includes functional modules as a plurality of processors having an optical communication function and capable of mutually cooperating, and an optical transmission line interconnecting the plurality of processors. Among the plurality of functional modules, the first functional module having a first information processing capacity has a function of determining whether information processing of a first information processing amount can be completed based on the first information processing capacity, and outputting a second information processing amount obtained by subtracting an information processing amount based on the first information processing capacity from the first information processing amount to at least one of the other functional modules.

摘要翻译： 作为多处理器的并行计算装置包括具有光通信功能并且能够相互配合的多个处理器的功能模块以及互连多个处理器的光传输线。 在多个功能模块中，具有第一信息处理能力的第一功能模块具有根据第一信息处理能力确定是否能够完成第一信息处理量的信息处理的功能，并且输出获得的第二信息处理量 通过从第一信息处理量减去基于第一信息处理能力的信息处理量到至少一个其他功能模块。

公开(公告)号：US20070243664A1

公开(公告)日：2007-10-18

申请号：US11579299

申请日：2006-03-07

申请人： Koichi Hirano ,  Seiji Karashima ,  Takashi Ichiryu ,  Yoshihiro Tomita ,  Seiichi Nakatani

发明人： Koichi Hirano ,  Seiji Karashima ,  Takashi Ichiryu ,  Yoshihiro Tomita ,  Seiichi Nakatani

IPC分类号： H05K3/34 ,  H01L21/00 ,  H01L21/44 ,  H05K3/00

CPC分类号： H01L21/563 ,  B23K35/0244 ,  H01L21/67144 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1131 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/133 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83815 ,  H01L2224/83886 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/18161 ,  H01L2924/30105 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/10977 ,  H05K2203/1361 ,  Y02P70/613 ,  Y10T29/53178 ,  H01L2224/05599

摘要： [Problem] To provide a flip-chip mounting method and a bump formation method applicable to flip-chip mounting of a next generation LSI and having high productivity and high reliability. [Means for Solving Problem] A semiconductor chip 20 having a plurality of electrode terminals 12 is held to oppose a circuit board 21 having a plurality of connection terminals 11 with a given gap provided therebetween, and the semiconductor chip 20 and the circuit board 21 in this state are dipped in a dipping bath 40 containing a melted resin 14 including melted solder particles for a given period of time. In this dipping process, the melted solder particles self-assemble between the connection terminals 11 of the circuit board 21 and the electrode terminals 12 of the semiconductor chip 20, so as to form connectors 22 between these terminals. Thereafter, the semiconductor chip 20 and the circuit board 21 are taken out of the dipping bath 40, and the melted resin 14 having permeated into the gap between the semiconductor chip 20 and the circuit board 21 is cured, so as to complete a flip-chip mounting body.

摘要翻译： [问题]提供一种适用于下一代LSI的倒装安装并具有高生产率和高可靠性的倒装芯片安装方法和凸块形成方法。 解决问题的手段具有多个电极端子12的半导体芯片20被保持为具有多个连接端子11的电路板21，其间设置有给定的间隙，并且半导体芯片20和电路板21 将该状态浸渍在包含熔融的焊料颗粒的熔融树脂14的浸渍浴40中一段给定的时间。 在该浸渍过程中，熔融的焊料颗粒自组装在电路板21的连接端子11和半导体芯片20的电极端子12之间，从而在这些端子之间形成连接器22。 此后，半导体芯片20和电路板21从浸渍浴40中取出，并且已经渗透到半导体芯片20和电路板21之间的间隙中的熔融树脂14固化， 芯片安装体。

公开(公告)号：US20070224735A1

公开(公告)日：2007-09-27

申请号：US11750617

申请日：2007-05-18

申请人： Seiji Karashima ,  Seiichi Nakatani ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Takashi Ichiryu

发明人： Seiji Karashima ,  Seiichi Nakatani ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Takashi Ichiryu

IPC分类号： H01L21/82

CPC分类号： G02B6/4249 ,  G02B6/3608 ,  G02B6/3636 ,  G02B6/3668 ,  G02B6/3676 ,  G02B6/3692 ,  G02B6/4214 ,  H05K1/0274 ,  H05K2203/167

摘要： A fabrication method for an optical transmission channel board includes a first step of forming on a substrate a layer containing an electrically conductive material, and a second step of patterning said layer containing an electrically conductive material formed on said substrate, and thereby forming circuit patterns at least a part of which is used as an electric circuit and at least a part of which positionally regulates an optical transmission channel.

摘要翻译： 用于光传输通道板的制造方法包括在衬底上形成含有导电材料的层的第一步骤，以及第二步骤，使包含形成在所述衬底上的导电材料的层的图案化，从而形成电路图案 其中至少一部分用作电路，其中至少一部分位置地调节光传输通道。

公开(公告)号：US07242823B2

公开(公告)日：2007-07-10

申请号：US11041101

申请日：2005-01-21

申请人： Seiji Karashima ,  Seiichi Nakatani ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Takashi Ichiryu

发明人： Seiji Karashima ,  Seiichi Nakatani ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Takashi Ichiryu

IPC分类号： G02B6/12 ,  H01L29/00

CPC分类号： G02B6/4249 ,  G02B6/3608 ,  G02B6/3636 ,  G02B6/3668 ,  G02B6/3676 ,  G02B6/3692 ,  G02B6/4214 ,  H05K1/0274 ,  H05K2203/167

摘要： An optical transmission board is provided. The optical transmission board includes an optical transmission channel, a retention board for retaining the optical transmission channel and circuit patterns. The circuit patterns are formed on the retention board and a part of the circuit patterns is used as an electric circuit. The optical transmission channel is positionally regulated by the part of the circuit patterns.

摘要翻译： 提供一种光传输板。 光传输板包括光传输通道，用于保持光传输通道和电路图案的保持板。 电路图案形成在保持板上，一部分电路图形用作电路。 光传输通道由电路图案的一部分位置调节。

公开(公告)号：US07205483B2

公开(公告)日：2007-04-17

申请号：US11079371

申请日：2005-03-15

申请人： Yoshihisa Yamashita ,  Hiroki Yabe ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Satoru Tomekawa ,  Toshio Fujii ,  Seiji Karashima

发明人： Yoshihisa Yamashita ,  Hiroki Yabe ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Satoru Tomekawa ,  Toshio Fujii ,  Seiji Karashima

IPC分类号： H05K1/11

CPC分类号： H05K3/4084 ,  G03G15/225 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H05K1/0393 ,  H05K3/102 ,  H05K3/1266 ,  H05K3/20 ,  H05K3/207 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/0376 ,  H05K2203/0143 ,  H05K2203/0195 ,  H05K2203/0517 ,  H05K2203/1189 ,  H05K2203/1572 ,  H01L2924/00

摘要： A flexible substrate comprises a film, a first insulating resin layer on a front face of the film, a second insulating resin layer on a rear face of the film, a front-sided wiring pattern embedded in the first insulating resin layer, and a rear-sided wiring pattern embedded in the second insulating resin layer. A surface of the front-sided wiring pattern is flush with a surface of the first insulating resin layer, and a surface of the rear-sided wiring pattern is flush with a surface of the second insulating resin layer. A part of at least one of the front-sided wiring pattern and the rear-sided wiring pattern is dented toward a part of the other of the at least one of the front-sided wiring pattern and the rear-sided wiring pattern such that a portion of the front-sided wiring pattern and a portion of the rear-sided wiring pattern are jointed to each other to form a junction.

摘要翻译： 柔性基板包括膜，膜的正面上的第一绝缘树脂层，膜背面的第二绝缘树脂层，嵌入第一绝缘树脂层中的前侧布线图案，以及后部 嵌入在第二绝缘树脂层中的布线图案。 前侧布线图案的表面与第一绝缘树脂层的表面齐平，并且背面布线图案的表面与第二绝缘树脂层的表面齐平。 前侧布线图案和背面布线图案中的至少一个的一部分朝向前侧布线图案和背面布线图案中的至少一个中的另一个的一部分凹陷，使得 前侧布线图案的一部分和背面布线图案的一部分彼此接合以形成结。

公开(公告)号：US20060091524A1

公开(公告)日：2006-05-04

申请号：US11262758

申请日：2005-11-01

申请人： Seiji Karashima ,  Yoshihisa Yamashita ,  Seiichi Nakatani ,  Toshiyuki Kojima ,  Shingo Komatsu ,  Satoru Tomekawa

发明人： Seiji Karashima ,  Yoshihisa Yamashita ,  Seiichi Nakatani ,  Toshiyuki Kojima ,  Shingo Komatsu ,  Satoru Tomekawa

IPC分类号： H01L23/12

CPC分类号： H01L21/486 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/03438 ,  H01L2224/0344 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05169 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05669 ,  H01L2224/16 ,  H01L2224/24137 ,  H01L2224/24226 ,  H01L2224/82047 ,  H01L2224/92144 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00014

摘要： A semiconductor module, comprising: a semiconductor element having a principal face on which an element electrode is formed; and a film member comprising an insulating resin layer having a front face and a rear face which is opposite to said front face, and a wiring pattern formed on the rear face of said layer, wherein said semiconductor element is superposed on said film member so that the principal face of said semiconductor element is in contact with the front face of the insulating resin layer of said film member; and a part of the wiring pattern of said film member extends through said insulating resin layer, so that said part is in contact with the element electrode of said semiconductor element.

摘要翻译： 一种半导体模块，包括：具有形成元件电极的主面的半导体元件; 以及膜构件，其包括具有与所述正面相对的正面和背面的绝缘树脂层和形成在所述层的背面上的布线图案，其中所述半导体元件叠置在所述膜构件上，使得 所述半导体元件的主面与所述膜构件的绝缘树脂层的前表面接触; 并且所述膜部件的布线图形的一部分延伸穿过所述绝缘树脂层，使得所述部分与所述半导体元件的元件电极接触。

公开(公告)号：US20060036831A1

公开(公告)日：2006-02-16

申请号：US11201234

申请日：2005-08-10

申请人： Seiji Karashima ,  Seiichi Nakatani ,  Yoshiyuki Saito

发明人： Seiji Karashima ,  Seiichi Nakatani ,  Yoshiyuki Saito

IPC分类号： G06F12/10 ,  G06F9/34

CPC分类号： G06F15/16 ,  H04L12/00

摘要： A parallel computation apparatus as a multiprocessor includes functional modules as a plurality of processors having an optical communication function and capable of mutually cooperating, and an optical transmission line interconnecting the plurality of processors. Among the plurality of functional modules, the first functional module having a first information processing capacity has a function of determining whether information processing of a first information processing amount can be completed based on the first information processing capacity, and outputting a second information processing amount obtained by subtracting an information processing amount based on the first information processing capacity from the first information processing amount to at least one of the other functional modules.

摘要翻译： 作为多处理器的并行计算装置包括具有光通信功能并且能够相互配合的多个处理器的功能模块以及互连多个处理器的光传输线。 在多个功能模块中，具有第一信息处理能力的第一功能模块具有根据第一信息处理能力确定是否能够完成第一信息处理量的信息处理的功能，并且输出获得的第二信息处理量 通过从第一信息处理量减去基于第一信息处理能力的信息处理量到至少一个其他功能模块。