公开(公告)号：US09224932B2

公开(公告)日：2015-12-29

申请号：US14096420

申请日：2013-12-04

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Chih-Kuang Yu ,  Hung-Yi Kuo

IPC: H01L21/58 ,  H01L21/60 ,  H01L23/498 ,  H01L33/62 ,  H01L33/00 ,  H01L33/38 ,  H01L33/06 ,  H01L33/08 ,  H01L33/40 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L33/005 ,  H01L33/0079 ,  H01L33/06 ,  H01L33/08 ,  H01L33/22 ,  H01L33/32 ,  H01L33/382 ,  H01L33/405 ,  H01L33/486 ,  H01L33/502 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A structure includes a carrier substrate with a first side and a second side opposite the first side. The carrier substrate has a first contact pad and a second contact pad disposed over the first side and a third contact pad and a fourth contact pad disposed over the second side. The carrier substrate further includes a substrate and an insulation film disposed between the substrate and the first, second, third, and fourth contact pads. The structure further includes a first epi-structure and a second epi-structure disposed over the carrier substrate. The structure further includes a first metal element and a second metal element. Moreover, the structure further includes a first through-via and a second through-via. The first through-via and the second through-via extend through the first and second epi-structures respectively.

Abstract translation: 结构包括具有第一侧和与第一侧相对的第二侧的载体基板。 载体衬底具有第一接触焊盘和设置在第一侧上的第二接触焊盘，以及设置在第二侧上的第三接触焊盘和第四接触焊盘。 载体衬底还包括衬底和设置在衬底和第一，第二，第三和第四接触焊盘之间的绝缘膜。 该结构还包括设置在载体衬底上的第一外延结构和第二外延结构。 该结构还包括第一金属元件和第二金属元件。 此外，该结构还包括第一通孔和第二通孔。 第一通孔和第二通孔分别延伸穿过第一和第二外延结构。

公开(公告)号：US09082942B2

公开(公告)日：2015-07-14

申请号：US14140973

申请日：2013-12-26

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Chi-Xiang Tseng ,  Hsiao-Wen Lee ,  Min-Sheng Wu ,  Tien-Min Lin

IPC: H01L33/50 ,  H01L33/46

CPC classification number: H01L33/504 ,  H01L33/46 ,  H01L33/505 ,  H01L2933/0041

Abstract: The present disclosure involves a method of packaging light-emitting diodes (LEDs). According to the method, a plurality of LEDs is provided over an adhesive tape. The adhesive tape is disposed on a substrate. In some embodiments, the substrate may be a glass substrate, a silicon substrate, a ceramic substrate, and a gallium nitride substrate. A phosphor layer is coated over the plurality of LEDs. The phosphor layer is then cured. The tape and the substrate are removed after the curing of the phosphor layer. A replacement tape is then attached to the plurality of LEDs. A dicing process is then performed to the plurality of LEDs after the substrate has been removed. The removed substrate may then be reused for a future LED packaging process.

Abstract translation: 本公开涉及封装发光二极管（LED）的方法。 根据该方法，在胶带上设置多个LED。 粘合带设置在基板上。 在一些实施例中，衬底可以是玻璃衬底，硅衬底，陶瓷衬底和氮化镓衬底。 磷光体层被涂覆在多个LED上。 然后将磷光体层固化。 在荧光体层固化之后去除胶带和基材。 然后将替代胶带附接到多个LED。 然后在去除衬底之后，对多个LED进行切割处理。 然后可以将去除的衬底重新用于将来的LED封装工艺。

公开(公告)号：US09048113B2

公开(公告)日：2015-06-02

申请号：US14181938

申请日：2014-02-17

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Chih-Lin Wang

IPC: H01L33/00 ,  F21K99/00 ,  F21S6/00 ,  F21V9/16 ,  H01L25/075 ,  F21Y101/02 ,  F21Y105/00

CPC classification number: H01L25/0753 ,  F21K9/00 ,  F21S6/005 ,  F21V9/30 ,  F21Y2105/10 ,  F21Y2105/12 ,  F21Y2115/10 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A lighting instrument includes: a substrate; a plurality of first light-emitting diodes (LEDs) disposed over the substrate, wherein the first LEDs each have a first value range for a light output characteristic; a plurality of second LEDs disposed over the substrate, wherein the second LEDs each have a second value range for the light output characteristic, the second value range being different from the first value range; a phosphor layer located at a distance above the first LEDs and the second LEDs; and a light-reflective layer that is disposed on a surface of the phosphor layer; wherein the first LEDs interleave with the second LEDs according to a predefined pattern.

Abstract translation: 照明器具包括：基板; 设置在所述基板上的多个第一发光二极管（LED），其中所述第一LED各自具有用于光输出特性的第一值范围; 设置在所述基板上的多个第二LED，其中所述第二LED各自具有用于所述光输出特性的第二值范围，所述第二值范围不同于所述第一值范围; 位于第一LED和第二LED上方的距离处的磷光体层; 以及设置在所述荧光体层的表面上的光反射层; 其中所述第一LED根据预定模式与所述第二LED交错。

公开(公告)号：US08993447B2

公开(公告)日：2015-03-31

申请号：US13858785

申请日：2013-04-08

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Hsing-Kuo Hsia ,  Chih-Kuang Yu ,  Hung-Yi Kuo ,  Chyi Shyuan Chern

IPC: H01L21/311 ,  H01L33/64

CPC classification number: H01L33/64 ,  H01L25/075 ,  H01L33/54 ,  H01L33/58 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: An apparatus includes a wafer with a number of openings therein. For each opening, an LED device is coupled to a conductive carrier and the wafer in a manner so that each of the coupled LED device and a portion of the conductive carrier at least partially fill the opening. A method of fabricating an LED device includes forming a number of openings in a wafer. The method also includes coupling light-emitting diode (LED) devices to conductive carriers. The LED devices with conductive carriers at least partially fill each of the openings.

Abstract translation: 一种装置包括其中具有多个开口的晶片。 对于每个开口，LED器件以这样的方式耦合到导电载体和晶片，使得每个耦合的LED器件和导电载体的一部分至少部分地填充开口。 制造LED器件的方法包括在晶片中形成多个开口。 该方法还包括将发光二极管（LED）器件耦合到导电载体上。 具有导电载体的LED装置至少部分地填充每个开口。

公开(公告)号：US08969894B2

公开(公告)日：2015-03-03

申请号：US13087564

申请日：2011-04-15

Applicant: Hsiao-Wen Lee ,  Shang-Yu Tsai ,  Pei-Wen Ko

Inventor： Hsiao-Wen Lee ,  Shang-Yu Tsai ,  Pei-Wen Ko

IPC: H01L33/00 ,  H01L33/58 ,  H01L33/50 ,  H01L33/60

CPC classification number: H01L33/005 ,  H01L33/50 ,  H01L33/58 ,  H01L33/60 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: A light emitting diode (LED) with a micro-structure lens includes a LED die and a micro-structure lens. The micro-structure lens includes a convex lens portion, at least one concentric ridge structure surrounding the convex lens portion, and a lower portion below the convex lens portion and the at least one concentric ridge structure. The lower portion is arranged to be disposed over the LED die. A first optical path length from an edge of the LED die to a top center of the microstructure lens is substantially the same as a second optical path length from the edge of the LED die to a side of the micro-structure lens.

Abstract translation: 具有微结构透镜的发光二极管（LED）包括LED管芯和微结构透镜。 微结构透镜包括凸透镜部分，围绕凸透镜部分的至少一个同心脊结构，以及在凸透镜部分下方的下部和至少一个同心脊结构。 下部布置成设置在LED管芯上。 从LED管芯的边缘到微结构透镜的顶部中心的第一光路长度与从LED管芯的边缘到微结构透镜侧的第二光程长度基本相同。

公开(公告)号：US08946742B2

公开(公告)日：2015-02-03

申请号：US12897124

申请日：2010-10-04

Applicant: Chen-Hua Yu ,  Hung-Pin Chang ,  Yung-Chi Lin ,  Chia-Lin Yu ,  Jui-Pin Hung ,  Chien Ling Hwang

Inventor： Chen-Hua Yu ,  Hung-Pin Chang ,  Yung-Chi Lin ,  Chia-Lin Yu ,  Jui-Pin Hung ,  Chien Ling Hwang

IPC: H01L33/00 ,  H01L21/768 ,  H01L21/683 ,  H01L23/48 ,  H01L33/48 ,  H01L33/64 ,  H01L21/48 ,  H01L23/14 ,  H01L23/498 ,  H01L23/00 ,  H01L33/62

CPC classification number: H01L21/76898 ,  H01L21/3065 ,  H01L21/486 ,  H01L21/6835 ,  H01L21/76843 ,  H01L21/76876 ,  H01L21/76877 ,  H01L21/76879 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/29 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L33/005 ,  H01L33/0054 ,  H01L33/486 ,  H01L33/62 ,  H01L33/641 ,  H01L33/644 ,  H01L33/647 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/32506 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/04941 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2933/0066 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The substrate with through silicon plugs (or vias) described above removes the need for conductive bumps. The process flow is very simple and cost efficient. The structures described combines the separate TSV, redistribution layer, and conductive bump structures into a single structure. By combining the separate structures, a low resistance electrical connection with high heat dissipation capability is created. In addition, the substrate with through silicon plugs (or vias, or trenches) also allows multiple chips to be packaged together. A through silicon trench can surround the one or more chips to provide protection against copper diffusing to neighboring devices during manufacturing. In addition, multiple chips with similar or different functions can be integrated on the TSV substrate. Through silicon plugs with different patterns can be used under a semiconductor chip(s) to improve heat dissipation and to resolve manufacturing concerns.

Abstract translation: 具有上述通孔硅衬底（或通孔）的基板消除了对导电凸块的需要。 流程非常简单，成本效益高。 所描述的结构将单独的TSV，再分配层和导电凸块结构组合成单个结构。 通过组合单独的结构，产生具有高散热能力的低电阻电连接。 此外，具有通过硅插头（或通孔或沟槽）的基板还允许将多个芯片封装在一起。 通过硅沟槽可围绕一个或多个芯片，以在制造期间提供防止铜扩散到相邻器件的保护。 此外，具有相似或不同功能的多个芯片可以集成在TSV基板上。 通过具有不同图案的硅插头可以在半导体芯片下使用以改善散热并解决制造问题。

公开(公告)号：US08939611B2

公开(公告)日：2015-01-27

申请号：US13293272

申请日：2011-11-10

Applicant: Pei-Wen Ko ,  Wei-Yu Yeh

Inventor： Pei-Wen Ko ,  Wei-Yu Yeh

IPC: F21V29/00 ,  F21V13/02 ,  F21S6/00 ,  F21V17/12 ,  F21Y101/02

CPC classification number: F21K9/54 ,  F21K9/62 ,  F21S6/00 ,  F21V13/02 ,  F21V17/12 ,  F21V29/50 ,  F21V29/70 ,  F21V29/763 ,  F21Y2115/10

Abstract: The present disclosure involves a lighting apparatus. The lighting apparatus includes a photonic device that generates light. The lighting apparatus includes a printed circuit board (PCB) on which the photonic device is located. The lighting apparatus includes a diffuser cap having a curved profile covering the PCB and the photonic device. The diffuser cap has a textured surface for scattering light generated by the photonic device. The lighting apparatus includes a thermally conductive cup that surrounds the diffuser cap and thermal conductively coupled to the PCB. The cup has a reflective inner surface that reflects light transmitting through the diffuser cap. The lighting apparatus includes a heat dissipation structure for dissipating heat generated by the photonic device. The heat dissipation structure is thermally coupled to the cup.

Abstract translation: 本公开涉及一种照明装置。 照明装置包括产生光的光子器件。 照明装置包括其上设置有光子装置的印刷电路板（PCB）。 照明装置包括具有覆盖PCB和光子装置的弯曲轮廓的扩散器盖。 扩散器盖具有纹理表面，用于散射由光子器件产生的光。 照明装置包括导热杯，该导热杯围绕扩散器盖并与PCB导热耦合。 杯子具有反射透射通过扩散器盖的光的反射内表面。 照明装置包括用于散发由光子器件产生的热的散热结构。 散热结构热耦合到杯子。

公开(公告)号：US08765500B2

公开(公告)日：2014-07-01

申请号：US13594219

申请日：2012-08-24

Applicant: Chi-Xiang Tseng ,  Hsiao-Wen Lee ,  Min-Sheng Wu ,  Tien-Ming Lin

Inventor： Chi-Xiang Tseng ,  Hsiao-Wen Lee ,  Min-Sheng Wu ,  Tien-Ming Lin

IPC: H01L33/00

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L33/50 ,  H01L2224/13 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2924/00

Abstract: The present disclosure involves a method of packaging a light-emitting diode (LED). According to the method, a group of metal pads and a group of LEDs are provided. The group of LEDs is attached to the group of metal pads, for example through a bonding process. After the LEDs are attached to the metal pads, each LED is spaced apart from adjacent LEDs. Also according to the method, a phosphor film is coated around the group of LEDs collectively. The phosphor film is coated on top and side surfaces of each LED and between adjacent LEDs. A dicing process is then performed to slice through portions of the phosphor film located between adjacent LEDs. The dicing process divides the group of LEDs into a plurality of individual phosphor-coated LEDs.

Abstract translation: 本公开涉及封装发光二极管（LED）的方法。 根据该方法，提供一组金属焊盘和一组LED。 该组LED例如通过粘合工艺连接到金属焊盘组上。 在LED连接到金属焊盘之后，每个LED与相邻的LED间隔开。 同样根据该方法，荧光膜被集体涂覆在LED组上。 荧光膜被涂覆在每个LED的顶表面和侧表面上以及相邻的LED之间。 然后进行切割处理以切割位于相邻LED之间的部分荧光膜。 切割工艺将LED组分成多个单独的磷光体涂覆的LED。

公开(公告)号：US08759854B2

公开(公告)日：2014-06-24

申请号：US13114787

申请日：2011-05-24

Applicant: Ching-Yi Chen ,  Hao-Yu Yang

Inventor： Ching-Yi Chen ,  Hao-Yu Yang

IPC: H01L33/00

CPC classification number: H01L33/58 ,  H01L25/0753 ,  H01L33/005 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2933/005 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A batwing beam is produced from an optical emitter having a primary LED lens over a number of LED dies on a package substrate. The LED lens includes a batwing surface formed by rotating a parabolic arc about an end of the parabolic arc over a center of the optical emitter. A center of each of the LED dies is mounted to the package substrate about the focus of a parabola whose arc forms the batwing surface, for example, between about 0.5 to 1.5 of a focal distance from the vertex of the parabola. The batwing surface reflects light from the number of LED dies through total internal reflection (TIR) or through a reflectivity gel coating.

Abstract translation: 蝙蝠横梁是由封装基板上的多个LED管芯上的具有主要LED透镜的光发射器产生的。 LED透镜包括通过围绕光发射器的中心的抛物线弧的端部旋转抛物线形成的蝙蝠wing表面。 每个LED管芯的中心围绕其圆弧形成蝙蝠翼表面的抛物线的焦点安装到封装基板，例如，距抛物线顶点的焦距的约0.5至1.5。 蝙蝠槌表面通过全内反射（TIR）或通过反射性凝胶涂层反射来自LED管芯数量的光。

公开(公告)号：US08754440B2

公开(公告)日：2014-06-17

申请号：US13053607

申请日：2011-03-22

Applicant: Yu-Sheng Tang ,  Hsin-Hung Chen ,  Hao-Wei Ku

Inventor： Yu-Sheng Tang ,  Hsin-Hung Chen ,  Hao-Wei Ku

IPC: H01L33/50 ,  H01L33/52 ,  H01L33/54

CPC classification number: H01L33/505 ,  H01L24/73 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/486 ,  H01L33/507 ,  H01L33/54 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/1305 ,  H01L2924/15788 ,  H01L2924/1815 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2924/00

Abstract: A light-emitting diode (LED) package system includes a LED disposed over a surface of a substrate. A molding material covers the LED. A phosphor-containing material is disposed over and spaced from the LED by the molding material.

Abstract translation: 发光二极管（LED）封装系统包括设置在衬底的表面上的LED。 成型材料覆盖LED。 含有荧光体的材料通过模塑材料设置在LED的上方并与LED间隔开。