公开(公告)号：US5823416A

公开(公告)日：1998-10-20

申请号：US680523

申请日：1996-07-09

Applicant: Hiroshi Haji

Inventor： Hiroshi Haji

IPC: B23K1/20 ,  B23K20/00 ,  H05K13/00 ,  B23K37/00 ,  B01J19/08 ,  C23F1/07

CPC classification number: H01L24/85 ,  B23K1/20 ,  B23K20/004 ,  H01L24/78 ,  H05K13/0061 ,  B23K2201/36 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48644 ,  H01L2224/7865 ,  H01L2224/85013 ,  H01L2224/85444 ,  H01L24/45 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041

Abstract: There are disclosed a surface treatment device and a wire bonding device which are compact in size, have a high processing ability, are simple in construction, and achieve a low cost. The surface treatment device includes a base having a transfer path for transferring an object, a lid provided above the base for movement into and out of contact with an upper surface of the base, the lid contacting the base to form a sealed space on the upper surface of the base, an engagement and disengagement mechanism for moving the lid into and out of contact with the base, a transfer mechanism for feeding the object, disposed on the transfer path, into and out of a position beneath the lid when the lid is out of contact with the base, and a treatment portion for surface treating electrodes of the object disposed in the sealed space. A wire bonding mechanism is provided at a downstream portion of the transfer path.

Abstract translation: 公开了一种尺寸紧凑，处理能力强，结构简单，成本低的表面处理装置和引线接合装置。 表面处理装置包括具有用于传送物体的传送路径的基座，设置在基座上方的盖，用于与基座的上表面移动和离开接触，盖接触基部，以在上部形成密封空间 基座的表面，用于将盖移动到与底座接触和脱离接触的接合和分离机构，用于将设置在传送路径上的物体进入和离开盖的下方的位置的传送机构 与基座不接触，以及用于处理设置在密封空间中的物体的表面处理电极的处理部分。 引线接合机构设置在传送路径的下游部分。

公开(公告)号：US5675889A

公开(公告)日：1997-10-14

申请号：US474343

申请日：1995-06-07

Applicant: John Acocella ,  Donald Ray Banks ,  Joseph Angelo Benenati ,  Thomas Caulfield ,  John Saunders Corbin, Jr. ,  Karl Grant Hoebener ,  David P. Watson

Inventor： John Acocella ,  Donald Ray Banks ,  Joseph Angelo Benenati ,  Thomas Caulfield ,  John Saunders Corbin, Jr. ,  Karl Grant Hoebener ,  David P. Watson

IPC: B23K1/00 ,  H01L21/48 ,  H01L23/488 ,  H01L23/498 ,  H05K1/11 ,  H05K3/34 ,  H05K3/36 ,  H05K3/42

CPC classification number: B23K1/0008 ,  B23K1/0016 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H05K1/114 ,  H05K3/3436 ,  H05K3/3478 ,  B23K2201/36 ,  B23K2201/40 ,  B23K2201/42 ,  H01L2224/81191 ,  H01L2224/814 ,  H01L2924/00013 ,  H01L2924/09701 ,  H05K2201/0215 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0195 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0455 ,  H05K2203/082 ,  H05K3/3452 ,  H05K3/42 ,  H05K3/429 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49144

Abstract: Two substrates are produced each with a planar, mirror-image matrix of metal contacts in a surface wiring layer. The substrates are positioned with the matrices in parallel confrontation which defines pairs of confronting contacts. A metal ball is positioned between each pair of contacts with a respective volume of joining material between the ball and each of the two respective contacts. The volumes of joining material are simultaneously melted to allow surface tension to align the substrates and to accurately center the balls between each respective pairs of contacts in a plane defines by the matrix of balls.

Abstract translation: 制造两个基板，每个基板在表面布线层中具有金属触点的平面的镜像矩阵。 衬底被定位成与平行对置的矩阵定义成对的面对的接触。 金属球被定位在每对触点之间，在球与两个相应的触头中的每一个之间具有相应体积的接合材料。 同时熔化接合材料的体积以允许表面张力对准衬底并且在由球的矩阵限定的平面中的每个相应的触头对之间精确地定位球。

公开(公告)号：US5651495A

公开(公告)日：1997-07-29

申请号：US165874

申请日：1993-12-14

Applicant: John L. Tocher ,  Jacques F. Linder

Inventor： John L. Tocher ,  Jacques F. Linder

IPC: B23K1/00 ,  H01L23/38 ,  H01L21/58

CPC classification number: B23K1/0016 ,  H01L23/38 ,  B23K2201/36 ,  H01L2924/0002

Abstract: An improved method for soldering a thermoelectric cooler between an electronic device and a heatsink. Thermoelectric coolers are assembled by soldering parts together using a first solder. The bottom surface of the thermoelectric cooler is first soldered to the heatsink using a second solder and then the top surface is soldered to the electronic device using a third solder preferably having the same melting point as the second solder, or having approximately the same melting point as the second solder. Reverse powering of the thermoelectric cooler assists the soldering of the top surface to the electronic device by heating the top surface to a temperature sufficient to melt the third solder while cooling the bottom surface of the thermoelectric cooler to a temperature lower than the melting point of the second solder. Since the second solder has a melting point chosen to be lower than the melting point of the first solder used to assemble the cooler and the third solder has preferably the same, or approximately the same melting point as the second solder, rather than a much lower melting point, the assembled electronic device may be operated at a higher temperature and tested at a higher thermal cycle.

Abstract translation: 一种用于在电子设备和散热器之间焊接热电冷却器的改进方法。 使用第一焊料将热电冷却器通过焊接部件组装在一起组装。 首先使用第二焊料将热电冷却器的底表面焊接到散热器，然后使用优选地具有与第二焊料相同的熔点的第三焊料将顶表面焊接到电子器件，或者具有大致相同的熔点 作为第二焊料。 热电冷却器的反向供电通过将顶表面加热到足以熔化第三焊料的温度，同时将热电冷却器的底表面冷却到低于熔点的温度来帮助将顶表面焊接到电子器件上 第二焊料 由于第二焊料的熔点被选择为低于用于组装冷却器的第一焊料的熔点，并且第三焊料优选地具有与第二焊料相同或大致相同的熔点，而不是低得多 熔点，组装的电子器件可以在更高的温度下操作并在更高的热循环下测试。

公开(公告)号：US5639390A

公开(公告)日：1997-06-17

申请号：US362866

申请日：1994-12-23

Applicant: Shinji Iino ,  Takashi Amemiya

Inventor： Shinji Iino ,  Takashi Amemiya

IPC: G01R31/02 ,  B23K31/12 ,  G01R31/08 ,  H01L21/66 ,  B23K26/00

CPC classification number: G01R31/086 ,  B23K31/12 ,  B23K2201/36

Abstract: A conductor pattern test apparatus comprises a DC voltage power source for applying a predetermined DC voltage to an end of one of a plurality of conductor patterns arranged in parallel with each other, a current measurement circuit for measuring a current flowing to another conductor pattern adjacent to the one of the conductor patterns via the end by the DC voltage power source to the end, and a short-circuit position calculation circuit for calculating a resistance value from the end to a short-circuited part of the two conductor patterns adjacent to each other, based on the current value measured by the current measurement circuit and the voltage value applied by the DC power source, and locating a position of the short-circuited part based on the calculated resistance value and a resistance value of a conductor pattern having no short-circuit. A disconnection position calculator calculates a capacitance value from voltage values.

Abstract translation: 导体图案测试装置包括用于将预定DC电压施加到彼此并联布置的多个导体图案之一的端部的DC电压电源，用于测量流向与其相邻的另一个导体图案的电流的电流测量电路 通过直流电压电源的末端的导体图案中的一个到端部，以及用于计算从彼此相邻的两个导体图案的端部到短路部分的电阻值的短路位置计算电路 基于由当前测量电路测量的电流值和由DC电源施加的电压值，并且基于计算的电阻值和不短的导体图案的电阻值来定位短路部分的位置 电路 断开位置计算器根据电压值计算电容值。

公开(公告)号：US5599159A

公开(公告)日：1997-02-04

申请号：US470770

申请日：1995-06-06

Applicant: Kazuo Sugiura ,  Yoshimitsu Hisajima ,  Naoki Kanayama

Inventor： Kazuo Sugiura ,  Yoshimitsu Hisajima ,  Naoki Kanayama

IPC: B65G47/91 ,  B25J17/02 ,  B65G49/07 ,  H01L21/00 ,  H01L21/52 ,  H01L21/677 ,  B66C23/00

CPC classification number: H01L21/67144 ,  B23K2201/36 ,  Y10T74/20323 ,  Y10T74/20348

Abstract: A pellet conveying device used with a bonding machine for, for example, semiconductor devices, including a conveying arm that has a collet for holding pellets. The conveying arm can move vertically and pivot horizontally by two different driving sources so that the collet can be moved between predetermined two positions such as a pellet pick-up position and a pellet releasing position.

Abstract translation: 一种用于例如半导体装置的粘结机的颗粒输送装置，包括具有用于保持颗粒的夹头的输送臂。 输送臂可以垂直移动并且通过两个不同的驱动源水平地枢转，使得夹头可以在预定的两个位置之间移动，例如颗粒拾取位置和颗粒释放位置。

公开(公告)号：US5597110A

公开(公告)日：1997-01-28

申请号：US519439

申请日：1995-08-25

Applicant: Cynthia M. Melton ,  Robert Pfahl

Inventor： Cynthia M. Melton ,  Robert Pfahl

IPC: B23K1/20 ,  H01L21/48 ,  H05K3/34 ,  B23K1/00

CPC classification number: H05K3/3457 ,  B23K1/20 ,  H01L21/4853 ,  B23K2201/36 ,  H05K2203/013 ,  H05K3/3463 ,  H05K3/3473

Abstract: The present invention provides a method for forming a solder bump (24) on a substrate (20). The substrate (20) includes a bond pad (18) having a faying surface (19) composed of solder-wettable metal. The method includes coating the faying surface (19) with a plate (16) formed of a first metal having a first melting temperature, and projecting a discrete microdroplet (14) onto the plate (16). The microdroplet (14) is formed of a molten second metal and has a second melting temperature greater than the first melting temperature. The microdroplet (14) fuses to the plate (16) to form the solder bump (24).

Abstract translation: 本发明提供了一种在衬底（20）上形成焊料凸点（24）的方法。 基板（20）包括具有由可焊接润湿金属构成的引线表面（19）的接合焊盘（18）。 所述方法包括用由具有第一熔融温度的第一金属形成的板（16）涂覆所述引线表面（19），并将离散的微滴（14）投射到所述板（16）上。 微滴（14）由熔融的第二金属形成，并且具有大于第一熔融温度的第二熔融温度。 微滴（14）熔合到板（16）以形成焊料凸块（24）。

公开(公告)号：US5593499A

公开(公告)日：1997-01-14

申请号：US366984

申请日：1994-12-30

Applicant: Louis J. Stans ,  James Tullo ,  Thomas S. Kohm

Inventor： Louis J. Stans ,  James Tullo ,  Thomas S. Kohm

IPC: B23K1/012 ,  C23C2/20 ,  H05K3/34 ,  H05K3/24

CPC classification number: C23C2/20 ,  B23K1/012 ,  H05K3/3468 ,  B23K2201/36 ,  H05K2203/044 ,  H05K2203/081

Abstract: A dual air knife assembly for removing excess solder and leveling any remaining solder on a passing circuit board with a gas from a gas source in accordance with the present invention includes a first and second air knife. The first air knife has a first passage with a first inlet adapted to connect to the gas source and a first outlet adapted to be positioned adjacent the passing circuit board. The second air knife has a second passage with a second inlet connected to the gas source and a second outlet adapted to be positioned adjacent the passing circuit board. The first air knife is adapted to be positioned substantially perpendicular to the circuit board and the second air knife is adapted to be positioned at an angle less than 90 degrees and preferably between 20 and 60 degrees to the circuit board. The dual air knife assembly may include a spacer which separates the a first and second air knife and is recessed from the outlets of the a first and second air knife to create an expansion chamber. The distance the first and second outlets are from the passing circuit board and the temperature and pressure of the gas exiting from the a first and second air knife should all be substantially the same. Typically, the dual air knife assembly is used in a soldering system which includes a conveyor, a flux station, and a solder station. The dual air knife assembly is used in a process referred to as "hot air solder levelling" to remove excess solder and more evenly distribute any remaining solder. A pair of dual air knife assemblies may be used in another soldering system where excess solder is removed and any remaining solder is levelled on both sides of a circuit board.

Abstract translation: 根据本发明的用于去除多余焊料并使通过电路板上的剩余焊料与来自气体源的气体调平的双气刀组件包括第一和第二气刀。 第一气刀具有第一通道，其具有适于连接到气体源的第一入口和适于邻近通过电路板定位的第一出口。 第二气刀具有第二通道，第二入口连接到气体源，第二出口适于邻近通过的电路板定位。 第一气刀适于基本上垂直于电路板定位，并且第二气刀适于以与电路板小于90度，优选地在20度和60度之间的角度定位。 双气刀组件可以包括分隔第一和第二气刀并且从第一和第二气刀的出口凹入以形成膨胀室的间隔件。 第一和第二出口距离通过的电路板的距离以及从第一和第二气刀排出的气体的温度和压力应全部相同。 通常，双气刀组件用于包括输送机，焊剂站和焊接站的焊接系统中。 双气刀组件用于称为“热空气焊料平整”的过程中，以去除多余的焊料，并且更均匀地分布剩余的焊料。 在另一个焊接系统中可以使用一对双气刀组件，其中去除多余的焊料，并且在电路板的两侧上均匀地保留任何剩余的焊料。

公开(公告)号：US5586712A

公开(公告)日：1996-12-24

申请号：US369957

申请日：1995-01-09

Applicant: Neil G. Fiddes ,  Christopher G. King ,  Anthony Mantone ,  Frank D. Shaffer

Inventor： Neil G. Fiddes ,  Christopher G. King ,  Anthony Mantone ,  Frank D. Shaffer

IPC: B23K20/10 ,  B23K37/04

CPC classification number: B23K20/10 ,  B23K2201/36 ,  Y10T29/49014

Abstract: Apparatus for forming welded joints on superconducting foils to form long lengths of foil for use in superconducting magnet tapes including fixturing for controlling the accurate positioning of sheared foils and control of the overlap to be welded.

Abstract translation: 用于在超导箔上形成焊接接头的装置，以形成用于超导磁带的长长度的箔，其包括用于控制剪切箔的精确定位的夹具和控制待焊接的重叠。

公开(公告)号：US5562243A

公开(公告)日：1996-10-08

申请号：US336453

申请日：1994-11-09

Applicant: Angelo R. Marcantonio

Inventor： Angelo R. Marcantonio

IPC: B23K1/008 ,  G05D23/19 ,  H05K3/34 ,  B23K3/00

CPC classification number: G05D23/1917 ,  B23K1/008 ,  H05K3/3494 ,  B23K2201/30 ,  B23K2201/36 ,  B23K2201/42 ,  H05K2203/163

Abstract: An artificial neural network is trained to recognize inputted thermal and physical features of a printed circuit board, for providing settings for a reflow oven for obtaining acceptable soldering of the printed circuit board.

Abstract translation: 训练人造神经网络以识别印刷电路板的输入热和物理特征，以提供回流炉的设置，以获得印刷电路板的可接受的焊接。

公开(公告)号：US5516031A

公开(公告)日：1996-05-14

申请号：US235909

申请日：1994-05-02

Applicant: Toru Nishikawa ,  Masahito Ijuin ,  Ryohei Sato ,  Mitsugu Shirai

Inventor： Toru Nishikawa ,  Masahito Ijuin ,  Ryohei Sato ,  Mitsugu Shirai

IPC: B23K1/00 ,  B23K1/008 ,  B23K1/20 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/498 ,  H05K3/34 ,  B23K3/08

CPC classification number: H01L24/81 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/206 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/12 ,  H01L24/75 ,  H05K3/3436 ,  H05K3/3489 ,  B23K2201/36 ,  B23K2201/40 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/742 ,  H01L2224/75 ,  H01L2224/75272 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15787 ,  H05K2201/10984 ,  H05K2203/025 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/0435 ,  H05K2203/086 ,  H05K2203/087 ,  H05K2203/095 ,  H05K2203/1157 ,  H05K3/3426 ,  Y02P70/613

Abstract: In order to remove oxide film and contamination film on members to be bonded by soldering and solder material therefor corresponding to variation of thickness thereof by sputter-etching in a fluxless bonding method and apparatus therefor, substance emitted from the solder material under sputter-etching using atom or ion is detected and determined whether it is from the solder material or from the oxide film thereon. The sputter-etching is controlled on the basis of the determination to remove the oxide film. Then, the members are aligned in oxidizing atmosphere and soldered in non-oxidizing atmosphere.

Abstract translation: 为了通过无焊接方法及其设备通过溅射蚀刻来对应于其通过溅射蚀刻的焊接和焊接材料的焊接材料的焊接和焊接材料上的氧化膜和污染膜去除氧化物膜和污染膜，在溅射蚀刻下从焊料材料发射的物质使用 检测并确定原子或离子是来自焊料材料还是来自其上的氧化物膜。 基于去除氧化膜的测定来控制溅射蚀刻。 然后，将构件在氧化气氛中排列并在非氧化气氛中焊接。