公开(公告)号：US20140322541A1

公开(公告)日：2014-10-30

申请号：US13964070

申请日：2013-08-10

Applicant: Elite Electronic Material (Kunshan) Co., Ltd

Inventor： RONG-TAO WANG ,  LI-CHIH YU ,  YU-TE LIN ,  YI-JEN CHEN ,  WENJUN TIAN ,  ZIQIAN MA ,  WENFENG LU

IPC: C08L63/04 ,  H05K1/05

CPC classification number: C08L63/04 ,  C08G59/4064 ,  C08G59/621 ,  C08K5/0066 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10T428/31529 ,  C08L63/00

Abstract: A halogen-free resin composition, a copper clad laminate using the same, and a printed circuit board using the same are introduced. The halogen-free resin composition comprising (A) 100 parts by weight of epoxy resin; (B) 3 to 15 parts by weight of diaminodiphenyl sulfone (DDS); and (C) 5 to 70 parts by weight of phenolic co-hardener. The halogen-free resin composition features specific ingredients and proportion to thereby achieve satisfactory maximum preservation period of the prepreg manufactured from the halogen-free resin composition, control the related manufacturing process better, and attain satisfactory laminate properties, such as a high degree of water resistance, a high degree of heat resistance, and satisfactory dielectric properties, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper clad laminates and printed circuit boards.

Abstract translation: 引入无卤素树脂组合物，使用其的覆铜层压板和使用其的印刷电路板。 无卤树脂组合物包含（A）100重量份的环氧树脂; （B）3〜15重量份的二氨基二苯砜（DDS）; 和（C）5〜70重量份的酚共聚硬化剂。 无卤素树脂组合物具有特定成分和比例，从而实现了由无卤素树脂组合物制成的预浸料坯的令人满意的最大保存期，更好地控制了相关制造工艺，并获得令人满意的层压性能，如高水量 电阻，高耐热性和良好的介电性能，因此适用于制备预浸料或树脂膜，从而可应用于覆铜层压板和印刷电路板。

公开(公告)号：US20140309335A1

公开(公告)日：2014-10-16

申请号：US14355052

申请日：2012-11-30

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Sohaib Elgimiabi

IPC: C08G59/40 ,  C08G59/54

CPC classification number: C08G59/4014 ,  C08G59/54 ,  C08G59/621 ,  C08G59/68 ,  C08G73/028 ,  C08K3/28 ,  C08K2003/287 ,  C08L63/00 ,  C08L79/02 ,  C08L77/08

Abstract: An epoxy curative is provided comprising: a) a Lewis base, b) calcium nitrate, and c) a polyamine amide salt. The present disclosure additionally provides a composition which is a mixture obtained by mixing the epoxy curative and a curable epoxy resin. The present disclosure additionally provides cured compositions which result from cure of such a mixture.

Abstract translation: 提供了环氧固化剂，其包含：a）路易斯碱，b）硝酸钙，和c）多胺酰胺盐。 本公开另外提供了通过混合环氧固化剂和可固化环氧树脂获得的混合物的组合物。 本公开另外提供了由这种混合物固化产生的固化组合物。

公开(公告)号：US20140178656A1

公开(公告)日：2014-06-26

申请号：US13827911

申请日：2013-03-14

Applicant: ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO.,LTD

Inventor： CHANG-YUAN LI ,  YI-JEN CHEN ,  HONG-XIA PENG

IPC: C08L63/00 ,  C08L35/00 ,  H05K1/03 ,  C08L79/04

CPC classification number: C08L63/00 ,  C08G59/302 ,  C08G59/4064 ,  C08G59/621 ,  C08L35/00 ,  C09D163/00 ,  H05K1/0353 ,  Y10T428/24917 ,  Y10T428/31529 ,  C08L35/06

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 10 to 100 parts by weight of styrene-maleic anhydride (SMA) copolymer; and (C) 5 to 50 parts by weight of bisphenol S. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby achieve a high glass transition temperature, high heat resistance, and attractive appearance, and thus is suitable for producing a prepreg or resin film to thereby be applicable to copper clad laminates and printed circuit boards.

Abstract translation: 无卤树脂组合物包含（A）100重量份环氧树脂; （B）10〜100重量份苯乙烯 - 马来酸酐（SMA）共聚物; 和（C）5〜50重量份的双酚S.无卤素树脂组合物包含特定成分，其特征在于其特定比例，从而实现高玻璃化转变温度，高耐热性和有吸引力的外观，以及 因此适用于制备预浸料或树脂膜，从而可应用于覆铜层压板和印刷电路板。

公开(公告)号：US20140147639A1

公开(公告)日：2014-05-29

申请号：US13831767

申请日：2013-03-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Seok Moon ,  Hyun Jun Lee ,  Keun Yong Lee ,  Seong Hyun Yoo

IPC: C09D167/02 ,  H05K1/03 ,  C09D163/00

CPC classification number: H05K1/0353 ,  C08G59/621 ,  C08J5/24 ,  C08J2363/00 ,  C08L63/00 ,  C08L67/03 ,  C09D163/00 ,  H05K1/0346 ,  H05K3/4676 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0209 ,  Y10T428/24802

Abstract: Disclosed herein are a resin composition of a printed circuit board including a liquid crystal oligomer, an epoxy resin, and a phenolic curing agent having five or more functional groups, an insulating film and a prepreg manufactured using the resin composition, and a printed circuit board including the insulating film or the prepreg. The resin composition for a printed circuit board according to the present invention, and the insulating film and the prepreg manufactured using the same, may have low coefficient of thermal expansion, excellent heat resistance property, and a high glass transition temperature.

Abstract translation: 本发明公开了包含液晶低聚物，环氧树脂和具有五个或更多个官能团的酚类固化剂的印刷电路板的树脂组合物，使用该树脂组合物制造的绝缘膜和预浸料，以及印刷电路板 包括绝缘膜或预浸料。 根据本发明的用于印刷电路板的树脂组合物以及使用其制造的绝缘膜和预浸料可以具有低的热膨胀系数，优异的耐热性和高的玻璃化转变温度。

公开(公告)号：US08715454B2

公开(公告)日：2014-05-06

申请号：US13619314

申请日：2012-09-14

Applicant: Hiroyuki Kawakami ,  Katsuyasu Niijima ,  Naoki Tomori ,  Daichi Takemori ,  Takuya Imai

Inventor： Hiroyuki Kawakami ,  Katsuyasu Niijima ,  Naoki Tomori ,  Daichi Takemori ,  Takuya Imai

IPC: B29C65/00 ,  B32B37/00 ,  B32B38/10 ,  C09J163/00 ,  H01L23/28

CPC classification number: H01L23/293 ,  C08G59/621 ,  C08K3/013 ,  C08L63/00 ,  C08L2666/54 ,  C08L2666/72 ,  H01L23/28 ,  H01L23/295 ,  H01L2924/0002 ,  H01L2924/12044 ,  Y10T428/24967 ,  Y10T428/25 ,  Y10T428/26 ,  Y10T428/31511 ,  H01L2924/00

Abstract: A method for sealing electrodes on a semiconductor device using a sealing film which includes a resin layer having a flow within the range of 150 to 1800 μm at 80° C., or having a resin layer with a viscosity within the range of 10,000 to 100,000 Pa·s in a B-stage state at 50 to 100° C. in thermosetting viscoelasticity measurement, and containing: (A) both (a1) a high-molecular-weight component including crosslinking functional groups and having a weight-average molecular weight of 100,000 or more and a Tg within the range of −50 to 50° C. and (a2) a thermosetting component including an epoxy resin as a main component, (B) a filler having an average particle size within the range of 1 to 30 μm, and (C) a colorant.

Abstract translation: 一种使用密封膜在半导体器件上密封电极的方法，所述密封膜包括在80℃下流动在150至1800μm范围内的树脂层，或具有粘度在10,000至100,000范围内的树脂层 在热固性粘弹性测定中，在50〜100℃下处于B阶状态的Pa·s，含有：（A）包含（a1）包含交联官能团的高分子量成分，重均分子量 为10〜10重量％，Tg为-50〜50℃，（a2）以环氧树脂为主要成分的热固性成分，（B）平均粒径为1〜 30μm，（C）着色剂。

公开(公告)号：US08702943B2

公开(公告)日：2014-04-22

申请号：US12344753

申请日：2008-12-29

Applicant: Timothy S December ,  Abdellatif Chouai ,  Cynthia A Stants

Inventor： Timothy S December ,  Abdellatif Chouai ,  Cynthia A Stants

IPC: C25D13/06 ,  C08G59/42

CPC classification number: C25D13/12 ,  C08G59/186 ,  C08G59/304 ,  C08G59/621 ,  C08L63/00 ,  C09D5/4411 ,  C09D5/4449 ,  C09D163/00 ,  C25D13/02

Abstract: An aqueous electrodeposition coating composition comprising a cathodically electrodepositable binder, the binder comprising a phosphorylated resin and a carboxyl group separated by from 2 to 4 carbons from an ester group, provides corrosion protection equivalent to that obtained by the conventional phosphate pretreatment-electrodeposition coating process.

Abstract translation: 包含阴极电沉积粘合剂的水性电沉积涂料组合物，所述粘合剂包含磷酸化树脂和从酯基分离出2至4个碳的羧基，提供与通过常规磷酸盐预处理电沉积涂覆方法获得的腐蚀保护相当的腐蚀保护。

公开(公告)号：US08653205B2

公开(公告)日：2014-02-18

申请号：US13255571

申请日：2010-03-02

Applicant: Masahiro Wada

Inventor： Masahiro Wada

IPC: C08K3/36 ,  C08L63/00 ,  C08L63/02 ,  H01L23/29

CPC classification number: H01L23/3128 ,  C08G59/621 ,  C08L63/00 ,  H01L21/565 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/20753

Abstract: Disclosed is a resin composition for encapsulating a semiconductor containing an epoxy resin (A), a curing agent (B), and an inorganic filler (C), wherein the epoxy resin (A) includes an epoxy resin (A1) having a predetermined structure, and the curing agent (B) includes a phenol resin (B1) having a predetermined structure, wherein the content of a c=1 component included in the total amount of the phenol resin (B1) is not less than 40% in terms of area percentage and the content of a C≧4 component is not more than 20% in terms of area percentage, as measured by the area method of gel permeation chromatography. Also disclosed is a semiconductor device obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor.

Abstract translation: 公开了一种用于封装含有环氧树脂（A），固化剂（B）和无机填料（C）的半导体的树脂组合物，其中环氧树脂（A）包括具有预定结构的环氧树脂（A1） ，固化剂（B）含有具有规定结构的酚醛树脂（B1），其中包含在酚醛树脂（B1）总量中的ac = 1成分的含量以面积计不小于40％ 百分数，C> = 4组分的含量以面积百分比计不超过20％，如通过凝胶渗透色谱法的面积法测量的。 还公开了通过将半导体元件与用于封装半导体的树脂组合物的固化物封装而获得的半导体器件。

公开(公告)号：US08629564B2

公开(公告)日：2014-01-14

申请号：US12447658

申请日：2007-10-30

Applicant: Satoru Katsurayama ,  Tomoe Yamashiro ,  Takashi Hirano

Inventor： Satoru Katsurayama ,  Tomoe Yamashiro ,  Takashi Hirano

IPC: H01L23/48

CPC classification number: H01L24/16 ,  C08G59/42 ,  C08G59/621 ,  C08L33/08 ,  C08L63/00 ,  C08L2666/02 ,  C09J163/00 ,  C09J179/08 ,  H01L23/3128 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L24/32 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05001 ,  H01L2224/0554 ,  H01L2224/05554 ,  H01L2224/1146 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/81815 ,  H01L2224/83101 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2224/83886 ,  H01L2224/83907 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01059 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T428/256 ,  C08L2666/22 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01083 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The problem of the present invention is to provide a chip-on-chip type semiconductor electronic component and a semiconductor device which can meet the requirements for further density increase of semiconductor integrated circuits.The present invention provides: a chip-on-chip type semiconductor electronic component in which a circuit surface of a first semiconductor chip and a circuit surface of a second semiconductor chip are opposed to each other, wherein the distance X between the first semiconductor chip and the second semiconductor chip is 50 μm or less, and the shortest distance Y between the side surface of the second semiconductor chip and the first external electrode is 1 mm or less; and a semiconductor device comprising the same.

Abstract translation: 本发明的问题在于提供一种能够满足半导体集成电路的密度增加的要求的片上芯片型半导体电子部件和半导体装置。 本发明提供一种片上型半导体电子元件，其中，第一半导体芯片的电路面和第二半导体芯片的电路面相互相对，其中，第一半导体芯片与第二半导体芯片之间的距离X 第二半导体芯片为50μm以下，第二半导体芯片的侧面与第一外部电极的最短距离Y为1mm以下; 以及包含该半导体器件的半导体器件。

公开(公告)号：US08603624B2

公开(公告)日：2013-12-10

申请号：US13510770

申请日：2010-10-29

Applicant: Takashi Matsuda ,  Kiyotaka Komori ,  Akiyoshi Nozue ,  Takayuki Suzue ,  Mitsuyoshi Nishino ,  Toshiyuki Asahi ,  Yoshito Kitagawa ,  Naoyuki Tani

Inventor： Takashi Matsuda ,  Kiyotaka Komori ,  Akiyoshi Nozue ,  Takayuki Suzue ,  Mitsuyoshi Nishino ,  Toshiyuki Asahi ,  Yoshito Kitagawa ,  Naoyuki Tani

IPC: B32B15/00

CPC classification number: H05K1/0373 ,  B32B5/28 ,  B32B15/14 ,  C08G59/38 ,  C08G59/4021 ,  C08G59/621 ,  C08J5/24 ,  H05K1/0366 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0266 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/254 ,  Y10T428/257 ,  Y10T442/20 ,  Y10T442/3455

Abstract: Disclosed is a prepreg obtained by impregnating a woven fabric base with a thermosetting resin composition, wherein the thermosetting resin composition contains 80 to 200 volume parts of an inorganic filler per 100 volume parts of a thermosetting resin, and the inorganic filler contains (A) gibbsite aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 μm, (B) at least one inorganic component selected from the group consisting of boehmite particles having an average particle diameter (D50) of 2 to 15 μm and inorganic particles that have an average particle diameter (D50) of 2 to 15 μm and that contain crystal water having a release initiation temperature of 400° C. or higher or contain no crystal water, and (C) aluminum oxide particles having an average particle diameter (D50) of 1.5 μm or smaller, the compounded ratio (volume ratio) of the gibbsite aluminum hydroxide particles (A), the at least one inorganic component (B) selected from the group consisting of the boehmite particles and the inorganic particles, and the aluminum oxide particles (C) being 1:0.1 to 2.5:0.1 to 1.

Abstract translation: 公开了一种通过用热固性树脂组合物浸渍机织织物基底而获得的预浸料，其中热硬化性树脂组合物每100体积份热固性树脂含有80〜200体积份的无机填料，无机填料含有（A）三水铝矿 平均粒径（D50）为2〜15μm的氢氧化铝粒子，（B）至少一种选自平均粒径（D50）为2〜15μm的勃姆石粒子的无机成分和无机粒子， 平均粒径（D50）为2〜15μm，并且含有剥离开始温度为400℃以上或不含结晶水的结晶水，（C）平均粒径（D50）的氧化铝粒子 ）为1.5μm以下，三水铝石氢氧化铝粒子（A），至少一种选自一组的无机成分（B）的配合比（体积比） 勃姆石粒子和无机粒子，氧化铝粒子（C）的比例为1:0.1〜2.5:0.1:1。

公开(公告)号：US20130294006A1

公开(公告)日：2013-11-07

申请号：US13558098

申请日：2012-07-25

Applicant: Sung Koo KANG ,  Myung Jun Park ,  Hyun Hee Gu ,  Kyung Pyo Hong ,  Chang Hoon Kim

Inventor： Sung Koo KANG ,  Myung Jun Park ,  Hyun Hee Gu ,  Kyung Pyo Hong ,  Chang Hoon Kim

IPC: H01B1/02 ,  H01G13/00 ,  H01B1/04 ,  H01G4/30 ,  B82Y30/00

CPC classification number: H01B1/22 ,  C08G59/42 ,  C08G59/621 ,  C08K3/08 ,  C08K9/02 ,  C08K2003/085 ,  C08K2201/001 ,  C08L63/00 ,  H01B1/24 ,  H01G4/012 ,  H01G4/12 ,  H01G4/224 ,  H01G4/2325 ,  H01G4/30

Abstract: There is provided a conductive resin composition including epoxy resin, copper powder particles, and non-nitrogen-based hardeners.

Abstract translation: 提供了包含环氧树脂，铜粉末颗粒和非氮基硬化剂的导电树脂组合物。