公开(公告)号：US08512491B2

公开(公告)日：2013-08-20

申请号：US12974611

申请日：2010-12-21

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

IPC分类号： B32B41/00

CPC分类号： H01L22/12 ,  H01L21/67092

摘要： A method of bonding a first substrate and a second substrate includes the steps of rotating first substrate with an adhesive mass thereon, and second substrate contacting the mass and overlying the first substrate, controlling a vertical height of a heated control platen spaced apart from and not contacting the second substrate so as to control a temperature of the adhesive mass, so as to at least one of bond the first and second substrates in alignment with one another, or achieve a sufficiently planar adhesive interface between the first and second substrates.

摘要翻译： 接合第一基板和第二基板的方法包括以下步骤：使第一基板与其上的粘合剂质量物质旋转，第二基板接触物料并覆盖第一基板，控制加热的控制台板的垂直高度， 使所述第二基板接触以控制所述粘合剂物料的温度，以便使所述第一和第二基板彼此对准的至少一个接合，或在所述第一和第二基板之间实现足够平坦的粘合界面。

公开(公告)号：US08476774B2

公开(公告)日：2013-07-02

申请号：US13316890

申请日：2011-12-12

申请人： Belgacem Haba ,  Ilyas Mohammed ,  Vage Oganesian ,  David Ovrutsky ,  Laura Wills Mirkarimi

发明人： Belgacem Haba ,  Ilyas Mohammed ,  Vage Oganesian ,  David Ovrutsky ,  Laura Wills Mirkarimi

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L21/78 ,  H01L21/6835 ,  H01L23/5382 ,  H01L24/24 ,  H01L24/48 ,  H01L24/82 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68377 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/9202 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A microelectronic assembly includes first and second stacked microelectronic elements, each having spaced apart traces extending along a front face and beyond at least a first edge thereof. An insulating region can contact the edges of each microelectronic element and at least portions of the traces of each microelectronic element extending beyond the respective first edges. The insulating region can define first and second side surfaces adjacent the first and second edges of the microelectronic elements. A plurality of spaced apart openings can extend along a side surface of the microelectronic assembly. Electrical conductors connected with respective traces can have portions disposed in respective openings and extending along the respective openings. The electrical conductors may extend to pads or solder balls overlying a face of one of the microelectronic elements.

摘要翻译： 微电子组件包括第一和第二堆叠的微电子元件，每个微电子元件具有沿前表面延伸并且至少其第一边缘延伸的间隔开的迹线。 绝缘区域可以接触每个微电子元件的边缘，并且每个微电子元件的迹线的至少部分延伸超过相应的第一边缘。 绝缘区域可以限定与微电子元件的第一和第二边缘相邻的第一和第二侧表面。 多个间隔开的开口可以沿着微电子组件的侧表面延伸。 与相应迹线连接的电导体可以具有设置在相应开口中并沿相应开口延伸的部分。 电导体可以延伸到覆盖在微电子元件中的一个的表面上的焊盘或焊球。

公开(公告)号：US08461460B2

公开(公告)日：2013-06-11

申请号：US12459864

申请日：2009-07-08

申请人： Chang Myung Ryu ,  Kimitaka Endo ,  Belgacem Haba ,  Yoichi Kubota

发明人： Chang Myung Ryu ,  Kimitaka Endo ,  Belgacem Haba ,  Yoichi Kubota

IPC分类号： H05K1/03

CPC分类号： B81B7/0006 ,  B81C1/00539 ,  C25D7/00 ,  H01L21/4846 ,  H01L21/768 ,  H01L23/498 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/244 ,  H01L2924/0002 ,  H01L2924/12042 ,  H01L2924/00

摘要： A microelectronic interconnect element can include a plurality of first metal lines and a plurality of second metal lines interleaved with the first metal lines. Each of the first and second metal lines has a surface extending within the same reference plane. The first metal lines have surfaces above the reference plane and remote therefrom and the second metal lines have surfaces below the reference plane and remote therefrom. A dielectric layer can separate a metal line of the first metal lines from an adjacent metal line of the second metal lines.

摘要翻译： 微电子互连元件可以包括与第一金属线交错的多个第一金属线和多个第二金属线。 第一和第二金属线中的每一个具有在相同参考平面内延伸的表面。 第一金属线具有高于参考平面并远离其的表面，并且第二金属线具有低于参考平面并远离其的表面。 电介质层可以将第一金属线的金属线与第二金属线的相邻金属线分开。

公开(公告)号：US20130122747A1

公开(公告)日：2013-05-16

申请号：US13296785

申请日：2011-11-15

申请人： Cyprian Uzoh ,  Craig Mitchell ,  Belgacem Haba ,  Ilyas Mohammed

发明人： Cyprian Uzoh ,  Craig Mitchell ,  Belgacem Haba ,  Ilyas Mohammed

IPC分类号： H01R24/28

CPC分类号： H05K1/0271 ,  H01L23/49827 ,  H01L2924/0002 ,  H01R12/714 ,  H05K1/114 ,  H05K1/115 ,  H05K3/42 ,  H05K2201/09645 ,  H05K2201/10378 ,  H05K2203/0242 ,  H05K2203/025 ,  Y10T29/49165 ,  H01L2924/00

摘要： An interconnection component includes an element with an opening, a plurality of conductors electrically insulted from one another extending through the opening, and a plurality of second contacts electrically insulated from one another. The element is comprised of a material having a coefficient of thermal expansion of less than 10 parts per million per degree Celsius. At least some of the conductors extend along at least one inner surface of the opening. The conductors define a plurality of wettable first contacts at the first surface. The first contacts are at least partially aligned with the opening in a direction of the thickness and electrically insulated from one another.

摘要翻译： 互连部件包括具有开口的元件，延伸穿过开口彼此电绝缘的多个导体以及彼此电绝缘的多个第二触点。 该元件由热膨胀系数小于10ppm /℃的材料构成。 至少一些导体沿开口的至少一个内表面延伸。 导体在第一表面限定多个可润湿的第一接触。 第一触点在厚度方向上与开口至少部分地对齐，并且彼此电绝缘。

公开(公告)号：US20130118784A1

公开(公告)日：2013-05-16

申请号：US13293698

申请日：2011-11-10

申请人： Cyprian Uzoh ,  Charles G. Woychik ,  Terrence Caskey ,  Belgacem Haba ,  Philip Damberg

发明人： Cyprian Uzoh ,  Charles G. Woychik ,  Terrence Caskey ,  Belgacem Haba ,  Philip Damberg

IPC分类号： H05K1/09 ,  H05K3/10

CPC分类号： H05K1/115 ,  H01L23/14 ,  H01L23/49827 ,  H01L23/49866 ,  H01L2924/0002 ,  H05K1/03 ,  H05K1/09 ,  H05K3/42 ,  H05K2201/0141 ,  H05K2201/0175 ,  H05K2201/09509 ,  H05K2201/10378 ,  H05K2203/025 ,  H05K2203/1105 ,  Y10T29/49165 ,  H01L2924/00

摘要： A component includes a support structure having first and second spaced-apart and parallel surfaces and a plurality of conductive elements extending in a direction between the first and second surfaces. Each conductive element contains an alloy of a wiring metal selected from the group consisting of copper, aluminum, nickel and chromium, and an additive selected from the group consisting of Gallium, Germanium, Indium, Selenium, Tin, Sulfur, Silver, Phosphorus, and Bismuth. The alloy has a composition that varies with distance in at least one direction across the conductive element. A concentration of the additive is less than or equal to 5% of the total atomic mass of the conductive element, and a resistivity of the conductive element is between 2.5 and 30 micro-ohm-centimeter.

公开(公告)号：US08436477B2

公开(公告)日：2013-05-07

申请号：US13439273

申请日：2012-04-04

申请人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

发明人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

IPC分类号： H01L23/48

CPC分类号： H01L25/0657 ,  G11C5/063 ,  H01L23/12 ,  H01L23/13 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/17 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/1715 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2225/06506 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/06575 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00

摘要： A microelectronic package can include a microelectronic element having a face and a plurality of element contacts thereon, a substrate having first and second surfaces, and terminals on the second surface configured for connecting the package with an external component. The microelectronic element can include a plurality of stacked electrically interconnected semiconductor chips. The substrate can have contacts facing the element contacts of the microelectronic element and joined thereto. The terminals can include first terminals arranged at positions within first and second parallel grids. The first terminals of each grid can be configured to carry address information usable by circuitry within the microelectronic package to determine an addressable memory location from among all the available addressable memory locations within the microelectronic element. The signal assignments of the first terminals in the first grid can be a mirror image of the signal assignments of the first terminals in the second grid.

摘要翻译： 微电子封装可以包括其上具有面和多个元件触点的微电子元件，具有第一和第二表面的衬底以及被配置为将封装与外部元件连接的第二表面上的端子。 微电子元件可以包括多个堆叠的电互连半导体芯片。 衬底可以具有面向微电子元件的元件触点并且与其接合的触点。 端子可以包括布置在第一和第二平行栅格内的位置处的第一端子。 每个电网的第一个端子可被配置为承载可由微电子封装内的电路使用的地址信息，以从微电子元件内的所有可寻址的存储单元中确定可寻址的存储器位置。 第一网格中的第一终端的信号分配可以是第二网格中的第一终端的信号分配的镜像。

公开(公告)号：US20130083583A1

公开(公告)日：2013-04-04

申请号：US13440515

申请日：2012-04-05

申请人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

发明人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

IPC分类号： G11C5/06

CPC分类号： H01L25/105 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/06 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/06156 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package can include a substrate having first and second opposed surfaces and first and second apertures extending between the first and second surfaces, first and second microelectronic elements each having a surface facing the first surface of the substrate, a plurality of terminals exposed at the second surface in a central region thereof, and leads electrically connected between contacts of each microelectronic element and the terminals. The apertures can have first and second parallel axes extending in directions of the lengths of the respective apertures. The central region of the second surface can be disposed between the first and second axes. The terminals can be configured to carry address information usable by circuitry within the microelectronic package to determine an addressable memory location from among all the available addressable memory locations of a memory storage array within the microelectronic elements.

摘要翻译： 微电子封装可以包括具有第一和第二相对表面的衬底以及在第一和第二表面之间延伸的第一和第二孔，第一和第二微电子元件各自具有面向衬底的第一表面的表面， 并且在每个微电子元件的触点和端子之间电连接引线。 孔可以具有在相应孔的长度方向上延伸的第一和第二平行轴线。 第二表面的中心区域可以设置在第一和第二轴线之间。 终端可以被配置为承载可由微电子封装内的电路使用的地址信息，以从微电子元件内的存储器存储阵列的所有可寻址的存储器位置中确定可寻址的存储器位置。

公开(公告)号：US20130082374A1

公开(公告)日：2013-04-04

申请号：US13439228

申请日：2012-04-04

申请人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

发明人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

IPC分类号： H01L23/498

CPC分类号： H01L25/0657 ,  G11C5/063 ,  H01L23/12 ,  H01L23/13 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/17 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/1715 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2225/06506 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/06575 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00

摘要： A microelectronic assembly can include a circuit panel having first and second panel contacts at respective first and second surfaces thereof, and first and second microelectronic packages each having terminals mounted to the respective panel contacts. Each package can include a microelectronic element having a face and contacts thereon, a substrate having first and second surfaces, and terminals on the second surface configured for connecting the package with an external component. The terminals can include first terminals at positions within first and second parallel grids. The first terminals can be configured to carry address information usable by circuitry within the package to determine an addressable memory location from among all the available addressable memory locations of a memory storage array within the microelectronic element. Signal assignments of the first terminals in the first grid can be a mirror image of signal assignments of the first terminals in the second grid.

摘要翻译： 微电子组件可以包括在其相应的第一和第二表面处具有第一和第二面板触点的电路板，以及每个具有安装到各个面板触点的端子的第一和第二微电子封装。 每个封装可以包括具有面和其上的触点的微电子元件，具有第一和第二表面的基板，以及在第二表面上的端子，用于将封装与外部元件连接。 端子可以包括在第一和第二平行网格内的位置处的第一端子。 第一终端可以被配置为承载可用于封装内的电路的地址信息，以从微电子元件内的存储器存储阵列的所有可寻址的存储器单元中确定可寻址的存储器位置。 第一网格中的第一终端的信号分配可以是第二网格中的第一终端的信号分配的镜像。

公开(公告)号：US08410618B2

公开(公告)日：2013-04-02

申请号：US13196192

申请日：2011-08-02

申请人： Belgacem Haba ,  Philip Damberg ,  Philip R. Osborn

发明人： Belgacem Haba ,  Philip Damberg ,  Philip R. Osborn

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/49816 ,  H01L21/50 ,  H01L23/13 ,  H01L23/49861 ,  H01L24/01 ,  H01L24/36 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L24/91 ,  H01L2224/05554 ,  H01L2224/40091 ,  H01L2224/40225 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48096 ,  H01L2224/4813 ,  H01L2224/4824 ,  H01L2224/4846 ,  H01L2224/48465 ,  H01L2224/48477 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/49112 ,  H01L2224/4942 ,  H01L2224/49427 ,  H01L2224/49429 ,  H01L2224/4945 ,  H01L2224/85051 ,  H01L2224/85191 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19107 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/48095 ,  H01L2224/37099 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A microelectronic assembly includes a semiconductor chip having chip contacts exposed at a first face and a substrate juxtaposed with a face of the chip. A conductive bond element can electrically connect a first chip contact with a first substrate contact of the substrate, and a second conductive bond element can electrically connect the first chip contact with a second substrate contact. The first bond element can have a first end metallurgically joined to the first chip contact and a second end metallurgically joined to the first substrate contact. A first end of the second bond element can be metallurgically joined to the first bond element. The second bond element may or may not touch the first chip contact or the substrate contact. A third bond element can be joined to ends of first and second bond elements which are joined to substrate contacts or to chip contacts. In one embodiment, a bond element can have a looped connection, having first and second ends joined at a first contact and a middle portion joined to a second contact.

摘要翻译： 微电子组件包括半导体芯片，其具有在第一面处露出的芯片触点和与芯片的表面并置的衬底。 导电接合元件可以将第一芯片触点与衬底的第一衬底接触电连接，并且第二导电结合元件可以将第一芯片触点与第二衬底触点电连接。 第一结合元件可以具有冶金地连接到第一芯片触点的第一端和冶金地连接到第一衬底触点的第二端。 第二结合元件的第一端可以冶金地连接到第一结合元件。 第二结合元件可以或可以不接触第一芯片触点或基板触点。 第三接合元件可以连接到第一和第二接合元件的端部，所述第一和第二接合元件连接到衬底触点或芯片触点。 在一个实施例中，接合元件可以具有环形连接，其具有在第一接触处连接的第一端和第二端以及与第二接触接合的中间部。

公开(公告)号：US20130063918A1

公开(公告)日：2013-03-14

申请号：US13232436

申请日：2011-09-14

申请人： Belgacem Haba ,  Kishor Desai

发明人： Belgacem Haba ,  Kishor Desai

IPC分类号： H05K7/00 ,  B32B38/08 ,  H05K1/00 ,  H05K1/11 ,  H05K1/16

CPC分类号： H01L23/49827 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49833 ,  H01L24/17 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/17104 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/19107 ,  Y10T29/49128 ,  Y10T428/24521 ,  Y10T428/24802 ,  H01L2924/00 ,  H01L2924/00012

摘要： An interconnection component includes a first support portion has a plurality of first conductive vias extending therethrough substantially perpendicular to surfaces thereof such that each via has a first end adjacent a first surface and a second end adjacent a second surface. A second support portion has a plurality of second conductive vias extending therethrough substantially perpendicular to surfaces thereof such that each via has a first end adjacent the first surface and a second end adjacent the second surface. A redistribution layer is disposed between the second surfaces of the first and second support portions, electrically connecting at least some of the first vias with at least some of the second vias. The first and second support portions can have a coefficient of thermal expansion (“CTE”) of less than 12 parts per million per degree, Celsius (“ppm/° C.”).

摘要翻译： 互连部件包括第一支撑部分，其具有大致垂直于其表面延伸的多个第一导电通孔，使得每个通孔具有邻近第一表面的第一端和邻近第二表面的第二端。 第二支撑部分具有大致垂直于其表面延伸穿过的多个第二导电通路，使得每个通孔具有邻近第一表面的第一端和邻近第二表面的第二端。 再分配层设置在第一和第二支撑部分的第二表面之间，将至少一些第一通孔与至少一些第二通孔电连接。 第一和第二支撑部分的热膨胀系数（CTE）可以低于每百万摄氏度（ppm /℃）的百万分之十二。